TWM491573U - Acrylic board structure which can be stacked and cut - Google Patents

Acrylic board structure which can be stacked and cut Download PDF

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Publication number
TWM491573U
TWM491573U TW103214867U TW103214867U TWM491573U TW M491573 U TWM491573 U TW M491573U TW 103214867 U TW103214867 U TW 103214867U TW 103214867 U TW103214867 U TW 103214867U TW M491573 U TWM491573 U TW M491573U
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processed
spacer layer
processed body
cut
stacked
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TW103214867U
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Chinese (zh)
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You-Wei Xue
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Shine Chief Entpr Co Ltd
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Description

可堆疊切割之壓克力板結構Stackable and cut acrylic sheet structure

本創作係一種可堆疊切割之壓克力板結構,尤指一種以雷射切割時,單次即可切割多數之加工體,以可提升製成、加工及產出之效率,且令加工體受熱熔時不相互沾黏者。This creation is a stackable acrylic sheet structure, especially a laser that cuts a large number of processed bodies in a single shot to improve the efficiency of fabrication, processing and output. Do not stick to each other when heated.

按,習知對於壓克力(Polymethylmethacrylate, PMMA)之加工,多數者係採用機械加工,意即,係對壓克力板分別進行切割、鑽孔、鉋平、雕刻、研磨及拋光等工序,將壓克力塑型為欲成型之態樣者;然而,就切割步驟而言,多係採用刀具進行切割者,其切割過程相當耗時,且將產生大量粉塵,使大幅影響環境及操作人員之健康,此外,使用刀具切割後之表面粗糙,導致後處理之工序極為繁雜。According to the conventional processing of Polymethylmethacrylate (PMMA), most of them are mechanically processed, that is, the steps of cutting, drilling, planing, engraving, grinding and polishing the acrylic sheets respectively. The acrylic shape is shaped as the shape to be formed; however, in terms of the cutting step, the cutter is used for cutting, and the cutting process is quite time consuming, and a large amount of dust is generated, which greatly affects the environment and the operator. The health, in addition, the rough surface after cutting with a cutter, the post-processing process is extremely complicated.

故習用提供一種用以進行壓克力之雷射切割機,其係透過雷射光束以進行熱切割者,藉以由雷射發振器(Resonator)將雷射光轉換為發散角極小之近似平行光束,而後以光束放大器(Beam Telescope)加寬該光束後,透過聚焦透鏡將光束聚集於壓克力,藉以將壓克力予以加熱昇華,而為防止於切割過程中因過熱而燃燒,故將同時噴以惰性或反應速率較慢之氣體,諸如:氦氣、氬氣或氮氣,以隔絕空氣者;藉此,可大幅縮短壓克力整體加工程序,且於切割後之邊緣光滑,此外,於加工過程中不易產生粉塵,藉可有效避免環境之汙染及影響操作人員之健康者;惟此,於雷射切割時,單次僅能進行單一壓克力之切割,因其主要係對壓克力加熱以熱熔昇華者,因此於切割之過程中,壓克力之切割面將有部分因受熱而融化之現象,故若將壓克力堆疊切割時,將導致壓克力之間因融化而沾黏,令難以將堆疊之壓克力分離,且亦將影響壓克力之品質;而若逐一進行壓克力切割者,則相當耗時,將導致成品難以量化生產者。Therefore, a laser cutting machine for performing acryl is provided for transmitting a laser beam for thermal cutting, whereby a laser is converted into an approximately parallel beam having a very small divergence angle by a Resonator. Then, after widening the beam with a Beam Amplifier, the beam is concentrated on the acryl by a focusing lens, thereby heating and sublimating the acryl, and in order to prevent burning due to overheating during the cutting process, Spraying a gas that is inert or slow in reaction rate, such as helium, argon or nitrogen, to isolate the air; thereby, the overall processing procedure of the acrylic can be greatly shortened, and the edge after cutting is smooth, and Dust is not easy to be generated during processing, which can effectively avoid environmental pollution and affect the health of the operator; however, in laser cutting, only a single acrylic cutting can be performed in a single time, because it is mainly for pressing The force is heated to be sublimated by the heat. Therefore, during the cutting process, the cutting surface of the acrylic will partially melt due to heat, so if the acrylic is stacked and cut, it will result in The adhesion between the crescennes is so hard that it is difficult to separate the acrylics of the stack, and it will also affect the quality of the acrylic. If the acrylic cutters are used one by one, it is quite time consuming, which will make the finished product difficult to quantify. Producer.

有鑑於此,本創作人特地針對壓克力之切割加以研究及改良,期以一較佳設計改善上述問題,並在經過長期研發及不斷測試後,始有本創作之問世。In view of this, the creator specially researched and improved the cutting of acrylic, and improved the above problems with a better design, and after long-term research and development and continuous testing, the creation of this creation began.

爰是,本創作係為解決習用使用雷射切割壓克力時,無法進行堆疊之量化切割,單次僅能切割單一之壓克力,導致影響成品製成之產率者。Therefore, in order to solve the problem of using laser-cutting acrylic, it is impossible to carry out quantitative cutting of the stack, and it is only possible to cut a single acrylic in a single time, which affects the yield of the finished product.

為達致以上目的,吾等創作人提供一種可堆疊切割之壓克力板結構,其包含:複數加工體,其係相互堆疊排列者,且所述加工體之間分別設有一對應之間隔層以分離所述加工體,所述間隔層係令所述加工體於切割時,所述加工體之間不因熱熔而相互黏合者。In order to achieve the above object, our creator provides a stackable cut acrylic sheet structure comprising: a plurality of processed bodies stacked one on another, and each of the processed bodies is provided with a corresponding spacer layer In order to separate the processed body, the spacer layer is such that when the processed body is cut, the processed bodies are not bonded to each other by heat fusion.

據上所述之壓克力板結構,其中,所述加工體為壓克力(Polymethylmethacrylate, PMMA)。According to the acrylic plate structure described above, the processed body is Polymethylmethacrylate (PMMA).

據上所述之壓克力板結構,其中,所述間隔層主要為薄層之紙類製成者。According to the acrylic plate structure described above, the spacer layer is mainly a thin layer of paper maker.

據上所述之壓克力板結構,其中,所述間隔層主要為薄層之紙類製成者。According to the acrylic plate structure described above, the spacer layer is mainly a thin layer of paper maker.

據上所述之壓克力板結構,更包含一對應由加工體堆疊排列方向切割所述加工體之雷射切割裝置,且該雷射切割裝置之聚焦深度係對應於所述加工體及間隔層堆疊之厚度者。According to the acrylic plate structure described above, a laser cutting device corresponding to cutting the processed body by the stacking direction of the processed body is further included, and the depth of focus of the laser cutting device corresponds to the processed body and the interval The thickness of the layer stack.

是由上述說明及設置,顯見本創作主要具有下列數項優點及功效,茲逐一詳述如下:It is from the above description and settings that it is obvious that this creation has the following several advantages and functions, which are detailed as follows:

1.本創作藉由間隔層之設置,藉可令雷射切割裝置單次即可切割複數堆疊之加工體,並於雷射切割過程中加工體之間於受熱熔時,將由間隔層阻隔,而不沾黏於相鄰之加工體,藉可提升加工成品之品質,並能有效提升製成、加工及產出之效率者。1. The creation of the spacer layer allows the laser cutting device to cut a plurality of stacked processed bodies in a single pass, and the partition between the processed bodies during the laser cutting process is blocked by the spacer layer. It does not stick to adjacent processing bodies, which can improve the quality of processed products and effectively improve the efficiency of manufacturing, processing and output.

本創作係一種可堆疊切割之壓克力板結構,其實施手段、特點及其功效,茲舉數種較佳可行實施例並配合圖式於下文進行詳細說明,俾供 鈞上深入瞭解並認同本創作。This creation is a stackable and cut acrylic sheet structure, its implementation means, characteristics and functions. Several preferred and feasible examples are described in detail below with reference to the drawings. This creation.

首先,請參閱第1圖所示,本創作係一種可堆疊切割之壓克力板結構,其包含:First, as shown in Figure 1, this creation is a stackable cutting acrylic sheet structure that includes:

複數加工體1,其係壓克力(Polymethylmethacrylate, PMMA),其係相互堆疊排列者,所述加工體1之間分別設有一對應之間隔層2以分離所述加工體1,所述間隔層2係令所述加工體1於切割時,所述加工體1之間不因熱熔而相互黏合者,所述間隔層2主要為薄層之紙類製成者;以及a plurality of processed bodies 1 which are stacked with each other (PMMA), which are arranged one above another, and a corresponding spacer layer 2 is respectively disposed between the processed bodies 1 to separate the processed body 1, the spacer layer 2, when the processed body 1 is cut, the processed bodies 1 are not bonded to each other by heat fusion, and the spacer layer 2 is mainly a thin layer of paper maker;

一對應由加工體1堆疊排列方向切割所述加工體1之雷射切割裝置3,且該雷射切割裝置3之聚焦深度(景深)係對應於所述加工體1及間隔層2堆疊之厚度者。Corresponding to the laser cutting device 3 for cutting the processed body 1 by the stacking direction of the processed body 1, and the depth of focus (depth of field) of the laser cutting device 3 corresponds to the thickness of the stacked body 1 and the spacer 2 By.

藉之,如第1圖所示,使用者係可依需求而予以選擇欲堆疊所述加工體1之數量,而分別於兩加工體1之間設置所述間隔層2,以透過間隔層2將加工體1分離,並計算堆疊後之加工體1及間隔層2整體之厚度T,其中,為防止整體之厚度T過高,且為不影響加工體1之雷射切割,故間隔層2係採用較薄之紙類為較佳者。As shown in FIG. 1 , the user can select the number of the processed bodies 1 to be stacked according to requirements, and the spacer layer 2 is disposed between the two processed bodies 1 to penetrate the spacer layer 2 . The processed body 1 is separated, and the thickness T of the processed body 1 and the spacer 2 as a whole is calculated, wherein the spacer layer 2 is prevented from being excessively affected by the thickness T of the processed body 1 Thinner papers are preferred.

續如第2圖所示,假設其為雷射切割裝置3之原聚焦深度L0 ,而由於雷射切割裝置3聚焦之焦點大小,將影響切割之速度及品質,其中,焦點越小者,其雷射功率之密度亦將隨之增加,其中,焦點之大小如下數學式1所示:As shown in FIG. 2, it is assumed that it is the original focus depth L 0 of the laser cutting device 3, and the focus of the laser cutting device 3 will affect the speed and quality of the cutting, wherein the smaller the focus, The density of its laser power will also increase, and the size of the focus is as shown in Mathematical Formula 1:

【數學式1】 [Math 1]

其中,d為焦點大小、M為該雷射切割裝置3之光束傳播參數、λ為雷射切割裝置3之雷射光波長、D為入射雷射之直徑、f為雷射切割裝置3聚焦之焦距。Where d is the focus size, M is the beam propagation parameter of the laser cutting device 3, λ is the laser light wavelength of the laser cutting device 3, D is the diameter of the incident laser, and f is the focal length of the laser cutting device 3 .

而為能令雷射切割裝置3一次性切割堆疊後之加工體1,故其聚焦深度則需對應於加工體1及間隔層2整體之厚度,而聚焦深度通常係指焦點大小5%之變化範圍(亦即1至1.05倍之焦點大小)之距離,故聚焦深度即可簡化為如下數學式2所示:In order to enable the laser cutting device 3 to cut the stacked processed body 1 at a time, the depth of focus is required to correspond to the thickness of the entire processed body 1 and the spacer layer 2, and the depth of focus generally refers to a change in the focus size of 5%. The distance of the range (that is, the focus size of 1 to 1.05 times) can be simplified to the following mathematical formula 2:

【數學式2】 [Math 2]

因此,透過如上之各參數調整,即可予以調整聚焦深度,故如第3圖所示,藉可將聚焦深度L1 調整至對應於堆疊後之加工體1及間隔層2整體之厚度T,即可予以切割該加工體1及間隔層2。Therefore, the focus depth can be adjusted by adjusting the above parameters, so as shown in FIG. 3, the focus depth L 1 can be adjusted to correspond to the thickness T of the processed body 1 and the spacer layer 2 as a whole. The processed body 1 and the spacer layer 2 can be cut.

而雷射切割裝置3於雷射切割之過程中,係將其聚焦深度涵蓋於加工體1及間隔層2整體,藉以透過聚焦透鏡將光束聚集於加工體1及間隔層2,以將加工體1及間隔層2加熱昇華,因加工體1之切割面將受熱熔形成液態,而熱熔之加工體1因受間隔層2隔絕,故無法沾附於鄰近之加工體1,因此當切割完成後,僅需將間隔層2予以撕除,即可得複數形狀相同且無相互沾黏之加工體1,藉此,顯見本創作確實單次即可予以切割複數加工體1,進而可提升製成、加工及產出之效率,以及提升加工成品之品質者。In the process of laser cutting, the laser cutting device 3 covers the entire depth of the processed body 1 and the spacer layer 2, so that the light beam is concentrated on the processed body 1 and the spacer layer 2 through the focusing lens to process the processed body. 1 and the spacer layer 2 is heated and sublimated, since the cut surface of the processed body 1 is heated to form a liquid state, and the hot melt processed body 1 is not separated by the adjacent processed body 1 because it is separated by the spacer layer 2, so when the cutting is completed After that, only the spacer layer 2 is torn off, and the processed body 1 having the same shape and no mutual adhesion can be obtained, thereby clearly showing that the creation of the plurality of processed bodies 1 can be performed in a single operation, and the system can be improved. The efficiency of production, processing and output, as well as the quality of finished products.

綜觀上述,本創作所揭露之技術手段不僅為前所未見,且確可達致預期之目的與功效,故兼具新穎性與進步性,誠屬專利法所稱之新型無誤,以其整體結構而言,確已符合專利法之法定要件,爰依法提出新型專利申請。Looking at the above, the technical means exposed in this creation is not only unprecedented, but also achieves the intended purpose and effect, so it is both novel and progressive. It is a new type of patent law that is called the whole. In terms of structure, it has indeed met the statutory requirements of the Patent Law and has filed a new type of patent application in accordance with the law.

惟以上所述者,僅為本創作之較佳實施例,當不能以此作為限定本創作之實施範圍,即大凡依本創作申請專利範圍及說明書內容所作之等效變化與修飾,皆應仍屬於本創作專利涵蓋之範圍內。However, the above descriptions are only preferred embodiments of the present invention, and should not be used as a limitation to the scope of implementation of the creation, that is, the equivalent changes and modifications made by the applicant in accordance with the scope of the patent application and the contents of the specification should still be Belonging to the scope covered by this creation patent.

1‧‧‧加工體
2‧‧‧間隔層
3‧‧‧雷射切割裝置
1‧‧‧Processed body
2‧‧‧ spacer
3‧‧‧Laser cutting device

第1圖係本創作加工體及間隔層堆疊之立體示意圖。 第2圖係本創作雷射切割裝置聚焦深度L0 之光學路徑示意圖。 第3圖係本創作雷射切割裝置聚焦深度L1 之光學路徑示意圖。Fig. 1 is a perspective view showing the stack of the created body and the spacer layer. Fig. 2 is a schematic diagram showing the optical path of the depth L 0 of the laser cutting device of the present invention. FIG 3 Creation of this laser cutting apparatus based focus depth L of the optical path of a schematic diagram.

1‧‧‧加工體 1‧‧‧Processed body

2‧‧‧間隔層 2‧‧‧ spacer

Claims (5)

一種可堆疊切割之壓克力板結構,其包含:複數加工體,其係相互堆疊排列者,且所述加工體之間分別設有一對應之間隔層以分離所述加工體,所述間隔層係令所述加工體於切割時,所述加工體之間不因熱熔而相互黏合者。A stackable and cut acrylic sheet structure comprising: a plurality of processed bodies stacked on each other, and a corresponding spacer layer is disposed between the processed bodies to separate the processed body, the spacer layer When the processed body is cut, the processed bodies are not bonded to each other by heat fusion. 如申請專利範圍第1項所述之壓克力板結構,其中,所述加工體為壓克力(Polymethylmethacrylate, PMMA)。The acrylic sheet structure according to claim 1, wherein the processed body is Polymethylmethacrylate (PMMA). 如申請專利範圍第1項所述之壓克力板結構,其中,所述間隔層主要為薄層之紙類製成者。The acrylic sheet structure of claim 1, wherein the spacer layer is mainly a thin layer of paper maker. 如申請專利範圍第2項所述之壓克力板結構,其中,所述間隔層主要為薄層之紙類製成者。The acrylic sheet structure of claim 2, wherein the spacer layer is mainly a thin layer of paper maker. 如申請專利範圍第1至4項中任一項所述之壓克力板結構,更包含一對應由加工體堆疊排列方向切割所述加工體之雷射切割裝置,且該雷射切割裝置之聚焦深度係對應於所述加工體及間隔層堆疊之厚度者。The acryl plate structure according to any one of claims 1 to 4, further comprising a laser cutting device corresponding to cutting the processed body by the direction in which the processed body is stacked, and the laser cutting device The depth of focus corresponds to the thickness of the processed body and the spacer layer stack.
TW103214867U 2014-08-20 2014-08-20 Acrylic board structure which can be stacked and cut TWM491573U (en)

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