TWM488581U - Lighting device and display - Google Patents
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- TWM488581U TWM488581U TW103208734U TW103208734U TWM488581U TW M488581 U TWM488581 U TW M488581U TW 103208734 U TW103208734 U TW 103208734U TW 103208734 U TW103208734 U TW 103208734U TW M488581 U TWM488581 U TW M488581U
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Abstract
Description
本創作係關於一種發光裝置及顯示器;特別是關於一種可避免電路板上之接頭脫落的發光裝置,以及包含該發光裝置之顯示器。The present invention relates to a light-emitting device and a display; and more particularly to a light-emitting device that can prevent the connector on the circuit board from falling off, and a display including the same.
在各式各樣之照明領域中,由於技術的進步,有漸漸使用LED(發光二極體)來取代傳統上使用之燈管(例如熱陰極燈管或冷陰極燈管)的趨勢。在一般之使用上,會先將多個LED設置在單一電路板上(例如:印刷電路板,Printed Circuit Board;PCB),形成一光條(Light Bar),接著再將多個光條設置在一殼體或框體中,形成一照明裝置或設備(例如照明燈具或背光模組)。In various fields of illumination, due to advances in technology, there has been a gradual use of LEDs (light-emitting diodes) to replace the traditionally used lamps (such as hot cathode lamps or cold cathode lamps). In general use, multiple LEDs are first placed on a single circuit board (for example, Printed Circuit Board; PCB) to form a light bar, and then multiple light bars are placed in the light bar. In a housing or frame, a lighting device or device (such as a lighting fixture or a backlight module) is formed.
在使用LED做為光源之顯示器中,隨著顯示器尺寸的增大,LED所需數量亦隨之增加,且光條之長度亦之增長。然而,若欲將所需之LED設置在單一電路板上,以形成一長度相對較長之光條,將會遭遇到製程上之困難。因此,需將多個LED分設在多個單一電路板上以形成長度相對較短之多個光條,接著再將多個光條沿著長軸方向排列。In displays using LEDs as light sources, as the size of the display increases, the number of LEDs required increases, and the length of the light bars also increases. However, if the desired LED is to be placed on a single circuit board to form a relatively long length of light strip, it will encounter difficulties in the process. Therefore, it is necessary to divide a plurality of LEDs on a plurality of single circuit boards to form a plurality of light strips having a relatively short length, and then to arrange the plurality of light strips along the long axis direction.
然而,為了減少組裝之工時、降低線材之材料成本、及獲得更佳之LED調控上的一致性(例如:各個光條上之LED發光時間點的一致性),通常需將多個光條以接頭(Connector)做電性連接。由於光條及其所固 接之基板(例如:背板;Rear Cover)膨脹係數差異,在使用一段時間後,光條會產生翹曲,進而使得接頭由光條上脫落,導致光條失效。However, in order to reduce the labor of assembly, reduce the material cost of the wire, and achieve better control of the LED (for example, the consistency of the LED illumination time on each strip), it is usually necessary to The connector is electrically connected. Due to the light bar and its solid The difference in the expansion coefficient of the substrate (for example, the back cover; the Rear Cover) causes the light bar to warp after a period of use, which causes the connector to fall off the light bar, resulting in failure of the light bar.
因此,需要提供一種改良之發光裝置之結構,用以避免如上所述,在使用一段時間後,由於光條之翹曲使得接頭由光條上脫落而導致光條失效的問題。Accordingly, it would be desirable to provide an improved illumination device structure that avoids the problem of failure of the light strip due to warping of the light strip due to warpage of the light strip as described above.
本創作之發光裝置包括基板、具有第一貫穿孔之第一電路板、具有第二貫穿孔之第二電路板、設置在第一與第二電路板上之多個發光二極體、設置在第一電路板一端之第一接頭、設置在第二電路板一端之第二接頭、具有第三及第四貫穿孔之固定裝置、以及第一與第二接合件。上述第二貫穿孔為圓形孔,第一與第二接頭電性連接,而第一接合件貫穿第一與第三貫穿孔,第二接合件貫穿第二與第四貫穿孔,且第一與第二接合件分別接合至基板上,藉此將第一電路板、第二電路板及固定裝置接合至基板上,其中上述圓形孔之直徑與第二接合件之直徑差大於或等於1m公厘(mm)。The light-emitting device of the present invention comprises a substrate, a first circuit board having a first through hole, a second circuit board having a second through hole, a plurality of light emitting diodes disposed on the first and second circuit boards, and a first connector at one end of the first circuit board, a second connector disposed at one end of the second circuit board, a fixing device having third and fourth through holes, and first and second bonding members. The second through hole is a circular hole, the first and second joints are electrically connected, and the first joint member penetrates the first and third through holes, the second joint member penetrates the second and fourth through holes, and the first Bonding to the substrate respectively with the second bonding member, thereby bonding the first circuit board, the second circuit board and the fixing device to the substrate, wherein a diameter difference between the diameter of the circular hole and the second bonding member is greater than or equal to 1 m Mm (mm).
在一較佳實施例中,如上所述之發光裝置之第三及第四貫穿孔之週邊分別具有一凸出部,此些凸出部分別穿設至上述第一與第二貫穿孔中。在另一較佳實施例中,上述第三及第四貫穿孔週邊之凸出部分別與第一及第二貫穿孔之週邊實質接觸。而在另一較佳實施例中,上述第三及第四貫穿孔週邊之凸出部之高度分別小於或等於第一電路板之厚度及第二電路板之厚度。此外,在又一較佳實施例中,上述第三及第四貫穿孔週邊之凸出部分別環繞第三及第四貫穿孔之整個週邊。In a preferred embodiment, the periphery of the third and fourth through holes of the light-emitting device as described above respectively have a protruding portion, and the protruding portions are respectively inserted into the first and second through holes. In another preferred embodiment, the protrusions around the third and fourth through holes are in substantial contact with the periphery of the first and second through holes, respectively. In another preferred embodiment, the heights of the protrusions around the third and fourth through holes are respectively less than or equal to the thickness of the first circuit board and the thickness of the second circuit board. In addition, in another preferred embodiment, the protrusions around the third and fourth through holes respectively surround the entire circumference of the third and fourth through holes.
在另一較佳實施例中,如上所述之發光裝置之第一與第二貫穿孔之週邊分別具有一凸出部,此些凸出部分別穿設至上述第三及第四貫穿孔中。而在另一較佳實施例中,上述第一與第二貫穿孔週邊之凸出部分別與第三及第四貫穿孔之週邊實質接觸。此外,在另一較佳實施例中,上述第一與第二貫穿孔週邊之凸出部之高度分別小於或等於固定裝置之厚度。再者,在又一較佳實施例中,上述第一與第二貫穿孔週邊之凸出部分別環繞第一與第二貫穿孔之整個週邊。In another preferred embodiment, the periphery of the first and second through holes of the light-emitting device has a protruding portion, and the protruding portions are respectively inserted into the third and fourth through holes. . In another preferred embodiment, the protrusions around the first and second through holes are in substantial contact with the periphery of the third and fourth through holes, respectively. In addition, in another preferred embodiment, the heights of the protrusions around the first and second through holes are respectively less than or equal to the thickness of the fixing device. Furthermore, in still another preferred embodiment, the protrusions around the first and second through holes respectively surround the entire circumference of the first and second through holes.
在另一較佳實施例中,如上所述之發光裝置之第三及第四貫穿孔之幾何形狀分別與第一及第二貫穿孔之幾何形狀一致,且第三及第四貫穿孔之尺寸分別與第一及第二貫穿孔之尺寸實質一致。而在另一較佳實施例中,上述第一及第三貫穿孔為一圓形孔。In another preferred embodiment, the geometric shapes of the third and fourth through holes of the light-emitting device as described above are respectively consistent with the geometric shapes of the first and second through holes, and the dimensions of the third and fourth through holes. The dimensions of the first and second through holes are substantially identical to each other. In another preferred embodiment, the first and third through holes are a circular hole.
在另一較佳實施例中,如上所述之發光裝置之固定裝置與第一電路板之膨脹係數差小於第一電路板與基板之膨脹係數差。此外,在又一較佳實施例中,固定裝置與第二電路板之膨脹係數差小於第二電路板與基板之膨脹係數差。In another preferred embodiment, the difference in expansion coefficient between the fixing device of the light-emitting device and the first circuit board as described above is smaller than the difference in expansion coefficient between the first circuit board and the substrate. In addition, in another preferred embodiment, the difference in expansion coefficient between the fixing device and the second circuit board is smaller than the difference in expansion coefficient between the second circuit board and the substrate.
在另一較佳實施例中,如上所述之發光裝置之固定裝置介於第一電路板與基板之間,且介於第二電路板與基板之間。然而,在另一較佳實施例中,上述第一與第二電路板介於固定裝置與基板之間。In another preferred embodiment, the fixing device of the light emitting device as described above is interposed between the first circuit board and the substrate and between the second circuit board and the substrate. However, in another preferred embodiment, the first and second circuit boards are interposed between the fixture and the substrate.
在又一較佳實施例中,如上所述之發光裝置之第一與第二接頭位在第一與第二貫穿孔之間。In still another preferred embodiment, the first and second joints of the illumination device as described above are positioned between the first and second through holes.
在又一較佳實施例中,如上所述之發光裝置之圓形孔之直徑與第二接合件之直徑差大於或等於1.5公厘(mm)。In still another preferred embodiment, the diameter of the circular aperture of the illumination device as described above and the diameter of the second engagement member are greater than or equal to 1.5 mm.
在本創作中,當基板熱脹冷縮時,第二接合件可在第二與第四貫穿孔中平移,藉此避免第一與第二電路板隨著基板膨脹或收縮,進而避免設置在第一與第二電路板上之第一與第二接頭脫落。In the present invention, when the substrate is inflated and contracted, the second engaging member can be translated in the second and fourth through holes, thereby preventing the first and second circuit boards from expanding or contracting with the substrate, thereby avoiding being disposed at The first and second connectors on the first and second circuit boards are detached.
此外,在特定之較佳實施例中,藉由凸出部穿設於貫穿孔之中,更可減少第一與第二電路板隨著基板膨脹或收縮之形變量,進一步避免第一與第二接頭的脫落。In addition, in a specific preferred embodiment, the protruding portion is disposed in the through hole, and the deformation of the first and second circuit boards along with the expansion or contraction of the substrate is further reduced, thereby further avoiding the first and the first The two joints are detached.
再者,在特定之較佳實施例中,當凸出部係設置在固定裝置之第三及第四貫穿孔的週邊,且分別穿設至第一與第二貫穿孔中時,藉由固定裝置本身之剛性,更可減少第一與第二電路板隨著基板膨脹或收縮所產生之彎曲形變量。Furthermore, in a specific preferred embodiment, when the protruding portion is disposed at the periphery of the third and fourth through holes of the fixing device and is respectively inserted into the first and second through holes, by fixing The rigidity of the device itself can further reduce the bending deformation of the first and second circuit boards as the substrate expands or contracts.
100‧‧‧發光裝置100‧‧‧Lighting device
102‧‧‧基板102‧‧‧Substrate
104‧‧‧第一電路板104‧‧‧First board
104a‧‧‧第一電路板104a‧‧‧First board
104b‧‧‧第一電路板104b‧‧‧First board
106‧‧‧第二電路板106‧‧‧Second circuit board
106a‧‧‧第二電路板106a‧‧‧Second circuit board
106b‧‧‧第二電路板106b‧‧‧second board
108‧‧‧LED108‧‧‧LED
110‧‧‧第一接頭110‧‧‧First joint
112‧‧‧第二接頭112‧‧‧second joint
114‧‧‧第一接合件114‧‧‧First joint
116‧‧‧第二接合件116‧‧‧Second joint
118‧‧‧第一貫穿孔118‧‧‧First through hole
118a‧‧‧凸出部118a‧‧‧Protruding
120‧‧‧第二貫穿孔120‧‧‧Second through hole
120a‧‧‧凸出部120a‧‧‧protrusion
200‧‧‧固定裝置200‧‧‧Fixed devices
202‧‧‧第三貫穿孔202‧‧‧Three through holes
202a‧‧‧凸出部202a‧‧‧protrusion
204‧‧‧第四貫穿孔204‧‧‧fourth through hole
204a‧‧‧凸出部204a‧‧‧protrusion
C1-C1‧‧‧線C1-C1‧‧‧ line
第1A圖係繪示根據本創作之一較佳實施例之發光裝置之剖面示意圖。1A is a schematic cross-sectional view showing a light-emitting device according to a preferred embodiment of the present invention.
第1B圖係繪示第1A圖之發光裝置中之固定裝置的俯視示意圖。FIG. 1B is a schematic plan view showing the fixing device in the light-emitting device of FIG. 1A.
第1C圖係繪示沿著第1B圖中之線C1-C1剖切之剖面示意圖。Fig. 1C is a schematic cross-sectional view taken along line C1-C1 in Fig. 1B.
第1D圖係繪示第1A圖之發光裝置中之電路板及接頭的俯視示意圖。Fig. 1D is a schematic plan view showing a circuit board and a joint in the light-emitting device of Fig. 1A.
第2A圖係繪示根據本創作之另一較佳實施例之發光裝置之俯視示意圖。2A is a top plan view of a light emitting device according to another preferred embodiment of the present invention.
第2B圖係繪示第2A圖之發光裝置之剖面示意圖。2B is a schematic cross-sectional view showing the light-emitting device of FIG. 2A.
第3圖係繪示根據本創作之又一較佳實施例之發光裝置之剖面示意圖。Figure 3 is a cross-sectional view showing a light-emitting device according to still another preferred embodiment of the present invention.
為了讓本創作之上述及其他目的、特徵、優點能更明顯易 懂,下文將特舉本創作較佳實施例,並配合所附圖式,作詳細說明如下。再者,本創作所提到的方向用語,例如上、下、頂、底、前、後、左、右、內、外、側面、周圍、中央、水平、橫向、垂直、縱向、軸向、徑向、最上層或最下層等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明及理解本創作,而非用以限制本創作。In order to make the above and other purposes, features and advantages of this creation more obvious It is to be understood that the preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. Furthermore, the directional terms mentioned in this creation, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, side, surrounding, central, horizontal, horizontal, vertical, vertical, axial, Radial, uppermost or lowermost, etc., only refer to the direction of the additional schema. Therefore, the directional terminology used is used to describe and understand the creation, and is not intended to limit the creation.
請參照第1A圖至第1D圖,其係分別繪示根據本創作之一較佳實施例之發光裝置之剖面示意圖,發光裝置中之固定裝置的俯視示意圖、沿著第1B圖中之線C1-C1剖切之剖面示意圖、及發光裝置中之電路板及接頭的俯視示意圖。發光裝置100包括基板102、第一電路板104、第二電路板106、多個LED 108、第一接頭110、第二接頭112、固定裝置200、及第一接合件114與第二接合件116。基板102之主要功能係用以承接上述各項元件,並提供各項元件適當之保護作用,而為了滿足輕量化及可變化更複雜之幾何造型等需求,基板102之材料可為塑膠材料。1A to 1D are schematic cross-sectional views showing a light-emitting device according to a preferred embodiment of the present invention, and a schematic view of the fixing device in the light-emitting device, along line C1 in FIG. 1B. - C1 cutaway schematic view, and a schematic view of the circuit board and connector in the illuminating device. The light emitting device 100 includes a substrate 102, a first circuit board 104, a second circuit board 106, a plurality of LEDs 108, a first joint 110, a second joint 112, a fixing device 200, and a first joint member 114 and a second joint member 116. . The main function of the substrate 102 is to take over the above components and provide appropriate protection for each component. The material of the substrate 102 may be a plastic material in order to meet the requirements of lightweight and changeable geometric shapes.
在此實施例中,第一電路板104具有第一貫穿孔118,而第二電路板106具有第二貫穿孔120,其中第二貫穿孔120為圓形孔,此圓形孔需使得穿設於其中接合件可沿著第二電路板106長邊方向平移。In this embodiment, the first circuit board 104 has a first through hole 118, and the second circuit board 106 has a second through hole 120, wherein the second through hole 120 is a circular hole, and the circular hole needs to be worn. The engaging member is translatable along the longitudinal direction of the second circuit board 106.
上述多個LED 108係設置在第一電路板104與第二電路板106上,LED 108係用以產生發光裝置100所需之光源。在此實施例中,僅繪示二LED 108,其分別位在第一電路板104與第二電路板106上,然而,LED 108之數量可根據設計需求加以變更,並不以本實施例為限。此外,第一接頭110與第二接頭112係分別設置在第一電路板104之一端,以及第二電路板106之一端,其中第一接頭110與第二接頭112互相電性連接,藉此使得第一 電路板104及第二電路板106上之LED 108之調控能夠一致化。The plurality of LEDs 108 are disposed on the first circuit board 104 and the second circuit board 106, and the LEDs 108 are used to generate a light source required for the light emitting device 100. In this embodiment, only two LEDs 108 are shown, which are respectively located on the first circuit board 104 and the second circuit board 106. However, the number of LEDs 108 can be changed according to design requirements, and is not in this embodiment. limit. In addition, the first connector 110 and the second connector 112 are respectively disposed at one end of the first circuit board 104 and one end of the second circuit board 106, wherein the first connector 110 and the second connector 112 are electrically connected to each other, thereby the first The regulation of the LEDs 108 on the circuit board 104 and the second circuit board 106 can be unified.
上述固定裝置200更具有第三貫穿孔202及第四貫穿孔204,其中第三貫穿孔202及第四貫穿孔204之設置位置需分別與第一貫穿孔118以及第二貫穿孔120之設置位置互相對應,藉此使得後續即將說明之第一接合件114與第二接合件116可穿設於其中。而為了將第一電路板104、第二電路板106及固定裝置200接合至基板102上,第一接合件114貫穿第一電路板104之第一貫穿孔118與固定裝置200之第三貫穿孔202,而第二接合件116則貫穿第二電路板106之第二貫穿孔120與固定裝置200之第四貫穿孔204,且第一接合件114與第二接合件116分別接合至基板102上,藉此將第一電路板104、第二電路板106及固定裝置200接合至基板102上。The fixing device 200 further includes a third through hole 202 and a fourth through hole 204. The positions of the third through hole 202 and the fourth through hole 204 are respectively disposed at a position corresponding to the first through hole 118 and the second through hole 120. Corresponding to each other, thereby allowing the first engaging member 114 and the second engaging member 116 to be described later to be inserted therein. In order to bond the first circuit board 104, the second circuit board 106, and the fixing device 200 to the substrate 102, the first bonding member 114 penetrates the first through hole 118 of the first circuit board 104 and the third through hole of the fixing device 200. 202, the second bonding member 116 penetrates the second through hole 120 of the second circuit board 106 and the fourth through hole 204 of the fixing device 200, and the first bonding member 114 and the second bonding member 116 are respectively bonded to the substrate 102. Thereby, the first circuit board 104, the second circuit board 106, and the fixing device 200 are bonded to the substrate 102.
為了達到上述「第二貫穿孔120之圓形孔需使得穿設於其中接合件(即第二接合件116)可沿著第二電路板106長邊方向平移」之功能,其中第二貫穿孔120之圓形孔之直徑與第二接合件116之直徑差大於或等於1公厘(mm)。在特定之實施例中,為了使第二接合件116具有更大的平移範圍,第二貫穿孔120之圓形孔之直徑與第二接合件116之直徑差大於或等於1.5公厘(mm)。In order to achieve the above-mentioned "the circular hole of the second through hole 120, the function of the engaging member (ie, the second engaging member 116) can be translated along the longitudinal direction of the second circuit board 106," the second through hole The diameter of the circular hole of 120 and the diameter of the second engaging member 116 are greater than or equal to 1 mm. In a particular embodiment, in order to provide the second engaging member 116 with a larger translation range, the diameter of the circular hole of the second through hole 120 and the diameter of the second engaging member 116 are greater than or equal to 1.5 mm (mm). .
此外,在本實施例中,第一接合件114與第二接合件116係為螺絲,藉由螺接方式將第一電路板104、第二電路板106及固定裝置200接合至基板102上。而在其他實施例中,第一接合件114與第二接合件116可以鉚釘或插銷來替代螺絲,用以接合上述元件至基板102上,由於此些接合技術已為此領域具有通常知識者所熟知,故不在此詳述。In addition, in the embodiment, the first joint member 114 and the second joint member 116 are screws, and the first circuit board 104, the second circuit board 106, and the fixing device 200 are joined to the substrate 102 by screwing. In other embodiments, the first engagement member 114 and the second engagement member 116 may be rivets or pins instead of screws for engaging the components onto the substrate 102, as such bonding techniques have been commonly used by those skilled in the art. Well known, so it is not detailed here.
在本實施例中,第二電路板106之第二貫穿孔120(圓形孔)直 徑大於第二接合件116(螺絲)之直徑,為達到鎖附固定功能,因此第二接合件116為附華司(Washer)的螺絲;更具體的說,華司以一體成型方式形成在螺絲頭的週邊,其中華司直徑大於第二貫穿孔120之圓形孔直徑,而螺絲具有螺牙部分之直徑小於第二貫穿孔120之圓形孔直徑,且圓形孔之直徑與螺牙部分之直徑差大於或等於1公厘(mm)。In this embodiment, the second through hole 120 (circular hole) of the second circuit board 106 is straight. The diameter is larger than the diameter of the second joint member 116 (screw), so as to achieve the locking and fixing function, the second joint member 116 is a washer attached to the washer; more specifically, the washer is integrally formed on the screw. a circumference of the head, wherein the diameter of the washer is larger than the diameter of the circular hole of the second through hole 120, and the diameter of the screw having the thread portion is smaller than the diameter of the circular hole of the second through hole 120, and the diameter of the circular hole and the thread portion The difference in diameter is greater than or equal to 1 mm.
當發光裝置100之基板102受熱(例如:LED 108發光產生之廢熱)膨脹,使得第二接合件116與基板102之接合處往第1A圖之右側移動時,由於第二電路板106之第二貫穿孔120為直徑大於第二接合件116之直徑的圓形孔,故穿設於其中之第二接合件116可隨著基板102在第二貫穿孔120中往第1A圖之右側平移。此外,為了使得第二接合件116能夠順利的平移,上述由第二接合件116所穿設之固定裝置200之第四貫穿孔204,亦需預先保留讓第二接合件116能夠平移的空間。藉由上述之第二貫穿孔120與第四貫穿孔204之特殊設計,當基板102受熱膨脹或遇冷收縮(熱脹冷縮)時,第二接合件116可在第二貫穿孔120與第四貫穿孔204中平移,亦即第二接合件116與第一電路板104及第二電路板106之間可產生相對平移,故可降低第一電路板104及第二電路板106隨著基板102膨脹或收縮而產生形變的機會,進而降低第一接頭110與第二接頭112脫落的機會。When the substrate 102 of the illuminating device 100 is heated (for example, the waste heat generated by the LED 108 illuminating), so that the junction of the second bonding member 116 and the substrate 102 moves to the right side of FIG. 1A, since the second circuit board 106 is second. The through hole 120 is a circular hole having a diameter larger than the diameter of the second engaging member 116, so that the second engaging member 116 penetrating therein can be translated to the right side of the first through hole in the second through hole 120. In addition, in order to enable the second engaging member 116 to be smoothly translated, the fourth through hole 204 of the fixing device 200 through which the second engaging member 116 is inserted also needs to reserve a space for the second engaging member 116 to translate. With the special design of the second through hole 120 and the fourth through hole 204 described above, when the substrate 102 is thermally expanded or contracted by heat (thermal expansion and contraction), the second joint member 116 may be in the second through hole 120 and the second through hole 120 The translation of the four through holes 204, that is, the second joint member 116 and the first circuit board 104 and the second circuit board 106 can be relatively translated, so that the first circuit board 104 and the second circuit board 106 can be reduced with the substrate. The expansion or contraction of 102 creates a chance of deformation, which in turn reduces the chance of the first joint 110 and the second joint 112 falling off.
再者,固定裝置200可用以強化第一電路板104與第二電路板106接合處之抗扭曲剛性,當基板102膨脹或收縮時,由於第一電路板104與第二電路板106可能分別與第一接合件114及第二接合件116有接觸,故基板102因形變而平移時,第一電路板104與第二電路板106接合處可能因為上述之接觸所產生之摩擦力作用而產生形變,此時,固定裝置200可有效降低上 述之形變量,進而降低第一接頭110與第二接頭112脫落的機會。Moreover, the fixing device 200 can be used to strengthen the anti-twist rigidity of the joint between the first circuit board 104 and the second circuit board 106. When the substrate 102 expands or contracts, the first circuit board 104 and the second circuit board 106 may respectively When the first engaging member 114 and the second engaging member 116 are in contact, when the substrate 102 is translated due to deformation, the joint between the first circuit board 104 and the second circuit board 106 may be deformed by the frictional force generated by the contact. At this time, the fixing device 200 can effectively lower the upper The shape variable described further reduces the chance of the first joint 110 and the second joint 112 falling off.
另外,在第1A至1D圖中,上述第三貫穿孔202及第四貫穿孔204之幾何形狀分別與第一貫穿孔118與第二貫穿孔120之幾何形狀一致,且第三貫穿孔202及第四貫穿孔204之尺寸分別與第一貫穿孔118及第二貫穿孔120之尺寸實質一致。上述幾何形狀一致是指,第三貫穿孔202與第一貫穿孔118具有相似之形狀(例如均為圓形孔),且第四貫穿孔204與第二貫穿孔120亦具有相似之形狀(例如均為上述之圓形孔)。而尺寸實質一致是指,在不考慮各式各樣的公差(例如組配公差)之前提下,第三貫穿孔202與第一貫穿孔118具有一致之尺寸(例如其圓形孔之直徑相同),且第四貫穿孔204與第二貫穿孔120亦具有一致之尺寸。在其他實施例中,第三貫穿孔202與第一貫穿孔118可包含不同之幾何形狀或尺寸,而第四貫穿孔204與第二貫穿孔120亦可包含不同之幾何形狀或尺寸,相關幾何形狀或尺寸可根據設計需要加以變化,僅需使得基板102在膨脹或收縮時,第二接合件116可在其穿設之第二貫穿孔120與第四貫穿孔204中產生如上所述之平移即可。In addition, in the first through the first through hole 202 and the fourth through hole 204, the geometric shapes of the first through hole 202 and the fourth through hole 204 are respectively matched with the geometric shapes of the first through hole 118 and the second through hole 120, and the third through hole 202 and The size of the fourth through hole 204 substantially coincides with the size of the first through hole 118 and the second through hole 120, respectively. The above-mentioned geometrical shape means that the third through hole 202 has a similar shape to the first through hole 118 (for example, both are circular holes), and the fourth through hole 204 and the second through hole 120 have similar shapes (for example, All are round holes as described above). Substantially uniform in size means that the third through hole 202 has the same size as the first through hole 118 (e.g., the diameter of the circular hole is the same), regardless of various tolerances (e.g., assembly tolerances). And the fourth through hole 204 and the second through hole 120 also have the same size. In other embodiments, the third through hole 202 and the first through hole 118 may include different geometric shapes or sizes, and the fourth through hole 204 and the second through hole 120 may also include different geometric shapes or sizes, and related geometries. The shape or size may be varied according to design requirements, and only when the substrate 102 is expanded or contracted, the second engaging member 116 may generate a translation as described above in the second through hole 120 and the fourth through hole 204 through which the substrate is inserted. Just fine.
為了使得發光裝置100能有更佳之光學特性,在本實施例中,上述第一貫穿孔118及第三貫穿孔202分別為一圓形孔。當第一接合件114穿設於上述貫穿孔而接合在基板102上時,可固定第一電路板104一端與其他光學元件(未繪示)之相對位置,藉此提升發光裝置100之光學性能。而在其他實施例中,上述第一貫穿孔118及第三貫穿孔202亦可分別為一非圓形孔,其中非圓形孔可為一矩形孔、橢圓形孔、類橢圓形孔、或延伸孔。上述類橢圓形孔是指,週邊由相對的二直線段及相對的二弧形線段所組成之幾何形狀,矩形孔則包含有方形孔及長方形孔,至於延伸孔則指除了上 述之矩形孔、橢圓形孔、及類橢圓形孔之外的其他幾何形狀貫穿孔。In the present embodiment, the first through hole 118 and the third through hole 202 are respectively a circular hole in order to enable the light emitting device 100 to have better optical characteristics. When the first bonding member 114 is inserted through the through hole and bonded to the substrate 102, the relative position of one end of the first circuit board 104 to other optical components (not shown) can be fixed, thereby improving the optical performance of the light emitting device 100. . In other embodiments, the first through hole 118 and the third through hole 202 may each be a non-circular hole, wherein the non-circular hole may be a rectangular hole, an elliptical hole, an elliptical hole, or Extend the hole. The above-mentioned elliptical hole refers to a geometric shape in which the periphery is composed of two opposite straight segments and two opposite curved segments, and the rectangular hole includes a square hole and a rectangular hole, and the extended hole refers to the upper hole. Rectangular, elliptical, and other geometrically shaped through-holes are described.
當基板102膨脹或收縮時,為了使得第一接頭110與第二接頭112之間能夠產生更小的相對位移,在第1A至1D圖之實施例中,固定裝置200之第三貫穿孔202及第四貫穿孔204之週邊分別具有凸出部202a及凸出部204a,此些凸出部202a及凸出部204a分別穿設至第一貫穿孔118與第二貫穿孔120中。如上所述,當基板102形變而平移時,第一電路板104與第二電路板106接合處可能因為摩擦力之作用而產生形變,此時,凸出部202a及凸出部204a可有效地限制第一貫穿孔118與第二貫穿孔120之間的直線形變量及扭曲形變量,亦即可有效地降低第一電路板104與第二電路板106接合處的形變量(位移量),進而有效地抑制第一接頭110與第二接頭112的脫落(即抑制第一接頭110與第二接頭112之間產生的相對位移)。When the substrate 102 is expanded or contracted, in order to enable a smaller relative displacement between the first joint 110 and the second joint 112, in the embodiment of FIGS. 1A to 1D, the third through hole 202 of the fixing device 200 and The periphery of the fourth through hole 204 has a protruding portion 202a and a protruding portion 204a. The protruding portion 202a and the protruding portion 204a are respectively inserted into the first through hole 118 and the second through hole 120. As described above, when the substrate 102 is deformed and translated, the joint between the first circuit board 104 and the second circuit board 106 may be deformed due to the frictional force. At this time, the protruding portion 202a and the protruding portion 204a can be effectively Limiting the linear variable and the distortion variable between the first through hole 118 and the second through hole 120 can also effectively reduce the deformation amount (displacement amount) at the junction of the first circuit board 104 and the second circuit board 106. Further, the detachment of the first joint 110 and the second joint 112 (i.e., the relative displacement generated between the first joint 110 and the second joint 112) is effectively suppressed.
為了更進一步降低第一電路板104與第二電路板106接合處的形變量,以更有效地抑制第一接頭110與第二接頭112的脫落,上述第三貫穿孔202及第四貫穿孔204之週邊的凸出部202a與凸出部204a分別與第一貫穿孔114及第二貫穿孔116之週邊實質接觸。此處實質接觸係指,在不考慮各式各樣的公差(例如組配公差)之前提下,凸出部202a與凸出部204a分別抵靠在第一貫穿孔114與第二貫穿孔116之週邊上。In order to further reduce the deformation of the joint between the first circuit board 104 and the second circuit board 106 to more effectively suppress the falling off of the first joint 110 and the second joint 112, the third through hole 202 and the fourth through hole 204 The peripheral protruding portion 202a and the protruding portion 204a are in physical contact with the periphery of the first through hole 114 and the second through hole 116, respectively. Here, the substantial contact means that the projection 202a and the projection 204a abut against the first through hole 114 and the second through hole 116, respectively, before considering various tolerances (for example, assembly tolerances). On the periphery.
此外,為了減少基板102之平移經由上述之摩擦力作用而對第一電路板104、第二電路板106、及固定裝置200產生應力作用,進而導致第一電路板104與第二電路板106接合處的形變,上述第三貫穿孔202及第四貫穿孔204之週邊的凸出部202a與凸出部204a之高度分別小於或等於(≦)第一電路板104之厚度及第二電路板106之厚度。藉由此設計,可避免第一接 合件114及第二接合件116與固定裝置200之接觸,故可減少基板102之平移經由上述之摩擦力作用而對第一電路板104、第二電路板106、及固定裝置200產生應力作用。In addition, in order to reduce the translation of the substrate 102, the first circuit board 104, the second circuit board 106, and the fixing device 200 are stressed by the frictional force described above, thereby causing the first circuit board 104 to be bonded to the second circuit board 106. The height of the protruding portion 202a and the protruding portion 204a around the third through hole 202 and the fourth through hole 204 are less than or equal to the thickness of the first circuit board 104 and the second circuit board 106, respectively. The thickness. With this design, the first connection can be avoided The contact 114 and the second engaging member 116 are in contact with the fixing device 200, so that the translation of the substrate 102 can be reduced to cause stress on the first circuit board 104, the second circuit board 106, and the fixing device 200 via the frictional force described above. .
再者,為了更加強化上述凸出部之功能,上述第三貫穿孔202及第四貫穿孔204之週邊的凸出部202a與凸出部204a分別環繞第三貫穿孔202及第四貫穿孔204之整個週邊(如第1B圖所示)。In addition, in order to further enhance the function of the protruding portion, the protruding portion 202a and the protruding portion 204a around the third through hole 202 and the fourth through hole 204 surround the third through hole 202 and the fourth through hole 204, respectively. The entire perimeter (as shown in Figure 1B).
在第1A至1D圖所示之實施例中,如第1A圖所示,其中固定裝置200介於第一電路板104與基板102之間,且固定裝置200亦介於第二電路板106與基板102之間。然而,在其他實施例中,可經由簡單的結構修正,例如,在原本之固定裝置200上開設另一貫穿孔以容設上述之第一接頭110及第二接頭112,進而使得上述之第一電路板104與第二電路板106介於固定裝置與基板102之間。In the embodiment shown in FIGS. 1A to 1D, as shown in FIG. 1A, wherein the fixing device 200 is interposed between the first circuit board 104 and the substrate 102, and the fixing device 200 is also interposed between the second circuit board 106 and Between the substrates 102. However, in other embodiments, another through hole may be opened in the original fixing device 200 to accommodate the first joint 110 and the second joint 112, thereby making the first circuit described above The board 104 and the second circuit board 106 are interposed between the fixture and the substrate 102.
此外,如第1A圖及1D所示,第一接頭110與第二接頭112係位在第一貫穿孔118與第二貫穿孔120之間。請參照第2A圖與第2B圖,其係分別繪示根據本創作之另一實施例之發光裝置之俯視示意圖,及發光裝置之剖面示意圖。在第2A圖與第2B圖所示之實施例中,其大致與第1A至1D圖所示之實施例具有相同之特徵,其中相同之元件以相同之符號加以標示,此二實施例間主要差異在於電路板,以下僅就差異部分加以說明,相同部分即不再加以贅述。Further, as shown in FIGS. 1A and 1D, the first joint 110 and the second joint 112 are positioned between the first through hole 118 and the second through hole 120. Please refer to FIG. 2A and FIG. 2B , which are schematic top views of a light-emitting device according to another embodiment of the present invention, and a schematic cross-sectional view of the light-emitting device. In the embodiments shown in FIGS. 2A and 2B, which have substantially the same features as the embodiments shown in FIGS. 1A to 1D, wherein the same elements are denoted by the same reference numerals, and the two embodiments are mainly The difference lies in the circuit board. The following only explains the difference, and the same part will not be described again.
在第1A至1D圖所示之實施例中,互相電性連接之第一接頭110與第二接頭112係分別設置在第一電路板104與第二電路板106之一端,且上述第一電路板104與第二電路板106之一端具有平整之外形。然而,在 第2A圖與第2B圖所示之實施例中,第一電路板104a設置第一接頭110之一端具有一缺口部,而第二電路板106a設置第二接頭112之一端具有一凸出部,在第一接頭110與第二接頭112電性連接後,上述凸出部如第2A圖所示容設在缺口部中,二固定裝置200則如第2A圖所示設置在第一接頭110與第二接頭112之二側。In the embodiment shown in FIGS. 1A to 1D, the first joint 110 and the second joint 112 electrically connected to each other are respectively disposed at one end of the first circuit board 104 and the second circuit board 106, and the first circuit is One end of the board 104 and the second circuit board 106 has a flat outer shape. However, in In the embodiment shown in FIG. 2A and FIG. 2B, the first circuit board 104a is provided with a notch at one end of the first connector 110, and the second terminal 106a is provided with a protrusion at one end of the second connector 112. After the first joint 110 and the second joint 112 are electrically connected, the protruding portion is accommodated in the notch portion as shown in FIG. 2A, and the second fixing device 200 is disposed on the first joint 110 as shown in FIG. 2A. Two sides of the second joint 112.
根據以上所述及第2A圖所示之內容,第一接頭110與第二接頭112並未如第1A圖及1D所示係位在第一貫穿孔118與第二貫穿孔120之間。針對第一接頭110、第二接頭112、第一貫穿孔118與第二貫穿孔120等四者之相對位置關係,並不以本說明書之實施例為限,僅需使得固定裝置200能夠發揮降低第一接頭110與第二接頭112脫落之機會的功能即可。According to the above and the contents shown in FIG. 2A, the first joint 110 and the second joint 112 are not between the first through hole 118 and the second through hole 120 as shown in FIGS. 1A and 1D. The relative positional relationship between the first joint 110, the second joint 112, the first through hole 118, and the second through hole 120 is not limited to the embodiment of the present specification, and only the fixing device 200 needs to be lowered. The function of the opportunity for the first joint 110 and the second joint 112 to fall off may be sufficient.
請再次參照第1A圖至第1D圖,在此實施例中,固定裝置200與第一電路板104之膨脹係數差小於第一電路板104與基板102之膨脹係數差,且固定裝置200與第二電路板106之膨脹係數差亦小於第二電路板106與基板102之膨脹係數差。然而,在其他實施例中,可不需同時滿足以上之二條件,例如:固定裝置200與第一電路板104之膨脹係數差小於第一電路板104與基板102之膨脹係數差,而固定裝置200與第二電路板106之膨脹係數差並未小於第二電路板106與基板102之膨脹係數差。Referring to FIG. 1A to FIG. 1D again, in this embodiment, the difference in expansion coefficient between the fixing device 200 and the first circuit board 104 is smaller than the difference in expansion coefficient between the first circuit board 104 and the substrate 102, and the fixing device 200 and the The difference in expansion coefficient of the two circuit boards 106 is also smaller than the difference in expansion coefficient between the second circuit board 106 and the substrate 102. However, in other embodiments, the above two conditions may not be satisfied at the same time, for example, the difference in expansion coefficient between the fixing device 200 and the first circuit board 104 is smaller than the difference in expansion coefficient between the first circuit board 104 and the substrate 102, and the fixing device 200 The difference in expansion coefficient from the second circuit board 106 is not less than the difference in expansion coefficient between the second circuit board 106 and the substrate 102.
請參照第3圖,其係繪示根據本創作之又一實施例之發光裝置之剖面示意圖。在第3圖所示之實施例中,其大致與第1A至1D圖所示之實施例具有相同之特徵,其中相同之元件以相同之符號加以標示,此二實施例間主要差異在於凸出部之設置位置,以下僅就差異部分加以說明,相同部分即不再加以贅述。在第3圖所示實施例中,第一貫穿孔118與第二貫 穿孔120之週邊分別具有凸出部118a與凸出部120a,其中此些凸出部118a與凸出部120a分別穿設至固定裝置200之第三貫穿孔202及第四貫穿孔204中,其主要功能係如上所述之凸出部202a及凸出部204a,可有效地降低第一電路板104與第二電路板106接合處的形變量(位移量),進而有效地抑制第一接頭110與第二接頭112的脫落。Please refer to FIG. 3, which is a cross-sectional view showing a light-emitting device according to still another embodiment of the present invention. In the embodiment shown in FIG. 3, it has substantially the same features as the embodiment shown in FIGS. 1A to 1D, wherein the same elements are denoted by the same symbols, and the main difference between the two embodiments lies in the convexity. The location of the department is described below only for the difference, and the same part will not be described again. In the embodiment shown in FIG. 3, the first through hole 118 and the second through hole The periphery of the through hole 120 has a protruding portion 118a and a protruding portion 120a, wherein the protruding portion 118a and the protruding portion 120a are respectively inserted into the third through hole 202 and the fourth through hole 204 of the fixing device 200, The main function is the protrusion 202a and the protrusion 204a as described above, which can effectively reduce the deformation amount (displacement amount) at the junction of the first circuit board 104 and the second circuit board 106, thereby effectively suppressing the first joint 110. Falling off with the second joint 112.
另外,同樣為了更進一步降低第一電路板104與第二電路板106接合處的形變量,以更有效地抑制第一接頭110與第二接頭112的脫落,上述第一貫穿孔118與第二貫穿孔120之週邊之凸出部118a與凸出部120a分別與第三貫穿孔202及第四貫穿孔204之週邊實質接觸。In addition, in order to further reduce the deformation of the joint between the first circuit board 104 and the second circuit board 106, the first joint 110 and the second joint 112 are more effectively suppressed from falling off, the first through hole 118 and the second. The protruding portion 118a and the protruding portion 120a of the periphery of the through hole 120 are in physical contact with the periphery of the third through hole 202 and the fourth through hole 204, respectively.
此外,為了減少基板102之平移經由上述之摩擦力作用而對第一電路板104、第二電路板106、及固定裝置200產生應力作用,上述第一貫穿孔118與第二貫穿孔120之週邊之凸出部118a與凸出部120a之高度分別小於或等於固定裝置200之厚度。In addition, in order to reduce the translation of the substrate 102 by the above-mentioned frictional force, the first circuit board 104, the second circuit board 106, and the fixing device 200 are stressed, and the first through hole 118 and the second through hole 120 are surrounded. The height of the protruding portion 118a and the protruding portion 120a is less than or equal to the thickness of the fixing device 200, respectively.
再者,為了更加強化上述凸出部之功能,上述第一貫穿孔118與第二貫穿孔120之週邊之凸出部118a與凸出部120a分別環繞第一貫穿孔118與第二貫穿孔120之整個週邊。In addition, in order to further enhance the function of the protruding portion, the protruding portion 118a and the protruding portion 120a surrounding the first through hole 118 and the second through hole 120 respectively surround the first through hole 118 and the second through hole 120. The entire perimeter.
在此要強調的是,以上所述之各種實施例之各式各樣的變化,並無需同時實施才能發揮其功能,熟悉此技術領域之技術者在參照本說明書之內容後,當可根據實際之狀況加以選擇性地採用,以達到其所欲之功效。It should be emphasized that various changes of the various embodiments described above are not required to be implemented at the same time, and those skilled in the art can refer to the contents of the present specification as The condition is selectively employed to achieve its desired effect.
此外,以上所述之各種實施例所述之發光裝置,其可為照明燈或應用於顯示器領域之背光模組。上述顯示器包括如以上所述之各種實 施例之各式各樣的發光裝置,以及一顯示面板(未繪示),設置在發光裝置之上,用以接收來自於發光裝置之入射光。In addition, the light-emitting device described in the various embodiments described above may be an illumination lamp or a backlight module applied to the display field. The above display includes various realities as described above A wide variety of illumination devices, as well as a display panel (not shown), are disposed on the illumination device for receiving incident light from the illumination device.
雖然本創作已以實施方式揭露如上,然其並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧發光裝置100‧‧‧Lighting device
102‧‧‧基板102‧‧‧Substrate
104‧‧‧第一電路板104‧‧‧First board
106‧‧‧第二電路板106‧‧‧Second circuit board
108‧‧‧LED108‧‧‧LED
110‧‧‧第一接頭110‧‧‧First joint
112‧‧‧第二接頭112‧‧‧second joint
114‧‧‧第一接合件114‧‧‧First joint
116‧‧‧第二接合件116‧‧‧Second joint
200‧‧‧固定裝置200‧‧‧Fixed devices
202‧‧‧第三貫穿孔202‧‧‧Three through holes
202a‧‧‧凸出部202a‧‧‧protrusion
204‧‧‧第四貫穿孔204‧‧‧fourth through hole
204a‧‧‧凸出部204a‧‧‧protrusion
Claims (19)
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TW103208734U TWM488581U (en) | 2014-05-19 | 2014-05-19 | Lighting device and display |
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TW103208734U TWM488581U (en) | 2014-05-19 | 2014-05-19 | Lighting device and display |
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TWM488581U true TWM488581U (en) | 2014-10-21 |
Family
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105553202A (en) * | 2016-03-04 | 2016-05-04 | 重庆大学 | Multi-stage stator/rotor combined motor |
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2014
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105553202A (en) * | 2016-03-04 | 2016-05-04 | 重庆大学 | Multi-stage stator/rotor combined motor |
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