TWM484236U - Packaged wireless charging receiver - Google Patents

Packaged wireless charging receiver Download PDF

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Publication number
TWM484236U
TWM484236U TW103203854U TW103203854U TWM484236U TW M484236 U TWM484236 U TW M484236U TW 103203854 U TW103203854 U TW 103203854U TW 103203854 U TW103203854 U TW 103203854U TW M484236 U TWM484236 U TW M484236U
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Taiwan
Prior art keywords
wireless charging
package
packaged
charging receiver
connector
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TW103203854U
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Chinese (zh)
Inventor
ri-xin Sun
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Biwin Storage Technology Ltd
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Priority to TW103203854U priority Critical patent/TWM484236U/en
Publication of TWM484236U publication Critical patent/TWM484236U/en

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Abstract

A packaged wireless charging receiver includes a package, a circuit board, a wireless charging receiver module and a plurality of metal pins. The circuit board is disposed inside the package. The wireless charging receiver module is disposed on the circuit board inside the package. Each of the metal pins has a first end coupled to the wireless charging receiver module inside the package, and a second end exposed to outside of the package. The wireless charging receiver module is coupled to the outside of the package through the metal pins.

Description

封裝式無線充電接收器Packaged wireless charging receiver

本創作係關於一種無線充電接收器,尤指一種將電路板與無線充電接收模組皆封裝於一封裝體之內的封裝式無線充電接收器。The present invention relates to a wireless charging receiver, and more particularly to a packaged wireless charging receiver in which a circuit board and a wireless charging receiving module are packaged in a package.

隨著手持式電子產品日漸普及,使用者們也隨之尋求可更方便地充電於手持式電子產品的方法。在無線裝置日漸普及的今日,手持式電子產品上的傳統充電線已經成為「最後一條線」,若能將之取消可大為增加便利程度。無線充電方法因具有操作簡易、避免線材凌亂、不受充電接頭規格限制、以及可將充電口密封以適用於高濕度與高粉塵環境等優點,故已成為充電相關市場上漸受歡迎的選項,目前已被應用於如手機、電動牙刷與刮鬍刀等手持式電子產品。各業者亦組成策略聯盟(例如無線充電聯盟WPC等)以發展各種無線充電規格(例如Qi等)來因應市場需求。一具備無線充電功能的手持式電子產品,必須於其產品內部安裝可接收電磁波的金屬線圈,以及將電磁波轉換為電能的一組無線充電接收電路,再進一步將轉換後的電能傳輸至電子產品內部的電池以進行充電。該電磁波則是來自一位於產品外部之無線充電發射器。請參考第1圖與第2圖,第1圖係為先前技術中無線充電接收電路之元件方塊示意圖,且第2圖係為在先前技術中無線充電接收電路200的外觀圖。由第1圖可知,在先前技術中,當製造者欲於其產品中安裝無線充電接收電路時,必須將組成無線充電接收電路所需的複數個功能區塊例如:全同步整流器(Full synchronous rectifier)101、低壓差線性穩壓器(Low-Dropout linear regulator;LDO)102、微控制器(micro control unit;MCU)103、通聯調變模組(Communication modulation module)104、線圈 105、以及被動元件如電阻與電容(未示於第1圖中)等,安裝至如第2圖所示之一印刷電路板(Print Circuit Board;PCB)上,並進一步以印刷電路板的走線將上述功能區塊相互連接。在第2圖的無線充電接收電路200中,上述的各功能區塊係各自為已封裝之積體電路。因無線充電接收電路200包含的功能區塊較多,導致無線充電接收電路下層的印刷電路板佈局繁雜,形狀不規則,體積也難以縮小,對於有意於自家產品中安裝無線充電接收電路的製造商,實已造成在產品內部整合無線充電接收電路時的困難,亦造成產品規格受限於無線充電接收電路的體積與重量而更不易縮小及輕量化,因此本領域實需一解決方案以降低使用者整合自家系統與無線充電接收電路時的困難度,與提高改善產品規格的機會。As handheld electronic products become more popular, users are looking for ways to more easily charge handheld electronic products. Today, with the increasing popularity of wireless devices, the traditional charging line on handheld electronic products has become the "last line". If it can be cancelled, it will greatly increase the convenience. The wireless charging method has become an increasingly popular option in the charging-related market because of its ease of operation, avoidance of messy wires, restrictions on the size of the charging connector, and the ability to seal the charging port for high humidity and high dust environments. It has been applied to handheld electronic products such as mobile phones, electric toothbrushes and razors. Various players also form strategic alliances (such as Wireless Charging Alliance WPC, etc.) to develop various wireless charging specifications (such as Qi, etc.) to meet market demand. A handheld electronic product with wireless charging function must be equipped with a metal coil capable of receiving electromagnetic waves and a set of wireless charging receiving circuits for converting electromagnetic waves into electric energy, and further transferring the converted electric energy to the inside of the electronic product. The battery is charged. The electromagnetic wave is from a wireless charging transmitter located outside the product. Please refer to FIG. 1 and FIG. 2, which is a block diagram of the components of the wireless charging receiving circuit in the prior art, and FIG. 2 is an external view of the wireless charging receiving circuit 200 in the prior art. As can be seen from Fig. 1, in the prior art, when a manufacturer wants to install a wireless charging receiving circuit in his product, it is necessary to form a plurality of functional blocks required for the wireless charging receiving circuit, for example, a full synchronous rectifier. 101, Low-Dropout linear regulator (LDO) 102, micro control unit (MCU) 103, communication modulation module 104, coil 105, and passive components such as resistors and capacitors (not shown in Figure 1), etc., mounted on a printed circuit board (PCB) as shown in Figure 2, and further walked on the printed circuit board The line connects the above functional blocks to each other. In the wireless charging receiving circuit 200 of Fig. 2, each of the above-described functional blocks is an integrated circuit that has been packaged. Since the wireless charging receiving circuit 200 includes a large number of functional blocks, the layout of the printed circuit board under the wireless charging receiving circuit is complicated, the shape is irregular, and the volume is difficult to be reduced. For the manufacturer who intends to install the wireless charging receiving circuit in the product. It has caused difficulties in integrating the wireless charging receiving circuit inside the product, and the product specifications are limited by the size and weight of the wireless charging receiving circuit, which is more difficult to reduce and lighter. Therefore, a solution is needed in the field to reduce the use. The difficulty of integrating your own system with wireless charging receiver circuits and the opportunity to improve product specifications.

一種封裝式無線充電接收器,包含封裝體、電路板、無線充電接收模組及複數個金屬接頭。該電路板,位於該封裝體內部。無線充電接收模組,位於該封裝體內部且設置於該電路板上。複數個金屬接頭中,每一金屬接頭包含一第一端,其位於該封裝體內且耦接於該無線充電接收模組,及一第二端,外露於該封裝體之外。該無線充電接收模組係透過該複數個金屬接頭連結至該封裝體外部。A packaged wireless charging receiver includes a package body, a circuit board, a wireless charging receiving module and a plurality of metal connectors. The board is located inside the package. The wireless charging receiving module is located inside the package and disposed on the circuit board. Each of the plurality of metal connectors includes a first end disposed in the package and coupled to the wireless charging receiving module, and a second end exposed outside the package. The wireless charging receiving module is coupled to the outside of the package through the plurality of metal connectors.

101‧‧‧全同步整流器101‧‧‧Full Synchronous Rectifier

102‧‧‧低壓差線性穩壓器102‧‧‧Low-dropout linear regulator

103‧‧‧微控制器103‧‧‧Microcontroller

104‧‧‧通聯調變模組104‧‧‧Tonglian modulation module

105‧‧‧線圈105‧‧‧ coil

200‧‧‧無線充電接收電路200‧‧‧Wireless charging receiving circuit

300‧‧‧封裝式無線充電接收器300‧‧‧Packaged wireless charging receiver

301至304‧‧‧區塊Blocks 301 to 304‧‧

R11至R36‧‧‧電阻R11 to R36‧‧‧ resistance

C4至C25‧‧‧儲能整流電容C4 to C25‧‧‧ energy storage rectifier capacitor

Q7至Q17‧‧‧功能電路區塊Q7 to Q17‧‧‧ functional circuit block

Diode1至Diode2‧‧‧電晶體Diode1 to Diode2‧‧‧O crystal

S1‧‧‧第一源極腳位S1‧‧‧first source pin

S2‧‧‧第二源極腳位S2‧‧‧Second source pin

G1‧‧‧第一閘極腳位G1‧‧‧ first gate pin

G2‧‧‧第二閘極腳位G2‧‧‧second gate pin

D1‧‧‧第一汲極腳位D1‧‧‧The first pole position

D2‧‧‧第二汲極腳位D2‧‧‧Second pole position

VSS‧‧‧地極腳位VSS‧‧‧ polar foot

VDD‧‧‧電源腳位VDD‧‧‧ power pin

SCK‧‧‧系統時脈腳位SCK‧‧‧ system clock position

VPP‧‧‧類比電源腳位VPP‧‧‧ analog power pin

SDA‧‧‧資料腳位SDA‧‧‧ data pin

GPIO1至GPIO3‧‧‧一般用途腳位GPIO1 to GPIO3‧‧‧General purpose feet

GND‧‧‧地極腳位GND‧‧‧ Ground pin

IN‧‧‧直流電輸入腳位IN‧‧‧DC input pin

OUT‧‧‧直流電輸出腳位OUT‧‧‧DC output pin

FB‧‧‧參考電壓腳位FB‧‧‧reference voltage pin

EN‧‧‧致能腳位EN‧‧‧Enable feet

VCC‧‧‧電壓輸入腳位VCC‧‧‧ voltage input pin

OUT1至OUT4‧‧‧電壓輸出腳位OUT1 to OUT4‧‧‧ voltage output pin

400‧‧‧封裝式無線充電接收器400‧‧‧Packaged wireless charging receiver

401‧‧‧晶粒401‧‧‧ grain

402‧‧‧金屬導線402‧‧‧Metal wire

403‧‧‧電路板403‧‧‧ circuit board

404‧‧‧封裝體404‧‧‧Package

405‧‧‧金屬接頭405‧‧‧Metal joints

4001‧‧‧電阻4001‧‧‧resistance

4002‧‧‧儲能整流電容4002‧‧‧ Energy storage rectifier capacitor

500‧‧‧第一電路層500‧‧‧First circuit layer

500a1‧‧‧第一面500a1‧‧‧ first side

5001‧‧‧板框5001‧‧‧ plate frame

500a2‧‧‧第二面500a2‧‧‧ second side

601‧‧‧導電性金屬接點601‧‧‧ Conductive metal contacts

700‧‧‧第二電路層700‧‧‧Second circuit layer

709‧‧‧環狀線路709‧‧‧Circular line

700a1‧‧‧第一面700a1‧‧‧ first side

7005‧‧‧過孔7005‧‧‧through hole

700a2‧‧‧第二面700a2‧‧‧ second side

701‧‧‧導電性金屬接點701‧‧‧ Conductive metal contacts

900‧‧‧隔磁層900‧‧‧magnetic barrier

901‧‧‧隔磁層穿孔區域901‧‧‧Magnetic layer perforated area

第1圖為先前技術中無線充電接收電路之元件方塊示意圖。1 is a block diagram showing the components of a wireless charging receiving circuit in the prior art.

第2圖為先前技術中無線充電接收電路的外觀圖。Fig. 2 is an external view of a prior art wireless charging receiving circuit.

第3圖為本創作實施例之封裝式無線充電接收器的線路設計示意圖。FIG. 3 is a schematic diagram showing the circuit design of the packaged wireless charging receiver of the present embodiment.

第4圖為第3圖中本創作實施例之封裝式無線充電接收器的系統構裝剖面示意圖。Fig. 4 is a schematic cross-sectional view showing the system configuration of the packaged wireless charging receiver of the present embodiment in Fig. 3.

第5圖為本創作實施例中封裝式無線充電接收器的系統構裝內部第一電路層 的第一面之俯瞰示意圖。FIG. 5 is a first internal circuit layer of the system configuration of the packaged wireless charging receiver according to the embodiment of the present invention. A schematic view of the first side of the view.

第6圖為本創作實施例中封裝式無線充電接收器的系統構裝內部第一電路層的第二面之俯瞰示意圖。FIG. 6 is a bird's-eye view of the second side of the first circuit layer in the system configuration of the packaged wireless charging receiver in the present embodiment.

第7圖為本創作實施例中封裝式無線充電接收器的系統構裝內部第二電路層的第一面之俯瞰示意圖。FIG. 7 is a bird's-eye view of the first side of the second circuit layer of the system assembly of the packaged wireless charging receiver in the present embodiment.

第8圖為本創作實施例中封裝式無線充電接收器的系統構裝內部第二電路層的第二面之俯瞰示意圖。FIG. 8 is a bird's-eye view of the second side of the second circuit layer of the system assembly of the packaged wireless charging receiver in the present embodiment.

第9圖為本創作實施例中封裝式無線充電接收器的系統構裝內部的隔磁板之俯瞰示意圖。FIG. 9 is a bird's-eye view of the magnetic isolation plate inside the system assembly of the packaged wireless charging receiver in the present embodiment.

第10圖為本創作實施例之封裝式無線充電接收器的完成外觀圖。FIG. 10 is a completed appearance view of the packaged wireless charging receiver of the present embodiment.

下文依本創作封裝式無線充電接收器,特舉實施例配合所附圖式作詳細說明,但所提供之實施例並非用以限制本創作所涵蓋的範圍。The following is a detailed description of the packaged wireless charging receiver in accordance with the present invention, but the embodiments are not intended to limit the scope of the present invention.

請搭配第1圖參考第3圖,第3圖係為本創作實施例之封裝式無線充電接收器300的線路設計示意圖(schematic diagram)。第3圖的線路中,區塊301至304係分別對應到第1圖之全同步整流器101、低壓差線性穩壓器102、微控制器103、及通聯調變模組104。由第3圖可知,此線路設計中亦包含複數個被動元件,如:電阻R11至R36與儲能整流電容C4至C25,或視設計需求亦可能包含電感。在此線路設計中,區塊301對應之全同步整流器101係與一外部金屬線圈相連,以透過該外部金屬線圈接收無線方式傳輸的電磁波。該電磁波係為電磁感應式無線電力傳輸的能量傳輸形式。Referring to FIG. 1 with reference to FIG. 3, FIG. 3 is a schematic diagram of a circuit design of the packaged wireless charging receiver 300 of the present embodiment. In the circuit of FIG. 3, blocks 301 to 304 correspond to the full synchronous rectifier 101, the low dropout linear regulator 102, the microcontroller 103, and the communication modulation module 104 of FIG. 1, respectively. As can be seen from Figure 3, the circuit design also includes a plurality of passive components, such as resistors R11 to R36 and energy storage rectifier capacitors C4 to C25, or may include inductors depending on design requirements. In this circuit design, the full synchronous rectifier 101 corresponding to the block 301 is connected to an external metal coil to receive wirelessly transmitted electromagnetic waves through the external metal coil. The electromagnetic wave is a form of energy transmission of electromagnetic induction type wireless power transmission.

電磁感應是最為常見的無線電力傳輸方式,通過發射端和接收端的線圈相互感應產生電流,從而實現無線電力傳輸的技術。其基本原理為法拉第電磁感應定律,而本創作亦是藉由電磁感應式的原理,首先一無線充電 發射器由例如插座取得電力,無線充電發射器的線圈因此產生磁力性質的電磁波,而由本創作實施例之封裝式無線充電接收器外接的金屬線圈感應並接收到該電磁波,進而將電磁波傳輸至本創作實施例之封裝式無線充電接收器以轉換成電力。實際應用時,金屬線圈與相配合的無線充電發射器之直線距離應小於產品規格所規範的距離,例如為10mm以內。Electromagnetic induction is the most common wireless power transmission method, and the current is induced by the coils of the transmitting end and the receiving end to realize the wireless power transmission technology. The basic principle is Faraday's law of electromagnetic induction, and this creation is also based on the principle of electromagnetic induction, first wireless charging The transmitter obtains power from, for example, a socket, and the coil of the wireless charging transmitter thus generates electromagnetic waves of magnetic properties, and the metal coil externally connected by the packaged wireless charging receiver of the present embodiment senses and receives the electromagnetic wave, thereby transmitting the electromagnetic wave to the present. The packaged wireless charging receiver of the embodiment is created to be converted into electricity. In practical applications, the linear distance between the metal coil and the matching wireless charging transmitter should be less than the distance specified by the product specification, for example, within 10 mm.

區塊301對應之全同步整流器101的功用,在於將感應金屬線圈接收的電磁波而生成的AC交流電整流為DC直流電。當區塊301對應的全同步整流器101實行整流時,第3圖之區塊303對應的微控制器103,會透過區塊304對應的通聯調變模組104,觀察並控制全同步整流器101,使全同步整流器101得以正常操作。當全同步整流器101將AC交流電轉換為DC直流電後,因全同步整流器101輸出之DC直流電的電壓過高,故需先輸入區塊302對應的低壓差線性穩壓器102,以將該高壓DC直流電予以穩壓,並降壓為例如為5伏特之DC直流電。經過低壓差線性穩壓器102穩壓與降壓後輸出的較低壓之DC直流電(例如為5伏特)即可被輸出至外部負載例如為一電池,以充電該電池。除此之外,低壓差線性穩壓器102輸出的DC直流電亦可供電給微控制器103。The function of the full synchronous rectifier 101 corresponding to the block 301 is to rectify the AC alternating current generated by the electromagnetic waves received by the induction metal coil into DC direct current. When the full synchronous rectifier 101 corresponding to the block 301 performs rectification, the microcontroller 103 corresponding to the block 303 of FIG. 3 observes and controls the full synchronous rectifier 101 through the communication modulation module 104 corresponding to the block 304. The full synchronous rectifier 101 is allowed to operate normally. After the full synchronous rectifier 101 converts the AC alternating current into the DC direct current, since the voltage of the DC direct current outputted by the full synchronous rectifier 101 is too high, the low dropout linear regulator 102 corresponding to the block 302 is first input to the high voltage DC. The DC power is regulated and stepped down to a DC current of, for example, 5 volts. The low-voltage DC direct current (for example, 5 volts) outputted after the low-dropout linear regulator 102 is regulated and stepped down can be output to an external load such as a battery to charge the battery. In addition to this, the DC direct current output from the low dropout linear regulator 102 can also be supplied to the microcontroller 103.

關於第3圖所示本創作實施例中上述的被動元件如電阻R11至R36與儲能整流電容C4至C25,可例如為以下設置:電阻R11為12k歐姆、電阻R12為3.3k歐姆、電阻R13需由使用者調整、電阻R21為16k歐姆、電阻R22為5.1k歐姆、電阻R23為3.9k歐姆、電阻R26為1k歐姆、電阻R28為51k歐姆、電阻R30為3.9k歐姆、電阻R31需由使用者調整、電阻R32為10k歐姆、電阻R34為10k歐姆、電阻R35需由使用者調整,以及電阻R36為10k歐姆;儲能整流電容C4為10uF、儲能整流電容C5為10uF、儲能整流電容C6為1.6nF、儲能整流電容C7為10uF、儲能整流電容C10為 0.1uF、儲能整流電容C12為100pF、儲能整流電容C13為0.1uF、儲能整流電容C14為0.1uF、儲能整流電容C15為10uF、儲能整流電容C16為10uF、儲能整流電容C17為10uF、儲能整流電容C18為10uF、儲能整流電容C19為22nF、儲能整流電容C20為22nF、儲能整流電容C21為47nF、儲能整流電容C23為33nF、儲能整流電容C24為33nF、以及儲能整流電容C25為33nF。第3圖中的電晶體Diode1與電晶體Diode2係為區塊301對應的全同步整流器101中的一部份。此外,第3圖中的功能電路區塊Q16與Q17係為全同步整流器控制電路,功能電路區塊Q14與Q15係為低壓差線性穩壓器控制電路,以及功能電路區塊Q7係為微控制器控制電路。於實作上,功能電路區塊Q7、Q14、Q15、Q16與Q17可採用市面上現有之晶圓切割後尚未包裝、且具有使用者所需之功能的裸晶粒(naked die)。關於第3圖之實施例中功能電路區塊Q7至Q17包含的各腳位,進一步簡述如下:功能電路區塊Q16與Q17之內部係為電晶體架構,其腳位係為第一源極腳位S1、第二源極腳位S2、第一閘極腳位G1、第二閘極腳位G2、第一汲極腳位D1以及第二汲極腳位D2;功能電路區塊Q17之內部係為微控制器電路,其腳位係為地極腳位VSS、電源腳位VDD、系統時脈腳位SCK、類比電源腳位VPP、資料腳位SDA以及一般用途腳位GPIO1至GPIO3;功能電路區塊Q14與Q15之內部係為低壓差線性穩壓器控制電路架構,其腳位係為地極腳位GND、直流電輸入腳位IN、直流電輸出腳位OUT、參考電壓腳位FB、致能腳位EN、電壓輸入腳位VCC、以及電壓輸出腳位OUT1至OUT4,其中:直流電輸出腳位OUT提供電力給功能電路區塊Q7的微控制器,而電壓輸出腳位OUT1至OUT4提供電力給外接的負載例如鋰電池以執行充電。Regarding the passive components such as the resistors R11 to R36 and the energy storage rectifying capacitors C4 to C25 in the present embodiment shown in FIG. 3, for example, the following settings can be made: the resistor R11 is 12 k ohms, the resistor R12 is 3.3 k ohms, and the resistor R13 Need to be adjusted by the user, resistor R21 is 16k ohm, resistor R22 is 5.1k ohm, resistor R23 is 3.9k ohm, resistor R26 is 1k ohm, resistor R28 is 51k ohm, resistor R30 is 3.9k ohm, resistor R31 needs to be used Adjust, resistor R32 is 10k ohm, resistor R34 is 10k ohm, resistor R35 needs to be adjusted by the user, and resistor R36 is 10k ohm; energy storage rectifying capacitor C4 is 10uF, energy storage rectifying capacitor C5 is 10uF, energy storage rectifying capacitor C6 is 1.6nF, energy storage rectifier capacitor C7 is 10uF, and energy storage rectifier capacitor C10 is 0.1uF, energy storage rectifier capacitor C12 is 100pF, energy storage rectifier capacitor C13 is 0.1uF, energy storage rectifier capacitor C14 is 0.1uF, energy storage rectifier capacitor C15 is 10uF, energy storage rectifier capacitor C16 is 10uF, energy storage rectifier capacitor C17 10uF, storage energy rectifying capacitor C18 is 10uF, energy storage rectifying capacitor C19 is 22nF, energy storage rectifying capacitor C20 is 22nF, energy storage rectifying capacitor C21 is 47nF, energy storage rectifying capacitor C23 is 33nF, and energy storage rectifying capacitor C24 is 33nF And the energy storage rectifier capacitor C25 is 33nF. The transistor Diode1 and the transistor Diode2 in FIG. 3 are part of the full synchronous rectifier 101 corresponding to the block 301. In addition, the functional circuit blocks Q16 and Q17 in Fig. 3 are full synchronous rectifier control circuits, the functional circuit blocks Q14 and Q15 are low dropout linear regulator control circuits, and the functional circuit block Q7 is micro control. Control circuit. In practice, the functional circuit blocks Q7, Q14, Q15, Q16 and Q17 can be used with commercially available wafers that have not been packaged after wafer dicing and have the functions required by the user. The pin circuits included in the functional circuit blocks Q7 to Q17 in the embodiment of FIG. 3 are further briefly described as follows: the internals of the functional circuit blocks Q16 and Q17 are a transistor structure, and the pin position is the first source. Pin S1, second source pin S2, first gate pin G1, second gate pin G2, first drain pin D1 and second drain pin D2; functional circuit block Q17 The internal system is a microcontroller circuit, and its pin position is the ground pin VSS, the power pin VDD, the system clock pin SCK, the analog power pin VPP, the data pin SDA, and the general purpose pins GPIO1 to GPIO3; The internal circuit of the functional circuit blocks Q14 and Q15 is a low-dropout linear regulator control circuit structure. The pin position is the ground pin GND, the DC input pin IN, the DC output pin OUT, the reference voltage pin FB, The enable pin EN, the voltage input pin VCC, and the voltage output pin OUT1 to OUT4, wherein: the DC output pin OUT provides power to the microcontroller of the functional circuit block Q7, and the voltage output pins OUT1 to OUT4 provide The power is supplied to an external load such as a lithium battery to perform charging.

請參考第4圖。第4圖係為本創作實施例中封裝式無線充電接收器400的系統構裝剖面示意圖。本創作之實施例係採用系統構裝(System in Package;SiP)封裝體(package),將上述之功能區塊,如:全同步整流器 101、低壓差線性穩壓器102、微控制器103、與通聯調變模組104,以及被動元件如電阻R11至R36與儲能整流電容C4至C25等,均以系統構裝技術包進系統構裝封裝體。現今的系統構裝技術(SiP technology)可將多個晶圓切割後尚未封裝之裸晶粒(naked die),即對應於上述之功能電路區塊Q7至Q17,以表面黏著技術(Surface-mount technology;SMT)黏著於封裝體內部的基板(substrate)或電路板如軟式印刷電路板或硬式印刷電路板,再以金屬線將各裸晶粒之接腳(pad)互相連接以建構一系統。使用系統構裝技術(SiP technology)建構於封裝體內的系統,效果可雷同於先前技術中,在印刷電路板上將多個已事先封裝之積體電路與被動元件透過印刷電路板的走線互相連接而構成的系統,其中,上述先前技術中印刷電路板上已事先封裝之積體電路,即對應於系統構裝封裝體中的裸晶粒。第4圖中,晶粒401即為上述之裸晶粒,其中具有積體電路;第3圖中區塊301至304所對應到的全同步整流器、低壓差線性穩壓器、微控制器、及通聯調變模組,其中的一項或多項,可被以積體電路的形式整合於晶粒401之中,其中,該些功能區塊可各自單獨被整合於晶粒401,亦可與其他功能區塊一起被整合於晶粒401中。金屬導線402則為連接各晶粒401之連接路徑,係對應於先前技術中印刷電路板上的走線。電路板403係用以承載晶粒401與金屬導線402,在封裝廠提供之工程服務許可的範圍內,亦可將被動元件如電阻或電容經佈局後黏著於電路板403上,再用金屬導線402或電路板403本身的導電性走線連接至晶粒401。因此,第4圖中相對應於第3圖中之被動元件(如電阻R11至R36、與儲能整流電容C4至C25)的電阻4001與儲能整流電容4002,亦可一併被整合於電路板403上。若封裝廠提供之系統構裝方案的規格許可,電路板403亦可用以提供地極電位。封裝體404係為一作為系統構裝之封裝外殼的塑膠殼體,其係用以將晶粒401、金屬導線402、電路板403與被動元如電阻4001與儲能整流電容4002均予以密封。金屬接頭405係用以作為封裝式無線充電接收器400內部與外部系統的連結路徑。每一金屬接頭405均有兩端,其中 第一端位於封裝體404內部且設置於電路板403上,且第二端外露於封裝體404之外。由於晶粒401、金屬導線402、電阻4001與儲能整流電容4002已被整合成一無線充電接收模組,故簡言之,封裝式無線充電接收器400即為將電路板403與該無線充電接收模組,以封裝體404予以密封,使無線充電接收模組被設置於封裝體404內,僅透過金屬接頭405與外部連結。Please refer to Figure 4. 4 is a schematic cross-sectional view showing the system configuration of the packaged wireless charging receiver 400 in the present embodiment. The embodiment of the present invention uses a System in Package (SiP) package to transfer the above functional blocks, such as a full synchronous rectifier. 101, low dropout linear regulator 102, microcontroller 103, and pass modulation module 104, and passive components such as resistors R11 to R36 and energy storage rectifier capacitors C4 to C25, etc., are packaged into the system by system packaging technology. The package is packaged. Today's system fabrication technology (SiP technology) can cut a plurality of wafers and then not packaged bare die, that is, corresponding to the above functional circuit blocks Q7 to Q17, surface adhesion technology (Surface-mount) Technology; SMT) A substrate or circuit board adhered to the inside of the package such as a flexible printed circuit board or a hard printed circuit board, and then the pads of the bare crystals are connected to each other by a metal wire to construct a system. The system built into the package using SiP technology can be similar to the prior art in that a plurality of pre-packaged integrated circuits and passive components are routed through the printed circuit board on the printed circuit board. A system constructed by connection, wherein the integrated circuit previously packaged on the printed circuit board of the prior art described above corresponds to the bare die in the system package. In Fig. 4, the die 401 is the above-mentioned bare die having an integrated circuit therein; in Fig. 3, the full synchronous rectifier, the low dropout linear regulator, and the microcontroller corresponding to the blocks 301 to 304 are And one or more of the connection modulation modules, which may be integrated into the die 401 in the form of an integrated circuit, wherein the functional blocks may be separately integrated into the die 401, or The other functional blocks are integrated together in the die 401. The metal wire 402 is a connection path for connecting the respective dies 401, corresponding to the traces on the printed circuit board of the prior art. The circuit board 403 is used to carry the die 401 and the metal wire 402. Within the scope of the engineering service license provided by the package factory, passive components such as resistors or capacitors may be laid on the circuit board 403 and then metal wires. The conductive traces of 402 or circuit board 403 itself are connected to die 401. Therefore, the resistor 4001 and the energy storage rectifying capacitor 4002 corresponding to the passive components (such as the resistors R11 to R36 and the energy storage rectifying capacitors C4 to C25) in FIG. 3 can also be integrated into the circuit. On board 403. Circuit board 403 can also be used to provide a ground potential if the specifications of the system configuration scheme provided by the packaging factory permit. The package body 404 is a plastic case as a package body of the system package, and is used for sealing the die 401, the metal wire 402, the circuit board 403 and the passive element such as the resistor 4001 and the energy storage rectifying capacitor 4002. The metal joint 405 is used as a connection path between the inside of the packaged wireless charging receiver 400 and an external system. Each metal joint 405 has two ends, wherein The first end is located inside the package body 404 and disposed on the circuit board 403 , and the second end is exposed outside the package body 404 . Since the die 401, the metal wire 402, the resistor 4001 and the energy storage rectifying capacitor 4002 have been integrated into a wireless charging receiving module, in short, the packaged wireless charging receiver 400 is to receive the circuit board 403 and the wireless charging. The module is sealed by the package 404, and the wireless charging receiving module is disposed in the package 404, and is connected to the outside only through the metal joint 405.

本創作之實施例中,上述之金屬接頭405可例如包含第一線圈接頭、第二線圈接頭、電源接頭、地極接頭、第一JTAG(Joint Test Action Group)接頭、第二JTAG接頭、第三JTAG接頭、第四JTAG接頭及第五JTAG接頭,其中:第一線圈接頭與第二線圈接頭係用以連結至一位於封裝體404外部的外接線圈。電源接頭與地極接頭係用以連結至一電池以對電池充電(該用以充電的輸出電流可例如為電壓5伏特且電流1000至1500mA之DC直流電)。第一至第五JTAG接頭係用以於一量產測試時輸入及讀出測試資料(test pattern),更新無線充電接收模組內存之韌體,以及為無線充電接收模組除錯(debug)時傳輸資料。請搭配參考第3圖,第3圖中所示的功能電路區塊Q7之地極腳位VSS、電源腳位VDD、系統時脈腳位SCK、類比電源腳位VPP與資料腳位SDA,於本創作實施例中,可對應並耦接於上述的第一至第五JTAG接頭,可供使用者存取以執行量產測試、韌體更新和除錯。In the embodiment of the present invention, the metal joint 405 may include, for example, a first coil joint, a second coil joint, a power joint, a ground joint, a first JTAG (Joint Test Action Group) joint, a second JTAG joint, and a third The JTAG connector, the fourth JTAG connector and the fifth JTAG connector, wherein the first coil connector and the second coil connector are used to connect to an external coil located outside the package body 404. The power connector and the ground connector are used to connect to a battery to charge the battery (the output current for charging can be, for example, a DC current of 5 volts and a current of 1000 to 1500 mA). The first to fifth JTAG connectors are used to input and read test patterns during a mass production test, to update the firmware of the wireless charging receiving module memory, and to debug the wireless charging receiving module. Transfer data. Please refer to the ground pin VSS, the power pin VDD, the system clock pin SCK, the analog power pin VPP and the data pin SDA of the function circuit block Q7 shown in Figure 3 and Figure 3. In the present embodiment, the first to fifth JTAG connectors may be correspondingly coupled and coupled to the user for performing mass production testing, firmware update, and debugging.

以上關於金屬接頭405之數量與規格的介紹僅為舉例,使用者亦可根據其需求,自行增加或減少金屬接頭405。舉例來說,根據本創作另一實施例,若使用者因規格需求,需將製作完成後的封裝式無線充電接收器400之體積縮小,而導致一部分的被動元件如電阻4001及/或儲能整流電容4002不被允許整合於封裝體404內部的電路板403上,則可將該些不被允許置入封裝體404內部的被動元件(如電阻4001及/或儲能整流電容4002)由設計中取消,改由封裝式無線充電接收器400外部、不屬於封裝式無線充電接收 器400的外接被動元件代替。其設計方法係為:使用者可另設置至少一金屬接頭405,於日後封裝式無線充電接收器400被整合於一系統如智慧型手機之主機板上時,以另設置的金屬接頭405連接到位於封裝式無線充電接收器400外部且不屬於封裝式無線充電接收器400的外接被動元件,該些外接被動元件的功能可相同於原先設置在封裝式無線充電接收器400內部但已被取消的被動元件。在此實施例中,因為已將若干非為絕對必要、依使用者之規格需求可選擇性不採用的被動元件,由封裝式無線充電接收器400內部取消,並讓使用者可依其需求改將封裝式無線充電接收器400由另設置的金屬接頭405接到外接被動元件以得到與被取消之內部被動元件相同的功能,故封裝式無線充電接收器400本身的體積可因此降低,使用者亦擁有更大的設計彈性可使用或不使用某些被動元件,而金屬接頭405的種類與數量亦可如此實施例所示,由使用者自行彈性規劃。The above description of the number and specifications of the metal joint 405 is merely an example, and the user can also increase or decrease the metal joint 405 according to his needs. For example, according to another embodiment of the present invention, if the user needs to reduce the size of the packaged wireless charging receiver 400 after completion, a part of the passive components such as the resistor 4001 and/or the energy storage may be required. The rectifying capacitor 4002 is not allowed to be integrated on the circuit board 403 inside the package 404, and the passive components (such as the resistor 4001 and/or the energy storage rectifying capacitor 4002) that are not allowed to be placed inside the package 404 can be designed. Cancelled, replaced by encapsulated wireless charging receiver 400, not included in packaged wireless charging reception The external passive component of the device 400 is replaced. The design method is as follows: the user can further set at least one metal connector 405. When the packaged wireless charging receiver 400 is integrated into a system such as a smart phone, the metal connector 405 is connected to the other. An external passive component that is external to the packaged wireless charging receiver 400 and does not belong to the packaged wireless charging receiver 400. The functions of the external passive components may be the same as those originally set in the packaged wireless charging receiver 400 but have been cancelled. Passive components. In this embodiment, since a plurality of passive components that are not absolutely necessary and are selectively not used according to the user's specifications are eliminated, the packaged wireless charging receiver 400 is internally cancelled and allowed to be changed according to the needs of the user. The packaged wireless charging receiver 400 is connected to the external passive component by a separately provided metal connector 405 to obtain the same function as the cancelled internal passive component, so that the volume of the packaged wireless charging receiver 400 itself can be reduced, and the user There is also greater design flexibility with or without the use of certain passive components, and the type and number of metal connectors 405 can also be as shown in the embodiment, which is flexibly planned by the user.

如第4圖所示之封裝式無線充電接收器400的系統構裝剖面示意圖,根據本創作實施例,在實際電路製作時,電路板403係為多層結構。將其分層後,分別由上方俯瞰或於下方往上看,可進一步分析其結構。請搭配第4圖進一步參考第5圖與第6圖。A schematic diagram of a system configuration of a packaged wireless charging receiver 400 as shown in FIG. 4, according to the present embodiment, the circuit board 403 is of a multi-layer structure during actual circuit fabrication. After stratification, the structure is further analyzed by looking up from above or looking up from below. Please refer to Figure 5 for further reference to Figure 5 and Figure 6.

第5圖係為本創作實施例中封裝式無線充電接收器400的系統構裝內部第一電路層500的第一面500a1之俯瞰示意圖,其中第一電路層500之第一面500a1包括位於四周的板框5001,以及安裝於第一面500a1上的電阻4001及/或儲能整流電容4002及晶粒401。由上文可知,晶粒401內部係將全同步整流器、低壓差線性穩壓器、微控制器、及/或通聯調變模組中的一項或多項之電路以積體電路實現,用以將執行整流與濾波以輸出持續穩定的直流電。5 is a bird's-eye view of the first surface 500a1 of the internal first circuit layer 500 of the system configuration of the packaged wireless charging receiver 400 in the present embodiment, wherein the first side 500a1 of the first circuit layer 500 is included The plate frame 5001 and the resistor 4001 and/or the energy storage rectifying capacitor 4002 and the die 401 mounted on the first surface 500a1. As can be seen from the above, the inside of the die 401 is implemented by an integrated circuit of one or more of a full synchronous rectifier, a low dropout linear regulator, a microcontroller, and/or a pass modulation module. Rectification and filtering will be performed to output a continuously stable direct current.

第6圖係為本創作實施例中封裝式無線充電接收器400的系統構裝內部第一電路層500的第二面500a2之俯瞰示意圖,其中包括導電性金屬接點601。導電性金屬接點601係可經過金屬走線與第4圖中所示的金屬接頭405相耦接以耦接至系統構裝外部,導電性金屬接點601除了可用以收發控制信號,也可將無線接收之電磁波轉換而成的電力傳送到電子產品的電池以進行充電。6 is a bird's-eye view of the second surface 500a2 of the first internal circuit layer 500 of the system configuration of the packaged wireless charging receiver 400 in the present embodiment, including a conductive metal contact 601. The conductive metal contact 601 can be coupled to the metal connector 405 shown in FIG. 4 via a metal trace to be coupled to the outside of the system package. The conductive metal contact 601 can be used in addition to transmitting and receiving control signals. The power converted from the wirelessly received electromagnetic waves is transmitted to the battery of the electronic product for charging.

請參考第7圖。第7圖係為本創作實施例中封裝式無線充電接收器400的系統構裝內部第二電路層700的第一面700a1之俯瞰示意圖。第二電路層700為二層、四層或八層之多層電路板,在電路板700上以繞線的方式形成環狀線路709,同時要求環狀線路709的直徑可通過足夠的電流和造成較低的直流電阻。每一層的環狀線路709都經由過孔(VIA)7005實現電連接,以此來增加環狀線路709的線圈數量。Please refer to Figure 7. 7 is a bird's-eye view of the first side 700a1 of the internal second circuit layer 700 of the system configuration of the packaged wireless charging receiver 400 in the present embodiment. The second circuit layer 700 is a two-layer, four-layer or eight-layer multilayer circuit board, and a loop line 709 is formed on the circuit board 700 in a winding manner, and the diameter of the loop line 709 is required to pass sufficient current and cause Lower DC resistance. The loop line 709 of each layer is electrically connected via a via (VIA) 7005 to increase the number of coils of the loop 709.

請參考第8圖,第8圖係為本創作實施例中封裝式無線充電接收器400的系統構裝內部第二電路層700的第二面700a2之俯瞰示意圖。在第二電路層700的第二面700a2上有導電性金屬接點701,導電性金屬接點701可以是方塊狀或球狀,根據本創作之一實施例,其加工時係通過加上錫膏的方式與第一電路層500進行電連接。根據本創作實施例,第8圖中所示之第二電路層700的第二面700a2亦可見到相對應於第7圖之過孔7005。Please refer to FIG. 8. FIG. 8 is a bird's-eye view of the second surface 700a2 of the internal second circuit layer 700 of the system configuration of the packaged wireless charging receiver 400 in the present embodiment. On the second surface 700a2 of the second circuit layer 700, there are conductive metal contacts 701, and the conductive metal contacts 701 may be square or spherical. According to an embodiment of the present invention, the processing is performed by adding The solder paste is electrically connected to the first circuit layer 500. According to the present embodiment, the second side 700a2 of the second circuit layer 700 shown in FIG. 8 can also be seen in the via 7005 corresponding to FIG.

請再參考第9圖。第9圖係為本創作實施例中封裝式無線充電接收器400的系統構裝內部的隔磁板900之俯瞰示意圖。隔磁板900的主要作用是使經過線圈的磁力綫可更好地形成一迴路,藉以提高無線充電的整體效率。第9圖所示的實施例中,隔磁板900被置放在第一電路層500和第二電路層700之間,且隔磁板900可以保護晶粒401、電阻4001及/或儲能整流電 容4002不因磁力線的干擾受到影響。根據第9圖所示的隔磁板900,其包括一隔磁板穿孔區域901,其係用以使封裝式無線充電接收器400的系統構裝內部有更多空間佈局置放例如晶粒401、電阻4001及/或儲能整流電容4002等電子元件,而只需隔磁板穿孔區域901以外之區域即可達到隔離磁力線的作用。Please refer to Figure 9 again. FIG. 9 is a bird's-eye view of the magnetic isolation plate 900 inside the system configuration of the packaged wireless charging receiver 400 in the present embodiment. The main function of the magnetic isolation plate 900 is to make the magnetic lines passing through the coil better form a loop, thereby improving the overall efficiency of wireless charging. In the embodiment shown in FIG. 9, the magnetic isolation plate 900 is placed between the first circuit layer 500 and the second circuit layer 700, and the magnetic isolation plate 900 can protect the die 401, the resistor 4001, and/or the energy storage. Rectifier Capacity 4002 is not affected by the interference of magnetic lines of force. According to the magnetic isolation plate 900 shown in FIG. 9, a magnetic isolation plate perforated area 901 is provided for making the space of the system configuration of the packaged wireless charging receiver 400 more spatially placed, for example, the die 401. The electronic component such as the resistor 4001 and/or the energy storage rectifying capacitor 4002 can be used to isolate the magnetic field lines only by the region other than the perforated region 901 of the magnetic plate.

請搭配第3圖到第9圖之說明,參考第10圖,第10圖為本創作實施例之封裝式無線充電接收器400的完成外觀圖。由於採用了第4圖所示的系統構裝技術,並於系統構裝內部採用第5圖至第9圖所示之多層結構,如第2圖中所示先前技術中形狀較不規則、走線較為複雜且面積亦較大的無線充電接收電路200,於本創作之實施例中已由系統構裝封裝體404包裝而成的封裝式無線充電接收器400所取代。如第10圖之實施例所示,封裝式無線充電接收器400之外觀係為一薄片狀矩形膠卡,厚度僅例如為1mm,其內部之無線充電接收模組則可透過複數個金屬接頭405與外部系統如智慧手機主機板相連。當使用者欲將封裝式無線充電接收器400整合於一系統如智慧型手機主機板中時,便不需再同先前技術一樣被迫在印刷電路板上進行佈局與製造,而僅需將封裝式無線充電接收器400置放於該系統內,並將欲充電的部件如一鋰電池的端子如正極與負極,依照封裝式無線充電接收器400的使用說明連結至相對應的金屬接頭405,即可方便地將封裝式無線充電接收器400整合於該系統,並對該部件如鋰電池實施無線充電。本創作實施例的封裝式無線充電接收器400的尺寸可例如為15mm x 10mm,相較於先前技術中無線充電接收電路大約30mm x 25mm的面積,面積有望縮小至原先的20%以下。由於封裝式無線充電接收器400的面積已縮小、形狀為規則矩形、有外殼保護且厚度為僅1mm之薄片狀,故本創作實施例中的封裝式無線充電接收器400,實有助於解決使用者於先前技術中,為了整合無線充電接收電路於系統中,因無線充電接收電路體積過大、電路過於龐雜且形狀不規則,所 遭遇的整合難題。Please refer to the description of FIGS. 3 to 9, referring to FIG. 10, which is a completed appearance view of the packaged wireless charging receiver 400 of the present embodiment. Since the system assembly technique shown in Fig. 4 is employed, and the multi-layer structure shown in Figs. 5 to 9 is employed inside the system configuration, as in the prior art shown in Fig. 2, the shape is irregular and goes. The wireless charging receiving circuit 200, which is relatively complicated in wire and large in area, is replaced by a packaged wireless charging receiver 400 which has been packaged by the system package 404 in the embodiment of the present invention. As shown in the embodiment of FIG. 10, the appearance of the packaged wireless charging receiver 400 is a thin rectangular plastic card having a thickness of only 1 mm, and the internal wireless charging receiving module can pass through a plurality of metal connectors 405. Connect to external systems such as smartphone motherboards. When the user wants to integrate the packaged wireless charging receiver 400 into a system such as a smart phone motherboard, it is no longer required to be laid out and manufactured on the printed circuit board as in the prior art, and only needs to be packaged. The wireless charging receiver 400 is placed in the system, and the components to be charged, such as the terminals of a lithium battery, such as the positive pole and the negative pole, are coupled to the corresponding metal joint 405 according to the instructions of the packaged wireless charging receiver 400, ie The packaged wireless charging receiver 400 can be conveniently integrated into the system and wirelessly charged to the component, such as a lithium battery. The size of the packaged wireless charging receiver 400 of the presently-created embodiment may be, for example, 15 mm x 10 mm, which is expected to be reduced to less than 20% of the original area compared to the area of the prior art wireless charging receiving circuit of approximately 30 mm x 25 mm. Since the area of the packaged wireless charging receiver 400 has been reduced, the shape is a regular rectangle, the outer casing is protected, and the thickness is only 1 mm, the packaged wireless charging receiver 400 in the present embodiment can be solved. In the prior art, in order to integrate the wireless charging receiving circuit into the system, the wireless charging receiving circuit is too large, the circuit is too complicated, and the shape is irregular. The integration problem encountered.

雖然本創作已以實施例揭露如上,然其並非用以限定本創作,任何具有本創作所屬技術領域之通常知識者,在不脫離本創作之精神和範圍內,當可作各種更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the technical field of the present invention can make various changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application attached.

400‧‧‧封裝式無線充電接收器400‧‧‧Packaged wireless charging receiver

401‧‧‧晶粒401‧‧‧ grain

402‧‧‧金屬導線402‧‧‧Metal wire

403‧‧‧電路板403‧‧‧ circuit board

404‧‧‧封裝體404‧‧‧Package

405‧‧‧金屬接頭405‧‧‧Metal joints

4001‧‧‧電阻4001‧‧‧resistance

4002‧‧‧儲能整流電容4002‧‧‧ Energy storage rectifier capacitor

Claims (11)

一種封裝式無線充電接收器(wireless charging receiver),包含:一封裝體;一電路板,位於該封裝體內部;一無線充電接收模組,位於該封裝體內部且設置於該電路板上;及複數個金屬接頭,其中每一金屬接頭包含:一第一端,其位於該封裝體內且耦接於該無線充電接收模組,及一第二端,外露於該封裝體之外;其中該無線充電接收模組可透過該複數個金屬接頭連結至該封裝體外部。A packaged wireless charging receiver includes: a package; a circuit board located inside the package; and a wireless charging receiving module disposed inside the package and disposed on the circuit board; a plurality of metal connectors, wherein each of the metal connectors includes: a first end disposed in the package and coupled to the wireless charging receiving module, and a second end exposed outside the package; wherein the wireless The charging receiving module can be connected to the outside of the package through the plurality of metal connectors. 如請求項1所述的封裝式無線充電接收器,其中該無線充電接收模組係包含一低壓差線性穩壓器(Low-Dropout linear regulator;LDO)、一通聯調變模組(Communication modulation module)、一全同步整流器(Full synchronous rectifier)、一微控制器(micro control unit;MCU)及至少一被動元件。The packaged wireless charging receiver according to claim 1, wherein the wireless charging receiving module comprises a low-dropout linear regulator (LDO) and a communication modulation module (Communication modulation module). ), a full synchronous rectifier, a micro control unit (MCU), and at least one passive component. 如請求項2所述的封裝式無線充電接收器,其中該至少一被動元件包含至少一電阻、至少一整流儲能電容、及/或至少一電感。The packaged wireless charging receiver of claim 2, wherein the at least one passive component comprises at least one resistor, at least one rectifying storage capacitor, and/or at least one inductor. 如請求項2所述的封裝式無線充電接收器,其中該低壓差線性穩壓器、該通聯調變模組、該全同步整流器、及/或該微控制器係整合於一晶粒(die)之一積體電路上。The packaged wireless charging receiver of claim 2, wherein the low dropout linear regulator, the pass modulation module, the full synchronous rectifier, and/or the microcontroller are integrated in a die ) One of the integrated circuits. 如請求項1所述的封裝式無線充電接收器,其中該無線充電接收模組係透 過該複數個金屬接頭中的至少一個金屬接頭耦接於一位於該封裝體外部之外接線圈,以透過該外接線圈接收以無線方式傳輸之一電磁波。The packaged wireless charging receiver of claim 1, wherein the wireless charging receiving module is transparent At least one metal connector of the plurality of metal connectors is coupled to an external coil located outside the package to receive an electromagnetic wave transmitted through the external coil. 如請求項1所述的封裝式無線充電接收器,其中該複數個金屬接頭包含一第一線圈接頭、一第二線圈接頭、一電源接頭、一地極接頭、一第一JTAG(Joint Test Action Group)接頭、一第二JTAG接頭、一第三JTAG接頭及一第四JTAG接頭,其中:該第一線圈接頭與該第二線圈接頭,係用以連結至一位於該封裝體外部之外接線圈;該電源接頭與該地極接頭,係用以連結至一電池以對該電池充電;及該第一至第四JTAG接頭係用以:於一量產測試時輸入及讀出一組測試資料(test pattern);更新該無線充電接收模組內存之至少一組韌體;及為該無線充電接收模組除錯(debug)時傳輸資料。The packaged wireless charging receiver of claim 1, wherein the plurality of metal connectors comprise a first coil connector, a second coil connector, a power connector, a ground connector, and a first JTAG (Joint Test Action) a connector, a second JTAG connector, a third JTAG connector, and a fourth JTAG connector, wherein: the first coil connector and the second coil connector are coupled to an external coil located outside the package The power connector and the ground connector are connected to a battery to charge the battery; and the first to fourth JTAG connectors are used to: input and read a set of test data during a mass production test (test pattern); updating at least one set of firmware of the wireless charging receiving module memory; and transmitting data when the wireless charging receiving module is debugged. 如請求項6所述的封裝式無線充電接收器,其中該複數個金屬接頭更包含至少一外接被動元件接頭,用以連結該無線充電接收模組與位於該封裝體之外部的至少一外接被動元件。The packaged wireless charging receiver of claim 6, wherein the plurality of metal connectors further comprise at least one external passive component connector for connecting the wireless charging receiving module with at least one external passive device located outside the package body. element. 如請求項1所述的封裝式無線充電接收器,其中該電路板係為一軟式印刷電路板(soft PCB),一硬式印刷電路板(hard PCB),或一基板(substrate)。The packaged wireless charging receiver of claim 1, wherein the circuit board is a flexible printed circuit board (soft PCB), a hard printed circuit board (hard PCB), or a substrate. 如請求項1所述的封裝式無線充電接收器,其中該電路板包括:一第一電路層,具有:一第一面,用以安裝至少一晶粒及/或至少一被動元件,且四周具有 一板框;及一第二面,具有至少一用以耦接至該封裝式無線充電接收器外部之導電性金屬接點;一第二電路層,具有:一第一面,具有至少一環狀電路及至少一用以耦接該環狀電路的過孔;及一第二面,具有至少一用以耦接至該第一電路層的該導電性金屬接點;及一隔磁層,位於該第一電路層與該第二電路層之間,用以保護該晶粒與該被動元件不被磁力線干擾,其中該隔磁層具有一隔磁層穿孔區域,用以使該晶粒與該被動元件易於置放。The packaged wireless charging receiver of claim 1, wherein the circuit board comprises: a first circuit layer having: a first surface for mounting at least one die and/or at least one passive component, and surrounding have a second frame having at least one conductive metal contact for coupling to the outside of the packaged wireless charging receiver; and a second circuit layer having: a first surface having at least one ring And a second via having at least one conductive metal contact for coupling to the first circuit layer; and a magnetic isolation layer, Located between the first circuit layer and the second circuit layer for protecting the die and the passive component from magnetic lines of force, wherein the magnetic isolation layer has a magnetic isolation layer perforation region for The passive component is easy to place. 如請求項1所述的封裝式無線充電接收器,其中該無線充電接收模組係以表面黏著技術(Surface-mount technology;SMT)設置於該電路板上。The packaged wireless charging receiver of claim 1, wherein the wireless charging receiving module is disposed on the circuit board by a surface-mounting technology (SMT). 如請求項1所述的封裝式無線充電接收器,其中該封裝體係為一系統構裝(System in Package;SiP)封裝外殼。The packaged wireless charging receiver of claim 1, wherein the package system is a system in package (SiP) package.
TW103203854U 2014-03-06 2014-03-06 Packaged wireless charging receiver TWM484236U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509934B (en) * 2014-03-06 2015-11-21 Biwin Storage Technology Ltd Packaged wireless charging receiver

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509934B (en) * 2014-03-06 2015-11-21 Biwin Storage Technology Ltd Packaged wireless charging receiver

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