TWM506360U - Solid state relay with debug and temperature detection function - Google Patents

Description

Solid state relay with debug and temperature detection 【0001】

This creation is about a solid state relay, especially for solid state relays that have a temperature sensing function and an abnormally active signal for the return coupling circuit.

【0002】

Solid state relay is a kind of non-contact switch composed of solid electronic components. It can achieve contactless, non-sparking, and can be turned on and off by using the switching characteristics of electronic components (such as switching transistors, bidirectional controllable semiconductor components). The purpose of the circuit is therefore also referred to as "contactless switch". It is often applied to the input or signal input, and then turns on the high-voltage, high-power output current, with the effect of isolating the input and output and controlling the high-power output current. After the signal is input, the high-voltage, high-power output current is turned on, and the effect of isolating the input and output and controlling the high-power output current is obtained. After the signal is input, the high-voltage, high-power output current is turned on, and the effect of isolating the input and output and controlling the high-power output current is obtained. After the signal is input, the high-voltage, high-power output current is turned on, and the effect of isolating the input and output and controlling the high-power output current is obtained.

[0003]

However, the disadvantage is that most solid-state relays are designed in one piece, so when the load is increased, the temperature will rise, so it is necessary to add heat-dissipating components when necessary to enhance the heat dissipation effect. Moreover, when the circuit connected to the solid state relay is abnormal, it can only be displayed on the warning light of the solid state relay itself. When multiple solid state relays are used to couple the load, it is difficult to immediately detect the fault, so there is centralized management. difficult.

[0004]

As mentioned above, it is true that the creators of this creation have been painstakingly researching, thinking and designing a solid-state relay with debugging and temperature detection functions to improve the lack of existing technology and enhance the implementation of the industry. use.

[0005]

In view of the above-mentioned problems, the purpose of this creation is to add a function of detecting temperature and returning an error message to the solid state relay, which can automatically detect the temperature of the solid state relay and adjust the speed of the fan on the heat sink according to the temperature, and the solid state The relay has a communication unit, which can then return the error information on the solid state relay to the central control unit to indicate that debugging is required, which can reduce management difficulties.

[0006]

Based on the above purposes, the present invention provides a solid state relay with debug and temperature detection functions, including a main frame, a top frame, a heat dissipation component, a processing unit, a communication unit, and a power supply unit. The main frame may be a housing having an accommodating space, and the upper end of the main frame is provided with an opening. The top frame is detachably disposed on the opening, and at least one fuse slot is disposed on the top surface of the top frame, and at least one corresponding fuse element is disposed in the fuse slot. The heat dissipating component is disposed under the main frame, and the heat dissipating component can include a heat dissipating frame, a fan and a temperature sensing component, wherein the fan and the temperature sensing component are disposed on the surface of the heat dissipation frame, and the temperature sensing component detects the heat dissipation frame The temperature is used to generate a temperature value, and the fan accelerates the heat convection of the heat sink. The processing unit is disposed in the accommodating space and electrically connected to at least one of the fuse element and the heat dissipating component. When the processing unit determines that the temperature value is lower than the temperature threshold, the switch of the fan is turned off, and when the processing unit determines that the temperature value is higher than the temperature threshold The fan is turned on to activate it. The communication unit can be electrically connected to the processing unit and return the debug message received by the processing unit to the central control unit, so that the central control unit prompts for debugging according to the debug message. The power supply unit can be electrically connected to the heat dissipation component, the processing unit, and the communication unit, and provides electrical energy to operate.

【0007】

Preferably, the top frame further comprises an insulating cover, and the insulating cover is correspondingly disposed on the top surface of the top frame.

[0008]

Preferably, the insulating cover or the top frame is provided with a plurality of venting ports.

【0009】

Preferably, the fuse slot is disposed on a side edge of the top end surface of the top frame.

[0010]

Preferably, the heat dissipation frame comprises a heat dissipation main plate and a plurality of heat dissipation fins.

[0011]

Preferably, the heat sink can be made of aluminum.

[0012]

Preferably, the debug message may include an abnormally actuated signal of at least one of the fuse element, the fan, the temperature sensing element, the processing unit, or a combination thereof.

[0013]

Preferably, the communication unit transmits the debug message to the central control unit via a wired or wireless network.

[0014]

Preferably, the solid state relay of the present invention further comprises a thyristor disposed on the circuit of the electrical connection processing unit, and the thyristor system generates an error message when the circuit is short-circuited and transmits the error message to the processing unit.

[0015]

In order to make the above-mentioned objects, technical features, and gains after actual implementation more obvious, a more detailed description will be given below with reference to the corresponding drawings in the preferred embodiments.

[0029]

10‧‧‧Insulation cover
11‧‧‧Top frame
12‧‧‧Main frame
13‧‧‧Fuse slot
14‧‧‧Base
15‧‧‧ venting port
20‧‧‧Fuse components
30‧‧‧Heat components
31‧‧‧heat shelf
32‧‧‧fan
33‧‧‧Temperature sensing components
331‧‧‧ Temperature values
40‧‧‧Processing unit
401‧‧‧Debug message
50‧‧‧Communication unit
60‧‧‧Power supply unit
70‧‧‧ thyristor
100‧‧‧Solid relay
200‧‧‧Central Control Unit

[0016]

Figure 1 is a block diagram of a solid state relay with debug and temperature detection capabilities.

[0017]

Figure 2 is a schematic diagram of the debugging of the solid state relay with the debugging and temperature detection function.

[0018]

Figure 3 is an exploded view of the components of the solid state relay with debug and temperature detection functions.

[0019]

In order to understand the creative characteristics, content and advantages of this creation and the effects that can be achieved by the examiner, the author will use the drawings in detail and explain the following in the form of the examples, and the drawings used therein The subject matter is only for the purpose of illustration and supplementary instructions. It is not necessarily the true proportion and precise configuration after the implementation of the creation. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited in the actual implementation scope.

[0020]

The advantages, features, and technical methods of the present invention will be more readily understood by referring to the exemplary embodiments and the accompanying drawings, and the present invention can be implemented in various forms and should not be construed as being limited to The stated embodiments, to the contrary, the embodiments of the present invention will provide a more thorough and complete and complete disclosure of the scope of the present invention, and the present invention will only be attached. The scope of the patent application is defined.

[0021]

Please also refer to Figure 1, Figure 2 and Figure 3, which are block diagrams, debug prompts and component explosion diagrams of the solid state relay with debug and temperature detection functions. In the figure, a solid state relay 100 with a debugging and temperature detecting function includes a main frame 12, a top frame 11, a heat dissipation assembly 30, a processing unit 40, a communication unit 50, and a power supply unit 60. The power supply unit 60 can be electrically connected to the heat dissipation component 30, the processing unit 40, and the communication unit 50, and provides electrical energy to operate.

[0022]

The main frame 12 is a housing having a receiving space, and the upper end is provided with an opening. The top frame 11 detachably closes the opening of the main frame 12. The top surface of the top frame 11 is provided with a fuse slot 13 corresponding to the number of connecting circuits. To set a corresponding number of fuse elements 20, the fuse slots 13 can be disposed on the side edges of the top end surface of the top frame 11 to reduce the volume of the solid state relay 100, thereby integrating the solid state relay 100 and the fuse element 20. The top frame 11 further includes an insulating cover 10, and the corresponding cover is disposed on the top end surface of the top frame 11, thereby protecting the internal components. A plurality of venting ports 15 may be disposed on the insulating cover 10 or the top frame 11 to accelerate the heat dissipation speed.

[0023]

The heat dissipating component 30 is disposed under the main frame 12 and is fixed above the base 14 and can include a heat dissipating frame 31, a fan 32, and a temperature sensing component 33. The heat dissipating frame 31 can be made of an aluminum heat dissipating main plate and a plurality of heat dissipating fins. The film is composed of a heat sink main board that is flattened below the main frame 12 to transfer the heat generated by the solid state relay 100. The fan 32 and the temperature sensing component 33 are disposed on the surface of the heat dissipation frame 31. The temperature sensing component 33 detects the temperature of the heat dissipation frame 31 and generates a corresponding temperature value 331. The fan 32 accelerates the heat convection of the heat dissipation frame 31.

[0024]

The processing unit 40 is disposed in the accommodating space, and is electrically connected to the fuse element 20 and the heat dissipating component 30. When the processing unit 40 determines that the temperature value 331 is higher or lower than the temperature threshold, the corresponding control is to turn on or off the fan 32. A switch to reduce the power lost by continuously turning on the fan 32. The processing unit 40 can also adjust the wind speed of the fan 32 according to the temperature value 331 to change the heat convection rate of the heat dissipation frame 31.

[0025]

The communication unit 50 can be electrically connected to the processing unit 40 to return the error message 401 received by the processing unit 40 and transmitted to the central control unit 200 connected to the solid state relay 100. The debug message 401 here can be the fuse element 20, The abnormal operation of the fan 32, the temperature sensing component 33 or the processing unit 40, when the central control unit 200 receives the debug message 401, can further prompt the manager to debug the components of the specific solid state relay 100. The program can reduce the time to find the location to be debugged.

[0026]

The communication unit 50 transmits the debug message 401 to the central control unit 200 in a wired or wireless network. In practice, the communication unit 50 can communicate with the central control unit 200 to communicate the debug message 401 using an industrial communication protocol, such as a Modbus serial. Communicate with the central control unit 200 to communicate the debug message 401.

[0027]

In practice, the solid state relay 100 of the present invention may further include a thyristor 70 disposed on the circuit of the electrical connection processing unit 40. When the circuit is short-circuited, the thyristor 70 generates an open circuit in the circuit and simultaneously generates a debug message 401. In addition to protecting the load connected to the circuit, the processing unit 40 can also immediately inform the manager that debugging is required.

[0028]

The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.

10‧‧‧Insulation cover

11‧‧‧Top frame

12‧‧‧Main frame

13‧‧‧Fuse slot

20‧‧‧Fuse components

30‧‧‧Heat components

31‧‧‧heat shelf

32‧‧‧fan

33‧‧‧Temperature sensing components

331‧‧‧ Temperature values

40‧‧‧Processing unit

50‧‧‧Communication unit

60‧‧‧Power supply unit

70‧‧‧ thyristor

100‧‧‧Solid relay

Claims (9)

[Item 1] A solid state relay with debugging and temperature detecting function includes:
a main frame is a housing having an accommodating space, and an upper end of the main frame is provided with an opening;
a top frame is detachably disposed on the opening, at least one fuse slot is disposed on a top surface of the top frame, and at least one fuse element is respectively disposed in the fuse slot;
a heat dissipating component is disposed under the main frame, the heat dissipating component includes a heat dissipating frame, a fan, and a temperature sensing component, wherein the fan and the temperature sensing component are disposed on a surface of the heat dissipation frame, The temperature sensing component detects the temperature of the heat dissipation frame and generates a temperature value, and the fan accelerates the heat convection of the heat dissipation frame;
a processing unit is disposed in the accommodating space and electrically connected to the at least one fuse element and the heat dissipating component. When the processing unit determines that the temperature value is lower than a temperature threshold, the switch of the fan is turned off. The processing unit determines that the temperature value is higher than the temperature threshold, and turns on the fan to make it act;
a communication unit electrically connected to the processing unit and returning the processing unit to receive a debug message and transmitting to a central control unit, so that the central control unit prompts for debugging according to the debug message And a power supply unit electrically connecting the heat dissipation component, the processing unit, and the communication unit, and providing electrical energy to operate. [Item 2] The solid state relay of claim 1, wherein the top frame further comprises an insulating cover, and the insulating cover is disposed on the top surface of the top frame. [Item 3] The solid state relay of claim 2, wherein the insulating cover or the top frame is provided with a plurality of venting ports. [Item 4] The solid state relay of claim 1, wherein the fuse slot is disposed on a side edge of the top surface of the top frame. [Item 5] The solid state relay of claim 1, wherein the heat dissipation frame comprises a heat dissipation main plate and a plurality of heat dissipation fins. [Item 6] The solid state relay of claim 1, wherein the heat dissipation frame is made of aluminum. [Item 7] The solid state relay of claim 1, wherein the error message comprises an abnormally actuated signal of the at least one fuse element, the fan, the temperature sensing element, the processing unit, or a combination thereof. [Item 8] The solid state relay of claim 1, wherein the communication unit transmits the debug message to the central control unit via a wired or wireless network. [Item 9] The solid state relay of claim 1, further comprising a thyristor disposed on a circuit electrically connected to the processing unit, the thyristor generating the debug message when the circuit is shorted and transmitting the processing to the processing unit.