TWM493748U - Cover unit with a sandwich structure - Google Patents

Description

Sandwich unit with sandwich structure

The present invention relates to a capping unit, and more particularly to a capping unit having a sandwich structure.

Cap packages are widely used for the purpose of protecting internal wafers, wiring or electronic components and providing functions such as Shielding or lens attachment and support. Most of the products of the conventional cover package are made by attaching a metal or plastic cover to a carrier to achieve the above purpose; however, although the metal cover has a good shielding effect, it is shaped by shape. It is not easy, so metal and plastic will be assembled in a way that is not only time-consuming but also incapable of effectively blocking electromagnetic interference (EMI), making electronic components susceptible to noise. Interference affects performance.

Furthermore, as shown in FIG. 1, it is a conventional optical sensing element, which is based on the requirement that the product is light and thin, so that in a limited space, the manufacturer usually uses a bonding agent to fit a component. A piece 1 (for example, a glass or a filter) is adhered to a package cover 2 and located inside a through hole 3; however, the size of the through hole directly affects the amount of light entering, and the optical sensing element is relatively The performance will have a significant impact, so the industry will hope to maximize the through hole, but this will lead to other problems. That is, the problem that the adhesive can be used is insufficient, and the overflowed glue may flow to the through hole to cause defective defects, or the amount of the adhesive may be too small, so that the fitting 1 cannot be firm. The adhesive cover 2 is bonded to the package cover 2. In addition, if the through hole of the package cover has to be enlarged or the size of the fitting is too large, the space available inside the package cover is limited. Therefore, the conventional package cover still has the above-mentioned defects and needs to be improved.

The main purpose of the present invention is to provide a capping unit with a sandwich structure, which can be lifted to the maximum through hole size without increasing the volume of the product, and the fitting member can be directly replaced according to different needs, thereby saving. Go and change the design again.

The secondary objective of the present invention is to provide a capping unit with a sandwich structure that is shielded and protected by forming a metal layer inside the capping unit.

In order to achieve the above object, the present invention provides a cover unit having a sandwich structure, comprising a lower cover, an upper cover, at least one accommodating space, and at least one fitting member, the lower cover having at least a lower through hole and a communication a chamber of the at least one through hole and a wall, the retaining wall standing upright on the periphery of the lower cover to form the chamber, the upper cover being fixed to the lower cover and having at least one upper through hole, the at least one The accommodating space is disposed between the lower cover and the upper cover and communicates with the at least one lower through hole and the at least one upper through hole, and the at least one fitting member is disposed in the at least one accommodating space.

Wherein the lower cover further has a partition, the partition is standing upright on the lower cover And the compartment is a first chamber and a second chamber.

It further includes a metal layer formed in the chamber and extending from the chamber to the bottom end of the retaining wall.

The lower cover and the upper cover are respectively provided with at least one lower recess and at least one upper recess, and the at least one lower recess communicates with the at least one upper recess to form the at least one receiving space.

The inner circumference of the at least one upper through hole is a slope that gradually expands from bottom to top.

Wherein the at least one fitting member is a filter.

The lower cover or the upper cover is provided with an overflow tank, and the overflow tank is located at the joint of the lower cover and the upper cover.

The positioning portion corresponding to the upper cover and the upper cover are respectively provided with at least one positioning hole or at least one positioning post, and the positioning posts are correspondingly embedded in the positioning holes.

In this way, the creation can increase the size of the through hole before increasing the volume of the product, so as to increase the amount of light entering, and the fittings can be directly replaced according to different needs, thereby eliminating the need to re-change the design and The metal layer is formed inside the capping unit to achieve the shielding effect.

In order to enable the review committee to further understand the composition, characteristics and purpose of the creation, the following are some examples of the creation, and the detailed description of the creation is as follows, and at the same time, those skilled in the art can implement the following, but the following In addition, one embodiment is provided for the purpose of explaining the technical content and features of the present creation, and those who have general knowledge in the field of creation are After understanding the technical content and characteristics of this creation, all kinds of simple modifications, substitutions, or reductions in components that are not in violation of the spirit of this creation should fall within the scope of this creative intent.

1‧‧‧Inlay cover

2‧‧‧Package cover

3‧‧‧through hole

10, 10' ‧ ‧ cover unit

20‧‧‧Under the cover

21‧‧‧Under hole

23‧‧‧Under recess

25‧‧‧ chamber

251‧‧‧ first chamber

253‧‧‧Second chamber

27‧‧‧Retaining wall

28‧‧‧Baffle

29‧‧‧Positioning holes

30‧‧‧metal layer

40‧‧‧Upper cover

41‧‧‧Upper through hole

411‧‧‧Bevel

43‧‧‧Upper recess

45‧‧‧Positioning column

50‧‧‧ accommodating space

60‧‧‧ fittings

70‧‧‧ overflow tank

80‧‧‧Substrate

81‧‧‧Sensor wafer

83‧‧‧Lighting chip

The technical content and features of the present invention will be described in detail below with reference to the accompanying drawings, wherein: FIG. 1 is a conventional package product, which mainly shows that the fitting member is attached to the capping unit. internal.

2 is a cross-sectional view of the capping unit having the sandwich structure provided by the first preferred embodiment of the present invention, mainly showing the positions at which the fitting member, the upper cover and the lower cover are disposed.

3 and 4 are cross-sectional views of the capping unit having the sandwich structure provided by the first preferred embodiment of the present invention, mainly showing different aspects of the accommodating space.

Fig. 5 is a cross-sectional view showing the capping unit with the sandwich structure provided by the first preferred embodiment of the present invention, mainly showing the detailed structure of the upper cap.

Figure 6 is a bottom plan view of the capping unit having the sandwich structure provided by the first preferred embodiment of the present invention, mainly showing the concave structure on the upper cover.

Figure 7 is a plan view of the capping unit with the sandwich structure provided by the first preferred embodiment of the present invention, mainly showing the recess structure under the lower cover.

Figure 8 is a cross-sectional view of the capping unit having the sandwich structure provided by the first preferred embodiment of the present invention, mainly showing the detailed structure of the lower cap.

Figure 9 is a cross-sectional view of the capping unit with the sandwich structure provided by the first preferred embodiment, mainly showing the fitting, the upper cover and the lower cover. Set the position.

Figure 10 is a cross-sectional view of the capping unit having the sandwich structure provided by the first preferred embodiment of the present invention, mainly showing the capping unit covering the substrate.

11 is a cross-sectional view of a capping unit having a sandwich structure according to a second preferred embodiment of the present invention, mainly showing a capping unit having a double through hole and a double chamber.

In order to explain in detail the structure, features and functions of the present invention, a first preferred embodiment will be described with reference to the following drawings, wherein: Please refer to Figures 2 to 9 for the creation of the present A capping unit 10 having a sandwich structure according to a preferred embodiment includes a lower cover 20 having a lower through hole 21, a lower recess 23, a chamber 25 and a retaining wall 27, the chamber 25 The lower through hole 21 is connected to the periphery of the lower cover 20 to form the chamber 25.

A metal layer 30 is formed in the chamber 25 by sputtering, pasting, fixing, etc., and extends from the inside of the chamber 25 to the bottom end of the retaining wall 27, and transmits a conductive adhesive (not shown). It is electrically connected to the substrate 80 (as shown in FIG. 8) to achieve a grounding effect, thereby achieving a more complete shielding protection.

An upper cover 40 is fixed to the lower cover 20 and has an upper through hole 41 and an upper concave portion 43. The inner periphery of the upper through hole 41 is a slope 411 which is gradually enlarged from the bottom to the top. The recess 43 is located at a relative position of the recess 23 below the lower cover 20.

An accommodating space 50 is formed by the lower portion 23 of the lower cover 20 The upper cover 40 is formed by the recess 43 and is located between the lower cover 20 and the upper cover 40 and communicates with the lower through hole 21 and the upper through hole 41. Of course, the accommodating space 50 can also be formed only by the recess 23 under the lower cover 20 or the recess 43 above the upper cover 40, and this will depend on the requirements of the process; therefore, as shown in Figures 2 to 4 It is shown that the accommodating space 50 is formed by the recess 23 under the lower cover 20 and the recess 43 above the upper cover 40, or only by the recess 23 under the lower cover 20 or the recess 43 above the upper cover 40. Forming is the scope of the invention to be protected.

A fitting member 60 is disposed in the accommodating space 50. The fitting member 60 is a filter. Although the fitting member 60 is a rectangular filter in the embodiment, this is not Restricted, it can be arbitrarily and directly replaced according to the needs of the product, no need to re-design, such as glass, plastic, metal materials, so that specific light can penetrate or can be The effect of the barrier is also a structure having diffusion, uniform light, and reflection (such as a lens), and the same applies to the fitting 60.

It is worth mentioning here that, in order to meet the needs of different uses, for example, the maximum through holes 21, 41 can be raised before increasing the volume of the product to increase the amount of light or a larger chamber; The largest through holes 21, 41 can have sufficient space for dispensing; therefore, the lower cover 20 and the through holes 21, 41 of the upper cover 40 can be more shaped than the size of the through holes 21, 41. A circular shape, an elliptical shape, a rectangular shape, a polygonal shape, or the like is changed. To accommodate the shape of each of the through holes 21, 41 or the fitting member 60, the shape of the accommodating space 50 can also be circular, elliptical, or the like. Make adjustments in rectangles or polygons. In the first preferred embodiment of the present invention, the shape of the through hole 41 above the upper cover 40 The shape of the through hole 21 under the lower cover 20 is rectangular, so that the upper cover 40 can obtain the largest circular through hole 41, and there is sufficient space in the four corners of the lower cover 20. It can be used for dispensing, and the problem of overflowing can be avoided. In order to facilitate the positioning and placement of the fitting 60 in the accommodating space 50, the shape of the accommodating space 50 is similar to that. The fitting 60 is slightly larger in size than the fitting 60.

In addition, since the capping unit 10 of the present invention binds the lower cap 20 and the upper cap 40 by using an adhesive, it is necessary to consider that the lower cap 20 and the upper cap 40 are attached and fixed. There may be a problem of overfilling and positioning. Therefore, one of the lower cover 20 or the upper cover 40 is provided with an overflow tank 70, and the overflow tank 70 is located at the joint between the lower cover 20 and the upper cover 40. When the amount of glue is large, the excess glue will flow into the overflow tank 70 to prevent excess glue from overflowing the joint of the lower cover 20 and the upper cover 40; in the positioning portion, the lower cover 20 and the The upper cover 40 is respectively provided with at least one positioning hole 29 or at least one positioning post 45. The at least one positioning post 45 is embedded in the at least one positioning hole 29. In the first preferred embodiment, the upper cover 40 is Each of the four corners is provided with one positioning post 45, and the lower cover 20 is also respectively provided with a positioning hole 29 at four corners of the upper cover 40, whereby each positioning post 45 is embedded in each positioning. The action of positioning the lower cover 20 and the upper cover 40 in the hole 29 can be easily performed.

As shown in FIG. 10, in the first preferred embodiment, the capping unit 10 is actually mounted on the substrate 80. A sensing wafer 81 is disposed on the substrate 80 and is received in the cavity. In the chamber 25, of course, the sensing wafer 81 can also be replaced by a light-emitting chip, and the sensing chip 81 or the light-emitting chip is located. The through hole 41 above the upper cover 40 and the lower surface of the lower cover 21 below the lower cover 20, when light is transmitted from the outside to the sensing wafer 81 or light is emitted from the light emitting chip to the outside, the light passes through the embedded The fitting 60 is used to achieve the effects of filtering, diffusing, homogenizing or reflecting.

Referring to FIG. 11 again, a cover unit 10 ′ having a sandwich structure according to a second preferred embodiment of the present invention is covered on the substrate 80 , wherein the second preferred embodiment Most of the technical features are the same as the first preferred embodiment, and the difference is that the lower cover 20 of the capping unit 10' of the second preferred embodiment further has a partition 28 which is erect The lower cover 20 and the compartment 25 are a first chamber 251 and a second chamber 253, so that the sensing wafer 81 and the light-emitting chip 83 on the substrate 80 can be individually accommodated in the first In the chamber 251 and the second chamber 253, the problem of interference is avoided; and in order to achieve a good shielding effect, the metal layer 30 is formed in the first chamber 251 and the second chamber 253. And extending from the first chamber 251 and the second chamber 253 to the bottom end of the retaining wall 27, the metal layer 30 can be electrically connected to the substrate 80 to achieve a more complete shielding protection effect.

In this way, the creation can increase the size of the through hole before increasing the volume of the product, so as to increase the amount of light entering, and the fittings can be directly replaced according to different needs, thereby eliminating the need to re-change the design and The metal layer is formed inside the capping unit to achieve the shielding effect.

The exemplified elements disclosed in the above embodiments are merely illustrative and are not intended to limit the scope of the present invention. The alternatives or variations of other equivalent elements are also covered by the scope of the patent application.

10‧‧‧Cover unit

20‧‧‧Under the cover

21‧‧‧Under hole

25‧‧‧ chamber

30‧‧‧metal layer

40‧‧‧Upper cover

41‧‧‧Upper through hole

50‧‧‧ accommodating space

60‧‧‧ fittings

Claims (9)

A cover unit having a sandwich structure, comprising: a lower cover having at least a lower through hole, a chamber connecting the at least one lower through hole, and a first wall, the retaining wall standing upright on the periphery of the lower cover, Forming the chamber; an upper cover is fixed to the lower cover and has at least one upper through hole; at least one receiving space is located between the lower cover and the upper cover and communicates with the at least one lower through hole and the at least one The upper through hole; and the at least one fitting member are disposed in the at least one receiving space. A capping unit having a sandwich structure according to claim 1, wherein the lower cap is further provided with a partition, the partition standing upright on the lower cover and partitioning the chamber into a first chamber and a Second chamber. The capping unit having a sandwich structure according to claim 2, wherein the first chamber and the second chamber or one of the first chamber or the second chamber further comprise a metal a layer, the metal layer is formed on each inner chamber edge and extends from each of the chambers to a bottom end of the retaining wall. A capping unit having a sandwich structure according to claim 1, wherein the chamber further comprises a metal layer formed on the inner edge of the chamber and extending from the chamber to the bottom of the retaining wall end. The capping unit with a sandwich structure according to claim 1, wherein the lower cover and the upper cover are respectively provided with at least a lower recess and at least one upper recess, wherein the at least one recess communicates with the at least one recess The at least one accommodating space is formed. The capping unit having a sandwich structure according to claim 1, wherein the inner periphery of the at least one upper through hole is a slope that gradually expands from bottom to top. A capping unit having a sandwich structure according to claim 1, wherein the at least one fitting member is a filter. The capping unit having a sandwich structure according to claim 1, wherein the lower cap or the upper cap is provided with a glue overflow groove, and the overflow tank is located at a joint of the lower cap and the upper cap. The capping unit with a sandwich structure according to the first aspect of the invention, wherein the lower cover and the upper cover respectively have at least one positioning hole or at least one positioning post, and the positioning posts are correspondingly embedded in the same Each positioning hole.