TWM511675U - Detection apparatus for wafer position - Google Patents

Description

Wafer positioning identification device

The present invention provides a wafer positioning and identification device, and more particularly relates to a wafer positioning and identification device for rapidly positioning a wafer by using a mark formed by a non-destructive method to increase the effective area of the wafer and the positioning accuracy.

Press, the semiconductor wafer is loaded into a variety of reaction chambers/processing chambers (hereinafter referred to as process chambers) for processing in a semiconductor process. A typical automated device is a properly repetitive robotic arm that performs wafer transfer operations. The robot arm is disposed in a transfer processing chamber that can access one or more process chambers connected to the transfer processing chamber. It is important to place the wafer in the optimal position in the process chamber. The accuracy of the center position and azimuth angle of the wafer in the process chamber has a significant impact on process yield. Therefore, accurate location identification will help maximize and optimize the process benefits of the wafer.

It is known to determine the center point and orientation of the wafer at the initial position by manually, manually, and visually identifying the notch of the edge of the wafer to an azimuth index. However, the error of this method is very large, and it is not possible to accurately rotate the wafer by a predetermined angle according to the needs of subsequent processing procedures, which has an adverse effect on the yield and efficiency of wafer processing. Another common scheme is on the wafer. A transmissive sensor is mounted on the edge to detect the presence of a corner notch (Notch), and the orientation of the wafer is determined based on the position of the notch. This penetrating sensor may be affected by parameters such as wafer thickness, substrate material, surface treatment, etc., resulting in misjudgment. In addition, the notch reference point must be visible to the worker, so it typically extends from a few microns to a few centimeters, resulting in considerable space loss on the wafer.

Therefore, how to solve the above problems and deficiencies in the past, that is, the applicants of the new type and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in view of the above-mentioned shortcomings, the applicants of this new type have collected relevant information, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, they have designed this kind of rapid and accurate design. A new patent holder of a wafer location identification device that performs position identification of the wafer and that does not affect the use of the wafer.

The main purpose of the novel is to quickly locate the wafer by markings formed by non-destructive techniques to increase the effective area of the wafer and the positioning accuracy.

Another main purpose of the present invention is to improve the practicality of wafer identification by combining the identification method of the notch reference point (Notch).

In order to achieve the above object, the structure of the present invention comprises: a wafer body, and forming, by means of non-destructive means, a plurality of marking patterns each having a different shape from each other, and having at least one for detecting the markings The detecting device of the graphic portion transmits a detecting signal to the marking graphic portion, and returns a positioning signal by the marking graphic portion to interpret the correct position and the corresponding angle of the wafer body; When the present invention is used as an identification device for wafer positioning, a plurality of different shape and shape graphic portions are formed by non-destructive means before the wafer body is different, and the relative position information of the graphic pattern portions and the wafer body is recorded, and then Using the detecting device to transmit a detecting signal to one of the marking graphics portions, and returning a positioning signal by the marking graphics portion, and then interpreting the positioning signal to identify the correct position and corresponding angle of the wafer body, and finally according to the above message The wafer is adjusted to the correct angular position. If the detection signal transmitted by the detecting device does not detect the presence of the marked graphic portion, the positioning signal will not be returned.

With the above technology, it is possible to solve the problem that the positioning accuracy of the notched angle reference point (notch) is low and the available space of the wafer is reduced, and the positioning speed still has room for improvement. Practical advancement of the above advantages.

1, 1a‧‧‧ wafer body

2, 2a‧‧‧ marking graphics department

3, 3a‧‧‧Detection device

31‧‧‧Lighting components

32‧‧‧Lens module

4a‧‧‧Neck angle identification department

The first figure is a perspective view of a preferred embodiment of the present invention.

The second drawing is a partial enlarged view of the preferred embodiment of the present invention.

The third figure is a schematic diagram of the implementation of the preferred embodiment of the present invention.

The fourth figure is a schematic diagram of the implementation of another embodiment of the present invention.

In order to achieve the above objects and effects, the technical means and structure adopted by the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions thereof are as follows.

Please refer to the first, second and third figures, which are perspective views, partial enlarged views and implementation diagrams of the preferred embodiment of the present invention. It can be clearly seen from the figure that the novel system includes: a wafer body 1; a plurality of non-destructive means formed on the wafer pattern 1 at different points of the graphic pattern portion 2, each of the label pattern portions 2 being one of geometric shapes or symbols different in shape from each other; at least one for detection The detecting device 3 for detecting the graphic portion 2 transmits a detecting signal to the marking pattern portion 2, and returns a positioning signal from the marking pattern portion 2 to interpret the correct position of the wafer body 1. And the corresponding detection device 3 includes a light-emitting component 31 for illuminating the indicator pattern portions 2 and a lens module 32 disposed on a side of the light-emitting component 31. The lens module 32 is provided for The light-emitting component 31 is received by the light-receiving component 2 and imaged for recognition.

With the above description, the structure of the present technology can be understood, and according to the corresponding cooperation of the structure, the advantage of fast and precise positioning without affecting the space of the wafer can be achieved, and the detailed explanation will be described below.

For the purpose of the present invention, the relative angle between the number of the wafer and the plurality of marking patterns 2 can be measured in advance (the marking pattern portion 2 of the embodiment is exemplified by three), and the wafer body 1 is in phase. The non-destructive means forms a plurality of different graphic patterns 2 (the non-destructive means may be transfer, floating, painting, etc.), and then records the relative positions of the graphic portions 2 and the wafer body 1. The information, the illumination component 31 of the detection device 3 transmits a detection signal to one of the indication patterns 2, and causes the indication pattern portion 2 to reflect back the reflected image as a result by the principle that the incident angle is equal to the reflection angle. The positioning signal is then received by the lens module 32 to detect the light reflected by the graphic portion 2 for imaging device 3 to interpret the positioning signal to identify the correct position and corresponding angle of the wafer body 1. Therefore, in the identification process, as long as any one of the graphic portions 2 is found, the corresponding positioning signal can be returned; otherwise, if the graphic portion 2 is not found, the positioning signal is not returned, thereby the detecting device 3 determines the wafer body. 1 position.

The reflected light used in the above operation is not particularly limited in the selection of the light source. In addition, this new When applied to a bare wafer without a blue film, the surface thereof is mirror-finished, so that the light-emitting component 31 and the lens module 32 of the detecting device 3 must have a certain angle to have better imaging, and the light-emitting component The optimum incident angle and reflection angle of the illumination pattern portion 2 are 45 degrees.

Please also refer to the fourth embodiment, which is a schematic diagram of another embodiment of the present invention. It can be clearly seen from the figure that a plurality of marking patterns 2a and at least one corner are simultaneously present on the wafer body 1a. The identification unit 4a, through the selective detection or double detection of the detection device 3a, enables the new type of detection mode to improve the practicality and accuracy of the wafer identification.

However, the above description is only the preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, all the simple modifications and equivalent structural changes that are made by using the present specification and the drawings are the same. It is included in the scope of this new patent and is given to Chen Ming.

Therefore, please refer to all the drawings, when compared with the conventional technology, the present invention has the following advantages:

1. The marking pattern portion 2 is formed on the wafer body 1 by non-destructive means, so that the effective space of the wafer body 1 itself is not affected, and the usability is higher than that of the conventional technology, and the cost is indirectly saved.

2. In actual operation, as long as any one of the graphic parts 2 is found, the correct position and corresponding angle of the entire wafer body 1 can be quickly and accurately obtained, which is more favorable for accurately placing the wafer in the processing chamber. Ideal location.

Third, the identification by reflection can reduce the influence of external factors such as wafer thickness and substrate material, and improve the identification accuracy.

Fourth, it can be backward compatible with the identification method of the reference point of the conventional missing angle to enhance the practicability of the new model.

In summary, the novel wafer positioning and identification device can achieve its efficacy and purpose when it is used. Therefore, the novel is a new type of application with excellent practicability, and is suitable for the application requirements of the new patent. I hope that the trial committee will grant this new type as soon as possible to protect the applicant's hard work. If there is any doubt in the trial committee, please do not hesitate to give instructions, the creator will try his best to cooperate and feel good.

1‧‧‧ Wafer Ontology

2‧‧‧Marking Graphic Department

3‧‧‧Detection device

31‧‧‧Lighting components

32‧‧‧Lens module

Claims (6)

A wafer positioning and recognizing device, comprising: a wafer body; a plurality of non-destructive means formed on the marked graphic portion of the wafer body at different places, each of the marking graphic portions having different shapes; and at least one for detecting The detecting device for detecting the graphic pattern portion transmits a detecting signal to the marking graphic portion, and a positioning signal is returned from the marking graphic portion to interpret the correct position and the corresponding angle of the wafer body. The wafer positioning and identification device of claim 1, wherein each of the indicator graphic portions is one of geometric shapes or symbols having different shapes. The wafer positioning device of claim 1, wherein the detecting device comprises a light emitting component for illuminating the marking patterns, and a lens module disposed on a side of the light emitting component, The lens module is configured to receive light of the light-emitting component reflected by the indicator graphic portions for imaging and identification. The wafer positioning and identification device of claim 3, wherein the illumination unit illuminates the indicator patterns with an optimum incident angle and a reflection angle of 45 degrees. The wafer location identification device of claim 3, wherein the positioning signal is a reflection image of the graphic portion. The wafer positioning and identification device of claim 1, wherein the wafer body has at least one notch identifying portion, and the correct position and corresponding angle of the wafer body are interpreted by detecting the detecting device. .