TWM506364U - Dispensing device of wafer polishing retaining ring - Google Patents

Description

Wafer grinding fixing ring gluing device

The present invention is a gluing device, in particular a wafer grinding and fixing ring gluing device.

In the semiconductor manufacturing process, chemical mechanical polishing is an indispensable process. The so-called chemical mechanical polishing process uses a wafer polishing fixing ring to frame the wafer to be polished, and then faces the wafer to be processed toward the polishing pad containing the chemical mechanical polishing liquid, and the other one of the wafer polishing fixing ring A polishing head is connected to the side, and a certain load is applied to the wafer grinding fixing ring through the polishing head, so that the surface of the wafer can be pressed onto the polishing pad with an appropriate pressure, and then the rotation of the polishing pad is used to chemically grind the surface of the wafer. .

In the chemical mechanical polishing process, the wafer grinding retaining ring plays a very important role. If the quality of the wafer grinding retaining ring is poor, the wafer will not be flatly attached to the polishing pad for chemical mechanical polishing, or even fragmentation. occur. As shown in FIG. 1, the known wafer polishing ring structure 9 generally includes an annular base 91 and a rubber ring 92, wherein the outer periphery of the annular base 91 is provided with an annular groove 91a. The inner edge of the rubber ring 92 (for example, a silicone ring) is looped in the annular groove 91a, whereby the wafer grinding fixing ring 9 can prevent moisture, dust or foreign particles from adhering to the annular base 91.

Conventionally, when the rubber ring 92 is mounted on the annular base 91, the method of manual sizing is adopted, that is, the adhesive is applied to the annular groove 91a of the annular base 91 by manual means, and then manually The rubber ring 92 is sleeved on the annular groove 91a to bond the rubber ring 92 with the annular base 91. However, the manner of manual sizing is difficult to uniformly apply the adhesive to the annular groove 91a of the annular base 91, resulting in assembly quality and assembly speed which may be difficult to maintain due to the experience of the field assembler, and also cause chemical mechanical polishing. process

In view of this, the present invention proposes a gluing device suitable for a wafer grinding fixing ring, the wafer grinding fixing ring comprises a ring base and a rubber ring, and the circumference of the ring base has an annular groove, and the glue The ring system is sleeved in the annular groove. The proposed gluing device comprises a seat body, a support base, a motor, a turntable, a door type bracket and a glue injection device.

The top surface of the base body is provided with a first track, the support base comprises a plate body and a connecting portion, the plate body is erected on the first track, and the connecting portion is respectively connected to the plate body and the first track, so that the plate body can be along the first track edge Slide in a first direction. The motor is disposed on the plate body, and the rotating shaft of the motor passes through the plate body. The turntable is disposed on the board body and pivoted to the rotating shaft of the motor. The turntable includes a fixing portion for fixing the annular base of the wafer grinding fixing ring to the surface of the turntable. The door bracket comprises a first pillar, a second pillar and a beam, the first pillar and the second pillar are respectively stood on two sides of the seat body, and the two ends of the beam are respectively connected to the first pillar and the second pillar, and the beam is disposed There is a second track, and the second track is located above the first track. The glue applicator is coupled to the second track and slidable in a second direction along the second track, the second direction being perpendicular to the first direction.

In one embodiment of the present invention, the body of the gluing device further includes a control panel for controlling the operation of the motor, the first track and the second track.

In one embodiment of the present invention, the glue applicator of the gluing device comprises a glue outlet and a barrel body, and the glue outlet is connected to the barrel body, and the barrel body is used for accommodating the glue.

In one embodiment of the present invention, the outer diameter of the turntable of the gluing device is not greater than the outer diameter of the annular base of the wafer grinding retaining ring.

The present invention also proposes another gluing device comprising a first seat body, a support base, a motor, a turntable, a second seat body and a glue applicator. The top surface of the first body is provided with a first track, the support base comprises a plate body and a connecting portion, wherein the plate body is parallel to the first track, and the connecting portion is respectively connected to the plate body and the first track, so that the plate body can be along the first The track slides. The motor is disposed on the plate body, and the rotating shaft of the motor passes through the plate body. The turntable is disposed on the board body and pivoted to the rotating shaft of the motor. The turntable includes a fixing portion for fixing the annular base of the wafer grinding fixing ring to the surface of the turntable. One of the surfaces of the second body is provided with a second track perpendicular to the first track. The glue applicator is coupled to the second track to be slidable along the second track.

In an embodiment of the present invention, the seat body of the other glue application device further includes a control panel for controlling the operation of the motor, the first track and the second track.

In one embodiment of the present invention, the glue applicator of the other gluing device comprises a glue outlet and a barrel body, and the glue outlet is connected to the barrel body, and the barrel body is used for accommodating the glue.

In an embodiment of the present invention, the connecting portion of the supporting seat of the another gluing device comprises a portion parallel to the plate body and a portion perpendicular to the plate body, and a portion perpendicular to the plate body is connected to the plate body. A portion parallel to the plate body is connected to the first track.

In one embodiment of the present invention, the outer diameter of the turntable of the other gluing device is not greater than the outer diameter of the annular base of the wafer grinding retaining ring.

Please refer to FIG. 2 to FIG. 4 , which are respectively a schematic diagram (1), an operation diagram (2) and a side view of the first embodiment of the present invention, and a glue application device 1 is illustrated. The gluing device 1 is applied to the wafer grinding fixing ring 9 as shown in Fig. 1. The wafer grinding fixing ring 9 includes an annular base 91 and a rubber ring 92. The circumference of the annular base 91 has an annular groove 91a, and the rubber ring 92 is sleeved in the annular groove 91a. In order to allow the rubber ring 92 itself to be more stably combined with the annular base 91, it is necessary to apply the adhesive to the annular groove 91a before the rubber ring 92 is sleeved on the annular groove 91a. In this way, when the rubber ring 92 is sleeved on the annular groove 91a, the inner edge of the rubber ring 92 can be adhered to the surface of the annular groove 91a through the adhesive, so that the rubber ring 92 is not easy to be combined with the annular base. Block 91 is separated. One of the functions of the topping device 1 of the present embodiment is that the adhesive ring 92 is uniformly coated with the adhesive on the annular groove 91a of the annular base 91 before the rubber ring 92 is sleeved on the annular groove 91a. The gluing device 1 of the first embodiment of the present invention comprises a seat body 11, a support base 12, a motor 13, a turntable 14, a door bracket 15 and a glue applicator 16, which are described in detail below.

The top surface 11a of the base 11 is provided with a first rail 111, and the support base 12 includes a plate body 121 and a connecting portion 122. The plate body 121 is erected on the first rail 111, that is, the normal direction of the plate surface of the plate body 121 is perpendicular to the normal direction of the top surface 11a. The connecting portion 122 is connected to the plate body 121 and the first rail 111, respectively. The connecting portion 122 of the present embodiment is integrally formed with the plate body 121, and the connecting portion 122 also has a flat shape and is perpendicular to the plate body 121. The two sides of the connecting portion 122 are bent and hooked, thereby clamping the side edges of the two long sides of the first rail 111, so that the plate body 121 can be translated on the first rail 111 through the connecting portion 122, and can be along The first direction D1 slides.

Referring to FIG. 4, the motor 13 is disposed on the plate body 121. The rotating shaft 131 of the motor 13 passes through the plate body 121. The turntable 14 is disposed on the plate body 121 and pivotally connected to the rotating shaft 131 of the motor 13. As shown in FIG. 2, the turntable 14 includes a fixing portion 141 for fixing the annular base 91 of the wafer polishing fixing ring 9 to the surface of the turntable 14. The fixing portion 141 of this embodiment is a pin which can be inserted into the two pin holes 911 of the annular base 91 of the wafer grinding fixing ring 9 , thereby fixing the ring base 91 to the turntable 14 . When the turntable 14 is rotated, the annular base 91 of the wafer grinding fixing ring 9 can be rotated together.

The portal bracket 15 includes a first pillar 151, a second pillar 152, and a beam 153. The first pillar 151 and the second pillar 153 are respectively stood on two sides of the seat body 11, and the two ends of the beam 153 are respectively connected to the top ends of the first pillar 151 and the second pillar 152. A second rail 154 is disposed on the beam 153. The second rail 154 is located directly above the first rail 111 and is perpendicular to the first rail 111 in the projection direction.

The glue applicator 16 is coupled to the second rail 154 and slidable in the second direction D2 perpendicular to the first direction D1 of the second rail 154. The glue applicator 16 of the embodiment comprises a glue outlet 161 and a barrel 162, and the glue outlet 161 is connected to the barrel 162.

That is to say, when the sizing process is to be performed (the adhesive is applied to the annular groove 91a of the annular base 91), the turntable 14 and the annular base 91 are moved along the first rail 111 to make the annular base 91. The annular groove 91a is aligned with the glue outlet 161 of the glue applicator 16. Then, the turntable 14 is rotated, and the glue injector 16 is started to apply glue, so that a ring of adhesive can be uniformly applied to the annular groove 91a of the annular base 91.

In this embodiment, the base 11 of the gluing device 1 further includes a control panel 119 for controlling the operation of the motor 13, the first rail 111 and the second rail 154 to make the annular groove of the annular base 91. The 91a can accurately align the glue outlet 161 of the glue applicator 16.

In the present embodiment, the outer diameter of the turntable 14 of the gluing device 1 is equal to the outer diameter of the annular base 91 of the wafer grinding retaining ring 9 or smaller than the outer diameter of the annular base 91 of the wafer grinding retaining ring 9. If the outer diameter of the turntable 14 is larger than the outer diameter of the annular base 91 of the wafer grinding ring 9, after the glue injection operation is completed, the glue outlet 161 must be raised to a higher height to avoid the turntable 14 being along The first rail 111 collides with the glue outlet 161 of the glue injector 16 during translation. In an embodiment, the glue applicator 16 can be a syringe.

When the gluing process is completed by the gluing device 1, and the annular base 91 of the wafer grinding fixing ring 9 has not been detached from the turntable 14, since the annular base 91 is in a state of being fixed by the turntable 14, it is just The user can conveniently place the rubber ring 92 in the annular groove 91a of the annular base 91 at this time. After the rubber ring 92 is sleeved in the annular groove 91a of the annular base 91, the entire wafer grinding fixing ring 9 is unloaded from the turntable 14.

Please refer to FIG. 5 , which is a schematic diagram of the operation of the glue applying device according to the second embodiment of the present invention. Another glue applicator 2 is disclosed, including a first seat body 21 , a support base 22 , a motor 23 , a turntable 24 , and a second seat body . 25 and the glue applicator 26 are described in detail below.

The top surface 21a of the first body 21 is provided with a first rail 211, and the support base 22 includes a plate body 221 and a connecting portion 222. The plate body 121 different from the support base 12 of the first embodiment is erected on the first rail 111. The plate body 221 of the support base 22 of the present embodiment is parallel to the first rail 211. The connecting portion 222 is connected to the plate body 221 and the first rail 211, respectively. As shown in FIG. 5, the connecting portion 222 of the present embodiment is integrally formed with the plate body 221, and the connecting portion 222 has an L-shape, which is parallel to the portion of the plate body 221 and perpendicular to the plate body 221. Part of the composition. The portion of the connecting portion 222 of the present embodiment that is perpendicular to the plate body 221 is directly connected to the plate body 221. The portion of the connecting portion 222 of the embodiment parallel to the plate body 221 is like the connecting portion 122 of the first embodiment, and the two sides thereof are curved and hook-shaped, thereby clamping the length of the first track 211 The side edges of the sides allow the plate body 221 to slide over the first rail 211 through the connecting portion 222.

The motor 23 of the present embodiment is the same as that of the first embodiment, and is disposed on the plate body 221, and the rotating shaft 231 of the motor 23 passes through the plate body 221. The turntable 24 of the present embodiment is similar to the turntable 14 of the first embodiment, and is also disposed on the surface of the plate body 221, with the difference that the plate body 221 of the present embodiment is parallel to the first track 211, so the turntable 24 is also parallel to the first A track 211. The turntable 24 is pivotally connected to the rotating shaft 231 of the motor 23 for fixing the annular base 91 of the wafer grinding fixing ring 9 to the surface thereof.

The second seat body 25 of this embodiment functions similarly to the beam 153 of the first embodiment, and is provided with a second rail 254 facing the surface of the turntable 24 for the glue applicator 26 to be attached thereto. The glue applicator 26 is slidable along the second track 254, and the second track 254 is perpendicular to the first track 211. The glue applicator 26 of the embodiment comprises a glue outlet 261 and a barrel 262, and the glue outlet 261 is in communication with the barrel 262.

When the sizing process is to be performed (the adhesive is applied to the annular groove 91a of the annular base 91), the turntable 24 and the annular base 91 are moved along the first rail 211 to make the annular base 91 ring-shaped. The groove 91a approaches and aligns with the glue outlet 261 of the glue applicator 26. Then, the turntable 24 is rotated, and the glue injector 26 is started to apply glue, so that a ring of adhesive is uniformly applied to the annular groove 91a of the annular base 91.

In this embodiment, the first body 21 of the gluing device 2 further includes a control panel 219 for controlling the operation of the motor 23, the first rail 211 and the second rail 254, and the annular groove of the annular base 91. The groove 91a can accurately align the glue outlet 261 of the glue applicator 26.

In the present embodiment, the outer diameter of the turntable 24 of the gluing device 2 is not greater than the outer diameter of the annular base 91 of the wafer grinding retaining ring 9. If the outer diameter of the turntable 24 is larger than the outer diameter of the annular base 91 of the wafer grinding ring 9, and the length of the glue outlet 261 of the glue injector 26 is not long enough, one possible case is the annular groove. When the groove 91a is not sufficiently close to the glue outlet 261 of the glue applicator 26, the turntable 24 has already touched the second seat body 25, resulting in failure to smoothly apply the glue.

When the gluing process is completed by the gluing device 2, and the annular base 91 of the wafer grinding fixing ring 9 has not been detached from the turntable 24, since the annular base 91 is in a state of being fixed by the turntable 24, it is just The user can conveniently place the rubber ring 92 in the annular groove 91a of the annular base 91 at this time. After the rubber ring 92 is sleeved in the annular groove 91a of the annular base 91, the entire wafer grinding fixing ring 9 is unloaded from the turntable 24.

In summary, unlike the conventional manual gluing method, the gluing device 1 or the gluing device 2 provided in the above embodiment can make the annular groove 91a of the annular base 91 uniformly coated in a short time. A ring of adhesive is provided, so that the bonding strength of the rubber ring 92 of the wafer grinding fixing ring 9 and the annular base 91 can be effectively improved.

The technical content of the present invention has been disclosed above in several embodiments, but it is not intended to limit the creation of the present invention. Anyone who is familiar with the skill of the art should make some changes and refinements without departing from the spirit of the present creation. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application.

1‧‧‧Gluing device
11‧‧‧
11a‧‧‧Top
111‧‧‧First track
119‧‧‧Control panel
12‧‧‧ support
121‧‧‧ board
122‧‧‧Connecting Department
13‧‧‧Motor
131‧‧‧ shaft
14‧‧‧ Turntable
141‧‧‧ Fixed Department
15‧‧‧door bracket
151‧‧‧First pillar
152‧‧‧Second pillar
153‧‧‧ beams
154‧‧‧second track
16‧‧‧ glue applicator
161‧‧‧Gap outlet
162‧‧‧
2‧‧‧Gluing device
21‧‧‧First body
21a‧‧‧Top
211‧‧‧ first track
219‧‧‧Control panel
22‧‧‧ Support
221‧‧‧ board
222‧‧‧Connecting Department
23‧‧‧Motor
231‧‧‧ shaft
24‧‧‧ Turntable
25‧‧‧Second body
254‧‧‧second track
26‧‧‧ glue applicator
261‧‧‧Gap outlet
262‧‧‧
9‧‧‧Wafer Grinding Ring
91‧‧‧ring base
91a‧‧‧Round groove
911‧‧ pin hole
92‧‧ ‧ rubber ring
D1‧‧‧ first direction
D2‧‧‧ second direction

[Fig. 1] is a schematic view of a conventional wafer grinding fixing ring. [Fig. 2] is a schematic view (1) of the operation of the first embodiment of the present invention. [Fig. 3] A schematic diagram (2) of the operation of the first embodiment of the present invention. [Fig. 4] A side view of the first embodiment of the creation. [Fig. 5] is a schematic view showing the operation of the second embodiment of the present invention.

1‧‧‧Gluing device

11‧‧‧

11a‧‧‧Top

111‧‧‧First track

12‧‧‧ support

121‧‧‧ board

122‧‧‧Connecting Department

14‧‧‧ Turntable

141‧‧‧ Fixed Department

15‧‧‧door bracket

151‧‧‧First pillar

152‧‧‧Second pillar

153‧‧‧ beams

154‧‧‧second track

D1‧‧‧ first direction

D2‧‧‧ second direction

Claims (9)

A gluing device is suitable for a wafer grinding and fixing ring, the wafer grinding fixing ring comprises a ring base and a rubber ring, the annular base has an annular groove at a periphery thereof, and the rubber ring is sleeved on the ring An annular groove, the gluing device comprises: a body, the top surface is provided with a first track; a support base comprises a plate body and a connecting portion, the plate body is erected on the first track, and the connecting portion is respectively connected In the plate body and the first track, the plate body is slidable in the first direction in the first direction; a motor is disposed on the plate body, the rotating shaft of the motor passes through the plate body; a rotating shaft disposed on the plate and pivoted to the motor, the rotating plate includes a fixing portion for fixing the annular base of the wafer grinding fixing ring to the surface thereof; and a door type bracket comprising a first pillar and a first pillar a second pillar and a beam, the first pillar and the second pillar are respectively erected on two sides of the seat body, the two ends of the beam are respectively connected to the first pillar and the second pillar, and the beam is provided with a second a track, the second track being above the first track And a dispensing device, connected to the second rail to the second rail and may be slidable along a second direction, the second direction perpendicular to the first direction. The topping device of claim 1, wherein the base further comprises: a control panel for controlling operation of the motor, the first track and the second track. The gumming device of claim 2, wherein the glue applicator comprises a glue outlet and a barrel, the glue outlet being connected to the barrel, the barrel being used for accommodating the glue. The gumming device of any one of claims 1 to 3, wherein the outer diameter of the turntable is not greater than the outer diameter of the annular base of the wafer grinding retaining ring. A gluing device is suitable for a wafer grinding and fixing ring, the wafer grinding fixing ring comprises a ring base and a rubber ring, the annular base has an annular groove at a periphery thereof, and the rubber ring is sleeved on the ring Annular groove: a first body, the top surface is provided with a first track; a support base includes a plate body and a connecting portion, the plate body is parallel to the first track, and the connecting portion is respectively connected to the plate And the first track, the plate body is slidable along the first track; a motor is disposed on the plate body, the rotating shaft of the motor passes through the plate body; a turntable is disposed on the plate body, and a pivoting shaft of the motor, the rotating disc includes a fixing portion for fixing the annular base of the wafer grinding fixing ring on the surface thereof; and a second seat body having a surface perpendicular to the first rail a second track; and a glue applicator coupled to the second track for sliding along the second track. The gumming device of claim 5, wherein the first body comprises a control panel for controlling operation of the motor, the first track and the second track. The gumming device of claim 6, wherein the glue applicator comprises a glue outlet and a barrel, the glue outlet being connected to the barrel, the barrel being used for accommodating the glue. The gluing device of claim 7, wherein the connecting portion comprises a portion parallel to the plate body and a portion perpendicular to the plate body, and a portion of the connecting portion perpendicular to the plate body is coupled to the plate portion And a portion of the connecting portion parallel to the plate body is connected to the first track. The gumming device of any one of claims 5 to 8, wherein the outer diameter of the turntable is not greater than the outer diameter of the annular base of the wafer grinding retaining ring.