TWM486236U - Mechanism for electronic device and electronic device - Google Patents

Description

Machine component and electronic device for electronic device

The present invention relates to a machine component, and more particularly to an electronic component that can be used as an inner or outer component of an electronic device and an electronic device using the same.

In the design and development of electronic devices, the trend of light, thin, short and small has gradually become more and more, and whether the materials of electronic products have the characteristics of light weight has become one of the important considerations in material selection. At present, the outer casing or inner frame of an electronic device such as a mobile phone, a tablet computer or a notebook computer is made of a metal material such as an aluminum alloy material, a magnesium alloy or a titanium aluminum alloy.

For the outer casing made of such alloy materials, it can be colored by surface treatment, which makes the product more beautiful and meets the needs of users. However, the shortcomings of the aluminum alloy material are also very obvious: it is not wear-resistant and easy to fall off the paint. As the use time increases, the color originally sprayed on the surface will still be worn away and reveal its dark gray original appearance; If you are scratched carefully, the nicks will be very conspicuous.

In addition, for the internal members made of the above-mentioned metal materials, the grounding point provided is prone to oxidative corrosion; one of the conventional treatment methods is to carry out rust and anticorrosion treatment at the grounding place, however, this method is cumbersome and costly. Processing time.

In view of the above problems, the present invention provides an electronic component and an electronic device for an electronic device. At least one surface of the machine member has a microstructure formed by laser engraving, and the machine member can serve as an inner member or an outer member of the electronic device.

According to one aspect of the present invention, a machine for an electronic device is proposed An embodiment of a member for use as an internal component of an electronic device, the machine member comprising: a metal plate member, a metal film layer, and a plurality of ground portions. The metal plate member has a first surface and a second surface for supporting internal components of the electronic device. The metal film layer is disposed on the first surface and the second surface of the metal plate member. A plurality of ground portions are disposed over a plurality of regions of at least one of the first surface and the second surface of the metal plate member and serve as ground points for the electronic device. The plurality of ground portions are microstructures formed by laser engraving of the surface of the metal film layer corresponding to the plurality of regions.

According to another aspect of the present invention, an embodiment of an electronic component for an electronic device is proposed for use as an outer member of an electronic device, the mechanical member comprising: a metal plate member, a first coating layer, a metal film layer, and a plurality of a microstructure portion and a second coating. The metal plate member has a surface, and the first coating layer is disposed on the surface of the metal plate member. The microstructures formed by laser engraving at a plurality of locations on the surface of the plurality of microstructured metal film layers are used to cause the mechanical components to exhibit an appearance pattern. The second coating layer is disposed on the metal film layer and the plurality of microstructure portions.

According to another aspect of the present invention, an embodiment of an electronic device is provided, comprising: a display screen module, a circuit module, and a machine component. The circuit module is coupled to the display screen module. The machine component is the foregoing embodiment as an internal component of the electronic device, wherein the metal plate member of the machine component is used to support the display screen module and the circuit module. At least one of the plurality of grounding portions of the mechanical component is electrically coupled to the grounding end of at least one of the display module and the circuit module.

In order to make the above-mentioned objects or other aspects of the present invention more comprehensible, a detailed description will be given below with reference to the corresponding drawings.

1, 2‧‧‧ machine components

11, 21‧‧‧Metal plates

110A, 110B, 210A, 210B‧‧‧ surface

111‧‧‧metal film

112‧‧‧Soft board slot

113‧‧‧Lock hole

12‧‧‧ Grounding Department

22‧‧‧ Coating

23‧‧‧Metal coating

24‧‧‧Microstructures Department

25‧‧‧ Coating

3‧‧‧Electronic devices

31‧‧‧Display screen module

32‧‧‧Circuit Module

33‧‧‧Shell

Figure 1A is a front perspective view of a first embodiment of the machine component of the present invention.

Figure 1B is a rear perspective view of the first embodiment of the machine component of the creation.

Figure 2A is a schematic cross-sectional view taken along line A-A' of the embodiment of Figure 1B.

2B is a schematic view showing an electron micrograph of the surface of the metal film layer 111 of FIG. 2A.

2C is a schematic view of an electron micrograph of the surface of the ground portion 12 of FIG. 2A.

2D is a schematic cross-sectional view of the electron micrograph of the ground portion 12 and the metal film layer 111 in FIG. 2A.

Figure 3A is a schematic cross-sectional view of a second embodiment of the machine component of the present invention.

3B-3C are examples in which the second embodiment is applied to different external members.

4 is an exploded perspective view of an embodiment of an electronic device in accordance with the present invention.

In order to understand the creative features, content and advantages of this creation and the effects that can be achieved, the authors will be combined with the drawings and will be described in detail in the following examples, and the schematics used therein are only for the purpose of The instructions and the supplementary explanations are used, so the scope of the attached drawings should not be interpreted or limited in terms of the actual implementation rights.

1A and 1B are respectively a front perspective view and a rear perspective view of a first embodiment of the machine component of the present invention. Referring again to Figure 2A, which is a schematic cross-sectional view taken along line A-A' of the embodiment of Figure 1B.

As shown, the machine component 1 of the first embodiment of the present invention can be used as an internal component of an electronic device. The machine component 1 includes a metal plate member 11, a metal film layer 111, and a plurality of grounding portions 12. As shown in Figures 1A and 1B, the sheet metal member 11 has surfaces 110A and 110B which can be used to load or support internal components of the electronic device. A plurality of grounding portions 12 are disposed over a plurality of regions of the surfaces 110A and 110B of the metal plate member 11 and serve as grounding points for the electronic device. As shown in Figure 2A, metal The film layer 111 is disposed on the surface 110B of the metal plate member 11. The plurality of ground portions 12 are microstructures formed by laser engraving of the surface of the metal film layer corresponding to the plurality of regions.

In a practical example, the position of the grounding portion 12, that is, the plurality of regions, depends on the surfaces 110A and 110B of the metal plate member 11 corresponding to electronic components (such as processors, communication circuits, antennas, etc.) that are susceptible to static electricity or interference signals. The location of the component). For example, in FIG. 1B, there are a total of 11 ground portions for loading or supporting different electronic components, respectively, which are grooved in FIG. 1B. However, the number and shape of the above-mentioned grounding portions or the regions corresponding to the metal plate members 11 may be changed according to the requirements of the internal electronic components of different electronic devices in terms of grounding, and the embodiment thereof is not limited thereto.

As shown in FIG. 2A, the plurality of ground portions 12 are microstructures formed by laser engraving of the surface of the metal film layer corresponding to the plurality of regions. The ground portion 12 serves as a grounding point, which has a more stable electrical conductivity and a delayed potential difference corrosion than the metal film layer 111. Please refer to Figures 2B to 2D. 2B is a schematic view showing an electron micrograph of the surface of the metal film layer 111 of FIG. 2A. 2C is a schematic view of an electron micrograph of the surface of the ground portion 12 of FIG. 2A. In Fig. 2C, the surface of the land portion 12 has a more dense surface microstructure than the surface of the gold film layer 111 in Fig. 2B. 2D is a schematic cross-sectional view of the electron micrograph of the ground portion 12 and the metal film layer 111 in FIG. 2A. In FIG. 2D, it is seen that the ground portion 12 is provided on the metal film layer 111. Further, each of the plurality of ground portions 12 is a metal oxide layer (for example, magnesium trioxide Mg ₂ O ₃ ) corresponding to a metal (for example, magnesium Mg) contained in the metal plate member 11 (for example, a magnesium alloy as a material).

Further, in order to form the microstructure of the ground portion 12, the laser engraving and modifying process will be described below as an example. Laser engraving and modification treatment is a process for reducing the surface activation characteristics of alloys such as magnesium alloys and aluminum alloys. The principle of action is to instantaneously heat the surface of the alloy by laser high energy/high temperature to modify the metal surface of the metal parts to generate A metal oxide layer of dense surface (eg Mg ₂ O ₃ ). This laser engraving modification process is applied to the above embodiment of the present invention, that is, a specific modification process is performed on a plurality of regions of the metal film layer 111, thereby forming a microstructure as shown in FIG. 2C, that is, in a metal film. Different regions of the surface of layer 111 form a metal oxide layer of dense surface. This surface layer, that is, the grounding portion 12, has a low activation property, so that the grounding portion 12 can be protected from corrosion by environmental influences, and the corrosion resistance function is also better than that of the metal coating layer 111. The grounding portion 12 obtained by the laser engraving and modifying process is also more conductive than the metal film layer 111. The main reason is the high energy of the laser moment, and the metal plate member 11 such as the magnesium alloy workpiece can be removed. The non-conductive substance such as a release agent/oxide further stabilizes the conductivity of the ground portion 12. For example, in a practical example, the grounding portion 12 has an average value of 0.2 ohms at a pressure of 0.2 N and 1.0 N; and the metal film layer 111 has a higher surface resistance at a lower pressure (0.2 N); From the standard deviation, the impedance of the ground portion 12 is better than that of the metal film layer 111.

Due to the design requirements of the electronic device product, different regions of the metal plate member 11 may be designed to have different thicknesses. For example, a magnesium alloy die-casting member is taken as the metal plate member 11 as an example, and the thickness thereof is varied, for example, from about 0.2 mm to about 2 mm, for example, the thickness of the region is about 0.25 mm, 0.35 mm, 0.75 mm, 1.8mm and so on. Thus, the surface resistance value of the metal plate member 11 is not uniform, and the conductivity of the different regions thereof is also different, which affects the effect of the grounding. Therefore, according to the first embodiment, the plurality of ground portions 12 are provided on the metal plate member 11, so that the conductivity can be improved.

In view of the fact that the metal of the metal frame mechanism and the grounding end of the circuit component of the electronic device is electrochemically corroded due to the potential difference, in the embodiment of the machine component 1 of the present invention, the surface resistance of the ground portion 12 is low, so It can achieve the same effect as the grounding point and can achieve delayed potential difference corrosion.

Further, the above-described machine member as an embodiment of the inner member can also reduce the cost. For example, in the process of laser engraving for certain areas of the metal sheet 11 The above technical effects can be achieved by engraving steps to form a microstructure; for example, laser etching can be performed after the metal sheet member 11 is subjected to filming or coating processing, and the above technical effects can also be achieved. The power condition parameter during laser engraving can be adjusted according to the impedance requirement range of the grounding portion 12, so that the average resistance of the ground portion 12 falls within the required range; for example, within 0 to 1.0 ohms, or as 0. Within 0.2 ohms.

In order to meet the needs of the internal electronic components of the electronic device, for example, referring to FIG. 1B, a plurality of grounding portions 12 are disposed along the edge and are arranged in two columns. The grounding portions 12 of the two columns are respectively distributed in two similarities. In the elongated groove, the long groove is connected to the slot to connect the electronic components to each other. However, the embodiment thereof may be changed, and is not limited thereto.

In addition, in other examples, a flexible circuit board slot 112 may be dug in the metal plate member 11 to provide electrical connection between the internal circuit modules of the electronic device through the slot 112. connection. Further, the metal plate member 11 may be provided with a plurality of locking holes 113 which are respectively disposed at the edges of the metal plate member 11, or at the center or other positions. Further, an opening may be provided in the metal plate member 11 for accommodating or for electrically or mechanically connecting the elements supported by the surfaces 110A and 110B. Thus, in addition to the grounding portion 12 providing grounding and the surface providing the internal components supporting the electronic device, the metal plate member 11 can provide different connection means or support means for the components of the electronic device.

Please refer to FIG. 3A, which is a cross-sectional view of a second embodiment of the machine component of the present invention. The machine member 2 of the second embodiment has the same technical features as the machine member 1 of the first embodiment: a microstructure formed by laser engraving on the surface of the metal film layer. It is to be noted that the machine member 2 is used as an outer member of an electronic device, such as an outer casing, and the aforementioned microstructure of the machine member 2 is used to cause the machine member 2 to assume an appearance pattern, such as illustrated in FIG. 3B or 3C. a picture of any one or more combinations of various lines or curves or repeated figures or characters that can be visually observed on the surface of the outer casing. case.

As shown in FIG. 3A, the machine member 2 is used as an external member of an electronic device, such as an outer casing. The machine member 2 includes a metal plate member 21, a coating layer 22, a metal film layer 23, a plurality of microstructure portions 24, and a coating layer 25. The metal plate member 21 includes a surface 210A and a surface 210B. The coating 22 is disposed on at least the surface 210A of the sheet metal member 21, wherein the surface 210A is, for example, an outer surface of the housing. The coating 22 can select primer colors of different colors depending on the recognition effect of the electronic product or the purpose of customization. A metal film layer 23 is disposed on the coating 22. A plurality of microstructure portions 24, which are microstructures formed by laser engraving at a plurality of locations on the surface of the metal film layer 23, are used to cause the machine member 2 to assume an appearance pattern. The coating layer 25 is disposed on or coated on the metal film layer 23 and the plurality of microstructure portions 24, and the coating layer 25 provides a protective effect and can be made of a transparent material. In still other examples, the coating 25 can be colored in addition to the protective effect, so that the coating 25 can also be made of a material having a color, for example, the coating 25 and the coating 22 are combined to provide a different color appearance.

In this way, according to the design of the housing, laser engraving can be performed according to the designed pattern to form a microstructure to present a specific desired pattern (character or pattern), so that the metal plate member 21 made of aluminum or magnesium alloy material can be used. To achieve a metallic color, to achieve an optical or visual effect of a colorful texture. Further, at least one of the microstructures described above presents a pattern in a concave or convex microstructure.

For example, taking the pattern in FIGS. 3B and 3C as an example, the laser engraving line width needs to be greater than 70 μm at a minimum appearance; and the sharp angle can be formed at the corner of the pattern; in addition, because of the laser-engraved metal The edge of the film layer will appear in an arc shape, so it will produce a certain optical reflection effect to achieve the optical or visual effect of the colorful texture.

The microstructure portion 24 also has similar properties as the microstructures shown in Figures 2B through 2D above, such as the microstructure portion 24 being densified relative to the metal film layer 25. The surface, and may also be regarded as a metal oxide layer of a metal (e.g., magnesium) contained in the metal sheet member 21 (e.g., magnesium alloy).

When the laser engraving is used to fabricate the inner member of the second embodiment, the power condition parameter may be within a reasonable range with respect to the thickness of the coating 22, the thickness of the metal film layer 23, and the desired appearance of the microstructure portion 24. Adjust it. For example, it is assumed that the thickness of the coating layer 22 is 45 mm, and the thickness of the metal film layer 23 is 22 mm; when the laser engraving power is too low (for example, less than 20%), the laser is directly reflected by the metal film layer 23 without leaving When the power is too high (for example, when it exceeds 30%), it is easy to directly etch the primer of the coating 22 to engrave the material to reduce the appearance effect. Therefore, the lower limit and the upper limit of the laser engraving power can be set according to the actual condition of the outer member to form the microstructure portion 24. For the above example, the power can be set to 20% to 30%. Of course, this range can be adjusted within a reasonable range with respect to the thickness of the coating 22, the thickness of the metal film layer 23, and the desired effect of the microstructure portion 24, and is not limited to the above examples. For example, this power can be set from 20% to 70%.

Please refer to FIG. 4 , which is an exploded perspective view of an embodiment of an electronic device according to the present invention. The electronic device 3 of this embodiment utilizes the above-described machine member 1 of the first embodiment as an internal member of the electronic device 3 to support other internal components, and utilizes the ground portion 12 of the aforementioned mechanical member 1 to cause internal electronics of the electronic device 3. The part has a stable grounding point.

As shown in FIG. 4, the electronic device 3 of the present invention includes a display screen module 31, a circuit module 32, a machine member 1 and a housing 33. The housing 33 functions as a housing for the electronic device 3 to protect or enclose internal components.

In the present embodiment, the machine member 1 is, for example, an example of any of the above-described examples shown in FIGS. 1A, 1B and 2A to 2D, or variations thereof, as an internal member of the electronic device. The metal plate member 11 of the machine member 1 is used for loading or supporting the display screen module 31 and the circuit module 32, wherein at least one of the plurality of grounding portions 12 of the machine member 1 is The ground end of at least one of the display module 31 and the circuit module 32 is electrically coupled.

The electronic device 3 is, for example, a mobile device such as a smart phone or a tablet computer, or a mobile device such as a notebook computer or other electronic device such as a digital camera or a navigation device. The display module 31 is, for example, a touch screen module or a liquid crystal screen module. The circuit module 32 includes, for example, a circuit module of a processor, a communication circuit, a memory, etc., and the circuit module 32 is loaded or supported by the metal plate 11 of the frame mechanism 1 and electrically coupled to the display module 21 to control the display mode. The content of the display screen of group 21. For example, the circuit module 32 is electrically coupled to the display module 31 through a flexible circuit board slot 112 by using a flexible circuit board or a cable.

In other examples, the housing 33 of the electronic device 3 can be achieved using, for example, plastic or other materials. Further, in an example, the appearance of the pattern 33 may be presented as a housing 33 in accordance with an embodiment of the aforementioned machine member 2 to exhibit a visual or optical effect of the aforementioned metallic color.

Further, in the above embodiment, the metal plate members 11, 21 are composed of, for example, one or more metal materials such as an aluminum alloy, a magnesium alloy or a titanium alloy. Further, the metal film layers 111 and 23 are, for example, a conversion coating obtained by a procedure such as phosphorylation or anodic treatment; and the chemical conversion film is chemically or electrochemically treated to form a film containing the metal component on the surface of the metal. Floor. The anode treatment is suitable for a metal material such as aluminum or magnesium which can obtain a dense protective oxide film. However, any specific chemical or electrochemical treatment of the various embodiments described above can be utilized to implement the embodiments of the present invention and is not limited to the examples set forth above.

It can be seen from the above embodiments that the metal plate members of the machine components of the present invention have a microstructure formed by a ray sculpture. According to the first embodiment, the machine member 1 is used as an inner member, and in addition to the structure for supporting the internal components of the electronic device, the grounding portion 12 formed by the ray-saw is used to provide the grounding point of the electronic components inside the electronic device. The effect, and can achieve the effect of delayed potential difference corrosion. According to the second reality In the embodiment, the machine member 2 is used as an outer member, and by using the microstructure formed by the ray sculpture, the appearance pattern of different figures or characters can be presented to express the metallic color, thereby achieving an optical or visual effect of a colorful texture.

The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equal changes or modifications made by the general in accordance with the spirit revealed by this creation are still covered by the scope of this creation patent.

1‧‧‧ machine components

11‧‧‧Metal plates

12‧‧‧ Grounding Department

110B‧‧‧ surface

111‧‧‧metal film

Claims (10)

A machine member for an electronic device, the machine member being used as an inner member of an electronic device, the machine member comprising: a metal plate member having a first surface and a second surface for supporting an interior of the electronic device a metal film layer disposed on the first surface and the second surface of the metal plate member; and a plurality of ground portions disposed on the first surface and the second surface of the metal plate member Above a plurality of regions, and used as a grounding point of the electronic device, the plurality of ground portions are microstructures formed by laser engraving of the surface of the metal film layer corresponding to the plurality of regions. The machine member of claim 1, wherein the plurality of ground portions are each a metal oxide layer corresponding to a metal contained in the metal plate member. The machine member of claim 1, wherein the plurality of ground portions each exhibit a microstructure of a dense surface with respect to the metal film layer. The machine component of claim 1, wherein the plurality of ground portions each have a groove shape. An electronic device, comprising: a display screen module; a circuit module electrically coupled to the display screen module; the machine member according to any one of claims 1 to 4, wherein the machine member The metal plate member is configured to support the display screen module and the circuit module, wherein at least one of the plurality of grounding portions of the machine member is electrically coupled to the display screen module and the circuit module One ground terminal. The electronic device of claim 5, further comprising a casing, the casing comprising: a metal plate member having an outer surface; a first coating disposed on at least the outer surface of the metal sheet member; a metal film layer disposed on the first coating layer; and a plurality of microstructure portions on a surface of the metal film layer a plurality of locations are microstructured by laser engraving for rendering the component in appearance; and a second coating disposed over the metal film layer and the plurality of microstructures. A machine member for an electronic device, the machine member being used as an outer member of an electronic device, the machine member comprising: a metal plate member having a surface; a first coating disposed on the metal plate member a metal film layer disposed on the first coating layer; a plurality of microstructure portions, which are microstructures formed by laser engraving at a plurality of positions on the surface of the metal film layer, The machine member presents an appearance pattern; and a second coating disposed on the metal film layer and the plurality of microstructure portions. The machine member of claim 7, wherein the plurality of microstructure portions are each a metal oxide layer corresponding to a metal contained in the metal sheet member. The machine member of claim 7, wherein the plurality of microstructure portions exhibit a groove shape. The machine member of claim 7, wherein each of the plurality of microstructure portions exhibits a microstructure of a dense surface relative to the metal film layer.