TWM492523U - Photomask protection film component - Google Patents

Description

Photomask protective film assembly

The present invention relates to a reticle protective film assembly, and more particularly to a reticle protective film assembly that can be used in an extreme ultraviolet (EUV) lithography process.

As the semiconductor device is highly integrated, the pattern formed by the lithography is also miniaturized, and devices having a pattern width of about 20 nm are now in practical use. At present, the 14nm process can be achieved using 193nm, and the ultra-violet (EUV: Extreme Ultra Violet) lithography is still under 14nm. At present, for the reticle protective film assembly, there are still many technical problems to be solved for implementing the reticle protective film module for EUV, such as a visor protective film adhered to the reticle to prevent the dust from falling directly on the light. On the cover, the wafer exposure is missing.

At present, the reticle protective film used in the general reticle is adhered to a frame through an organic adhesive, and the organic adhesive generates harmful gas during the process of storing or transporting the reticle, which may cause damage to the reticle, and If the reticle protection mode is an organic film, since the EUV lithography mainly uses extreme ultraviolet light having a wavelength of 10-14 nm as a light source, the exposure wavelength can be lowered to 13.5 nm at a time, so that the lithography technology can be extended to 20 nm. The following characteristic dimensions, but when the light of 13.5 nm wavelength is irradiated on the organic film or the organic binder, the structure of the organic matter is destroyed, and the organic matter is decomposed, and harmful gases are generated, which will lead to the environment. Contamination and premature damage to equipment occur, so how to overcome the above problems will be an urgent problem in the industry.

Therefore, if the organic film and the organic adhesive can be used, but it can also be used as a dustproof film and can be adhered to a frame, this should be an optimum solution.

The present invention relates to a reticle protective film module capable of using a wafer film as a dustproof film and generating a viscous surface by means of ion beam or fast atomic beam irradiation to replace the organic binder to avoid generation of harmful gases. Cause environmental pollution and equipment damage.

The reticle protective film used in this creation uses the principle of defocusing, so that the dust on the protective film will not be imaged on the wafer, resulting in an increase in yield, so most masks require a reticle protective film, and the EUV reticle also need.

A reticle protective film assembly comprising: a frame having two bonding faces, wherein a bonding surface is a viscous surface activated by irradiation with an ion beam or a fast beam atom beam; and a wafer film Having two surfaces, one of which is a viscous surface formed by activation by ion beam irradiation; the activated viscous surface of the wafer film is coated on the activated bonding surface of the frame to make the wafer film The surface is bonded to the frame bonding surface, and the wafer film is tightly bonded to the frame.

A method for manufacturing a reticle protective film module, comprising the steps of: irradiating an ion beam or a frame with one of a surface of a crystalline germanium film and a bonding surface of a frame by ion beam or a fast beam atomic beam; The surface of the beam irradiation is activated to form a viscous surface; after that, the viscous surface of the wafer film is adhered to the viscous bonding surface of the frame, so that the wafer film is closely adhered to the frame.

The above-mentioned wafer film has a thickness of 20 to 100 nm.

The above description further includes a reticle having at least one surface for activating the bonding surface of the reticle and the other unbonded surface of the frame to become a viscous surface by ion beam irradiation, so that the affixed The frame of the wafer film can then be adhered to the surface of the reticle.

The above description further includes an increasing frame having two bonding faces, wherein one of the bonding faces of the elevated frame and the other bonding surface of the frame that is not activated are activated by ion beam irradiation to become a viscous surface. The frame of the adhered wafer film is capable of re-adhering to the activated bonding surface of the elevated frame.

Other technical contents, features, and effects of the present invention will be apparent from the following detailed description of the preferred embodiments.

Please refer to FIG. 1A and FIG. 1B , which are schematic views of an exploded structure and a combined structure of the reticle protective film assembly. The reticle protective film assembly includes a frame 1 and a wafer film 2 , wherein The frame 1 has a first bonding surface 11 and a second bonding surface 12, and one surface of the wafer film 2 and the first bonding surface 11 of the frame 1 are irradiated by an ion beam or a fast atomic beam, so that the frame 1 A surface of the wafer 2 and the first bonding surface 11 of the frame 1 are activated to form a viscous surface 21, 111, and the first bonding surface of the viscous surface 21 activated by the wafer 2 and the frame 1 is activated. The 11-phase cover is bonded, because the viscous surface 21 of the wafer 2 and the first joint 11 of the frame 1 are viscous, so that the wafer 2 and the first joint 11 of the frame 1 can be tightly bonded. , not easy to detach, to replace the traditional organic adhesive. Further, the wafer film 2 is a single crystal germanium film or a polycrystalline germanium film.

Since the wafer 2 is applied to EUV lithography, 80% of EUV light (13.5 nm wavelength) passes through the wafer 2, so it is sufficient to replace the conventional organic film, and when EUV lithography is to be performed, As shown in Fig. 2A and Fig. 2B, since the frame 1 is made of wafer or aluminum material or quartz glass, when the ion beam or the fast atomic beam is irradiated, the irradiated surface can be activated, and Producing a viscous surface, as shown in the figure, the second bonding surface 12 of the frame 1 is activated by ion beam or rapid atomic beam irradiation to form a viscous surface 121, and a surface 31 of the reticle 3 is also performed. The ion beam or the fast atom beam irradiation is activated to cause the illuminating surface 31 of the reticle to also form the viscous surface 311, so that the second bonding surface 12 of the frame 1 to which the wafer film 2 has adhered can be combined with the surface 31 of the reticle 3. The bonding is performed such that the frame 1 incorporating the wafer film 2 is covered on the reticle 3.

In order to make the frame 1 and the reticle 3 easy to be separated in the future, the reticle 3 can be repeatedly used, so when the second bonding surface 12 of the frame 1 and the surface of the reticle 3 are subjected to ion beam or rapid atom beam irradiation activation. In this case, the irradiation activation time can be shortened, or the irradiation activation area can be reduced or the activation mode can be irradiated in a point manner, so that the second bonding surface 12 of the frame 1 and the surface 31 of the photomask 3 do not have high viscosity, so as to facilitate the future frame. 1 is separated from the reticle 3.

Furthermore, referring to FIG. 5A and FIG. 5B, the wafer film 2 can be activated by an ion beam or a fast atomic beam in a range of all surfaces (as shown in FIG. 5A), so that all surfaces of the wafer 2 are As a viscous surface, or only a part of the surface bonded to the frame (as shown in Fig. 5B), the wafer film 2 has only a peripheral surface to form a viscous surface.

In order to increase the height of the reticle protective film assembly, as shown in FIGS. 3A and 3B, at least one of the elevated frames 4 can be further included, and the second bonding surface 12 and the elevated frame 4 of the frame 1 are The first bonding surface 41 is activated by ion beam or rapid atom beam irradiation to form a viscous surface 121, 411, and the second bonding surface 12 of the activated frame 1 is bonded to the first bonding surface 41 of the elevated frame 4, The frame 1 of the adhered wafer film 2 can be reattached to the surface of the heightening frame 4, thereby increasing the overall height of the frame 1, and the heightening frame 4 is made of wafer or aluminum material or quartz glass. Therefore, when the reticle protective film module having the elevated frame 4 is to be applied to the EUV lithography, the second bonding surface 42 of the elevated frame 4 and the surface of the reticle 3 can be subjected to ion beam or fast atom beam irradiation. After activation, the second bonding surface 42 of the activated heightening frame 4 and the surface of the mask 3 form a viscous surface 421, 311, and the second bonding surface 42 of the activated heightening frame 4 is adhered to the activation. On the surface of the rear reticle 3, this will enable Increased protection mask frame 4 of the membrane module for performing EUV lithography, as shown in Figure 4A and second 4B.

The method for manufacturing the reticle protective film assembly, as shown in FIG. 6, is as follows: 1. After one of the surfaces of the wafer and one of the frames is irradiated with an ion beam or a fast atomic beam, The irradiated surface of the wafer film and the irradiated bonding surface of the frame are activated to form a viscous surface 401; 2. Thereafter, the viscous surface of the wafer film is adhered to the viscous bonding surface of the frame. Upper, the wafer film is tightly bonded to the frame 402.

The surface of the wafer 2 or the frame 1 or the reticle 3 or the frame 3 or the frame or the bonding surfaces 11, 12, 41, 42 of the frame 1 or the frame 1 or the frame 3 or the frame 3 are activated by ion beam or rapid atom beam irradiation to form a viscous surface 21, 111, 121, 311, 411, 421. The activation time is from several seconds to several minutes, and the activation temperature is room temperature, wherein the activation time is preferably from 30 seconds to 5 minutes, depending on the size of the wafer 2.

The advantages of the reticle protective film module provided by the present invention when compared with other conventional techniques are as follows: 1. The conventional product uses an organic film or an organic adhesive to bond the reticle protective film to the frame, so the organic matter is subject to Destruction, the production of organic gases, which in turn cause pollution and damage to equipment. The creation of the reticle protective film surface and the frame bonding surface is performed by ion beam or fast atomic velocity, so that the activated reticle protective film surface and the frame bonding surface can form a viscous surface, when the activated crystal When the surface of the tantalum film is bonded to the activated frame joint surface, no organic gas is generated at all to solve the problem that the conventional product generates organic gas. 2. The creation can be activated by adjusting the activation time of the bonding surface of the frame and the reticle or reducing the activation range or in a point mode to control the adhesion of the frame to the viscous surface of the reticle, so that the frame can be easily The mask is separated to achieve the purpose that the mask can be reused, thereby reducing the manufacturing cost. 3. This creation can make the frame into several different or different heights, and then irradiate the frame joint surface by ion beam or fast atomic velocity, so that the frame joint surface is activated to produce viscous, resulting in several frame joint faces. They can be bonded to each other to adjust the overall height of the frame without customizing the height of a single frame. The present invention has been disclosed above in the above embodiments, but it is not intended to limit the present invention. Anyone skilled in the art having ordinary knowledge will understand the foregoing technical features and embodiments of the present invention without departing from the present invention. In the spirit and scope, the scope of patent protection of this creation shall be subject to the definition of the requirements attached to this manual.

1‧‧‧Frame
11‧‧‧ first joint
111‧‧‧Adhesive surface
12‧‧‧Second junction
121‧‧‧ Viscous surface
2‧‧‧ wafer film
21‧‧‧ Viscous surface
3‧‧‧Photomask
31‧‧‧ surface
311‧‧‧ Viscous surface
4‧‧‧Higher frame
41‧‧‧ first joint
411‧‧‧ Viscous surface
42‧‧‧Second junction
421‧‧‧ Viscous surface

[Fig. 1A] is a schematic exploded view of the protective mask protective film assembly of the present invention. [Fig. 1B] is a schematic view showing the combined structure of the reticle protective film module. [Fig. 2A] is a schematic exploded view of the first implementation application of the present reticle protective film module. [Fig. 2B] is a schematic diagram of a first implementation application combined structure of the present reticle protective film module. [Fig. 3A] is a schematic exploded view of the second implementation application of the present reticle protective film module. [Fig. 3B] is a schematic view showing a second embodiment of the application of the reticle protective film module. [Fig. 4A] is a schematic exploded view showing the third embodiment of the present invention. [Fig. 4B] is a schematic view showing a combined structure of a third implementation application of the present reticle protective film module. [Fig. 5A] is a schematic view showing the entire surface activation of the wafer film of the present photomask protective film module. [Fig. 5B] is a schematic diagram showing the surface activation of the wafer film portion of the present photomask protective film module. [Fig. 6] is a schematic flow chart of the mask protective film assembly of the present invention.

1‧‧‧Frame

11‧‧‧ first joint

111‧‧‧Adhesive surface

12‧‧‧Second junction

2‧‧‧ wafer film

21‧‧‧ Viscous surface

Claims (5)

A reticle protective film assembly comprising: a frame having two bonding faces, wherein one bonding surface is a viscous surface activated by ion beam irradiation; and a wafer film having two surfaces One of the surfaces is a viscous surface activated by ion beam irradiation; the activated viscous surface of the wafer is coated on the activated bonding surface of the frame to bond the surface of the wafer to the frame. The face is bonded and the wafer film is tightly bonded to the frame. The reticle protective film module of claim 1, wherein the wafer film has a thickness of 20 to 100 nm. The reticle protective film module of claim 1, further comprising a reticle having at least one surface, wherein the surface of the reticle and the other unbonded surface of the frame are activated by ion beam irradiation The viscous surface allows the frame of the adhered wafer to adhere to the surface of the reticle. The reticle protective film module of claim 1, further comprising a height increasing frame having two bonding faces, wherein one of the bonding faces of the elevated frame and the other bonding surface of the frame that is not activated are passed through the ion beam The activation of the radiation becomes a viscous surface, so that the frame of the adhered wafer film can be reattached to the activated bonding surface of the elevated frame. The reticle protective film assembly of claim 1, wherein the ion beam can be replaced with a fast atomic beam.