TWM508785U - Cutting mechanism of semiconductor terminal manufacturing machine - Google Patents

Description

Cutting mechanism of semiconductor terminal manufacturing machine

The present invention relates to a cutting mechanism for a semiconductor terminal manufacturing machine, and more particularly to a cutting mechanism for a semiconductor terminal manufacturing machine which increases wire diameter and has better tangential efficiency and quality.

Generally, semiconductor terminals such as glass-sealed diodes and thermal fuses are required to be electrically connected inside and outside when manufacturing, and in a general automated process, wires are provided during processing, and wires are cut through a processing component. A subsequent length of welding is performed at an appropriate length.

The conventional machining component uses a pendulum arc or a twisting method to cut the wire. This type of machining is only applicable to the wire whose wire diameter is less than 1.0 mm and which is cut off by the arc or twisting method. And the copper coverage is not good, and the length error is not accurate.

In view of this, the present invention provides a cutting mechanism for a semiconductor terminal manufacturing machine that increases the wire diameter and has better tangential efficiency and quality, and is the main purpose thereof.

In order to achieve the above object, the cutting mechanism of the present invention comprises at least: a clamping body, a driving component, a tangential module and a linking component, the clamping body has at least one first threading hole, and the driving component is disposed on the clamping Holding the side of the seat, the driving group The workpiece is provided with a power member, a rotating shaft driven by the power member, and a cam. The cam shaft is disposed on the rotating shaft. The tangential module is provided with a pushing portion, a moving block and at least one elastic member. Located on one side of the clamping seat body, the moving block has at least one second threading hole, and the linking member is located between the pushing portion and the cam.

When the driving member drives the rotating shaft and the cam, the linking member is driven by the cam to push the pushing portion to move the moving block, so that the first threading hole and the second threading hole are mutually displaced, and the first threading hole can be worn in the first The wire in the second threading hole is cut off, and the cutting mechanism can improve the arcing or twisting method, and the length of the wire after the cutting is small, the precision is better, and the cylinder has better cylinder and coverage. Copperness for better tangent quality.

With the above structural features, the semiconductor terminal manufacturing machine of the present invention is provided with a work surface for receiving the cutting mechanism, and another partition plate is vertically disposed on the work surface.

According to the above structural feature, the linking member is further fixed to the partition by a first fixing seat, and the first fixing seat is provided with a through hole for the linking member to pass through.

According to the above structural feature, a second fixing seat is further fixed on the working surface, and the clamping seat body and the moving block are disposed on the working surface through the second fixing seat.

According to the above structural feature, the second fixing seat is provided with at least one guiding rod, and the guiding rod is disposed for the moving block to linearly move the moving block along the guiding rod.

According to the above structural feature, the elastic member is sleeved outside the guiding rod, and one end of the elastic member is in contact with the moving block, and the other end is in contact with the second fixing seat.

According to the above structural features, the elastic member may be a plate spring, Disc spring or pellet spring.

According to the above structural feature, one end of the linking member and the cam may be provided with a rotating portion.

According to the above structural feature, the power member is a motor.

According to the above structural feature, the driving component is further provided with a driving component, and the driving component is disposed between the power component and the rotating shaft.

According to the above structural feature, the entraining member is a belt or a gear.

1‧‧‧cutting mechanism

2‧‧‧Wire mechanism

10‧‧‧Clamping body

11‧‧‧First threading hole

20‧‧‧Drive components

21‧‧‧Power parts

22‧‧‧ shaft

23‧‧‧ cam

24‧‧‧Drives

30‧‧‧tangential module

31‧‧‧Promotion Department

32‧‧‧moving block

321‧‧‧Second threading hole

33‧‧‧Flexible parts

40‧‧‧ linkages

41‧‧‧Rotation

51‧‧‧Working surface

52‧‧‧Baffle

53‧‧‧First mount

531‧‧‧Perforation

54‧‧‧Second seat

541‧‧‧guides

61‧‧‧ wire

Fig. 1 is a schematic view showing the structure of a semiconductor terminal manufacturing machine in the present invention.

Figure 2 is a three-dimensional structure diagram of the cutting mechanism in the present creation.

Figure 3 is a schematic view of the first structure of the cutting mechanism in the present creation.

Figure 4 is a schematic view of the second structure of the cutting mechanism in the present creation.

Figure 5 is a schematic view of the third structure of the cutting mechanism in the present creation.

Figure 6 is a fourth structural diagram of the cutting mechanism in the present creation.

Figure 7 is a fifth schematic diagram of the cutting mechanism of the present creation.

The present invention mainly provides a cutting mechanism for a semiconductor terminal manufacturing machine having better tangential efficiency and quality. As shown in FIGS. 1 to 7, the semiconductor terminal manufacturing machine of the present invention has a plurality of working areas as shown in the figure. In the implementation, the cutting mechanism 1 of the present invention is located on the side of the wire mechanism 2, and the wire mechanism 2 supplies the wire to the cutting mechanism 1 to cut the predetermined length, and then performs subsequent processing; The mechanism comprises at least: a clamping base 10, a driving assembly 20, a tangential module 30 and a linking member 40; wherein the semiconductor terminal manufacturing machine is provided with a working surface 51 for receiving the cutting mechanism, and a partition 52 is vertical Set on the countertop 51 on.

The clamping seat body 10 has at least one first threading hole 11 for threading the pre-machined wire 61.

The driving assembly 20 is disposed on one side of the clamping body 10. In the embodiment shown in the figure, the clamping body 10 and the driving assembly 20 are respectively located at two sides of the partition 52, and the driving component 20 is provided with a power member 21, a rotating shaft 22 driven by the power member 21, and a cam 23, the cam 23 is axially disposed on the rotating shaft 22, and is rotatable simultaneously with the rotating shaft 22, and the driving assembly 20 is further provided with a The driving member 24 is disposed between the power member 21 and the rotating shaft 22, and the driving member 24 is a motor. The driving member 24 is a belt or a gear, and the power of the power member 21 can be transmitted to the rotating shaft. 22 and cam 23.

The tangential module 30 is provided with a pushing portion 31, a moving block 32 and at least one elastic member 33. The moving block 32 is located on one side of the clamping seat body 10, and the moving block 32 has at least one second threading hole 321 The pushing portion 31 is in contact with one side of the moving block 32, and the elastic member 33 is in contact with the other side of the moving block 32, and provides an elastic force for the moving block to move normally to the pushing portion 31.

The linking member 40 is disposed between the pushing portion 31 and the cam 23. The connecting member 40 is further fixed to the partition 52 by a first fixing base 53. The first fixing base 53 is provided with a through hole 531 for the linkage. The member 40 is sleeved so that the linking member 40 can be traversed in the through hole 531, and one end of the connecting member 40 contacting the cam 23 can be provided with a rotating portion 41, which can reduce the frictional resistance between the two and maintain better The second mounting seat 54 is further disposed on the working surface 51. The clamping base 10 and the moving block 32 are disposed on the working surface 51 through the second fixing base 54. The two fixing bases 54 are provided with at least one guiding rod 541. In the embodiment shown in the figure, two guiding rods 541 are provided, and the guiding rods 541 are provided for the moving block 32 to pass along the moving block 32. The guiding rod 541 moves linearly, and the elastic member 33 is sleeved on the Outside the guide rod 541, one end of the elastic member 33 is in contact with the moving block 32, and the other end is in contact with the second fixing seat 54, and the elastic member 33 may be a plate spring, a disc spring or a pellet spring.

When the integral cutting mechanism is used, a wire 61 is inserted into the first and second threading holes 11 and 321 to activate the power member 21 to drive the rotating shaft 22 and the cam 23, and the linking member 40 is driven by the cam 23. The pushing portion 31 moves the moving block 32 to displace the first threading hole 11 and the second threading hole 321 . Please refer to FIG. 7 to be inserted into the first and second threading holes 11 . The wire 61 in the 321 is cut, and when the moving block 32 is not pushed by the pushing portion 31, the moving member 32 is returned to the pushing portion 31 by the elastic member 33 on the other side, while the first one is made The second threading holes 11, 321 correspond to each other.

The cutting mechanism can improve the conventional arc or twisting method, and can be applied not only to the wire with a large wire diameter, but also to the wire having a small length error with better precision and better cylindricality and Copper coating for better tangent quality.

In summary, the present invention provides a better and feasible cutting mechanism for the semiconductor terminal manufacturing machine, and submits a new patent application according to law; the technical content and technical features of the present invention have been disclosed as above, but those skilled in the art still It is possible to make various substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of the present invention is not limited to the embodiments disclosed, but includes various alternatives and modifications that do not depart from the present invention and are covered by the following claims.

10‧‧‧Clamping body

11‧‧‧First threading hole

31‧‧‧Promotion Department

32‧‧‧moving block

321‧‧‧Second threading hole

61‧‧‧ wire

Claims (11)

A cutting mechanism for a semiconductor terminal manufacturing machine, comprising: a clamping body having at least one first threading hole; a driving component disposed on a side of the clamping body, the driving component being provided with a power component, a a rotating shaft driven by the power member and a cam, wherein the cam shaft is disposed on the rotating shaft; the tangential module is provided with a pushing portion, a moving block and at least one elastic member, wherein the moving block is located in the clamping body a side, and the moving block has at least one second threading hole, the pushing portion is in contact with one side of the moving block, and the elastic member contacts the other side of the moving block, and provides the moving block to move normally to the pushing portion And an interlocking member is located between the pushing portion and the cam, and is driven by the cam to push the pushing portion to move the moving block, thereby making the first threading hole and the second threading hole Misplaced with each other. The cutting mechanism of the semiconductor terminal manufacturing machine according to claim 1, wherein the semiconductor terminal manufacturing machine is provided with a work surface for receiving the cutting mechanism, and another partition plate is vertically disposed on the work surface. The cutting mechanism of the semiconductor terminal manufacturing machine of claim 2, wherein the linking member is further fixed to the partition by a first fixing seat, and the first fixing seat is provided with a through hole for the connecting member to pass through. The cutting mechanism of the semiconductor terminal manufacturing machine of claim 2, wherein a second fixing seat is further fixed on the working surface, and the clamping seat body and the moving block are disposed through the second fixing seat On the work surface. The cutting mechanism of the semiconductor terminal manufacturing machine of claim 4, wherein the second fixing base is provided with at least one guiding rod, and the guiding rod is disposed for the moving block to allow the moving block to follow the guiding rod Linear movement. The cutting mechanism of the semiconductor terminal manufacturing machine according to claim 5, wherein the elasticity The sleeve is sleeved outside the guide rod, and one end of the elastic member is in contact with the moving block, and the other end is in contact with the second fixed seat. The cutting mechanism of the semiconductor terminal manufacturing machine according to any one of claims 1 to 6, wherein the elastic member may be a plate spring, a disc spring or a pellet spring. The cutting mechanism of the semiconductor terminal manufacturing machine according to any one of claims 1 to 6, wherein the one end of the linking member and the cam is provided with a rotating portion. The cutting mechanism of the semiconductor terminal manufacturing machine according to any one of claims 1 to 6, wherein the power member is a motor. The cutting mechanism of the semiconductor terminal manufacturing machine according to any one of claims 1 to 6, wherein the driving assembly is further provided with a driving member that is disposed between the power member and the rotating shaft. The cutting mechanism of the semiconductor terminal manufacturing machine according to claim 10, wherein the driving member is a belt or a gear.