TWM503013U - Electronic device with electrostatic protection - Google Patents

Description

Electrostatically protected electronic device

The present invention relates to a protective device, and more particularly to a protective device having an Electrostatic Discharge (ESD) to prevent electronic components from being destroyed.

In the semiconductor industry, there are many reasons why the failure of electronic component products is attributed to EOS/ESD, that is, the situation that the product is broken, burned, deteriorated or destroyed by static electricity is often the cause of product problems. In recent years, electrostatic protection has clearly It has become a problem to be solved by semiconductor manufacturers.

In today's electronic products, one or more printed circuit boards (PCBs) are often arranged, and these printed circuit boards have one or more electronic components, such as an integrated circuit (IC). . In the case of electrostatic discharge, electronic components in electronic products often cause sudden high currents due to electrostatic discharge, causing electronic products to crash or even permanently damage. In view of this, in order to ensure the normal operation of the electronic products, the circuit designer will perform perfect electrostatic discharge (ESD) protection on the designed circuit.

As shown in FIG. 1, in the technical field of conventional electrostatic discharge protection, the wiring trace layout on the entire printed circuit board is usually changed or an electrostatic discharge (ESD) circuit 2A is electrically connected to the electronic component 1A. When an electrostatic discharge is generated, the electrostatic discharge is input from the input terminal (IN) and quickly released through the grounding structure or the electrostatic discharge (ESD) circuit 2A to ensure the normal operation of the electronic component 1A. However, this design method will increase In addition to the difficulty in design, the production cost is increased by the addition of an electrostatic discharge circuit.

The main purpose of this creation is to provide a simple electrostatic discharge protection design, which can achieve the effect of preventing ESD without adding additional ESD circuits and modifying the layout of the traces, thereby reducing the manufacturing cost and improving the performance.

For the above purposes, the present invention provides an electrostatically protected electronic device including a circuit board, electronic components, and a protection unit. The circuit board has a signal transmission line, and the circuit includes at least a signal input line and a ground line. The electronic component is electrically connected to the signal input line on the circuit board. The protection unit is disposed on the circuit board and includes a signal input metal line and a ground metal line. The signal input metal wire and the grounding metal wire are arranged around the electronic component, and the grounding metal wire is electrically connected to the grounding wire. The signal input metal wire is electrically connected to the signal input line and the electronic component. Among them, when the electrostatic discharge phenomenon occurs, the large current generated by the electrostatic discharge will flow from the signal input line to the signal input metal line, and then the signal input metal line discharges the grounded metal line, and then the grounded metal line will guide the large current. Flow to the ground wire for electrostatic discharge treatment.

In an embodiment of the present invention, the grounding wire has a line width smaller than the signal input wire, and the grounding wire is surrounded by the square or the frame around the electronic component, and a first spacing is formed between the electronic component and the electronic component. The grounding metal wire is electrically connected to the grounding wire by a bridge structure, and the signal input metal wire is arranged around the grounding metal wire in a square or frame shape, and a second spacing is formed between the grounding metal wire and the signal. The input metal wire is electrically connected to the signal input line and the electronic component; in addition, a plurality of corresponding discharge portions are electrically connected to the signal input metal line, and the discharge portions are interposed between the signal input metal line and the ground metal line There is a discharge interval between the discharge portions and the grounding wire.

In an embodiment of the present invention, the distance between the discharge portions of the signal input wires and the discharge pitch of the ground metal wires is set by the potential difference between the discharge portions of the signal input wires and the ground metal wires; a voltage difference between the discharge portions of the signal input metal line and the ground metal line is large, and a discharge interval between the discharge portions of the signal input metal line and the ground metal line is large; and the discharge portions of the signal input metal line and the ground metal line The voltage difference is small, and the discharge intervals of the discharge portions of the signal input wires and the ground metal wires are small.

In an embodiment of the present invention, the bridge structure is a single-layer board on the circuit board, the grounding metal line of the protection unit is surrounded by the signal input metal line, and an insulating layer is disposed on the signal input metal line, and the grounding metal line is opposite to the circuit board. The electrically connected line of the grounding wire can be spanned on the insulating layer.

In an embodiment of the present invention, when the circuit board is a multi-layer board, and the grounding metal line of the protection unit is surrounded by the signal input metal line, the grounding metal line is electrically connected to the first conductive layer on the circuit board of the first layer. a first conductive pillar is electrically connected to one end of the circuit board of the second layer, and the other end of the circuit board of the second layer is electrically connected to the second conductive pillar of the circuit board of the first layer, and the second conductive The pillar is electrically connected to the grounding wire of the circuit board of the first layer.

In an embodiment of the present invention, the signal input metal line is surrounded by the square or the frame around the electronic component, and is electrically connected to the electronic component, and the signal input metal wire and the electronic component form a first The spacing, the signal input metal line can be electrically connected to the signal input line of the circuit board through the bridge structure, and the signal input metal line is electrically connected to have a plurality of discharge parts; and the grounding metal line is surrounded by a square or a frame. A second spacing is formed around the signal input metal line and the signal input metal line, and the grounding metal wire is electrically connected to the grounding wire, and the discharging portions are between the signal input metal wire and the grounding metal wire. Having a discharge between the discharge portions and the grounded metal wires distance.

In an embodiment of the present invention, the bridge structure is a single layer board on the circuit board, the signal input metal line of the protection unit is surrounded by the signal input metal line 31, the grounding metal line is provided with an insulation layer, and the signal input metal line is opposite to the circuit board. The circuit on which the signal input line is electrically connected may be disposed across the insulating layer.

In an embodiment of the present invention, the bridge structure is a multi-layer board on the circuit board, and the signal input metal line of the protection unit is surrounded by the ground metal line, and the signal input metal line is electrically connected to the first layer on the first layer of the circuit board. a conductive post, the first conductive post is electrically connected to one end of the circuit board of the second layer, and the other end of the circuit of the second layer is electrically connected to the second conductive post of the first layer of the circuit board, second The conductive post is electrically connected to the line of the signal input line of the circuit board.

In an embodiment of the present invention, the signal input metal line is composed of a plurality of discharge portions, each of the discharge portions has a line segment and a discharge protrusion portion, and the discharge portions are electrically connected to the signal input line and the electronic component. A discharge gap is formed between the discharge protrusion and the ground metal line, and the ground line of the circuit board is electrically connected to the ground metal line through the two discharge portions.

In an embodiment of the present invention, the grounding metal wire is composed of a plurality of line segments which are arranged in a square or frame shape on the periphery of the electronic component, and the grounding wires of the circuit board are worn by the corresponding discharge portions. The two discharge portions are electrically connected to the line segments of the ground metal wires.

In an embodiment of the present invention, the grounding metal wire has a plurality of discharging ends, and the discharging ends of the grounding metal wires correspond to the discharging portions on the signal input metal line, and a discharge interval is formed between the discharging portion and the discharging end. .

In an embodiment of the present invention, the grounding wire is composed of a plurality of segments, and the segments are surrounded by a square or a frame on the periphery of the electronic component, and each of the segments has a protrusion. The protrusion corresponds to some discharge portion, the ground A wire passes through the two discharge portions to be electrically connected to a line segment of the ground metal wire.

Convention:

1A‧‧‧Electronic parts

2A‧‧‧Electrostatic Discharge Circuit

This creation:

1, 1'‧‧‧ boards

11, 11’‧‧‧ lines

12‧‧‧Signal input line

13‧‧‧ Grounding wire

14‧‧‧First conductive column

15‧‧‧Second conductive column

2‧‧‧Electronic parts

3, 3a, 3b‧‧‧ protection unit

31, 31a, 31b‧‧‧ signal input wire

311, 311a, 311b, 312‧‧ discharge section

3111b‧‧ ‧ line segment

3112b‧‧‧Discharge convex

32, 32a, 32b‧‧‧ grounded metal wire

321‧‧‧ discharge end

321b‧‧‧ segments

322b‧‧‧protrusion

33‧‧‧Insulation

D1, d1a, d1b‧‧‧ first spacing

D2, d2a, d2b‧‧‧ second spacing

D3, d3a, d3b‧‧‧ discharge spacing

Figure 1 is a schematic diagram of a conventional electronic device with electrostatic protection.

2 is a schematic diagram of an electronic device with electrostatic protection according to a first embodiment of the present invention.

3 is a schematic view of an electronic device with electrostatic protection according to a second embodiment of the present invention.

Figure 4 is a schematic view of the bridging structure of the electrostatically protected electronic device of the present invention.

FIG. 5 is a schematic diagram of another bridging structure of the electrostatically protected electronic device of the present invention.

FIG. 6 is a schematic diagram of an electronic device with electrostatic protection according to a third embodiment of the present invention.

FIG. 7 is a schematic diagram of an electronic device with electrostatic protection according to a fourth embodiment of the present invention.

FIG. 8 is a schematic diagram of an electronic device with electrostatic protection according to a fifth embodiment of the present invention.

FIG. 9 is a schematic diagram of an electronic device with electrostatic protection according to a sixth embodiment of the present invention.

FIG. 10 is a schematic diagram of an electronic device with electrostatic protection according to a seventh embodiment of the present invention.

The technical content and detailed description of the present invention are described below with reference to the following drawings: Please refer to FIG. 2, which is a schematic diagram of an electronic device with electrostatic protection according to the first embodiment of the present invention. As shown in FIG. 2, the electrostatic protection electronic device of the present invention comprises a circuit board 1, an electronic component 2 and a protection unit 3.

The circuit board 1 is a single-layer board or a multi-layer board having a signal line 11 for transmitting signals, and the lines 11 include at least a signal input line 12 and a ground line 13. Among them, the circuit board 1 is a fiberglass board, a glass or a plastic board.

The electronic component 2 is electrically connected to the signal input line 12. The electronic component 2 is an integrated circuit (IC) such as a sensor (SENSOR).

The protection unit 3 is disposed on the circuit board 2, and the protection unit 3 includes a signal input metal line 31 and a grounding metal line 32. The grounding wire 32 has a line width smaller than the signal input wire 31, and the grounding wire 32 is surrounded by the square or frame (FRAME) around the electronic component 2, and is formed with the electronic component 2. A spacing d1. The grounding wire 32 can be electrically connected to the grounding wire 13 of the circuit board 1 through a bridge structure (described in detail later) or electrically connected to a casing of an electronic device (not shown). The signal input metal line 31 is surrounded by the square metal wire 32 in a square or frame shape, and forms a second pitch d2 with the ground metal wire 32. The signal input metal line 31 is electrically connected to the signal input line 12 and the electronic component 2.

In addition, the signal input metal line 31 is electrically connected to have a plurality of discharge portions 311 correspondingly disposed, and the discharge portion 311 is interposed between the signal input metal line 31 and the ground metal line 32, and the discharge portion 311 and the grounding metal line There is a discharge spacing d3 between 32. In the present drawing, the discharge portion 311 is polygonal or semi-circular. The polygon is a triangle or a diamond.

When the ESD phenomenon is not generated, the signal of the signal input line 12 is transmitted to the electronic component 2 in a normal transmission route.

When the ESD phenomenon occurs, the large current generated by the ESD will flow from the signal input line 12 of the circuit board 1 to the signal input metal line 31, and then the discharge metal portion 32 of the signal input metal line 31 discharges the ground metal line 32. And the ground current wire 32 conducts a large current to the grounding wire 13 of the circuit board 1 or the electronic device. The housing is placed for electrostatic discharge treatment to ensure that the electronic component 2 is not damaged by ESD. The design of the protection unit 3 can achieve the effect of preventing ESD without additionally adding an ESD circuit and modifying the layout of the trace, thereby reducing the manufacturing cost and improving the performance.

Further, the distance between the discharge portion 311 on the signal input metal line 31 and the discharge pitch d3 of the ground metal line 32 is determined depending on the magnitude of the potential difference between the discharge portion 311 of the signal input metal line 31 and the ground metal line 32; The voltage difference between the discharge portion 311 of the signal input metal line 31 and the ground metal line 32 is large, and the discharge interval d3 of the discharge portion 311 of the signal input metal line 31 and the ground metal line 32 is large; if the discharge portion 311 of the signal input metal line 31 is The voltage difference of the grounding wire 32 is small, and the discharge interval d3 of the discharge portion 311 of the signal input wire 31 and the grounding wire 32 is small.

Please refer to FIG. 3 , which is a schematic diagram of an electronic device with electrostatic protection according to a second embodiment of the present invention. As shown in FIG. 3, this embodiment is substantially the same as FIG. 2, and the difference is in the protection unit 3a. The protection unit 3a includes a signal input metal line 31a and a ground metal line 32a. The signal input wire 31a is surrounded by the square or frame (FRAME) around the electronic component 2, and is electrically connected to the electronic component 2, and a first spacing d1a is formed between the signal input wire 31a and the electronic component 2a. The signal input metal line 31a is electrically connected to the signal input line 12 of the circuit board 1 through a bridge structure (described in detail later). The signal input metal line 31a is electrically connected to have a plurality of discharge portions 311a. In addition, the grounding wire 32a is surrounded by the square or frame shape around the signal input wire 31a, and a second spacing d2a is formed between the grounding wire 31a and the grounding wire 32a and the grounding wire 13 Electrically connected, the discharge portion 311a is interposed between the signal input metal line 31a and the ground metal line 32a, and has a discharge pitch d3a between the discharge portion 311a and the ground metal line 32a. In the figure, the discharge portion 311 It is a polygon or a semicircle. The polygon is a triangle or a diamond.

When the ESD phenomenon occurs, a large current generated by the ESD will flow from the signal input line 12 of the circuit board 1 to the signal input metal line 31a, and the discharge metal portion 32a of the signal input metal line 31a discharges the ground metal line 32a. Then, a large current is conducted by the grounding wire 32a to the grounding wire 13 of the circuit board 1 or the housing of the electronic device for electrostatic discharge processing to ensure that the electronic component 2 is not damaged by the ESD. The design of the protection unit 3a can achieve the effect of preventing ESD without additionally adding an ESD circuit and modifying the layout of the trace, thereby reducing the manufacturing cost and improving the performance.

Please refer to FIG. 4 , which is a schematic diagram of the bridge structure of the electrostatic protection electronic device. As shown in FIG. 4, when the circuit board 1 is a single-layer board, when the grounding metal line 32 (or the signal input metal line 31) of the protection unit 3 is surrounded by the signal input metal line 31 (or the grounding metal line 32), An insulating layer 33 is disposed on the signal input metal line 31 (or the grounding metal line 32), and the grounding line 32 (or the signal input metal line 31) is connected to the ground line 13 (signal input line 12) on the circuit board 1 It can be placed across the insulating layer 33 for bridging purposes.

Please refer to FIG. 5 , which is another schematic diagram of the bridging structure of the electrostatically protected electronic device. As shown in FIG. 5, when the circuit board 1 is a multi-layer board, when the grounding metal line 32 (or the signal input metal line 31) of the protection unit 3 is surrounded by the signal input metal line 31 (or the grounding metal line 32), The grounding wire 32 (or the signal input wire 31) is electrically connected to the first conductive pillar 14 on the circuit board 1 of the first layer, and the first conductive pillar 14 and the circuit 11' of the second layer of the circuit board 1' are electrically terminated. The other end of the line 11' of the circuit board 1' of the second layer is electrically connected to the second conductive post 15 of the circuit board 1 of the first layer, and the grounding line 13 of the second conductive post 15 and the circuit board 1 The line 11 of the (or signal input line 12) is electrically connected for bridging purposes.

Please refer to FIG. 6 , which is a schematic diagram of an electronic device with electrostatic protection according to a third embodiment of the present invention. As shown in FIG. 6, this embodiment is substantially the same as that of FIG. 2, except that the signal input metal line of the protection unit 3b includes a plurality of discharge portions separated from each other (described later). The protection unit 3b is disposed on the circuit board 1, and includes a signal input metal line 31b and a ground metal line 32b. The grounding wire 32b is surrounded by the square or frame (FRAME) around the electronic component 2, and forms a first spacing d1b with the electronic component 2, and the grounding wire 13 of the circuit board 1 passes through the two discharging portions 311b. It is electrically connected to the grounding wire 32b or electrically connected to the casing of an electronic device (not shown). The signal input metal line 31b is surrounded by a square or a frame around the ground metal wire 32b, and forms a second pitch d2b with the ground metal wire 32b. The signal input wire 31b is composed of a plurality of discharge portions 311b. Each of the discharge portions 311b has a line segment 3111b and a discharge convex portion 3112b. The discharge portions 311b are electrically connected to the signal input line 12 and the electronic component 2. (This writing only draws a set of discharge portions 311b and signal input lines 12 and electronic components. 2 electrical connection). Further, a discharge pitch d3b is provided between the discharge convex portion 3112b and the ground metal wire 32b. In the figure, the discharge convex portion 3112b is polygonal or semi-circular. The polygon is a triangle or a diamond.

When the ESD phenomenon occurs, the large current generated by the ESD will flow from the signal input line 12 of the circuit board 1 to the signal input metal line 31b, and then to the ground of the discharge convex portion 3112b of the discharge portion 311b of the signal input metal line 31b. The metal wire 32a is discharged, and a large current is conducted by the grounding wire 32a to the grounding wire 13 of the circuit board 1 or the housing of the electronic device to perform electrostatic discharge processing to ensure that the electronic component 2 is not damaged by ESD.

Please refer to FIG. 7 , which is a schematic diagram of an electronic device with electrostatic protection according to a fourth embodiment of the present invention. As shown in FIG. 7, this embodiment is substantially the same as FIG. 5, and the difference is that the grounding wire 32b is composed of a plurality of line segments 321b, and the line segments 321b A square or a frame is disposed on the periphery of the electronic component 2, and corresponding to the discharge portion 311b, the grounding wire 13 of the circuit board 1 passes through the two discharge portions 311b to be electrically connected to the grounding wire 32b to form a discharge. The protection unit 3b (this creation only draws a set of grounding lines 13 and the grounding metal lines 32b are electrically connected by the plurality of line segments 321b).

When the ESD phenomenon occurs, the large current generated by the ESD will flow from the signal input line 12 of the circuit board 1 to the signal input metal line 31b, and then to the ground of the discharge convex portion 3112b of the discharge portion 311b of the signal input metal line 31b. The line segments 321b of the metal wires 32a are discharged, and the large currents are conducted by the line segments 321b to the grounding wires 13 of the circuit board 1 or the housing of the electronic device to perform electrostatic discharge processing to ensure that the electronic components 2 are not protected. Damage caused by ESD.

Please refer to FIG. 8 , which is a schematic diagram of an electronic device with electrostatic protection according to a fifth embodiment of the present invention. As shown in FIG. 8 , this embodiment is substantially the same as FIG. 2 , except that the grounding wire 32 has a plurality of discharging ends 321 , and the discharging ends 321 of the grounding wires 32 are connected to the signal input wires 31 . The discharge portion 311 has a discharge pitch d3 formed between the discharge portion 311 and the discharge end 321.

When the ESD phenomenon occurs, the large current generated by the ESD will flow from the signal input line 12 of the circuit board 1 to the signal input metal line 31, and then the discharge of the ground metal line 32 by the discharge portion 311 of the signal input metal line 31. The terminal 321 is discharged, and the large current is conducted to the grounding wire 13 of the circuit board 1 or the housing of the electronic device by the discharging end 321 of the grounding wire 32 to perform electrostatic discharge processing to ensure that the electronic component 2 is not affected by the ESD. Damaged by influence. Please refer to FIG. 9 , which is a schematic diagram of an electronic device with electrostatic protection according to a sixth embodiment of the present invention. As shown in FIG. 9 , this embodiment is substantially the same as that of FIG. 7 , except that the grounding wire 32b is composed of a plurality of line segments 321b, which are arranged in a square or frame shape around the electronic component 2 . On the periphery, and in the segments 321b A protruding portion 322b is disposed, and the protruding portion 322b corresponds to the discharging portion 311b. The grounding wire 13 of the circuit board 1 passes through the two discharging portions 311b to be electrically connected to the grounding metal wire 32b to form a The protection unit 3b for discharging (this creation only draws a set of grounding lines 13 and the grounding metal lines 32b are electrically connected by the plurality of line segments 321b).

When the ESD phenomenon occurs, a large current generated by the ESD will flow from the signal input line 12 of the circuit board 1 to the signal input metal line 31b, and the signal is input to the discharge convex portion of the discharge portion 311b of the metal line 31b. 3112b discharges the protruding portion 322b of the line segments 321b of the grounding wire 32a, and then conducts a large current to the grounding wire 13 of the circuit board 1 or the housing of the electronic device by the line segments 321b to perform static electricity. Discharge treatment to ensure that the electronic component 2 is not damaged by the ESD.

Please refer to FIG. 10 , which is a schematic diagram of an electronic device with electrostatic protection according to a seventh embodiment of the present invention. As shown in FIG. 10, this embodiment is substantially the same as that of FIG. 2, except that the plurality of discharge portions 312 of the signal input metal line 31 have a diamond design, and the discharge portion 312 of the diamond design corresponds to the formation of the ground metal line 32. There is a discharge spacing d3.

When the ESD phenomenon occurs, the large current generated by the ESD will flow from the signal input line 12 of the circuit board 1 to the signal input metal line 31, and then the discharge metal portion 32 of the signal input metal line 31 discharges the ground metal line 32. Then, a large current is conducted by the grounding wire 32 to the grounding wire 13 of the circuit board 1 or the housing of the electronic device to perform electrostatic discharge processing to ensure that the electronic component 2 is not damaged by ESD.

However, the above description is only a preferred embodiment of the present invention, and it is not intended to limit the scope of patent protection of the present creation. Therefore, the equivalent changes made by using the present specification or the content of the schema are all included in the right of the creation. Within the scope of protection Chen Ming.

1‧‧‧ boards

11‧‧‧ lines

12‧‧‧Signal input line

13‧‧‧ Grounding wire

2‧‧‧Electronic parts

3‧‧‧Protection unit

31‧‧‧Signal input wire

311‧‧‧Discharge Department

32‧‧‧Grounding wire

D1‧‧‧first spacing

D2‧‧‧second spacing

D3‧‧‧discharge spacing

Claims (15)

An electronic device with electrostatic protection includes: a circuit board having a signal transmission line thereon, the circuit comprising at least a signal input line and a ground line; an electronic component connected to the signal on the circuit board The input line is electrically connected; a protection unit is disposed on the circuit board, the protection unit includes a signal input metal line and a grounding metal line, and the signal input metal line and the grounding metal line are disposed around the electronic part The grounding wire is electrically connected to the grounding wire, and the signal input wire is electrically connected to the signal input wire and the electronic component; wherein, when the electrostatic discharge phenomenon occurs, the large current generated by the electrostatic discharge will be The signal input line flows into the signal input metal line, and the ground metal wire is discharged by the signal input metal line, and the ground metal wire conducts a large current to the ground line for electrostatic discharge treatment. The electronic device with electrostatic protection according to claim 1, wherein the grounding wire has a line width smaller than the signal input wire, and the grounding wire is surrounded by the square or the frame. Forming a first spacing around the component and the electronic component, the grounding metal wire is electrically connected to the grounding wire by a bridge structure, and the signal input metal wire is surrounded by the grounding metal in a square or frame shape. a second spacing is formed between the line and the grounding metal line, and the signal input metal line is electrically connected to the signal input line and the electronic component; and the plurality of wires are electrically connected to the signal input metal line. The discharge portion is disposed correspondingly, and the discharge portions are interposed between the signal input metal line and the ground metal line, and the discharge portions and the ground metal line have a discharge interval. An electronic device with electrostatic protection as described in claim 2, The distance between the discharge lines between the discharge portions and the ground metal wires on the signal input line, and the potential difference between the discharge portions of the signal input wires and the ground metal wires If the voltage difference between the discharge portions of the signal input metal line and the ground metal line is large, the discharge interval between the discharge portions of the signal input metal line and the ground metal line is large; the signal input to the metal line The voltage difference between the discharge portions and the ground metal line is small, and the discharge pitch between the discharge portions of the signal input metal line and the ground metal line is small. The electronic device with electrostatic protection according to claim 3, wherein the bridge structure is a single-layer board on the circuit board, and the grounding metal line of the protection unit is surrounded by the signal input metal line. An insulating layer is disposed on the signal input metal line, and the grounding metal line is electrically connected to the insulating layer on the circuit board. The electronic device with electrostatic protection according to claim 3, wherein the bridge structure is a multi-layer board in the circuit board, and the grounding metal line of the protection unit is surrounded by the signal input metal line, the grounding The metal wire is electrically connected to a first conductive pillar on the circuit board of the first layer, the first conductive pillar is electrically connected to one end of the circuit board of the second layer, and the circuit board of the second layer is electrically connected. One end is electrically connected to a second conductive post on the circuit board of the first layer, and the second conductive post is electrically connected to the ground line of the circuit board of the first layer. The electronic device with electrostatic protection according to claim 1, wherein the signal input metal wire is surrounded by the square or frame and electrically connected to the electronic component, and A first spacing is formed between the signal input metal line and the electronic component, and the signal input metal wire is electrically connected to the signal input line of the circuit board through a bridge structure. The signal input metal line is electrically connected to have a plurality of discharge portions; the ground metal wire is surrounded by the square or frame shape around the signal input metal line, and forms a line with the signal input metal line. a second spacing, and the grounding metal line is electrically connected to the grounding wire, and the discharging portions are interposed between the signal input metal line and the grounding metal wire to have a discharge between the discharging portion and the grounding metal wire spacing. The electronic device with electrostatic protection according to claim 6, wherein the bridge structure is a single layer board on the circuit board, and the signal input metal line of the protection unit is surrounded by the signal input metal line, the grounding An insulating layer is disposed on the metal wire, and the signal input wire electrically connects the signal input line on the circuit board to the insulating layer. The electronic device with electrostatic protection according to claim 6, wherein the bridge structure is a multi-layer board on the circuit board, and the signal input metal line of the protection unit is surrounded by the ground metal line, and the signal input is The metal wire is electrically connected to a first conductive pillar on the circuit board of the first layer, the first conductive pillar is electrically connected to one end of the circuit board of the second layer, and the circuit of the second layer of the circuit board The other end is electrically connected to a second conductive post of the circuit board of the first layer, and the second conductive post is electrically connected to the line of the signal input line of the circuit board. The electronic device with electrostatic protection according to claim 3, wherein the signal input wire is composed of a plurality of discharge portions, each of the discharge portions having a line segment and a discharge protrusion, and the discharges The portion is electrically connected to the signal input line and the electronic component. The discharge protrusion has a discharge interval between the ground line and the ground line. The ground line is electrically connected to the ground metal line through the two discharge portions. An electronic device with electrostatic protection as described in claim 9 of the patent application, The grounding wire is composed of a plurality of line segments, which are arranged in a square or frame shape on the periphery of the electronic component, and corresponding to the discharge portion, the grounding wire passes through the two discharge portions to The line segments of the grounding wire are electrically connected. The electronic device with electrostatic protection according to claim 9, wherein the grounding wire is composed of a plurality of line segments, and the wire segments are surrounded by a square or a frame on the periphery of the electronic component. Each of the segments has a protrusion corresponding to the discharge portion, and the ground line passes through the two discharge portions to be electrically connected to the line segment of the ground wire. The electronic device with electrostatic protection according to claim 3, wherein the grounding metal wire has a plurality of discharging ends, and the discharging ends of the grounding metal wires correspond to the discharge portions of the signal input metal wires. A discharge gap is formed between the discharge portions and the discharge end. The electronic device with electrostatic protection according to claim 3, wherein the discharge portions are polygonal or semi-circular, and the polygon is triangular or diamond-shaped. The electronic device with electrostatic protection according to claim 1, wherein the electronic component is an integrated circuit. The electronic device with electrostatic protection according to claim 1, wherein the circuit board is a fiberglass board, a glass or a plastic board.