TWM482846U - Chip-placing frame - Google Patents

Description

Wafer placement rack

The present invention relates to a wafer rack, and more particularly to a wafer rack that provides wafer accommodation and can be stacked in multiple layers for stable transfer.

After the chip is cut, the wafer is placed in the wafer rack, and the wafer is transported through the wafer rack to facilitate the transfer movement of the subsequent process. The existing wafer rack includes a base, and the top surface of the base is provided with a capacitor. a convex portion is disposed, and a plurality of wafer grooves are disposed on an end surface of the accommodating convex portion, the wafer grooves are further arranged in a matrix, and a top surface of the pedestal forms a marking surface surrounding the accommodating convex portion, the pedestal The bottom surface defines a receiving recess, and a corner is formed at a corner of the base, wherein the inner top surface of the receiving recess may be a flat surface, or a plurality of interlaced partitions are disposed on the inner top surface, and A space is formed between the plates, and the bottom edge of the partition does not protrude from the inner top surface of the receiving recess.

The diced wafers can be placed in the wafer slots of the wafer placement rack. After being placed, the wafer placement racks can be stacked, and the accommodating recesses of the upper wafer placement racks are placed on the wafer placement racks located below. The accommodating convex portion smoothly stacks the wafer placing rack by the cooperation of the accommodating convex portion and the accommodating concave portion, wherein the stack of the wafer placing racks can be aligned and stacked, and the wafer is placed The label side of the rack indicates the type of wafer.

However, in the above-mentioned stacked wafer rack, the end surface of the adjacent receiving convex portion and the inner top surface of the accommodating concave portion may have a gap, and the wafer in the wafer groove accommodating the convex portion is not positioned, thereby making the wafer easy to pass through. The gap is separated from the wafer slot in which it is located, which is not conducive to the operation of the wafer for subsequent processing.

The main purpose of this creation is to provide a wafer placement rack which is intended to improve the problem that stacked wafer racks cannot effectively position the wafer.

In order to achieve the foregoing, the wafer rack of the present invention comprises: a base; a receiving protrusion disposed on a top surface of the base; and a plurality of wafers on an end surface of the receiving convex portion a receiving recess, which is disposed on the bottom surface of the base and has an inner top surface; and a plurality of positioning units protruding from the inner top surface of the receiving recess and corresponding to the wafer accommodating the convex portion a slot, the positioning unit includes at least one positioning protrusion protruding from an inner top surface of the receiving recess.

According to the above, the wafer rack can provide the wafer placement after cutting, and the wafer rack can be stacked to facilitate the transfer. When the wafer rack is stacked, the wafer rack is placed above. The concave portion is sleeved on the receiving convex portion of the wafer placing frame located below, and the positioning unit of the upper wafer placing frame respectively protrudes into the corresponding wafer groove in the lower wafer placing frame, and the positioning convex portion of the positioning unit The wafer is not in contact with the wafer in which the wafer is inserted, and the wafer is stopped by the positioning convex portion and is limited to the wafer groove, so that the wafer does not slip out of the wafer groove to facilitate the subsequent processing of the wafer.

Referring to FIG. 1 to FIG. 4 , a preferred embodiment of the wafer placement rack of the present invention includes a base 10 , a receiving protrusion 20 , a receiving recess 30 , and a plurality of positioning units 40 .

The base 10 is a rectangular block and has four corners. The base 10 forms a positioning angle 11 at one corner thereof. The base 10 includes an opposite top surface and a bottom surface, and the base. The marking surface 12 is formed on the top surface and is adjacent to the outer edge of the base 10, wherein the marking surface 12 can indicate the type of the wafer.

The accommodating protrusion 20 is disposed on the top surface of the pedestal 10 and is surrounded by the marking surface 12 of the pedestal 10. The end surface of the accommodating protrusion 20 is provided with a plurality of wafer slots 21, and the wafer slots 21 are spaced apart. Set and arranged in a matrix.

The accommodating recess 30 is disposed on a bottom surface of the susceptor 10 , and the accommodating recess 30 has a pair of inner top surfaces 31 that should accommodate the protrusions 20 .

The positioning unit 40 is disposed on the inner top surface 31 of the accommodating recess 30, and the positioning units 40 respectively correspond to the wafer slots 21 for accommodating the convex portions 20, that is, a positioning unit 40 corresponds to a wafer slot 21, The positioning unit 40 includes at least one positioning protrusion 41 protruding from the inner top surface 31 of the receiving recess 30. Referring to FIG. 5 to FIG. 10, the positioning protrusion 41 may be a hemisphere. The body, the strip, the column or the cone member, in addition, the positioning unit 40 may include one, two or more positioning protrusions 41.

As shown in FIGS. 5-10, the diced wafers 50 can be placed in the wafer slots 21 of the wafer placement rack, and the wafer placement racks can be stacked to facilitate the transport of the wafers 50. The wafer placement racks can be aligned. Positioning the corners 11 and stacking them, the accommodating recesses 30 of the upper wafer rack are placed on the receiving protrusions 20 of the wafer racks located below, and the positioning units 40 of the upper wafer racks respectively correspond to And extending into the wafer slot 21 of the lower wafer placement frame, the positioning convex portion 41 of the positioning unit 40 projects into the wafer groove 21 and does not contact the wafer 50 of the wafer groove 21, and the wafer 50 to be moved out of the wafer groove 21 is in the process of displacement. The stopper of the positioning convex portion 41 is prevented from moving to the detachment from the wafer groove 21.

In summary, the wafer placement frame is disposed in the accommodating recess 30, and the positioning unit 40 is corresponding to the wafer slot 21 of the accommodating portion 20. When stacked, the positioning unit 40 can extend into the wafer slot 21 to The wafer 50 of the wafer carrier 21 is stopped, so that the wafer 50 does not slip out of the wafer groove 21, and the wafer 50 is effectively positioned in the wafer groove 21, thereby facilitating the access of the wafer 50 in the subsequent process.

10‧‧‧ Pedestal
11‧‧‧ positioning angle
12‧‧‧Marking surface
20‧‧‧ accommodating convex parts
21‧‧‧ chip slot
30‧‧‧ accommodating recess
31‧‧‧ inside top
40‧‧‧ Positioning unit
41‧‧‧ positioning convex
50‧‧‧ wafer

FIG. 1 is an exploded perspective view showing an unstacked first preferred embodiment of the present wafer placement rack. FIG. 2 is a perspective view of a stacked assembly of a first preferred embodiment of the present wafer placement rack. 3 is a top plan view showing a first preferred embodiment of the wafer placement rack of the present invention. Figure 4 is a schematic cross-sectional view of the 4-4 cut line of Figure 3. Figure 5 is a cross-sectional view showing the stacking of the first preferred embodiment of the wafer carrier. Figure 6 is a cross-sectional view showing the stacking of the second preferred embodiment of the wafer carrier. Figure 7 is a cross-sectional view showing the stacking of the third preferred embodiment of the wafer carrier. Figure 8 is a cross-sectional view showing the stacking of the fourth preferred embodiment of the wafer carrier. Figure 9 is a cross-sectional view showing the stacking of the fifth preferred embodiment of the wafer carrier. Figure 10 is a cross-sectional view showing the stacking of the sixth preferred embodiment of the wafer carrier.

10‧‧‧ Pedestal

11‧‧‧ positioning angle

12‧‧‧Marking surface

20‧‧‧ accommodating convex parts

21‧‧‧ chip slot

30‧‧‧ accommodating recess

31‧‧‧ inside top

40‧‧‧ Positioning unit

41‧‧‧ positioning convex

Claims (8)

A wafer rack comprising: a base; a receiving protrusion disposed on a top surface of the base; and an end surface of the receiving protrusion is provided with a plurality of wafer slots; and a receiving recess; The locating unit is disposed on the bottom surface of the pedestal and has an inner top surface; and a plurality of positioning units are disposed on the inner top surface of the accommodating recess and respectively corresponding to the wafer slots accommodating the convex portions, and the positioning unit includes At least one protruding convex portion that protrudes from the inner top surface of the receiving recess. The wafer rack of claim 1, wherein the positioning protrusion is a hemispherical member. The wafer rack of claim 1, wherein the positioning protrusion is an elongated member. The wafer rack of claim 1, wherein the positioning protrusion is a cylindrical member. The wafer rack of claim 1, wherein the positioning protrusion is a tapered member. The wafer rack of any one of claims 1 to 5, wherein the top surface of the base forms a marking surface surrounding the receiving protrusion. The wafer rack of any one of claims 1 to 5, wherein the base forms a positioning angle at a corner. The wafer rack of claim 6, wherein the base forms a positioning angle at a corner.