KR20190012872A - Shunt resistor and method for manufacturing the same - Google Patents

Abstract

The present invention is to provide a shunt resistor having a new structure and a method for manufacturing the same, in which an operator or a user can intuitively check a resistance size of the shunt resistor. The shunt resistor less occupies a mounting space on a substrate, and can increase the degree of freedom in the design of the substrate, When the shunt resistor is surface-mounted, the shunt resistor can be more stably mounted on the substrate. According to the present invention, the shunt resistor includes a resistor body, a first resistor leg bent from one end of the resistor body toward one surface of the substrate and provided in one side thereof with a first resistor leg hole, a second resistor leg bent from an opposite end of the resistor body and provided in one side thereof with a second resistor leg hole, a first resistor connection part bent from an end of the first resistor leg toward the second resistor leg such that the first resistor is electrically connected with the substrate, disposed in parallel to one surface of the substrate, and having a first resistor connection part hole connected to the first resistor leg hole, and a second resistor connection part bent from an end of the second resistor leg toward the first resistor leg such that the first resistor is electrically connected with the substrate, disposed in parallel to one surface of the substrate, and having a first resistor connection part hole connected to the first resistor leg hole.

Description

[0001] SHUNT RESISTOR AND METHOD FOR MANUFACTURING THE SAME [0002]

The present invention relates to a shunt resistor, and more particularly, to a shunt resistor mounted on a substrate through a surface mounting technique and a method of manufacturing the same.

With the development of electronic technology, various electronic devices are being applied to a wide variety of products such as home appliances and automobiles. An electronic device includes various electronic devices, which are mounted on the substrate and electrically connected to the substrate.

Surface mounting technology (SMT) is a typical method for mounting electronic devices on a substrate. The surface mount technology replaces the through hole technology attaching method in which the device pins of the electronic device are inserted into the holes of the substrate. Surface mount technology has the advantage of easily attaching surface mount components (SMC) of various chips, resistors, capacitors, etc. to the substrate easily and automatically.

1 schematically shows a conventional shunt resistor used for a power window switch or the like mounted on a substrate through a surface mounting technique.

The conventional shunt resistor 20 is likely to interfere with other electronic elements mounted on the substrate 10 because many surface-mounted components are disposed on the substrate 10 constituting the electronic device. In addition, there is a disadvantage that the operator or the user can not intuitively know the magnitude of the resistance. Further, when the conventional shunt resistor 20 is mounted on the surface of the substrate 10, solder fillet is not smoothly formed, and thus there is a high risk of cold welding and cracking.

Public Utility Model Publication No. 2009-0000596 (2009. 01. 21) Patent Registration No. 1135712 (2012.04.13)

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, And to provide a shunt resistor of a new structure which can be mounted more stably on a substrate with improved wettability in mounting and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a shunt resistor comprising: a resistor body; A first resistor leg bent from one end of the resistor body toward one surface of the substrate and having a first resistor leg hole at one side; A second resistor leg bent from the other end of the resistor body toward one surface of the substrate and having a second resistance leg hole at one side thereof; And a first resistor connection hole which is bent from the end of the first resistor leg to the second resistor leg so as to be electrically connected to the substrate and which is parallel to one surface of the substrate and is connected to the first resistor leg hole, 1 resistor connection; And a second resistor connection hole formed in parallel with one surface of the substrate and bent to the first resistor leg at an end of the second resistor leg to be electrically connected to the substrate, the second resistor connection hole being connected to the second resistor leg hole And a second resistor connection portion.

The resistance body may be disposed in parallel with the first resistance connection portion and the second resistance connection portion.

The first resistor leg and the second resistor leg are respectively bent vertically at both ends of the resistor body and the first resistor connection portion is vertically bent at an end of the first resistor leg, And may be bent vertically at an end of the second resistance leg.

The shunt resistor according to the present invention may have a mirror symmetrical structure centering on a virtual line segment disposed in parallel with the first resistor leg and the second resistor leg at the center of the resistor body.

Wherein the first resistance leg hole and the first resistance connection hole are each formed in a semicircular shape and each of the conductive parts is disposed so as to be in contact with each other and the second resistance leg hole and the second resistance connection hole are semicircular , And each of the proximal portions may be disposed in contact with each other.

The first resistor leg hole has a semicircular shape, and the first resistor contact hole has a polygonal shape with one side portion abutting on the current portion of the first resistor leg hole, and the second resistor leg hole has a semicircular shape And the second resistor connection hole may have a polygonal shape with one side portion abutting the current portion of the second resistor leg hole.

The first resistor leg hole and the first resistor connection hole are formed in a polygonal shape, and the side edges of the first resistor leg hole and the second resistor connection hole are polygonal, , And the respective side portions may be disposed so as to be in contact with each other.

According to another aspect of the present invention, there is provided a method of manufacturing a shunt resistor, comprising: (a) preparing a metal base material having a predetermined length and width; (b) forming a first through hole and a second through hole in a position eccentric from the center of the metal base material to one end side and eccentrically to the other end side from the center of the metal base material, respectively; (c) bending one end of the metal base material to a predetermined length to form a first resistor connecting portion including a portion of the first through hole; (d) bending the other end of the metal base material to a predetermined length to form a second resistance connecting portion including a portion of the second through hole; (e) bending an intermediate portion of the metal base material to a predetermined length to form a first resistance leg including the remaining portion of the first through hole; And (f) bending the other intermediate side of the metal base material to a predetermined length to form a second resistance leg including the remaining portion of the second through hole, And the second resistor legs are disposed at the ends of the second resistor legs, and the intermediate portion of the metal base material, to which the first resistor leg and the second resistor leg are connected, Body.

The method of manufacturing a shunt resistor according to the present invention is characterized in that the first resistor leg and the second resistor leg are connected to each other through a first resistor leg and a second resistor leg, And the first resistor leg and the second resistor leg may be mirror-symmetrically formed.

The shunt resistor according to the present invention includes a resistor body, a first resistor leg and a second resistor leg bent at both ends of the resistor body, a first resistor leg and a second resistor leg, And a second resistance connection portion. Since the first resistor connecting portion and the second resistor connecting portion of the shunt resistor are disposed inwardly between the first resistor leg and the second resistor leg, they can be coupled to the substrate while occupying a relatively small space on the substrate, There is an effect that the degree of freedom can be increased. Further, by taking a structure in which only the resistor body and the pair of resistance legs are exposed to the outside as a current path between the first resistor connecting portion and the second resistor connecting portion, it is easy for the operator or the user to intuitively confirm the resistance size.

The shunt resistor according to the present invention is characterized in that the solder melted during soldering on the substrate has a first resistance leg hole of the first resistance leg, a second resistance leg hole of the second resistance leg, And a first resistor connection electrically connected to the substrate in such a manner as to flare into the second resistor connection hole of the second resistor connection part and the first resistor connection part and the second resistor connection part while being evenly spread around the second resistor connection part. Therefore, it can be mounted on the substrate with strong bonding strength without defects such as cold soldering or cracking of solder.

Further, the shunt resistor according to the present invention can be attached to the substrate with a stronger bonding strength by increasing the solder coating length in the resistor connecting portion, and the solder contact area of the resistor connecting portion is small and the thermal conductivity is excellent.

1 shows a conventional shunt resistor mounted on a substrate.
Figure 2 is a projection view of the shunt resistor in various directions according to one embodiment of the present invention.
3 is a photograph showing a shunt resistor mounted on a substrate according to an embodiment of the present invention.
4 illustrates a process of surface mounting a shunt resistor on a substrate according to an embodiment of the present invention.
5 is a graph comparing solder coating lengths of a shunt resistor and a conventional shunt resistor according to an embodiment of the present invention.
FIG. 6 is a graph comparing solder contact areas of a shunt resistor and a conventional shunt resistor according to an embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing a shunt resistor according to an exemplary embodiment of the present invention.
FIG. 8 is a step-by-step illustration of a method of manufacturing a shunt resistor according to an embodiment of the present invention.
9 illustrates an example of a method of bending a metal base material in a method of manufacturing a shunt resistor according to an embodiment of the present invention.
10 shows another example of a method of bending a metal base material in a method of manufacturing a shunt resistor according to an embodiment of the present invention.
11 shows another example of a method of bending a metal base material in a method of manufacturing a shunt resistor according to an embodiment of the present invention.
FIG. 12 is a projection view showing shunt resistors in various directions according to another embodiment of the present invention. FIG.
13 is a view showing a through hole formed in a metal base material for manufacturing the shunt resistor shown in Fig.
14 is a projection view of the shunt resistor in various directions according to another embodiment of the present invention.
Fig. 15 shows a through hole formed in a metal base material for manufacturing the shunt resistor shown in Fig. 14;

Hereinafter, a shunt resistor and a manufacturing method thereof according to the present invention will be described in detail with reference to the drawings.

FIG. 2 is a projection view showing shunt resistors according to an embodiment of the present invention in various directions, and FIG. 3 is a photograph showing a shunt resistor mounted on a substrate according to an embodiment of the present invention.

As shown in the figure, the shunt resistor 100 according to an embodiment of the present invention includes a resistor body 110, a first resistor leg 115 bent at both ends of the resistor body 110, Leg 125 and first and second resistance connections 135 and 145 bent at the ends of the first and second resistance legs 115 and 125, respectively. The shunt resistor 100 may be mounted on one surface of the substrate 10 such that the first resistance connection portion 135 and the second resistance connection portion 145 are electrically connected to the substrate 10. [

The first resistor leg 115 is vertically bent toward one side of the substrate 10 at one end of the resistor body 110 and the second resistor leg 125 is bent at one end of the resistor body 110 at one side And is disposed so as to face the first resistance leg 115. The first resistance leg 115 is bent in a vertical direction. The first resistor connection part 135 is bent from the end of the first resistor leg 115 toward the second resistor leg 125 and disposed parallel to one surface of the substrate 10. The second resistor connection part 145 is bent from the end of the second resistor leg 125 toward the first resistor leg 115 and disposed in parallel with one surface of the substrate 10. The first resistor connection part 135 and the second resistor connection part 145 are electrically connected to the substrate 10, respectively.

The first resistor leg 115 and the first resistor connection 135 are symmetrically disposed with the second resistor leg 125 and the second resistor connection 145, respectively. The shunt resistor 100 has a virtual line segment L vertically passing through the center of the resistor body 110, that is, the first resistor leg 115 and the second resistor leg 125 Symmetrically with respect to a line segment L arranged in parallel with the line segment L.

A first resistance leg hole 120 is formed on one side of the first resistance leg 115 and a second resistance leg hole 130 is formed on one side of the second resistance leg 125. A first resistor connection hole 140 connected to the first resistor leg hole 120 of the first resistor leg 115 is formed on one side of the first resistor connection part 135. A second resistance connection hole 150 is formed on one side of the second resistance connection part 145 to be connected to the second resistance leg hole 130 of the second resistance leg 125.

The first resistor leg hole 120 and the first resistor connection hole 140 are formed in a semicircular shape. The first resistance leg hole 120 and the first resistance connection hole 140 are in contact with each other at their longest portions. That is, the first resistance leg hole 120 and the first resistance connection hole 140 are arranged such that the strings are in contact with each other. The second resistance leg hole 130 and the second resistance connection hole 150, which are interconnected, are also semicircular. The second resistor leg hole 130 and the second resistor contact hole 150 are disposed such that the longest portions, that is, the respective current portions, are in contact with each other. The first resistance leg hole 120, the first resistance leg hole 130, the first resistance connection hole 140 and the second resistance connection hole 150 are formed in the solder S Can be spread evenly around the shunt resistor 100 to improve the bonding strength of the shunt resistor 100. [

3, the shunt resistor 100 is mounted on the substrate 10 by surface mounting so that the first resistor connecting portion 135 and the second resistor connecting portion 145 face one surface of the substrate 10 . The shunt resistor 100 is configured such that the first resistor connection 135 and the second resistor connection 145 coupled to the substrate 10 are disposed inwardly between the first resistor leg 115 and the second resistor leg 125 , And can be mounted on the substrate (10) while occupying a relatively small space on the substrate (10). Therefore, the shunt resistor 100 according to the present invention can increase the degree of freedom in designing the substrate 10. [ The resistance body 110 and the pair of resistance legs 115 and 125 which are current paths between the first resistance connecting portion 135 and the second resistance connecting portion 145 are exposed to the outside, It is easy for the user to intuitively confirm the resistance size.

The shunt resistor 100 according to the present invention is characterized in that when the first resistor connecting portion 135 and the second resistor connecting portion 145 are soldered to face one surface of the substrate 10, Can be evenly distributed around the shunt resistor 100 by the leg hole 120, the second resistance leg hole 130, the first resistance connecting hole 140 and the second resistance connecting hole 150, And can be bonded to the substrate 10.

4 illustrates a process of surface mounting a shunt resistor on a substrate according to an embodiment of the present invention.

The first resistor connecting portion 135 and the second resistor connecting portion 135 of the shunt resistor 100 are formed so that the solder S is interposed between the substrate 10 and the shunt resistor 100 in a paste state as shown in FIG. The solder S is melted and the shunt resistor 100 is fixed to the substrate 10 when the soldering process is performed while the solder resist 145 is placed on the substrate 10. At this time, in a manner that the molten solder S is buried into the first resistance leg hole 120, the second resistance leg hole 130, the first resistance connection hole 140, and the second resistance connection hole 150, The first resistor connection portion 135 and the second resistor connection portion 145 are covered with the first resistor connection portion 135 and the second resistor connection portion 145 while being evenly spread around the resistor connection portion 135 and the second resistor connection portion 145 of the resistor 100. Therefore, the shunt resistor 100 can be mounted on the substrate 10 with a high bonding strength without causing defects such as cold soldering or cracking of the solder.

FIG. 5 is a graph comparing solder coating lengths of a conventional shunt resistor and a conventional shunt resistor according to an embodiment of the present invention. FIG. 6 is a graph comparing the solder contact areas of a shunt resistor and a conventional shunt resistor according to an embodiment of the present invention Respectively.

5 and 6, the width of each of the resistor connecting portions provided in the conventional shunt resistor 100 and the shunt resistor 100 according to the present invention is 3 mm. In the case of the shunt resistor 100 of the present invention, It is assumed that the diameter of the hole is 1.2 mm.

5 (a), the conventional shunt resistor 20 has a solder coating length of 3 mm at the resistor connecting portion, while the solder coating length at the resistance connecting portion of the conventional shunt resistor 20 shown in FIG. 5 (a) The shunt resistor 100 according to the present invention has a length of about 3.885 mm at the resistive connecting portion, which is about 30% larger than that of the prior art. With such an increase in the solder application length, the shunt resistor 100 according to the present invention can be mounted on the substrate 10 with a bonding strength superior to that of the conventional art.

6 (a), the length of one side of the resistance connecting portion in contact with the solder is 3 mm, and in the present invention as shown in Fig. 6 (b) The shunt resistor 100 according to the present embodiment has a side length of 1.8 mm which is smaller than that of the conventional shunt resistor 20. Therefore, the shunt resistor 100 according to the present invention has a smaller solder contact area at the resistor connecting portion than the conventional shunt resistor 100 and a smaller solder contact area, which increases the thermal conductivity at the soldering step, Effect can be obtained. In addition, it is possible to prevent a cold soldering phenomenon due to a low thermal conductivity and to prevent a solder crack by forming a stable solder fillet.

The shunt resistor 100 according to the present embodiment can be manufactured simply by punching and bending the metal base material 200. [ Hereinafter, a method of manufacturing the shunt resistor 100 according to an embodiment of the present invention will be described.

FIG. 7 is a flowchart illustrating a method of manufacturing a shunt resistor according to an embodiment of the present invention. FIG. 8 is a simplified flowchart illustrating a method of manufacturing a shunt resistor according to an embodiment of the present invention. An example of a process of bending a metal base material in a method of manufacturing a shunt resistor according to an embodiment of the present invention.

7, the method of manufacturing the shunt resistor 100 includes the steps of preparing a metal base material S11, a through hole forming step S12, a first resistance connecting portion forming step S13, Forming step S14, a first resistance leg forming step S15, and a second resistance leg forming step S16.

First, in the metal base material preparation step S11, the metal base material 200 is prepared by processing the selected metal to a predetermined length and width as shown in FIG. 8A. As the metal base material 200, various metals suitable for the resistive material may be used.

Next, in the through hole forming step S12, the through holes 210 and 215 are formed in the metal base material 200 as shown in FIG. 8 (b). In this step, a first through hole 210 is formed at a position eccentric from the center of the metal base material 200 to one end, a second through hole 215 is formed at a position eccentric from the center of the metal base material 200 to the other end, . The first through holes 210 and the second through holes 215 may be formed to be symmetrical with respect to the center point of the metal base material 200 in a circular shape.

Next, one end and the other end of the metal base material 200 are respectively bent in predetermined lengths in the step S13 of forming the first resistor connecting portion 135 and the step S14 of forming the second resistor connecting portion 145, 1 resistance connecting portion 135 and the second resistance connecting portion 145, respectively. As shown in FIG. 8 (c), by bending a portion of the metal base material 200 where the intermediate portion of the first through hole 210 is located, the first resistance connecting portion 210, which includes a part of the first through hole 210, (135) can be formed. A portion of the first through hole 210 included in the first resistor connection portion 135 becomes the first resistor connection hole 140. The second resistor connecting portion 145 including a part of the second through hole 215 may be formed by bending a portion of the metal base material 200 where the middle portion of the second through hole 215 is located. A part of the second through hole 215 included in the second resistance connecting portion 145 becomes the second resistance connecting hole 150. [

Next, the metal base material 200 is bent in the step S15 of forming the first resistor leg 115 and the step S16 of forming the second resistor leg 125 to form the first resistor leg 115 and the second resistor leg 115, 2 resistance legs 125 are formed. As shown in FIG. 8 (d), the first resistor leg 115, which is vertically connected to the first resistor connecting portion 135 at the end, can be formed by bending the intermediate portion of the metal base material 200 to a predetermined length have. At this time, the first resistor leg 115 includes a remaining part of the first through hole 210 that does not belong to the first resistor connection part 135, and the remaining part of the first through hole 210 is connected to the first resistor The leg hole 120 is formed. The other end of the metal base material 200 may be bent to a predetermined length to form a second resistance leg 125 having a second resistance connecting portion 145 vertically connected to the end thereof. The second resistance leg 125 includes the remaining part of the second through hole 215 not belonging to the second resistance connection part 145 and the remaining part of the second through hole 215 is connected to the second resistance leg hole 145. [ (130).

The middle portion of the metal base material 200 to which the first resistor leg 115 and the second resistor leg 125 are connected at both ends is formed after the formation of the first resistor leg 115 and the second resistor leg 125 The resistance body 110 is formed.

The process of bending the metal base material 200 to form the first resistor connecting portion 135, the second resistor connecting portion 145, the first resistor leg 115 and the second resistor leg 125 is the same as that shown in Fig. 9 And can be performed through the press apparatus 300. That is, the metal base material 200 can be bent by placing the metal base material 200 on the support jig 310 of the press apparatus 300 and pressing the base metal material 200 with the press punch 320. A specific process of forming the first resistance connecting portion 135, the second resistance connecting portion 145, the first resistance leg 115 and the second resistance leg 125 by bending the metal base material 200 with the press apparatus 300 Is as follows.

First, as shown in FIG. 9A, the metal base material 200 having the first through hole 210 and the second through hole 215 is placed on the receiving jig 310, and the press punch 320 The first resistor connection part 135 including a part of the first through hole 210 may be formed by bending one end of the metal base material 200 to a predetermined length.

9 (b), the other end of the metal base material 200 is bent to a predetermined length by the press punch 320 while the metal base material 200 is supported by the support jig 310, The second resistor connection part 145 including a part of the second through hole 215 can be formed.

9 (c), an intermediate one side of the metal base material 200 in which the first resistor connecting portion 135 is formed in a state where the metal base material 200 is supported by the receiving jig 310 is set to a predetermined length So that the first resistor leg 115 including the remaining portion of the first through hole 210 can be formed.

9 (d), the other side of the metal base material 200 in which the second resistance connecting portion 145 is formed in a state where the metal base material 200 is supported by the receiving jig 310 is set to be the other side So that the second resistance leg 125 including the remaining portion of the second through hole 215 can be formed. At this time, the middle portion of the metal base material 200, to which the first resistance leg 115 and the second resistance leg 125 are connected, can complete the shunt resistor 100 constituting the resistance body 110 .

With this manufacturing method, it is possible to efficiently manufacture the shunt resistor 100 of various sizes.

The shunt resistor 100 may be manufactured by various other methods other than the method as described above. For example, steps (S13 to S16) for forming each part of the shunt resistor 100 by bending the prepared metal base material 200 may be sequentially selected and performed in accordance with the manufacturing environment, conditions, and the like. That is, a step S13 of forming the first resistor connecting portion 135, a step S14 of forming the second resistor connecting portion 145, a step S15 forming the first resistor leg 115, The order of the step S16 of forming the legs 125 can be variously changed.

10 shows another example of a method of bending a metal base material. The method of bending the metal base material shown in Fig. 10 also uses the press device 300 as described above. The first resistor connecting portion 135, the second resistor connecting portion 145, the second resistor leg 125, The formation order of the resistance legs 125 is different from that described above.

10 (a), the metal base material 200 having the first through holes 210 and the second through holes 215 is placed on the receiving jig 310, and the press punch 320 One end of the metal base material 200 may be pressed to form the first resistance leg 115 including a portion of the first through hole 210. [

10 (b), a middle portion of the metal base material 200 in which the first resistance connecting portion 135 is formed in a state where the metal base material 200 is supported by the receiving jig 310 is called a press punch The first resistor leg 115 including the remaining portion of the first through hole 210 may be formed.

10 (c), the other end of the metal base material 200 is bent to a predetermined length by the press punch 320 while the metal base material 200 is supported by the support jig 310, The second resistor connection part 145 including a part of the second through hole 215 can be formed.

10 (d), a middle portion of the metal base material 200 having the second resistance connecting portion 145 formed thereon while the metal base material 200 is supported by the receiving jig 310 is called a press punch To form a second resistor leg 125 that includes the remainder of the second through hole 215. At this time, the middle portion of the metal base material 200, to which the first resistor leg 115 and the second resistor leg 125 are connected at both ends, constitutes the resistor body 110.

11 shows another example of a method for bending a metal base material. The method of bending the metal base material shown in Fig. 11 also uses the press device 300 as described above. The first resistance connecting portion 135, the second resistance connecting portion 145, the second resistance leg 125, The formation order of the resistance legs 125 is different from that described above.

First, as shown in FIG. 11A, a metal base material 200 having a first through hole 210 and a second through hole 215 is placed on the receiving jig 310, and the press punch 320 One end of the metal base material 200 may be pressed to form the first resistance leg 115 including a portion of the first through hole 210. [

Next, as shown in Fig. 11 (b), in the state in which the metal base material 200 is supported by the support jig 310, the other intermediate portion of the metal base material 200 is pressed by the press punch 320, Through holes 215 may be formed. The second resistor leg 125 is disposed parallel to the first resistor leg 115 and includes a resistor body 110 having first and second resistor legs 115 and 125 connected to both ends thereof, .

11 (c), the end of the first resistance leg 115 is pressed by the press punch 320 while the metal base material 200 is supported by the receiving jig 310, The first resistor connection portion 135 including another portion of the through hole 210 may be formed.

11 (d), the end of the second resistance leg 125 is pressed by the press punch 320 while the metal base material 200 is supported by the support jig 310, A second resistance connection portion 145 including another portion of the through hole 215 may be formed.

In addition, the steps of bending the metal base material 200 to form the first resistor connecting portion 135, the second resistor connecting portion 145, the first resistor leg 115, and the second resistor leg 125 are various . It is also possible to manufacture the shunt resistor 100 by a method other than press working.

12 is a view illustrating a shunt resistor according to another embodiment of the present invention in various directions, and FIG. 13 shows a through hole formed in a metal base material for manufacturing the shunt resistor shown in FIG.

The shunt resistor 400 shown in FIG. 12 includes a resistor body 110, a first resistor leg 115 and a second resistor leg 125 bent at both ends of the resistor body 110, And a first resistor connection 135 and a second resistor connection 145 that are bent at the ends of the first resistor leg 115 and the second resistor leg 125, respectively. A first resistance leg hole 410 is formed on one side of the first resistance leg 115 and a second resistance leg hole 415 is formed on one side of the second resistance leg 125. A first resistor connection hole 420 is formed at one side of the first resistor connection part 135 and connected to the first resistor leg hole 410 of the first resistor leg 115, And a second resistance connection hole 425 connected to the second resistance leg hole 415 of the second resistance leg 125 is provided on one side.

The shunt resistor 400 has a first resistor leg hole 410, a second resistor leg hole 415, a first resistor connection hole 420, and a second resistor connection hole (not shown) 425) is somewhat deformed. That is, the first resistance leg hole 410 of the first resistance leg 115 has a semicircular shape similar to that described above, and the first resistance connection hole 420 of the first resistance connection portion 135 connected thereto is a rectangular Shape. One side portion of the rectangular first resistance connection hole 420 is in contact with the current portion of the first resistance leg hole 410 of the semicircular shape. The second resistance leg hole 415 of the second resistance leg 125 has a semicircular shape similar to that described above and the second resistance connection hole 425 of the second resistance connecting portion 145 connected thereto has a rectangular shape Lt; / RTI > One side portion of the rectangular second resistance connection hole 425 is in contact with the current portion of the semi-circular second resistance leg hole 415. The first resistor connection hole 420 and the second resistor connection hole 425 may be formed in various other polygonal shapes such that one side portion of the first resistor connection hole 420 and the second resistor connection hole 425 can contact the current portion of the second resistance leg hole 415 It can be deformed.

When the shunt resistor 400 is soldered to the substrate 10, the melted solder S contacts the first resistance leg hole 410, the second resistance leg hole 415, the first resistance contact hole 420, The first resistance connecting portion 135 and the second resistance connecting portion 145 of the shunt resistor 400 are uniformly spread in the second resistance connecting portion hole 425 so that a strong bonding And can be mounted on the substrate 10 with a high strength.

The solder application length in the resistance connecting portions 135 and 145 can be increased and the solder can be attached to the substrate 10 with a stronger bonding strength and the solder contact area of the resistance connecting portions 135 and 145 is small and the thermal conductivity is excellent So that it is possible to have an effect of increasing the solder S in height.

13, the shunt resistor 400 may be manufactured by forming a first through hole 430 and a second through hole 435 in the metal base material 200 and then bending the first through hole 430 and the second through hole 435. The first through hole 430 and the second through hole 435 are formed in the metal base material 200 and the method described above may be used for bending the same.

FIG. 14 is a view illustrating a shunt resistor according to another embodiment of the present invention in various directions. FIG. 15 illustrates a through hole formed in a metal base material for manufacturing the shunt resistor shown in FIG.

The shunt resistor 500 shown in Fig. 14 includes a resistor body 110, a first resistor leg 115 and a second resistor leg 125 bent at both ends of the resistor body 110, And a first resistor connection 135 and a second resistor connection 145 that are bent at the ends of the first resistor leg 115 and the second resistor leg 125, respectively. A first resistance leg hole 510 is formed on one side of the first resistance leg 115 and a second resistance leg hole 515 is formed on one side of the second resistance leg 125. A first resistance connection hole 520 connected to the first resistance leg hole 510 of the first resistance leg 115 is formed on one side of the first resistance connection portion 135, And a second resistance connection hole 525 connected to the second resistance leg hole 515 of the second resistance leg 125 is provided on one side.

The shunt resistor 500 has a first resistor leg hole 510, a second resistor leg hole 515, a first resistor connecting hole 520 and a second resistor connecting hole (not shown) 525) is somewhat deformed. That is, the first resistance leg hole 510 of the first resistance leg 115 and the first resistance connection hole 520 of the first resistance connection portion 135 are formed in a rectangular shape. One side portion of the first resistance leg hole 510 is in contact with one side portion of the first resistance connection hole 520. The second resistance leg hole 515 of the second resistance leg 125 and the second resistance connection hole 525 of the second resistance connection portion 145 are formed in a rectangular shape. One side portion of the second resistance leg hole 515 is abutted with one side portion of the second resistance connection hole 525. The first resistance leg hole 510 and the first resistance connection hole 520 may be deformed into various other polygonal shapes in which the respective side portions of the first resistance leg hole 510 and the first resistance connection hole 520 are in contact with each other. Also, the second resistance leg hole 515 and the second resistance connection hole 525 may be deformed into various other polygonal shapes such that the respective side portions of the second resistance leg hole 515 and the second resistance connection hole 525 can contact each other.

The shunt resistor 500 according to another embodiment of the present invention can be mounted on the substrate 10 with a high bonding strength without causing defects such as cold soldering or cracking of solder.

15, the shunt resistor 500 may be manufactured by forming a first through hole 530 and a second through hole 535 in the metal base material 200 and bending the first through hole 530 and the second through hole 535. The first through hole 530 and the second through hole 535 are formed in the metal base material 200 and the method described above may be used for bending the same.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Those skilled in the art will appreciate that numerous modifications and variations can be made in the present invention without departing from the spirit and scope of the appended claims.

100, 400, 500: shunt resistance 110: resistance body
115: first resistance leg 120, 410, 510: first resistance leg hole
125: second resistor legs 130, 415, 515: second resistor leg hole
135: first resistance connecting portion 140, 420, 520: first resistance connecting portion hole
145: second resistance connecting portion 150, 425, 525: second resistance connecting portion
200: metal base material 210, 430, 530: first through hole
215, 435, 535: second through hole 300: press device
310: Support jig 320: Press punch

Claims (9)

In a shunt resistor that is surface mounted on a substrate,
Resistance body;
A first resistor leg bent from one end of the resistor body toward one surface of the substrate and having a first resistor leg hole at one side;
A second resistor leg bent from the other end of the resistor body toward one surface of the substrate and having a second resistance leg hole at one side thereof;
And a first resistor connection hole which is bent from the end of the first resistor leg to the second resistor leg so as to be electrically connected to the substrate and which is parallel to one surface of the substrate and is connected to the first resistor leg hole, 1 resistor connection; And
And a second resistor connection hole which is bent from the end of the second resistor leg to the first resistor leg so as to be electrically connected to the substrate and is parallel to one surface of the substrate and is connected to the second resistor leg hole, And a second resistor connected to the shunt resistor.
The method according to claim 1,
Wherein the resistor body is disposed parallel to the first resistor connection and the second resistor connection.
3. The method of claim 2,
The first resistor leg and the second resistor leg are respectively bent vertically at both ends of the resistor body and the first resistor connection portion is vertically bent at an end of the first resistor leg, And the second resistance leg is vertically bent at an end of the second resistance leg.
The method of claim 3,
And a mirror symmetrical structure is formed around an imaginary line segment arranged in parallel with the first resistor leg and the second resistor leg at the center of the resistor body.
The method according to claim 1,
Wherein the first resistance leg hole and the first resistance connection hole are each formed in a semicircular shape,
Wherein the second resistance leg hole and the second resistance connecting hole are each formed in a semicircular shape, and each of the current portions is disposed to be in contact with each other.
The method according to claim 1,
Wherein the first resistance leg hole has a semicircular shape,
Wherein the first resistor connection hole has a polygonal shape with one side portion abutting the current portion of the first resistor leg hole,
Wherein the second resistance leg hole has a semicircular shape,
Wherein the second resistor connection hole has a polygonal shape with one side portion abutting the current portion of the second resistor leg hole.
The method according to claim 1,
Wherein the first resistance leg hole and the first resistance connection hole are formed in a polygonal shape so that respective side portions thereof are in contact with each other,
Wherein the second resistance leg hole and the second resistance connection hole are formed in a polygonal shape, and the respective side portions are disposed so as to be in contact with each other.
(a) preparing a metal base material having a predetermined length and width;
(b) forming a first through hole and a second through hole in a position eccentric from the center of the metal base material to one end side and eccentrically to the other end side from the center of the metal base material, respectively;
(c) bending one end of the metal base material to a predetermined length to form a first resistor connecting portion including a portion of the first through hole;
(d) bending the other end of the metal base material to a predetermined length to form a second resistance connecting portion including a portion of the second through hole;
(e) bending an intermediate portion of the metal base material to a predetermined length to form a first resistance leg including the remaining portion of the first through hole; And
(f) bending the other intermediate side of the metal base material to a predetermined length to form a second resistance leg including the remaining portion of the second through hole,
The first resistor connecting portion is disposed at an end of the first resistor leg and the second resistor connecting portion is disposed at an end of the second resistor leg,
Wherein a middle portion of the metal base material to which the first resistor leg and the second resistor leg are connected is formed by a resistor body at both ends thereof.
9. The method of claim 8,
Wherein the first resistor connection portion and the second resistor connection portion are mirror-symmetrically formed in the center of the resistor body about a line segment disposed in parallel with the first resistor leg and the second resistor leg, And the second resistor leg are formed in a mirror-symmetrical shape.

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