TWM516825U - Heat dissipation plate and heat dissipation components - Google Patents

Description

Heat sink and heat sink

The invention relates to a heat dissipation plate and a heat dissipation component, in particular to a heat dissipation plate and a heat dissipation component with a support column.

As the technology in the electronics field continues to evolve, the performance of the electronic chips produced continues to increase. However, in general, the performance of an electronic chip is increased, and the amount of heat generated is increased. This heat is constantly accumulated on the electronic wafer and causes the temperature of the electronic chip itself to rise. If the temperature of the electronic chip is not effectively lowered, the electronic chip will be destroyed or even burned. Therefore, the problem that the electronics industry generally faces today is not the improvement of performance, but how to effectively eliminate the heat generated by the electronic chip.

Generally speaking, the most common way of dissipating heat is to make the heat dissipation plate have a protruding structure, and to thermally contact the electronic chip on the circuit board through the protruding structure, so that the heat on the electronic chip can be transmitted to the heat dissipation through heat conduction. The board, which in turn reduces the operating temperature of the electronic chip. However, in the process of mounting the heat sink in the circuit board, the heat sink is often bumped or pressed onto the electronic chip. Therefore, how to avoid the situation that the heat sink will collide or interfere with the rest of the electronic chip during the assembly and alignment process is one of the problems that the researcher should solve.

The invention relates to a heat dissipating plate and a heat dissipating component, so as to avoid the situation that the protruding post of the heat dissipating plate collides or interferes with the rest of the electronic chip during assembly and alignment.

The heat dissipation plate disclosed in the present invention comprises a plate body, a protruding structure and a support column. The plate body has a first surface and a second surface opposite to each other. The protruding structure protrudes from the first surface of the plate body and has a thermal contact surface facing away from the second surface. The support post protrudes from the first surface of the plate body, and the support column has a chamfer away from an outer edge of the plate body.

The heat dissipating component disclosed in the present invention comprises a circuit board, an electronic chip and a heat dissipating plate as described above. The electronic chip is stacked and electrically connected to the circuit board. The thermal contact surface of the protruding structure of the heat sink contacts the electronic wafer. The support column of the heat sink abuts against the circuit board.

According to the heat dissipation plate and the heat dissipation assembly disclosed in the above embodiments, the distance between the plate body and the circuit board of the heat dissipation plate is separated by the support column, and the heat dissipation plate is prevented from tilting relative to the circuit board, thereby preventing the protruding structure of the heat dissipation plate from being squeezed. To the electronic chip. In this way, the probability of damage to the electronic chip can be reduced.

Furthermore, the outer edge of the support column adjacent to one side of the circuit board has a chamfered design, which can enlarge the installation space of the electronic chip on the circuit board, and increase the distance between the support column and the electronic chip, thereby reducing the support column and the electron. The probability of wafer phase interference.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the present invention and to provide a further explanation of the scope of the invention.

Please refer to Figure 1 to Figure 3. 1 is a perspective view of a heat dissipating assembly according to a first embodiment of the present invention. Figure 2 is an exploded perspective view of Figure 1. Figure 3 is a schematic cross-sectional view of Figure 1. 4 is an enlarged schematic view of FIG. 3.

The heat dissipating component 10 of the embodiment includes a circuit board 100, a grounding spring 150, an electronic chip 200, a heat sink 300, an engaging clip 400, and an elastic member 500.

The grounding elastic piece 150 is connected to the circuit board 100 and electrically connected to a grounding circuit (not shown) of the circuit board 100.

The electronic chip 200 is, for example, a central processing unit or a south and north bridge wafer. The electronic chip 200 is stacked and electrically connected to the circuit board 100.

The heat dissipation plate 300 includes a plate body 310, two protruding structures 320, and a plurality of support columns 330.

The plate body 310 has a first surface 311 and a second surface 312 opposite to each other. The board body 310 is located above the circuit board 100, and the first surface 311 of the board body 310 faces the circuit board.

The protruding structure 320 protrudes from the first surface 311 of the plate body and has a thermal contact surface 321 facing away from the second surface 312. The thermal contact surface 321 is in contact with the electronic wafer 200. In addition, the protruding structure 320 of the present embodiment is, for example, a convex hull structure formed by press working, but is not limited thereto. In other embodiments, the protruding structure 320 may also be processed by mechanical cutting. Bump structure.

It should be noted that, in this embodiment, the number of the protruding structures 320 is exemplified by two, but not limited thereto. In other embodiments, the number of the protruding structures 320 may also depend on the electronic chip 200. The number is adjusted to one or three or more.

The material of the support post 330 is, for example, a conductive material such as gold, silver, copper or iron, and the support post 330 protrudes from the first surface 311 of the plate body 310. The support post 330 abuts against the circuit board 100 from one side of the board body 310 and is in contact with the grounding elastic piece 150 to achieve the grounding effect. In addition, the height of the first surface 311 of the support post 330 protruding from the plate body 310 is greater than the height of the first surface 311 of the protruding structure 320 protruding from the plate body 310.

In detail, the support post 330 includes an annular side portion 331 and a bottom portion 332. The annular side portion 331 is mounted on the plate body 310 and surrounds a through slot 331a. The bottom portion 332 is connected to one side of the annular side portion 331 away from the plate body 310, and has a through hole 332a communicating with the through groove 331a.

The engaging clip 400 passes through the through hole 332a of the elastic member 500 and the bottom 332 of the support post 330, and is fastened to the circuit board 100 so that the bottom 332 of the support post 330 abuts against the circuit board 100, and the bottom 332 of the support post 330 It is sandwiched between the elastic member 500 and the circuit board 100. The elastic member 500 is, for example, a compression spring.

When the heat dissipation plate 300 is attached to the circuit board 100 through the bonding clip 400 and the elastic member 500, the support of the support columns 330 of the heat dissipation plate 300 can prevent the board body 310 and the protruding structure 320 from being crushed by the tilting. A problem with the wafer 200 arises.

In addition, the outer edge of the bottom portion 332 has a chamfer 332a. The chamfer 332a of the embodiment is, for example, a chamfered corner, but is not limited thereto. In other embodiments, the chamfer 332a may also be a rounded corner. Since the outer edge of the bottom portion 332 has a chamfer 332a design, the volume of the support post 330 can be reduced, thereby expanding the installation space of the electronic chip 200 and increasing the distance between the support post 330 and the electronic chip 200. That is, the design of the chamfer 332a can also reduce the probability of the support post 330 interfering with the electronic wafer 200.

Moreover, since the support post 330 protrudes from the first surface 311 of the board body 310 and the bottom 332 of the support post 330 is closer to the circuit board 100, the length requirement of the joint clip 400 can be shortened. Therefore, the engaging clip 400 of the heat dissipating component 10 can be used in a standard standard, and the lengthening specification is not required, thereby further saving material cost.

According to the heat dissipation plate and the heat dissipation assembly disclosed in the above embodiments, the distance between the plate body and the circuit board of the heat dissipation plate is separated by the support column, and the heat dissipation plate is prevented from tilting relative to the circuit board, thereby preventing the protruding structure of the heat dissipation plate from being squeezed. To the electronic chip. In this way, the probability of damage to the electronic chip can be reduced.

Furthermore, the outer edge of the support column adjacent to one side of the circuit board has a chamfered design, which can enlarge the installation space of the electronic chip on the circuit board, and increase the distance between the support column and the electronic chip, thereby reducing the support column and the electron. The probability of wafer phase interference.

In addition, since the bottom of the support column is closer to the circuit board than the board body, the joint clip can be joined to the bottom of the support column and the circuit board, thereby shortening the length requirement of the joint clip. Therefore, the joint fastener of the heat dissipating component can be used in a standard standard, and the lengthening specification is not required, thereby further saving material cost.

Although the embodiments of the present invention are disclosed as described above, it is not intended to limit the present invention, and those skilled in the art can, without departing from the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the spirit of the invention is subject to change. Therefore, the scope of patent protection of the present invention is subject to the definition of the scope of the patent application attached to this specification.

10‧‧‧Heat components
100‧‧‧ boards
150‧‧‧ Grounding shrapnel
200‧‧‧electronic chip
300‧‧‧heat plate
310‧‧‧ board
311‧‧‧ first surface
312‧‧‧ second surface
320‧‧‧ protruding structure
321‧‧‧Hot contact surface
330‧‧‧Support column
331‧‧‧ring side
331a‧‧‧through slot
332‧‧‧ bottom
332a‧‧‧Perforation
332b‧‧‧Chamfering
400‧‧‧Joint clips
500‧‧‧Flexible parts
D1, D2‧‧‧ height

1 is a perspective view of a heat dissipating assembly according to a first embodiment of the present invention. Figure 2 is an exploded perspective view of Figure 1. Figure 3 is a schematic cross-sectional view of Figure 1. 4 is an enlarged schematic view of FIG. 3.

10‧‧‧Heat components

100‧‧‧ boards

150‧‧‧ Grounding shrapnel

200‧‧‧electronic chip

310‧‧‧ board

320‧‧‧ protruding structure

330‧‧‧Support column

331‧‧‧ring side

331a‧‧‧through slot

332‧‧‧ bottom

332a‧‧‧Perforation

332b‧‧‧Chamfering

400‧‧‧Joint clips

500‧‧‧Flexible parts

Claims (8)

A heat dissipation plate comprising: a plate body having an opposite first surface and a second surface; a protruding structure protruding from the first surface of the plate body and having a back surface facing the second surface a thermal contact surface; and a support post protruding from the first surface of the plate body, and the support post has a chamfer away from an outer edge of the plate body. The heat dissipation plate of claim 1, wherein the chamfer of the support column is a rounded or chamfered corner. The heat dissipation plate of claim 1, wherein the height of the first surface of the support column protruding from the plate body is greater than the height of the convex structure protruding from the first surface of the plate body. The heat dissipation plate of claim 1, wherein the support column comprises an annular side portion and a bottom portion, the annular side portion is mounted on the plate body and surrounds a through slot, the bottom portion being connected to the annular side portion away from One side of the plate body has a perforation communicating with the through groove. The heat dissipation plate of claim 1, wherein the protruding structure is a convex hull. A heat dissipating component comprising: a circuit board; an electronic chip stacked and electrically connected to the circuit board; and a heat sink according to any one of claims 1 to 5, wherein the heat sink is protruded The thermal contact surface of the structure is in thermal contact with the electronic wafer, and the support post of the heat sink abuts the circuit board. The heat dissipating component of claim 6, further comprising a grounding elastic piece, the supporting column is made of a conductive material, one side of the grounding elastic piece is mounted on the circuit board, and the other side of the grounding elastic piece is in contact with and electrically connected. On the support column. The heat dissipating component of claim 6, further comprising an engaging clip and an elastic member, the engaging clip passing through the supporting member of the elastic member and the heat dissipating plate, and being fastened to the circuit board to enable the The bottom of the support column is sandwiched between the elastic member and the circuit board.