TWM513457U - Lead frame material belt structure improvement - Google Patents
Lead frame material belt structure improvement Download PDFInfo
- Publication number
- TWM513457U TWM513457U TW104211795U TW104211795U TWM513457U TW M513457 U TWM513457 U TW M513457U TW 104211795 U TW104211795 U TW 104211795U TW 104211795 U TW104211795 U TW 104211795U TW M513457 U TWM513457 U TW M513457U
- Authority
- TW
- Taiwan
- Prior art keywords
- lead frame
- bonding
- strip
- base portion
- base
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
本創作係關於一種引線框架料帶結構改良；特別關於一種結合引線框架單元與導板架之特殊料帶結構者。The present invention relates to a lead frame strip structure improvement; in particular, a special strip structure that combines a lead frame unit and a guide frame.
按，引線框架是製造半導體分離式元件的基本部件，例如應用在組合成各式的二極體、電晶體等電子元件。而目前業界常見的一種引線框架結構，在現有技術製作上，均先係以一金屬料帶為基材(例如銅合金、鋁合金或者鐵合金材料)，在其金屬料帶上沖壓成型具有複數彼此相鄰的引線框架單元A(如第1圖所示)，然後，如第2圖所示，再以另一金屬料帶為基材，在其金屬料帶上沖壓成型複數個導板架B(俗稱銅夾子)，然後分別給予裁切，最後再利用液態的錫鉛溶料，加以粘結以利用導板架B與引線框架單元A間作為整流電橋(Bridge)。然而，現行引線框架料帶結構設計上，是將引線框架單元A與導板架B分別在不同的金屬料帶上製作，不僅製作過程繁複，而且料帶在裁切後存在許多廢料，如此，不但會造成生產成本的增加，亦會浪費料材的使用， 為一相當不便之設計。According to the lead frame, it is a basic component for manufacturing a semiconductor split type element, for example, an electronic component such as a diode or a transistor which is combined into various types. At present, a lead frame structure commonly used in the industry is produced by using a metal strip as a substrate (for example, a copper alloy, an aluminum alloy or a ferroalloy material) in the prior art, and stamping and forming on the metal strip has a plurality of Adjacent lead frame unit A (as shown in Fig. 1), and then, as shown in Fig. 2, another metal strip is used as a base material, and a plurality of guide frames B are stamped and formed on the metal strip. (commonly known as copper clips), and then separately cut, and finally using liquid tin-lead solution, bonding to use between the guide frame B and the lead frame unit A as a rectifier bridge. However, in the current lead frame strip structure design, the lead frame unit A and the guide frame B are respectively fabricated on different metal strips, which is not only complicated in the production process, but also has many scraps after the cutting, so Not only will it increase the cost of production, but it will also waste the use of materials. For a rather inconvenient design.
有鑒於此，上述引線框架料帶結構存在有的缺失與不便，是以，本創作人秉持著研究創作、精益求精的精神，利用專業知識，研究出一種引線框架料帶結構，在同一金屬料帶上結合了引線框架單元與導板架結構，如此，不僅可以節省料材、生產成本，而且將廢料做有效的利用，亦不會浪費料材的使用。In view of this, the above-mentioned lead frame strip structure has some defects and inconveniences, so that the creator holds the spirit of research creation and excellence, and utilizes professional knowledge to develop a lead frame strip structure in the same metal strip. The lead frame unit and the guide frame structure are combined, so that not only the material and the production cost can be saved, but also the waste can be effectively utilized, and the use of the material is not wasted.
為達上述目的，本創作所述的引線框架料帶結構，主要係於一金屬料帶上沖壓成型具有複數彼此相鄰的引線框架單元，每一引線框架單元均具有用以與一晶片粘接的一第一基部，及與第一基部相對應的一第二基部，其中，每個彼此相鄰的引線框架單元間具有與第二基部呈平行的一導板架結構。In order to achieve the above object, the lead frame strip structure of the present invention is mainly formed by stamping and forming a plurality of lead frame units adjacent to each other on a metal strip, each lead frame unit having a die for bonding with a wafer. a first base portion and a second base portion corresponding to the first base portion, wherein each of the lead frame units adjacent to each other has a guide frame structure parallel to the second base portion.
本創作所提出之一種引線框架料帶結構改良，其中，該第一基部上進一步具有一載片部，以供該晶片粘接。The lead frame strip structure of the present invention is improved, wherein the first base further has a carrier portion for bonding the wafer.
本創作所提出之一種引線框架料帶結構改良，其中，每一引線框架單元均具有供料帶卡位固定之一定位孔。The lead frame strip structure improved by the present invention, wherein each lead frame unit has one positioning hole for fixing the feeding belt card.
本創作所提出之一種引線框架料帶結構改良，其中，該等導板架結構與該等第二基部間具有維持適當間距型態之一橫結條。The lead frame strip structure of the present invention is improved, wherein the guide frame structure and the second base portion have a horizontal strip that maintains a proper spacing pattern.
本創作所提出之一種引線框架料帶結構改良，其中，該導板架結構上進一步具有一折部，以使該導板架結構前端 面形成有一第一粘接部及後端面形成有一第二粘接部。The lead frame strip structure improved by the present invention, wherein the guide frame structure further has a fold portion for the front end of the guide frame structure The surface has a first bonding portion and a rear surface formed with a second bonding portion.
本創作所提出之一種引線框架料帶結構改良，其中，該第一粘接部能與該晶片粘接，而第二粘接部能與該第二基部粘接。The lead frame strip structure improved by the present invention is improved in that the first bonding portion can be bonded to the wafer, and the second bonding portion can be bonded to the second base portion.
由於，本創作在同一金屬料帶上結合了引線框架單元與導板架結構，如此，不僅可以節省料材、生產成本，而且將原是引線框架的廢料做有效的利用，亦不會浪費料材的使用。Therefore, the creation combines the lead frame unit and the guide frame structure on the same metal strip, so that not only the material and the production cost can be saved, but also the waste material which is originally the lead frame can be effectively utilized, and the material is not wasted. The use of materials.
1‧‧‧料帶1‧‧‧Material
2‧‧‧引線框架單元2‧‧‧ lead frame unit
21‧‧‧第一基部21‧‧‧ First Base
211‧‧‧載片部211‧‧‧Loading Department
22‧‧‧第二基部22‧‧‧ Second Base
23‧‧‧橫結條23‧‧‧cross knots
24‧‧‧定位孔24‧‧‧Positioning holes
3‧‧‧導板架3‧‧‧Guide frame
31‧‧‧折部31‧‧‧Folding
32‧‧‧第一粘接部32‧‧‧First Bonding Department
33‧‧‧第二粘接部33‧‧‧Second Bonding Department
4‧‧‧晶片4‧‧‧ wafer
10‧‧‧引線框架結構10‧‧‧ lead frame structure
A‧‧‧現有技術的引線框架單元A‧‧‧ Prior art lead frame unit
B‧‧‧現有技術的導板架B‧‧‧Prior art guide frame
第1圖係為現有技術的引線框架料帶之平面示意圖。Figure 1 is a schematic plan view of a prior art lead frame strip.
第2圖係為現有技術的導板架料帶之平面示意圖。Figure 2 is a schematic plan view of a prior art guide frame strip.
第3圖係為本創作之引線框架料帶之立體圖。Figure 3 is a perspective view of the lead frame strip of the present creation.
第4圖係為本創作之引線框架料帶之平面示意圖。Figure 4 is a schematic plan view of the lead frame strip of the present invention.
第5圖係為本創作之引線框架與晶片及導板架粘接後立體示意圖。Figure 5 is a perspective view of the lead frame of the present invention bonded to the wafer and the guide frame.
由於本創作係揭露一種引線框架料帶結構，其所利用金屬料帶沖壓之相關原理已為相關技術領域具有通常知識者所能明瞭，故以下文中之說明，不再作完整描述。同時，以下文中所對照之圖式，係表達與本創作特徵有關之結構示意，並未亦不需要依據實際尺寸完整繪製，合先敘明。Since the present invention discloses a lead frame strip structure, the principle of the metal strip stamping utilized by the present invention is well known to those skilled in the relevant art, and therefore, the description below will not be fully described. At the same time, the drawings in the following texts express the structural schematics related to the creative features, and do not need to be completely drawn according to the actual size.
煩請參考第3圖，係為根據本創作之引線框架料帶結構之一較佳實施例，該料帶1結構為具有一導電性金屬料帶，例如已知銅或銅合金金屬類型，在該料帶1結構上沖壓成型具有複數彼此相鄰的引線框架單元2，每一引線框架單元2均具有一第一基部21，及與第一基部21相對應的一第二基部22，該第一基部21上進一步具有一載片部211，以供一晶片4粘接(如第5圖所示)，其中，每個彼此相鄰的引線框架單元2間具有與第二基部22呈平行的一導板架3結構，如此一來，在同一金屬料帶1上結合了引線框架單元2與導板架3結構，不僅可以節省料材、生產成本，而且將原有的廢料做有效的利用。Referring to FIG. 3, which is a preferred embodiment of the lead frame strip structure according to the present invention, the strip 1 is constructed to have a conductive metal strip, such as a known copper or copper alloy metal type. The strip 1 is structurally stamped and formed with a plurality of lead frame units 2 adjacent to each other, each lead frame unit 2 having a first base portion 21 and a second base portion 22 corresponding to the first base portion 21, the first The base portion 21 further has a carrier portion 211 for bonding a wafer 4 (as shown in FIG. 5), wherein each of the lead frame units 2 adjacent to each other has a parallel with the second base portion 22 The structure of the guide frame 3 is such that the structure of the lead frame unit 2 and the guide frame 3 is combined on the same metal strip 1, which not only saves material and production cost, but also effectively utilizes the original waste.
如第3圖至第5圖所示，該每一引線框架單元2均具有供料帶1卡位固定之一定位孔24，此外，該等導板架3結構與該等第二基部22間具有維持適當間距型態之一橫結條23，而該導板架3結構上進一步具有一折部31，以使該導板架3結構前端面形成有一第一粘接部32及後端面形成有一第二粘接部33，而該第一粘接部32能與該晶片4粘接，而第二粘接部33能與該第二基部22粘接，以成型一引線框架結構10，如第5圖所示。As shown in FIG. 3 to FIG. 5 , each lead frame unit 2 has a positioning hole 24 for fixing the feeding belt 1 , and the structure of the guiding frame 3 and the second base 22 are The cross member 23 has a cross-shaped strip 23, and the guide frame 3 further has a fold portion 31 so that the front end surface of the guide frame 3 is formed with a first bonding portion 32 and a rear end surface. There is a second bonding portion 33, and the first bonding portion 32 can be bonded to the wafer 4, and the second bonding portion 33 can be bonded to the second substrate 22 to form a lead frame structure 10, such as Figure 5 shows.
藉由前述結構，請參考第3圖至第4圖所示，本創作由於在同一金屬料帶1上結合了引線框架單元2與導板架3結構，使得製作上不僅可以節省料材、生產成本，而且導板架3結 構部份是將原引線框架單元2廢料做有效的利用，另外，值得一提的事，在同一金屬料帶1上設計了引線框架單元2與導板架3結構，並不需要增加裁切次數，都可以一起裁切，即可獲取引線框架單元2與導板架3結構，而且本次裁切導板架3結構，亦可做為下次的或與往後的引線框架單元2粘結架接，以成型一引線框架結構10。With the foregoing structure, please refer to FIGS. 3 to 4, the present invention combines the structure of the lead frame unit 2 and the guide frame 3 on the same metal strip 1, so that the production can not only save material, but also produce. Cost, and the guide frame 3 knot The structure part is to make effective use of the original lead frame unit 2 waste. In addition, it is worth mentioning that the lead frame unit 2 and the guide frame 3 structure are designed on the same metal strip 1, and no need to increase the cutting. The number of times can be cut together, and the structure of the lead frame unit 2 and the guide frame 3 can be obtained, and the structure of the cutting guide frame 3 can be used as the next or subsequent lead frame unit 2 Bonding is performed to form a lead frame structure 10.
以上所述僅為本創作之較佳實施例，並非用以限定本創作之申請專利權利；同時以上的描述，對於熟知本技術領域之專門人士應可明瞭及實施，因此其他未脫離本創作所揭示之精神下所完成的等效改變或修飾，均應包括在申請專利範圍中。The above description is only a preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention; at the same time, the above description should be understood and implemented by those skilled in the art, so that the other does not deviate from the present invention. Equivalent changes or modifications made in the spirit of the disclosure should be included in the scope of the patent application.
1‧‧‧料帶1‧‧‧Material
2‧‧‧引線框架單元2‧‧‧ lead frame unit
21‧‧‧第一基部21‧‧‧ First Base
211‧‧‧載片部211‧‧‧Loading Department
22‧‧‧第二基部22‧‧‧ Second Base
23‧‧‧橫結條23‧‧‧cross knots
24‧‧‧定位孔24‧‧‧Positioning holes
3‧‧‧導板架3‧‧‧Guide frame
31‧‧‧折部31‧‧‧Folding
32‧‧‧第一粘接部32‧‧‧First Bonding Department
33‧‧‧第二粘接部33‧‧‧Second Bonding Department
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104211795U TWM513457U (en) | 2015-07-22 | 2015-07-22 | Lead frame material belt structure improvement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104211795U TWM513457U (en) | 2015-07-22 | 2015-07-22 | Lead frame material belt structure improvement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM513457U true TWM513457U (en) | 2015-12-01 |
Family
ID=55408464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104211795U TWM513457U (en) | 2015-07-22 | 2015-07-22 | Lead frame material belt structure improvement |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM513457U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904137A (en) * | 2019-01-28 | 2019-06-18 | 苏州技泰精密部件有限公司 | The stable lead frame circuit material strip of processing procedure, manufacturing method and product install shell |
-
2015
- 2015-07-22 TW TW104211795U patent/TWM513457U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109904137A (en) * | 2019-01-28 | 2019-06-18 | 苏州技泰精密部件有限公司 | The stable lead frame circuit material strip of processing procedure, manufacturing method and product install shell |
| CN109904137B (en) * | 2019-01-28 | 2024-05-17 | 苏州技泰精密部件有限公司 | Lead frame circuit material tape with stable manufacturing process, manufacturing method and product mounting shell |
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