TWM508857U - Remote controller with fingerprint recognition - Google Patents

Description

Remote control with fingerprint recognition

This creation is about a remote control, especially a remote control with fingerprint recognition.

With the development of information, various types of TV programs are invisibly broadcasted around us. Most of them are educational, but there are still other programs that are not suitable for underage adults, such as bloody, violent, and twilight. Such programs, and these programs are also likely to have a negative impact on the growth of these minors.

In addition, with the development of technology, smart TVs are gradually becoming popular. When users want to watch certain channels, they need to pay more, but there is no ideal way to authenticate various payment mechanisms. . In other words, it is highly probable that a minor will pay if the parent does not agree, resulting in a family conflict. Therefore, a biometric verification mechanism is still needed at the time of payment to determine whether it is the correct payer.

Therefore, how to provide a biometrics inspection mechanism to overcome the above-mentioned shortcomings has become one of the important topics to be solved by this undertaking.

In view of the above problems, the present invention provides a remote control with fingerprint recognition function, which can set the fingerprint recognition module on the outer casing to allow the correct user to perform certain operations.

In order to achieve the above object, the present invention provides a remote control with a fingerprint recognition function, which includes an outer casing, a fingerprint identification module, and a control System module. The outer casing has an accommodating space. The fingerprint recognition module is disposed in the accommodating space of the outer casing. The control module is electrically connected to the fingerprint recognition module to control the fingerprint identification module.

The beneficial effect of the present invention may be that the remote control with the fingerprint recognition function provided by the present embodiment can perform fingerprint identification by the fingerprint recognition module disposed on the remote controller, so that it can be performed by the correct user. These specific operations, and by placing the miniaturized fingerprint recognition module in the remote controller, the fingerprint recognition module and the remote controller are integrated.

Further, the conventional fingerprint identification module mainly includes a substrate, a wafer, and a sealant. The wafer is disposed on the substrate and electrically connected to the substrate, and the encapsulant covers the surface of the substrate and a portion of the wafer for fixing the wafer and protecting the wires. In addition, the encapsulant needs to expose the sensing area of the wafer for finger fingerprint sensing. However, when the finger touches the sensing area of the wafer, the wafer will withstand the force from the finger. Therefore, the wafer is liable to cause cracks in the wafer due to repeated stresses. In addition, the wafer is exposed to the air and is touched by the fingers. Dust particles in the external environment or oil or water marks on the fingers may cause distortion of the wafer. Therefore, the thinning thickness of the mold layer, the color layer and the protective layer provided by the fingerprint identification module of the present invention can avoid the sensing of the fingerprint recognition wafer.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

P‧‧‧Remote control

1‧‧‧ outer casing

11‧‧‧ outer surface

12‧‧‧ inner wrap surface

2‧‧‧Fingerprint Identification Module

21‧‧‧Substrate

211‧‧‧ first surface

212‧‧‧ second surface

213‧‧‧ pads

214‧‧‧Signal connection

22‧‧‧Fingerprinting chip

23‧‧‧Mold seal layer

24‧‧‧Encapsulation layer

241‧‧‧ upper surface

242‧‧‧ lower surface

243‧‧‧Color layer

244‧‧‧protection layer

25‧‧‧ wire

26‧‧‧Outer wrap surface

27‧‧‧protection frame

271‧‧‧Shell

272‧‧‧ slotting

3‧‧‧Control Module

4‧‧‧Signal transmission module

C‧‧‧TV

S1‧‧‧ accommodating space

H1, H2‧‧‧ distance

F‧‧‧ finger

FIG. 1 is a perspective exploded view of a remote controller with a fingerprint recognition function according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a three-dimensional combination of a remote controller with a fingerprint recognition function according to an embodiment of the present invention.

FIG. 3 is a schematic top view of a remote controller with a fingerprint recognition function according to an embodiment of the present invention.

4 is a fingerprint identification of a remote controller with fingerprint recognition function according to the first embodiment of the present invention A schematic cross-sectional view of the module.

FIG. 5 is a cross-sectional view of the fingerprint identification module of the remote controller with fingerprint recognition function according to the second embodiment of the present invention.

FIG. 6 is a cross-sectional view showing the fingerprint identification module of the remote controller with fingerprint recognition function according to the third embodiment of the present invention.

FIG. 7 is a cross-sectional view showing the fingerprint identification module of the remote controller with fingerprint recognition function according to the fourth embodiment of the present invention.

Figure 8 is a cross-sectional view of Figure 7.

FIG. 9 is a block diagram of a module of a remote controller with a fingerprint recognition function according to an embodiment of the present invention.

FIG. 10 is a perspective view showing the state of use of the remote controller with the fingerprint recognition function according to the embodiment of the present invention.

The following describes the implementation of the "remote controller with fingerprint recognition function" disclosed in the present specification by a specific specific example. Those skilled in the art can easily understand other advantages and effects of the present invention by the contents disclosed in the present specification. The present invention can also be implemented or applied by various other specific embodiments. The details of the present specification can also be modified and changed without departing from the spirit of the present invention. The drawing of this creation is only a brief description, and is not depicted in actual size, that is, the actual size of the relevant composition is not reflected, which will be described first. The following embodiments are intended to further explain the related technical content of the present invention, but are not intended to limit the technical scope of the present creation.

[First Embodiment]

First, referring to FIG. 1 to FIG. 3 and FIG. 10, the first embodiment of the present invention provides a remote controller P having a fingerprint recognition function, which includes an outer casing 1, a fingerprint recognition module 2, and a control module. The control module 3 can be electrically connected to the fingerprint recognition module 2 to control the fingerprint recognition module 2. Thereby, the user can move the finger F to the fingerprint recognition module 2, and the fingerprint recognition module 2 disposed on the remote controller P Fingerprint identification is performed to achieve the biometric function of the remote controller P, thereby performing the opening of certain specific channels or performing a mechanism for payment authentication. Further, the remote controller P can further include a signal transmission module 4, and the control module 3 can be electrically connected to the signal transmission module 4 to control the signal transmission module 4. For example, the signal transmission module 4 can be an infrared signal transmitter to control the selection of the channel of the television C or the operation of other functions.

Then, as shown in FIG. 1 , specifically, the outer casing 1 can include an accommodating space S1 , and the accommodating space S1 can be formed by a groove and formed on the outer casing 1 to use the fingerprint recognition module. 2 is disposed in the accommodating space S1 of the outer casing 1. The control module 3 can be electrically connected to the fingerprint recognition module 2 to control the fingerprint recognition module 2. For example, the outer casing 1 has an outer surface 11 and an inner circumferential surface 12, and the inner circumferential surface 12 surrounds the accommodating space S1. The fingerprint recognition module 2 can be disposed in the accommodating space S1 by using a wire. It is electrically connected to the foregoing control module 3, but the creation is not limited thereto. Preferably, the fingerprint recognition module 2 has an outer circumferential surface 26, and the outer circumferential surface 26 of the fingerprint recognition module 2 may have the same shape as the inner circumferential surface 12. In other words, the fingerprint recognition module 2 can be embedded or disposed in the accommodating space S1. It is worth mentioning that a main substrate (not shown) may be disposed inside the outer casing 1. The fingerprint identification module 2, the control module 3, and the signal transmission module 4 may be disposed on the main substrate. Will be electrically connected to each other.

Next, referring to FIG. 4 , the fingerprint identification module 2 can include a substrate 21 , a fingerprint identification chip 22 , a molding layer 23 , and an encapsulation layer 24 . The substrate 21 can have a first surface 211, a second surface 212 opposite to the first surface 211, and a plurality of pads 213. The first surface 211 and the second surface 212 of the substrate 21 may be respectively located on two sides of the substrate 21, and the plurality of pads 213 may be exposed on the first surface 211 or the second surface 212.

In the above, one or more fingerprint recognition wafers 22 can be electrically connected to the substrate 21. For example, the fingerprint recognition chip 22 can be a capacitive touch recognition fingerprint chip. In addition, in the present embodiment, the fingerprint identification module 2 further includes At least one wire 25 and at least one wire 25 can be electrically connected between the fingerprint identification chip 22 and the plurality of pads 213 of the substrate 21 by wire bonding. The shortest distance H1 between the highest point of the wire 25 relative to the first surface 211 of the substrate 21 to the top layer of the fingerprint recognition wafer 22 may be between 20 and 30 μm.

It should be noted that, in the embodiment, the wire 25 can be electrically connected to the fingerprint identification chip 22 and the pad 213 by means of reverse wire bonding. One end of the wire 25 is first connected to the pad 213 of the substrate 21, and the other end of the wire 25 is pulled up to the fingerprint recognition wafer 22. Reverse wire bonding can reduce the height of wire 25 as compared to the general way of positive wire bonding. That is, the distance H1 between the highest point of the wire 25 relative to the first surface 211 of the substrate 21 to the top layer of the fingerprint recognition wafer 22 is lower than when the wire is being positively wound.

In the above, the molding layer 23 can be disposed on the substrate 21, and the molding layer 23 can cover the fingerprint identification wafer 22, the wires 25, and the pads 213. For example, the mold layer 23 can be formed by high pressure injection molding, however, the present invention is not limited thereto. For example, in other embodiments, the mold layer 23 may be formed by a compression molding method. It is worth mentioning that the material of the encapsulation layer 23 may include aluminum oxide or hafnium oxide, and the shortest distance from the top end of the encapsulation layer 23 to the fingerprint recognition wafer 22 is about 40 to 180 μm. In addition, after the molding layer 23 is formed, the polishing layer 23 can be polished by mechanical grinding, but the creation is not limited thereto. Thereby, after the thinning, the mold layer 23 may have an abrasive surface such that the shortest distance H2 of the abrasive surface of the mold layer 23 to the fingerprint recognition wafer 22 may be between about 35 and 80 μm. It should be noted that the resin, oil, wax, or colloid originally covering the surface of the mold layer 23 can be removed by the grinding surface of the mold layer 23, so that the subsequent encapsulation layer 24 can be It is easier to arrange on the mold layer 23.

Next, the encapsulation layer 24 may be disposed on the encapsulation layer 23. For example, the encapsulation layer 24 may be a color protection layer, and the color protection layer may have a material of aluminum oxide, and the color protection layer is a layer of color and has both hydrophobic and oleophobic properties. Sex. In detail, in the present embodiment, the color protective layer may be formed on the surface of the mold layer 23 by a sputtering technique or an inkjet technique. It should be noted that in other embodiments, coating may also be utilized. Printing, electroplating, evaporation, vacuum sputtering, etc. to form a color protective layer, this creation is not limited to this. It is worth mentioning that the thickness of the color protective layer is between 10 and 40 μm. Thereby, the color protective layer can be of the same color as the outer casing 1, so that the outer casing 1 and the fingerprint recognition module 2 can be integrally formed by the appearance. In addition, when the user's finger touches, the color protection layer can reduce the fingerprint recognition wafer 22 from oil or water marks on the finger and dust particles or moisture in the external environment, resulting in distortion of the fingerprint recognition wafer 22 chance.

Next, the encapsulation layer 24 can have an upper surface 241 and a lower surface 242 opposite to the upper surface 241 of the encapsulation layer 24. The lower surface 242 of the encapsulation layer can be disposed on the encapsulation layer 23, and the lower surface 242 of the encapsulation layer 24 can be It is disposed on the mold layer 23, and the upper surface 241 of the encapsulation layer 24 is flush with the outer surface 11 of the outer casing 1. Therefore, when the user uses the remote controller P with the fingerprint recognition function provided by the present creation, the fingerprint recognition module 2 and the outer casing 1 can be smooth to the touch.

[Second embodiment]

First, as shown in FIG. 5, the second embodiment of the present invention provides a remote control device P having a fingerprint recognition function, which includes an outer casing 1, a fingerprint recognition module 2, and a control module 3. The comparison between FIG. 5 and FIG. 4 shows that the maximum difference between the second embodiment and the first embodiment is that the encapsulation layer 24 provided in the second embodiment may include a color layer 243 and a protective layer 244. The color layer 243 may be used. The protective layer 244 may be disposed on the color layer 243. The arrangement method and sequence of the substrate 21, the fingerprint identification wafer 22, the mold layer 23, and the outer casing 1 are the same as those of the previous embodiment, and will not be further described herein.

In view of the above, for example, the color layer 243 can be attached to the surface of the mold layer 23. In the present embodiment, the color layer 243 can be formed on the surface of the mold layer 23 by a sputtering technique. After the sputtering is completed, the color layer 243 can make the surface of the aluminum oxide appear A variety of colors. In addition, the color layer 243 has a thickness of between 10 and 40 μm. It should be noted that in other embodiments, the color layer 243 may be formed by a method such as coating, inkjet, electroplating, vapor deposition, vacuum sputtering, etc., and the present invention is not limited thereto. In addition, in other embodiments, if there is no special color requirement, the encapsulation layer 24 may not have the color layer 243, but only one protective layer 244.

In the above, the protective layer 244 is formed over the color layer 243. The protective layer 244 may be formed on the color layer 243 by inkjet, coating, printing, or sputtering. It should be noted that the material of the protective layer 244 has the characteristics of hydrophobicity and oleophobicity. In addition, the protective layer 244 may be transparent and colorless, and the protective layer 244 has a thickness of between 2 and 4 μm. Thereby, since the protective layer 244 is transparent and colorless, the color of the color layer 243 located below can be displayed. In addition, the material of the protective layer 244 is hydrophobic and oleophobic. When the user's finger touches, the protective layer 244 can reduce the fingerprint identification wafer 22 from oil or water marks on the finger and dust particles in the external environment or It is moisture, which causes the fingerprint recognition wafer 22 to have an opportunity to be distorted.

In addition, it should be noted that in the second embodiment, the shortest distance H2 of the surface of the encapsulation layer 23 to the fingerprint recognition wafer 22 may be between 35 and 80 μm, and the thickness of the color layer 243 may be between 10 and 40 μm. Meanwhile, the thickness of the protective layer 244 may be between 2 and 4 μm. In addition, the dielectric constant of the mold layer 23, the color layer 243, and the protective layer 244 may be between 7 and 45. In other words, the height from the top of the protective layer 244 to the fingerprint recognition wafer 22 is very thin and the dielectric constant is high. Therefore, the encapsulation layer 23, the color layer 243, and the protective layer 244 do not affect the recognition function of the fingerprint recognition wafer 22. In other words, when the user's finger touches the surface of the protective layer 244, the fingerprint recognition wafer 22 can identify the user's fingerprint.

As described above, in the present embodiment, the material of the mold layer 23, the color layer 243, and the protective layer 244 is aluminum oxide. However, in other embodiments, the mold layer 23, the color layer 243, and the protective layer 244 may also be oxides or carbides of aluminum, titanium, chromium, zirconium, hafnium, such as alumina, titania, titanium carbide, Chromium oxide, cerium oxide, chromium carbide, zirconium oxide, zirconium carbide, or a combination thereof. And the sealing layer 23, color The color coefficient of the color layer 243 and the protective layer 244 may be between 7 and 45, but the present invention is not limited thereto. In addition, the mold layer 23, the color layer 243, and the protective layer 244 can withstand temperatures of 250 to 300 degrees without deterioration or cracking on the surface thereof.

[Third embodiment]

Referring to FIG. 6, the third embodiment of the present invention provides a remote control device P having a fingerprint recognition function, which includes an outer casing 1, a fingerprint recognition module 2, and a control module 3. As can be seen from the comparison between FIG. 6 and FIG. 4, the greatest difference between the third embodiment and the first embodiment is that the encapsulation layer 24 can simultaneously cover the outer surface 11 of the encapsulation layer 23 and the outer casing 1. In other words, the fingerprint recognition module 2 having the substrate 21, the fingerprint recognition wafer 22, and the mold layer 23 may be first disposed on the outer casing 1. The encapsulation layer 24 is simultaneously disposed on the outer surface 11 of the encapsulation layer 23 and the outer casing 1 by a coating process or an inkjet process, so that the outer casing 1 and the fingerprint identification module 2 are both hydrophobic and oleophobic. Characteristics. Thereby, the fingerprint recognition module 2 and the outer casing 1 can have the same color of color. By appearance, the fingerprint recognition module 2 and the outer casing 1 are integrally formed, and the fingerprint recognition module 2 and the outer casing 1 have a common smooth surface. In other words, the upper surface 241 of the encapsulation layer 24 of the fingerprint recognition module 2 can be flush with the outer surface 11 of the outer casing 1. In addition, it should be noted that although the figure shows that the top end of the molding layer 23 is flush with the outer surface 11 of the outer casing 1, in other embodiments, the top end of the molding layer 23 may be lower than the outer casing. The outer surface 11 of the body 1 is either higher than the outer surface 11 of the outer casing 1.

It is worth mentioning that, since the fingerprint identification module 2 and the outer casing 1 share an encapsulation layer 24, that is, the fingerprint identification module 2 and the outer casing 1 have the same color protection layer, the fingerprint identification module 2 can be made. The thickness is thinner. Therefore, the signal connection end 214 or the pad 213 can be disposed on the second surface 212 of the substrate 21 by the added space, so as to be electrically connected to the control module 3, but the creation is not limited thereto. .

[Fourth embodiment]

First, please refer to FIG. 7 and FIG. 8. As can be seen from the comparison between FIG. 7 and FIG. 5, The maximum difference between the fourth embodiment and the second embodiment is that the remote controller P having the fingerprint recognition function provided by the fourth embodiment further includes a protection frame 27, and the substrate 21 of the fingerprint recognition module 2 is further A plurality of signal connections 214 can be further included. Thereby, when a finger or other object contacts the fingerprint recognition wafer 22, the protection frame 27 can bear the force exerted by a part of the finger or other object, so that the protection frame 27 can be used to strengthen the overall structural strength of the fingerprint recognition module 2. In addition, the protective frame 27 can also transmit static electricity from a finger or other object, so that the protective frame 27 can provide the use of the fingerprint recognition wafer 22 for electrostatic discharge protection. In addition, the shape of the encapsulation layer 24 may be further changed such that the encapsulation layer 24 is flush with the upper surface of the protective frame 27. In other words, the protective layer 244 has a stepped shape. In addition, it should be noted that the substrate 21, the fingerprint identification wafer 22, the mold layer 23, the encapsulation layer 24, the color layer 243, the protective layer 244, and the outer casing 1 are arranged in the same manner and in the same manner as the previous embodiment. Do not make more details.

The protection frame 27 can be disposed on the substrate 21, and the protection frame 27 has a housing 271 and a slot 272. The slot 272 is disposed on the housing 271, and the fingerprint recognition chip 22 can be disposed in the slot 272. . In detail, in the present embodiment, the encapsulation layer 24 can abut against the top of the protection frame 27, and the second surface 212 of the substrate 21 can be at the same level as the bottom of the protection frame 27. In actual operation, since the bottom of the protective frame 27 and the second surface 212 of the substrate 21 are located on the same horizontal surface, the solder balls can be disposed at the bottom of the protective frame 27, so that the area where the solder balls are disposed can be increased. In addition, a plurality of signal connection ends 214 can be disposed on the second surface 212 of the substrate 21 to be electrically connected to the control module 3 shown in the foregoing embodiment.

[Effective effect of the embodiment]

In summary, the creative effect of the present invention may be that the remote control device P with the fingerprint recognition function provided by the present embodiment can perform fingerprint identification by the fingerprint recognition module 2 disposed on the outer casing 1. In addition, the fingerprint recognition module 2 includes a substrate 21, a fingerprint recognition wafer 22, a mold layer 23, a color layer 243, and a protective layer 244. The encapsulation layer 23, the color layer 243, and the protective layer 244 cover the fingerprint recognition wafer 22. Due to mode The thickness of the capping layer 23, the color layer 243, and the protective layer 244 are thin, and thus do not affect the sensing of the fingerprint recognition wafer. It is worth mentioning that the fingerprint recognition module 2 can be the same color as the outer casing 1 of the remote controller P by the color layer 243 or the color protection layer. And by providing the miniaturized fingerprint recognition module 2 in the remote controller P, the fingerprint recognition module 2 and the remote controller P are integrated.

The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the schema are included in the scope of protection of the present creation. .

P‧‧‧Remote control

1‧‧‧ outer casing

11‧‧‧ outer surface

12‧‧‧ inner wrap surface

2‧‧‧Fingerprint Identification Module

241‧‧‧ upper surface

26‧‧‧Outer wrap surface

3‧‧‧Control Module

4‧‧‧Signal transmission module

S1‧‧‧ accommodating space

Claims (12)

A remote control with a fingerprint recognition function, comprising: an outer casing having an accommodating space; a fingerprint identification module, wherein the fingerprint identification module is disposed in the accommodating space of the outer casing And a control module, the control module is electrically connected to the fingerprint recognition module to control the fingerprint identification module. The remote controller having the fingerprint recognition function of claim 1, wherein the fingerprint recognition module comprises: a substrate having a first surface, a second surface relative to the first surface, and a plurality of pads, the first surface and the second surface are respectively located on two sides of the substrate, and a plurality of the pads are exposed on the first surface or the second surface; a fingerprint identification a chip, the fingerprint identification chip is electrically connected to the substrate; a mold layer, the mold layer is disposed on the substrate, and the mold layer covers the fingerprint recognition chip; and an encapsulation layer The encapsulation layer is disposed on the mold layer. The fingerprint identification module further includes: at least one wire, at least one of the wires is electrically connected between the fingerprint identification chip and the substrate, Wherein the molding layer covers at least one of the wires. The remote controller having the fingerprint recognition function according to claim 2, wherein the encapsulation layer is a color protection layer. The remote control device with the fingerprint recognition function of claim 2, the fingerprint identification module further includes: a protection frame, the protection frame is disposed on the substrate, and the protection frame has a casing and a slot is disposed on the housing, wherein the fingerprint recognition chip is disposed in the slot. A remote controller having a fingerprint recognition function according to claim 2, wherein a shortest distance from a surface of the mold layer to the fingerprint recognition wafer is between 45 and 80 μm. The remote controller having the fingerprint recognition function according to claim 2, wherein the encapsulation layer has an upper surface and a lower surface opposite to the upper surface of the encapsulation layer, and the outer casing has an outer surface. The lower surface of the encapsulation layer is disposed on the mold layer, and the upper surface of the encapsulation layer is flush with the outer surface of the outer casing. The remote controller having the fingerprint recognition function of claim 2, the substrate further comprising: at least one signal connection end, wherein at least one of the signal connection ends is disposed on the second surface of the substrate, thereby Electrically connected to the control module. The remote controller having the fingerprint recognition function according to claim 2, wherein the encapsulation layer comprises a color layer and a protection layer, the color layer is disposed on the mold layer, and the protection layer is disposed on the On the color layer. The remote controller with fingerprint identification function according to claim 9, wherein the material of the mold layer, the color layer, and the protective layer comprises aluminum oxide, aluminum oxide, titanium oxide, cerium oxide, and carbonization. Titanium, chromium oxide, chromium carbide, zirconium oxide, zirconium carbide, or a combination thereof. The remote controller having the fingerprint recognition function according to claim 9, wherein the mold layer, the color layer, and the protective layer have a dielectric constant of between 7 and 45. A remote controller having a fingerprint recognition function according to claim 2, wherein the outer casing has an outer surface, and the encapsulation layer is simultaneously disposed on the outer surface of the mold layer and the outer casing.