TWM486142U - Passive device - Google Patents
Passive device Download PDFInfo
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- TWM486142U TWM486142U TW103207842U TW103207842U TWM486142U TW M486142 U TWM486142 U TW M486142U TW 103207842 U TW103207842 U TW 103207842U TW 103207842 U TW103207842 U TW 103207842U TW M486142 U TWM486142 U TW M486142U
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- flat
- segment
- passive component
- conductive
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- 239000011810 insulating material Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000005452 bending Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
本創作係與被動元件有關，特別是有關於一種具有扁平導電引腳之被動元件。This creation is related to passive components, especially one that has a flat conductive pin.
一般常見之被動元件如電容器、電阻器、電感器等，常用於各種需要使用電力來驅動的產品，利用各種不同被動元件之配置來達成電子迴路控制的功能，其應用範圍包含電子產業及其他工業領域，係極為重要之元件。Commonly used passive components such as capacitors, resistors, inductors, etc., are commonly used in a variety of products that require the use of electricity to drive, using a variety of passive components to achieve electronic loop control functions, the application range includes the electronics industry and other industries The field is an extremely important component.
習知被動元件通常具有二由底面垂直延伸而出之引腳，該二引腳係供對應插入一例如PCB基板之孔洞中，再經由錫焊接合方式將該被動元件電性連接至該PCB基板之電路。例如：TW I434306、TW M472299、TW I425540等專利所揭示者即為此類結構。The passive component usually has two pins extending vertically from the bottom surface, and the two pins are correspondingly inserted into a hole such as a PCB substrate, and the passive component is electrically connected to the PCB substrate via a solder joint. The circuit. For example, those disclosed in TW I434306, TW M472299, TW I425540, etc. are such structures.
然而，一般PCB基板之電路極為複雜且需要搭配大量被動元件，因此需開設非常多數之孔洞，首先即耗工費時，此外，在電性連接作業中，由於該二引腳無法穩定支撐定位該被動元件，因此需要額外之扶助，另外引腳會遮蔽於被動元件下方而不利於觀察對位，因此無法方便快速地進行錫焊接合。However, the circuit of a general PCB substrate is extremely complicated and requires a large number of passive components. Therefore, a very large number of holes are required, which is time consuming and time consuming. In addition, in the electrical connection operation, the passive pin is unable to stably support the positioning. Components, so additional support is required, and the pins are shielded under the passive components and are not suitable for viewing the alignment, so the solder joint cannot be easily and quickly performed.
此外，電子產品日愈小型化的趨勢，因此被動元件也越做越 小，然而上述習知結構及其插接電性連接方式會造成整體高度較高且整體體積較大之情形，亟待改善。In addition, the trend of electronic products becoming smaller and smaller, so passive components are becoming more and more Small, however, the above-mentioned conventional structure and its plug-in electrical connection method will result in a situation in which the overall height is high and the overall volume is large, which needs to be improved.
因此，有必要提供一種新穎且具有進步性之被動元件，以解決上述之問題。Therefore, it is necessary to provide a novel and progressive passive component to solve the above problems.
本創作之主要目的在於提供一種被動元件，其包括二扁平段的導電引腳，方便立置、且設置極為方便快速；可減少整體體積；增加與對應電極端之焊接及接觸面積、增加導電效果(降低電阻)；簡單、成本低廉、且可一次大量製造。The main purpose of the present invention is to provide a passive component, which comprises two flat segments of conductive pins, which are convenient to stand up and are extremely convenient and quick to set up; the overall volume can be reduced; the welding and contact areas of the corresponding electrode ends are increased, and the conductive effect is increased. (Reducing resistance); simple, low cost, and can be manufactured in large quantities at one time.
為達成上述目的，本創作提供一種被動元件，包括：一被動元件本體、一第一導電線體及一第二導電線體。該被動元件本體包括位於相對之一第一側及一第二側的一第一電極端及一第二電極端。該第一導電線體由一端依序定義有一第一連接段、一轉折段及一第一扁平段，該第一扁平段具有供面向一電路結構而貼設於該電路結構之一第一平面，該第一連接段電性連接至該第一電極端，該轉折段沿該被動元件本體之一周側延設、該第一扁平段與該第二側同側且概平行該第二側延伸，該第一平面並實質上與該第二側同面向。該第二導電線體由一端依序定義有一第二連接段及一第二扁平段，該第二連接段及該第二扁平段概呈線性延伸，該第二扁平段具有供面向該電路結構而貼設於該電路結構之一第二平面，該第二連接段電性連接至該第二電極端，該第二扁平段與該第二側同側且概平行該第二側延伸，該第二平面並實質上與該第二側同面向。To achieve the above object, the present invention provides a passive component comprising: a passive component body, a first conductive line body and a second conductive line body. The passive component body includes a first electrode end and a second electrode end on opposite one of the first side and the second side. The first conductive wire body has a first connecting segment, a turning segment and a first flat segment sequentially defined by one end, the first flat segment having a first planar surface attached to the circuit structure for facing a circuit structure The first connecting segment is electrically connected to the first electrode end, and the turning segment is extended along a circumferential side of the passive component body, the first flat segment is on the same side as the second side and extends parallel to the second side The first plane is substantially coplanar with the second side. The second conductive wire body has a second connecting segment and a second flat segment sequentially defined by one end, the second connecting segment and the second flat segment extending linearly, and the second flat segment has a surface for the circuit structure And being attached to the second plane of the circuit structure, the second connecting segment is electrically connected to the second electrode end, and the second flat segment is on the same side of the second side and extends parallel to the second side, The second plane is substantially coplanar with the second side.
10‧‧‧第一導電線體10‧‧‧First conductive body
11‧‧‧第一連接段11‧‧‧First connection segment
12‧‧‧轉折段12‧‧‧ turning section
23‧‧‧焊膏23‧‧‧ solder paste
24‧‧‧第二扁平段24‧‧‧Second flat section
25‧‧‧第二平面25‧‧‧ second plane
13‧‧‧第一引腳段13‧‧‧First pin segment
14‧‧‧第一扁平段14‧‧‧First flat section
15‧‧‧第一平面15‧‧‧ first plane
20‧‧‧第二導電線體20‧‧‧Second conductive body
21‧‧‧第二連接段21‧‧‧Second connection
22‧‧‧第二引腳段22‧‧‧second pin segment
30‧‧‧被動元件本體30‧‧‧ Passive component body
31‧‧‧第一電極端31‧‧‧First electrode end
32‧‧‧第二電極端32‧‧‧Second electrode end
40‧‧‧絕緣材40‧‧‧Insulation
60‧‧‧被動元件60‧‧‧ Passive components
70‧‧‧被動元件70‧‧‧ Passive components
圖1-7為本創作一較佳實施例之被動元件製法示意圖。FIG. 1-7 is a schematic diagram of a passive component manufacturing method according to a preferred embodiment of the present invention.
圖8為本創作一較佳實施之被動元件之立體圖。Figure 8 is a perspective view of a passive component of a preferred embodiment of the present invention.
圖9為本創作另一較佳實施例之被動元件之立體圖。Figure 9 is a perspective view of a passive component of another preferred embodiment of the present invention.
圖10為本創作又一較佳實施例之被動元件之立體圖。Figure 10 is a perspective view of a passive component of another preferred embodiment of the present invention.
以下僅以實施例說明本創作可能之實施態樣，然並非用以限制本創作所欲保護之範疇，合先敘明。The following is a description of possible implementations of the present invention by way of example only, and is not intended to limit the scope of the creation of the present invention.
請配合參考圖1-7，其顯示本創作之一較佳實施例，本創作之被動元件製法可用於製造例如電容器、電阻器、電感器、阻容器或突波吸收器等被動元件，該被動元件製法詳細說明如下。Please refer to FIG. 1-7, which shows a preferred embodiment of the present invention. The passive component method of the present invention can be used to manufacture passive components such as capacitors, resistors, inductors, dampers or surge absorbers. The component manufacturing method is described in detail below.
首先參考圖1，提供至少一第一導電線體10，各該第一導電線體10由一端依序定義有一第一連接段11、一轉折段12及一第一引腳段13。詳細地說，係將多數該第一導電線體10同時固定於(例如以黏貼或壓掣等手段)一製造機具之載台上，其中各該第一導電線體10係概呈一長一短腳部之U形，如此方便固定，其中長腳部設有該第一連接段11、該轉折段12及該第一引腳段13。Referring first to FIG. 1 , at least one first conductive wire body 10 is provided. Each of the first conductive wire bodies 10 has a first connecting segment 11 , a turning segment 12 and a first pin segment 13 defined by one end. In detail, a plurality of the first conductive body 10 are simultaneously fixed (for example, by means of bonding or pressing) to a stage on which the machine is manufactured, wherein each of the first conductive bodies 10 has a length and a short leg. The U-shape is so convenient to fix, wherein the long leg portion is provided with the first connecting portion 11, the turning portion 12 and the first lead portion 13.
提供至少一第二導電線體20，各該第二導電線體20由一端依序定義有一第二連接段21及一第二引腳段22。詳細地說，係將多數該第二導電線體20同時固定於該製造機具之載台上，其中各該第二導電線體20係概呈一長一短腳部之U形，如此方便固定，其中長腳部設有該第二連接段21及該第二引腳段22。At least one second conductive wire body 20 is provided, and each of the second conductive wire bodies 20 has a second connecting segment 21 and a second pin segment 22 defined by one end. In detail, a plurality of the second conductive wires 20 are simultaneously fixed on the mounting table of the manufacturing tool, wherein each of the second conductive wires 20 has a U shape of a long and a short leg, which is convenient for fixing, wherein the length is long. The second connecting section 21 and the second lead section 22 are provided on the leg.
參考圖2-4，打折各該第一及第二連接段11,21之末端(如 圖2)，之後將打折後之各該第一及第二連接段11,21之末端附著焊膏23(例如錫膏，如圖3)再進行扁化(如圖4)。其中，打折各該第一及第二連接段11,21之末端可有助於該焊膏23之附著，後續扁化步驟可增加後續接合之面積及使接合更容易。可理解的是，在此階段之打折及扁化步驟係為選擇性步驟，亦可省略。Referring to Figures 2-4, the ends of the first and second connecting segments 11, 21 are folded (e.g. FIG. 2), after which the solder paste 23 (for example, solder paste, as shown in FIG. 3) is adhered to the end of each of the first and second connecting segments 11, 21 after being folded (see FIG. 4). Wherein, the ends of the first and second connecting segments 11, 21 can be folded to facilitate the adhesion of the solder paste 23, and the subsequent flattening step can increase the area of the subsequent bonding and make the bonding easier. It can be understood that the folding and flattening steps at this stage are optional steps and may be omitted.
請配合參考圖4-5，彎折各該第一導電線體10及扁化各該第 一及第二導電線體10,20，其中該第一及第二引腳段13,22分別被扁化形成一第一扁平段14及一第二扁平段24，該第一及第二扁平段14,24分別具有供面向一電路結構(未示)而貼設於該電路結構之一第一平面15及一第二平面25，彎折狀態之各該第一導電線體10之轉折段12橫向於該第一連接段11、彎折狀態之各該第一導電線體10之第一扁平段14橫向於該轉折段12，各該第二導電線體20之第二連接段21及該第二扁平段24概呈線性延伸。具體地說，扁化之該第一扁平段14及該第二扁平段24係與扁化之該第一及第二連接段11,21之末端概呈平行。進一步說，該彎折各該第一導電線體10及扁化各該第一及第二導電線體10,20之步驟包括以下步驟：先彎折各該第一電線體，使各該第一導電線體10之轉折段12橫向於該第一連接段11、且使各該第一導電線體10之第一引腳段13橫向於該轉折段12；再扁化各該第一及第二引腳段13,22而分別形成各該第一及第二扁平段14,24。Please refer to FIG. 4-5 to bend each of the first conductive body 10 and to flatten each of the first First and second conductive wires 10, 20, wherein the first and second lead segments 13, 22 are respectively flattened to form a first flat segment 14 and a second flat segment 24, the first and second flat portions The segments 14, 24 respectively have a first plane 15 and a second plane 25 attached to one of the circuit structures (not shown), and the turning portions of the first conductive body 10 in the bent state The first flat section 14 of the first conductive wire body 10 is transverse to the first connecting section 11 and the bent state, and the second connecting section 21 of each of the second conductive wire bodies 20 and The second flat section 24 extends substantially linearly. Specifically, the flattened first flat section 14 and the second flat section 24 are substantially parallel to the ends of the flattened first and second connecting sections 11, 21. Further, the step of bending each of the first conductive wire body 10 and the flattening each of the first and second conductive wire bodies 10, 20 includes the steps of: first bending each of the first wire bodies to make each of the first wires a turning portion 12 of a conductive wire body 10 is transverse to the first connecting portion 11 and the first lead portion 13 of each of the first conductive wire bodies 10 is transverse to the turning portion 12; The second pin segments 13, 22 form respective first and second flat segments 14, 24, respectively.
使各該第一連接段11與一該第二連接段21間隔相對，較佳 地係使扁化後之各該第一連接段11之末端的扁平面與一扁化後之該第二連接段21之末端的扁平面平行相對；接著再於各該第一連接段11之末端與各 該第二連接段21之末端附著助焊劑，以利於後續焊接。然而，附著助焊劑之步驟亦可省略。Preferably, each of the first connecting segments 11 is spaced apart from a second connecting segment 21, preferably The flat surface of the first connecting section 11 after the flattening is parallel to the flat surface of the end of the flattened second connecting section 21; and then the first connecting section 11 is further End and each A flux is attached to the end of the second connecting segment 21 to facilitate subsequent soldering. However, the step of attaching the flux may also be omitted.
再參考圖5，提供至少一被動元件本體30，各該被動元件本 體30包括位於相對之一第一側及一第二側的一第一電極端31及一第二電極端32。明確地說，係將多數該被動元件本體30分別設置(例如夾設)於各相對第一連接段11與第二連接段21之間，並使各相對第一連接段11與第二連接段21分別對應於一該第一電極端31及一該第二電極端32。Referring again to FIG. 5, at least one passive component body 30 is provided, each of the passive component The body 30 includes a first electrode end 31 and a second electrode end 32 on a first side and a second side opposite to each other. Specifically, a plurality of the passive component bodies 30 are respectively disposed (eg, sandwiched) between the opposing first connecting segments 11 and the second connecting segments 21, and each of the opposing first connecting segments 11 and the second connecting segment 21 corresponds to a first electrode end 31 and a second electrode end 32, respectively.
將各該第一及第二連接段11,21分別電性連接至該第一及 第二電極端31,32(較佳地，該第一及第二連接段11,21係為扁平狀且分別平貼至該第一及第二電極端31,32)，例如，利用焊接或其他適當方式使該焊膏融化以將各該第一及第二連接段11,21分別電性連接至該第一及第二電極端31,32。其中，該轉折段12沿該被動元件本體30之一周側延設、該第一及第二扁平段14,24與該第二側同側且概平行該第二側延伸、該第一及第二平面15,25並實質上與該第二側同面向。較佳地，該第一及第二扁平段14,24與該第二側位於同一平面，然亦可具少許高低差。Electrically connecting each of the first and second connecting segments 11, 21 to the first and Second electrode ends 31, 32 (preferably, the first and second connecting segments 11, 21 are flat and are respectively flattened to the first and second electrode ends 31, 32), for example, by soldering or The solder paste is melted to electrically connect the first and second connecting segments 11, 21 to the first and second electrode ends 31, 32, respectively. The first and second flat sections 14, 24 are on the same side of the second side and extend parallel to the second side, the first and the second The two planes 15, 25 are substantially coplanar with the second side. Preferably, the first and second flat segments 14, 24 are in the same plane as the second side, but may have a slight difference in height.
請配合參考圖5-6，較佳地，在各該第一及第二連接段11,21 分別電性連接至對應之第一及第二電極端31,32後，另包括以一絕緣材40包封各對應之被動元件本體30之步驟，各該第一及第二扁平段14,24至少部分露出於該絕緣材40之外。該包封步驟例如可經由置入模具、注入該絕緣材40、震動、旋轉等程序而完成，但不以此為限。Please refer to FIG. 5-6, preferably, in each of the first and second connecting segments 11, 21 After being electrically connected to the corresponding first and second electrode ends 31, 32, respectively, the method further comprises the steps of encapsulating the corresponding passive component bodies 30 with an insulating material 40, each of the first and second flat segments 14, 24 At least partially exposed outside the insulating material 40. The encapsulation step can be completed, for example, by placing a mold, injecting the insulating material 40, vibrating, rotating, etc., but not limited thereto.
參考圖7，最後，依據所需於各該第一及第二扁平段14,24 之適當位置處進行截斷，如此即製作完成本創作之被動元件。該等被動元 件後續還可進行適當之包裝或其他程序。Referring to FIG. 7, finally, according to each of the first and second flat segments 14, 24 The truncation is made at the appropriate position, thus making the passive component of the creation. Passive elements The package can be followed by appropriate packaging or other procedures.
可理解的是，基於本創作之精神，本創作之方法可加以變 化，例如彎折各該第一導電線體10及扁化各該第一及第二導電線體10,20之步驟亦可改變為：先扁化各該第一及第二引腳段13,22而分別形成各該第一及第二扁平段14,24；再彎折各該第一導電線體10，使各該第一導電線體10之轉折段12橫向於該第一連接段11、且使各該第一導電線體10之第一扁平段14橫向於該轉折段12。此外，該步驟亦可於包封該絕緣材40之後再進行。Understandably, based on the spirit of this creation, the method of this creation can be changed. For example, the steps of bending each of the first conductive body 10 and flattening the first and second conductive bodies 10, 20 may be changed to: first flatten each of the first and second lead segments 13 And forming the first and second flat segments 14, 24 respectively; and bending each of the first conductive wires 10 so that the turning segments 12 of the first conductive wires 10 are transverse to the first connecting segment 11. The first flat section 14 of each of the first conductive body 10 is transverse to the turning section 12. In addition, this step can also be performed after encapsulating the insulating material 40.
請配合參考圖1-5，本創作另提供一種被動元件用之導電引 腳製法，該導電引腳製法包括以下步驟：提供至少一第一導電線體10，各該第一導電線體10由一端依序定義有一第一連接段11、一轉折段12及一第一引腳段13；彎折及扁化各該第一導電線體10，其中該第一引腳段13被扁化形成一第一扁平段14，該第一扁平段14具有一供面向一電路結構而貼設於該電路結構之第一平面15，彎折狀態之各該第一導電線體10之轉折段12橫向於該第一連接段11、彎折狀態之各該第一導電線體10之第一扁平段14橫向於該轉折段12；其中，當該第一連接段11電性連接至該第一電極端31時，該轉折段12沿該被動元件本體30之一周側延設，該第一扁平段14與該第二側同側且概平行該第二側延伸，該第一平面15並實質上與該第二側同面向。其中，在該被動元件用之導電引腳製法中，可選擇先彎折各該第一導電線體10再進行扁化步驟，當然亦可選擇先扁化各該第一引腳段13再進行彎折各該第一導電線體10之步驟。其中，與上述被動元件製法中相同之元件及步驟已詳述如前，在此不再加以敘述。Please refer to Figure 1-5. This design also provides a conductive lead for passive components. The method of manufacturing the conductive pin includes the following steps: providing at least one first conductive wire body 10, each of the first conductive wire bodies 10 having a first connecting segment 11 , a turning segment 12 and a first The first conductive segment 10 is bent and flattened, wherein the first lead segment 13 is flattened to form a first flat segment 14 having a surface facing a circuit The structure is attached to the first plane 15 of the circuit structure, and the turning sections 12 of the first conductive wire bodies 10 in the bent state are transverse to the first connecting segments 11 and the first conductive lines of the bent state. The first flat section 14 of the 10 is transverse to the turning section 12; wherein when the first connecting section 11 is electrically connected to the first electrode end 31, the turning section 12 is extended along a peripheral side of the passive component body 30 The first flat section 14 extends on the same side of the second side and parallel to the second side, and the first plane 15 is substantially in the same plane as the second side. In the method of manufacturing the conductive pin for the passive component, the first conductive wire 10 may be bent first and then the flattening step may be performed. Alternatively, the first lead segment 13 may be first flattened and then performed. The step of bending each of the first conductive bodies 10. Among them, the same components and steps as those in the above passive component manufacturing method have been described in detail as before, and will not be described here.
請配合參考圖5、圖7及圖8，本創作另提供一種被動元件， 該被動元件包括一被動元件本體30、一第一導電線體10及一第二導電線體20。該被動元件本體30包括位於相對之一第一側及一第二側的一第一電極端31及一第二電極端32。該第一導電線體10由一端依序定義有一第一連接段11、一轉折段12及一第一扁平段14，該第一扁平段14具有供面向一電路結構而貼設於該電路結構之一第一平面15，該第一連接段11電性連接至該第一電極端31，該轉折段12沿該被動元件本體30之一周側延設、該第一扁平段14與該第二側同側且概平行該第二側延伸，該第一平面15並實質上與該第二側同面向。該第二導電線體20由一端依序定義有一第二連接段21及一第二扁平段24，該第二連接段21及該第二扁平段24概呈線性延伸，該第二扁平段24具有供面向該電路結構而貼設於該電路結構之一第二平面25，該第二連接段21電性連接至該第二電極端32，該第二扁平段24與該第二側同側且概平行該第二側延伸，該第二平面25並實質上與該第二側同面向。較佳地，一絕緣材40另包封該被動元件本體30，該第一及第二扁平段14,24至少部分露出於該絕緣材40之外。Please refer to FIG. 5, FIG. 7 and FIG. 8 together, and the present invention further provides a passive component. The passive component includes a passive component body 30, a first conductive body 10 and a second conductive body 20. The passive component body 30 includes a first electrode end 31 and a second electrode end 32 on a first side and a second side opposite to each other. The first conductive wire body 10 has a first connecting segment 11 , a turning segment 12 and a first flat segment 14 defined by one end. The first flat segment 14 has a circuit structure attached to the circuit structure. The first connecting portion 11 is electrically connected to the first electrode end 31. The turning portion 12 extends along a circumferential side of the passive component body 30, and the first flat segment 14 and the second portion The second side extends on the same side and substantially parallel to the second side, and the first plane 15 is substantially coplanar with the second side. The second conductive wire body 20 has a second connecting segment 21 and a second flat segment 24 defined by one end. The second connecting segment 21 and the second flat segment 24 extend linearly. The second flat segment 24 is linearly extended. And a second surface 25 of the circuit structure, the second connecting portion 21 is electrically connected to the second electrode end 32, and the second flat portion 24 is on the same side as the second side And extending substantially parallel to the second side, the second plane 25 is substantially coplanar with the second side. Preferably, an insulating material 40 further encloses the passive component body 30, and the first and second flat segments 14, 24 are at least partially exposed outside the insulating material 40.
其中，與上述被動元件製法及被動元件用之導電引腳製法中 相同之元件及步驟已詳述如前，在此不再加以敘述。Among them, in the above-mentioned passive component manufacturing method and passive component manufacturing method for passive components The same elements and steps have been described in detail as before and will not be described here.
依據不同之需要，於其他實施例中的被動元件60可設計為 長圓柱狀(例如電解電容，如圖9所示)、或被動元件70可設計為扁豆狀(例如獨石電容，如圖10所示)；第一及第二扁平段14,24亦可設計為90度夾角配置(如圖9所示)、或同向平行延伸(如圖10所示)，當然亦可設計為其他任何角度配置。Passive component 60 in other embodiments can be designed to serve different needs The long cylindrical shape (for example, electrolytic capacitor, as shown in FIG. 9), or the passive component 70 can be designed as a lenticular shape (for example, a monolithic capacitor, as shown in FIG. 10); the first and second flat segments 14, 24 can also be designed. For a 90 degree angle configuration (as shown in Figure 9), or parallel in the same direction (as shown in Figure 10), of course, can also be designed for any other angle configuration.
綜上，本創作之方法可製造出包括二扁平段的被動元件，而 該二扁平段具有同向朝向一待設置面之平面，可方便該被動元件之立置，於該被動元件被黏貼或貼設至一電路結構之過程中不需額外扶助即可直接進行，此外朝外延伸之該二扁平段有助於直接觀察及對位而不會被被動元件本體所遮蔽，故設置極為方便快速。In summary, the method of the present invention can produce a passive component comprising two flat segments, and The two flat segments have a plane facing in the same direction toward a surface to be disposed, which can facilitate the standing of the passive component, and can be directly performed without additional assistance during the process of attaching or attaching the passive component to a circuit structure. The two flat sections extending outwardly facilitate direct viewing and alignment without being obscured by the passive component body, so the setup is extremely convenient and fast.
另外，該被動元件之二扁平段係概平行於其底側而沿伸，而 非由該底側垂直向下延伸(如習知結構)，可減少整體體積。In addition, the two flat segments of the passive component are parallel to the bottom side thereof and extend along the Without extending vertically downward from the bottom side (as in conventional construction), the overall volume can be reduced.
並且，該二扁平段可增加與對應電極端之焊接及接觸面積， 非常有助於焊接步驟(快速且牢固)、且可增加導電效果(降低電阻)。Moreover, the two flat segments can increase the welding and contact area with the corresponding electrode ends, Very helpful for the soldering step (fast and robust) and can increase the conductive effect (reduced resistance).
此外，該被動元件用之導電引腳製法、被動元件製法及被動 元件之結構極為簡單、成本低廉，且可一次大量製造。In addition, the conductive pin method, passive component method and passive for the passive component The structure of the components is extremely simple, low cost, and can be manufactured in large quantities at once.
綜上所述，本創作之整體結構設計、實用性及效益上，確實 是完全符合產業上發展所需，且所揭露之結構創作亦是具有前所未有的創新構造，所以其具有「新穎性」應無疑慮，又本創作可較之習知結構更具功效之增進，因此亦具有「進步性」，其完全符合我國專利法有關新型專利之申請要件的規定，乃依法提起專利申請，並敬請 鈞局早日審查，並給予肯定。In summary, the overall structural design, practicality and effectiveness of this creation are indeed It is fully in line with the needs of industrial development, and the disclosed structural creation is also an unprecedented innovative structure, so its "novelty" should be undoubtedly considered, and this creation can be more effective than the conventional structure. It also has "progressiveness", which fully complies with the requirements of the application requirements for new types of patents in China's Patent Law. It is a patent application filed in accordance with the law and is subject to the early review and affirmation.
10‧‧‧第一導電線體10‧‧‧First conductive body
11‧‧‧第一連接段11‧‧‧First connection segment
12‧‧‧轉折段12‧‧‧ turning section
14‧‧‧第一扁平段14‧‧‧First flat section
15‧‧‧第一平面15‧‧‧ first plane
20‧‧‧第二導電線體20‧‧‧Second conductive body
21‧‧‧第二連接段21‧‧‧Second connection
23‧‧‧焊膏23‧‧‧ solder paste
24‧‧‧第二扁平段24‧‧‧Second flat section
25‧‧‧第二平面25‧‧‧ second plane
30‧‧‧被動元件本體30‧‧‧ Passive component body
31‧‧‧第一電極端31‧‧‧First electrode end
32‧‧‧第二電極端32‧‧‧Second electrode end
40‧‧‧絕緣材40‧‧‧Insulation
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103207842U TWM486142U (en) | 2014-05-06 | 2014-05-06 | Passive device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103207842U TWM486142U (en) | 2014-05-06 | 2014-05-06 | Passive device |
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| Publication Number | Publication Date |
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| TWM486142U true TWM486142U (en) | 2014-09-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI572264B (en) * | 2014-10-06 | 2017-02-21 | Flat-mounted electronic components |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI572264B (en) * | 2014-10-06 | 2017-02-21 | Flat-mounted electronic components |
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