TWM481812U - Mould with a heating device - Google Patents

Abstract

A mould with a heating device, which comprises an upper mould, a lower mould, a conductive layer, an insulating layer, at least one pair of electrodes disposed on the conductive layer, at least one first conductive unit and one second conductive unit, a first outer conductive section of the first conductive unit and a second outer conductive section of the second conductive unit are located at the same side of the conductive layer by passing through a conductive side of the conductive layer, the first conductive unit is provided with a first inner conductive section corresponding to a cavity of the lower mould, and the second conductive unit is located nearer an insulating surface of the conductive layer than the first conductive unit. Such arrangements can control the current path flowing through the conductive layer, so as to make current collected in the cavity, thus improving the heating effect.

Description

Mould with heating device

This creation relates to molds for thermoplastic or thermosetting processes, and in particular to a mold with a heating device.

The heating method or device according to the conventional mold is disposed inside the mold or on the parting surface of the mold, and is provided with a high-frequency-induced induction magnetic wave, and the heat-conducting coil is connected with the high-frequency power supply system to load the high-frequency current. The thermal coil is used to preheat the mold from room temperature to the operating temperature while limiting the heating to the interface between the mold and the material.

However, the high-frequency furnace itself is an electric energy source. Although it has no safety concerns, the equipment cost is high, and the high frequency is only effective for the shallow depth and the flat mold cavity, and it is difficult to apply to the complex shape of the mold surface, and There is a problem of uneven heating, that is, the temperature distribution of the mold surface is uneven, and there are problems such as unstable induction current, long heating time, and high power consumption.

For this reason, in the prior patent of WO 2010/104129 A1, it is disclosed that a conductive layer, an insulating layer, and two electrodes and two conductive units are disposed in the upper mold or the lower mold, and the resistivity of the conductive unit is lower than the conductive The resistivity of the layer, so that the surface temperature distribution of the upper or lower mold is uniform. However, in the prior patent, the two conductive units are respectively disposed on both sides of the conductive layer, and the two conductive units directly penetrate The external cavity does not correspond to the cavity. Therefore, in addition to causing inconvenience in power supply configuration, the current required for heating cannot be collected, and the heating effect of the cavity heating zone is not good.

Therefore, how to develop a mold with a heating device, which can solve the above defects is the motive of the creation of the case.

The purpose of the present work is to provide a mold with a heating device that primarily enhances the heating effect of the heating zone of the mold.

In order to achieve the foregoing objective, a mold having a heating device according to the present invention includes: a conductive layer having a first conductive surface, a second conductive surface opposite to the first conductive surface, and a a heating portion disposed on the first conductive surface, and a first conductive side and a second conductive side connecting the first and second conductive surfaces; an insulating layer is insulatively coupled to the conductive layer and has a bond a first insulating surface of the second conductive surface, a second insulating surface opposite to the first insulating surface, and a first surface connected to the first and second insulating surfaces and respectively on the same side of the first and second conductive sides And a second insulating unit, wherein the first conductive unit has a first electrode portion electrically connected to the first conductive side, and an electric device a first connecting portion electrically connected to the first electrode portion and insulated from the conductive layer, a first inner conductive portion electrically connected to the first connecting portion and located in the insulating layer and corresponding to the heating portion, and an electrical property connection a first inner conductive segment and a first outer conductive segment outside the second insulating side; the second conductive unit has a second electrode portion electrically connected to the second conductive side, and an electrical connection a second outer conductive portion of the second electrode portion and located outside the second insulating side and insulated from the first outer conductive portion.

Preferably, the heating portion of the conductive layer is recessed in a groove shape from the first conductive surface toward the second conductive surface.

Preferably, the upper mold further comprises a lower mold adjacent to or away from the upper mold, and the lower mold is composed of the conductive layer and the insulating layer.

Preferably, the heating portion of the conductive layer is convexly convex from the first conductive surface in a direction opposite to the second conductive surface.

Preferably, the upper mold further comprises a lower mold adjacent to or away from the upper mold, and the upper mold is composed of the conductive layer and the insulating layer.

Preferably, the second conductive unit further has an adjustment section electrically connected to the second outer conductive section, and the adjustment section is located in the insulating layer and between the heating part and the first inner conductive section.

Preferably, the adjustment section of the second conductive unit is provided with a through hole corresponding to the heating portion.

Preferably, the second conductive unit further has a shielding segment electrically connected to the second outer conductive segment, the shielding segment being located in the insulating layer and located between the first inner conductive segment and the second insulating surface.

Preferably, the first and second conductive units are in a plate shape.

Preferably, the first electrode portion of the first conductive unit has a first through hole, the first connecting portion, the first inner conductive portion and the first outer conductive portion are tubular, and the first connecting portion is inserted into the a first through hole, the second electrode portion of the second conductive unit has a second through hole, and the second outer conductive portion is tubular and inserted into the second through hole and the insulating sleeve is disposed on the first outer conductive portion. The two conductive units further have a tubular adjustment section electrically connected to the second outer conductive section, and the adjustment section is located in the insulating layer and is insulated from the first inner conductive section.

The techniques, means, and other effects of the present invention in order to achieve the above objectives are set forth in the accompanying drawings.

10, 10A, 10B‧‧‧ conductive layer

11‧‧‧First conductive surface

12‧‧‧Second conductive surface

13, 13A‧‧‧ heating department

14‧‧‧First conductive side

15‧‧‧Second conductive side

20, 20A, 20B‧‧‧ insulation

21‧‧‧First insulating surface

22‧‧‧Second insulation surface

23‧‧‧First insulated side

24‧‧‧Second insulation side

30, 30A, 30B‧‧‧ first conductive unit

31, 31B‧‧‧ first electrode

311B‧‧‧First perforation

32, 32B‧‧‧ first connection

33, 33A, 33B‧‧‧ first inner conductive section

34, 34B‧‧‧ first outer conductive section

40, 40A, 40B‧‧‧ second conductive unit

41, 41B‧‧‧ second electrode

411B‧‧‧Second perforation

42, 42A, 42B‧‧‧ second outer conductive section

43, 43A, 43B‧‧‧ adjustment section

431‧‧‧Perforation

44‧‧‧Shading Department

51‧‧‧上模

52‧‧‧Down

90‧‧‧Power supply

L1, L2‧‧‧ distance

A‧‧‧ first position

B‧‧‧second position

Fig. 1 is a perspective view showing a first embodiment of the present creation.

Fig. 2 is a schematic cross-sectional view showing the first embodiment of the present creation.

Figure 3 is a perspective view of the first embodiment of the present invention, showing the stereoscopic state of a first conductive unit and a second conductive unit.

Figure 4 is a schematic cross-sectional view showing a second embodiment of the present creation.

Figure 5 is a perspective view of a second embodiment of the present invention showing the stereoscopic state of a first conductive unit and a second conductive unit.

Figure 6 is a schematic cross-sectional view showing a third embodiment of the present creation.

Figure 7 is a schematic cross-sectional view showing a fourth embodiment of the present creation.

Figure 8 is a perspective view showing a fourth embodiment of the present invention, showing a stereoscopic state of a first conductive unit and a second conductive unit.

Figure 9 is a perspective view of a fifth embodiment of the present creation.

Fig. 10 is a perspective view showing a fifth embodiment of the present invention, showing a state in which the first and second conductive units are in a plate shape.

Figure 11 is a perspective view of a sixth embodiment of the present creation.

Fig. 12 is a perspective view showing a sixth embodiment of the present invention, showing a state in which the first and second conductive units are in a plate shape.

Figure 13 is a schematic cross-sectional view showing a seventh embodiment of the present creation.

Figure 14 is a perspective view of a seventh embodiment of the present creation.

Figure 15 is a perspective view of a seventh embodiment of the present invention, showing the stereoscopic state of the first conductive unit and the second conductive unit.

Figure 16 is a perspective view of an eighth embodiment of the present creation.

Figure 17 is a perspective view of a ninth embodiment of the present creation.

Referring to Figures 1, 2 and 3, a mold having a heating device according to the first embodiment of the present invention is mainly composed of a conductive layer 10, an insulating layer 20, and a heating device. The conductive layer 10 is made of steel (or aluminum) and has a first conductive surface 11 , a second conductive surface 12 opposite to the first conductive surface 11 , and a a heating portion 13 of the first conductive surface 11 and a first conductive side surface 14 and a second conductive side surface 15 connecting the first and second conductive surfaces 11 and 12; in this embodiment, the heating portion 13 is formed by the first The conductive surface 11 is recessed in the direction of the second conductive surface 12, and the first conductive side surface 14 and the second conductive side surface 15 are respectively located on the left and right sides of the second drawing surface.

The insulating layer 20 is insulatively bonded to the conductive layer 10 and has a first insulating surface 21 bonded to the second conductive surface 12, a second insulating surface 22 opposite to the first insulating surface 21, and a first and second insulating side surfaces 23, 24 connected to the first and second insulating surfaces 21, 22 and on the same side of the first and second conductive sides 14, 15 respectively; in the embodiment, the insulating layer 20 and the conductive layer The layer 10 can be electrically insulated by electrical insulation treatment or anodization. The insulation layer 20 can also be made of stone material or ceramic material, and can also be electrically insulated from the conductive layer 10.

The heating device includes three first conductive units 30 and three second conductive units 40, wherein each of the first conductive units 30 has a first electrode portion 31 electrically connected to the first conductive side surface 14, and an electrical a first connecting portion 32 connecting the first electrode portion 31 and insulated from the conductive layer 10, a first inner conductive portion electrically connected to the first connecting portion 32 and located in the insulating layer 20 and corresponding to the heating portion 13 33. A first outer conductive segment 34 electrically connected to the first inner conductive segment 33 and located outside the second insulating side surface 24; in the embodiment, each of the first outer conductive segments 34 is connected to a power source 90. And being in the shape of a plate, and each of the first conductive units 30 is made of copper or the surface is coated with silver or gold.

Each of the second conductive units 40 has an electrical connection to the second conductive side 15 a second electrode portion 41, and a second outer conductive portion 42 electrically connected to the second electrode portion 41 and located outside the second insulating side surface 24 and insulated from the first outer conductive portion 34, such that the second The outer conductive segment 42 is located on the same side as the first outer conductive segment 34. In this embodiment, each of the second outer conductive segments 42 is connected to a power source 90 and has a plate shape, and each of the second conductive units 40 is Copper or gold is coated with gold or gold.

Accordingly, since the first outer conductive segments 34 of the first conductive unit 30 and the second outer conductive segments 42 of each of the second conductive units 40 are located on the same side except the second insulating side surface 24, The first conductive unit 30 has a pair of first inner conductive segments 33 that should be the heating portion 13 of the conductive layer 10. Therefore, by the configuration of the first and second conductive units 30, 40, the conductive layer 10 can be controlled to flow through. The current path is such that the current can be collected on the first conductive surface 11 of the conductive layer 10, especially concentrated on the surface of the heating portion 13, so that it is preheated from the room temperature to reach the working temperature, thereby lifting the mold. The purpose of the heating effect of the heating zone is to make the first outer conductive segments 34 of the first conductive unit 30 and the second outer conductive segments 42 of the second conductive units 40 relatively simple when the power source 90 is connected.

Referring to Figures 4 and 5, a mold having a heating device according to a second embodiment of the present invention is also composed of a conductive layer 10, an insulating layer 20, and a heating device, due to its configuration and efficacy. The second embodiment is different from the first embodiment in that the second conductive unit 40 has an adjustment section 43 electrically connected to the second outer conductive section 42. 43 is located in the insulating layer 20 and between the heating portion 13 and the first inner conductive portion 33, according to which the current flowing through the conductive layer 10 can be more controlled, so that the current can be more concentrated in the heating portion. 13 surface, so that it is preheated from room temperature to the working temperature, so as to achieve the purpose of improving the heating effect of the heating zone of the mold.

Referring to FIG. 6, a third embodiment of the present invention provides a heating device. The mold is also composed of a conductive layer 10, an insulating layer 20, and a heating device. Since its configuration and function are the same as those of the second embodiment, it will not be described again. The third embodiment differs in that the third embodiment is different. The adjusting portion 43 of the second conductive unit 40 is provided with a through hole 431 corresponding to the heating portion 13, and the optimal position of the through hole 431 is set according to the distance between the surface of the heating portion 13 and the adjusting portion 43, for example Referring to FIG. 6, at the first position A of the heating portion 13, the distance L1 between the surface of the heating portion 13 and the adjustment portion 43 is greater than the second position B of the heating portion 13 to the adjustment portion 43. The distance L2 between the two can be provided on the adjustment section 43 of the first position A of the heating portion 13, so that the path of the current circulation can be effectively controlled to achieve the purpose of improving the heating effect of the heating zone of the mold.

Referring to Figures 7 and 8, a mold having a heating device according to the fourth embodiment of the present invention is also composed of a conductive layer 10, an insulating layer 20, and a heating device, due to its configuration and efficacy. The second embodiment is different from the second embodiment in that the second conductive unit 40 further has a shielding segment 44 electrically connected to the second outer conductive segment 42. The shielding segment 44 is further omitted. It is located in the insulating layer 20 and between the first inner conductive segment 33 and the second insulating surface 24, so as to effectively control the path of the current circulation, thereby improving the heating effect of the heating zone of the mold. It is worth mentioning that the shielding segment 44 and the first conductive unit 30 are still insulated.

Referring to Figures 9 and 10, a mold having a heating device according to a fifth embodiment of the present invention is also composed of a conductive layer 10A, an insulating layer 20A, and a heating device, due to its configuration and efficacy. The same as the first embodiment, it will not be described again. The fifth embodiment is different in that the number of the first and second conductive units 30A, 40A of the heating device are both The plate has a plate shape, and the entire inner conductive portion 33A of the first conductive unit 30A has a uniform area corresponding to the heating portion 13A of the conductive layer 10A, thereby achieving the purpose of improving the heating effect of the heating zone of the mold.

Referring to Figures 11 and 12, a mold having a heating device according to a sixth embodiment of the present invention is also composed of a conductive layer 10A, an insulating layer 20A, and a heating device, due to its configuration and efficacy. The first embodiment is different from the first embodiment, and the sixth embodiment is different in that the number of the first and second conductive units 30A, 40A of the heating device is one plate and the first conductive The entire inner conductive portion 33A of the unit 30A has a whole area corresponding to the heating portion 13A of the conductive layer 10A, and the second conductive unit 40A further has an adjusting portion 43A electrically connected to the second outer conductive portion 42A. The adjusting portion 43A is located in the insulating layer 20A and between the heating portion 13A and the first inner conductive portion 33A. Accordingly, the current flowing through the conductive layer 10A can be more controlled, so that the current can be more concentrated. The surface of the heating portion 13A is preheated from room temperature to an operating temperature, thereby achieving the purpose of improving the heating effect of the heating zone of the mold.

Referring to Figures 13, 14, and 15, a mold having a heating device according to a seventh embodiment of the present invention is also composed of a conductive layer 10B, an insulating layer 20B, and a heating device, due to its configuration. The first embodiment is different from the first embodiment, and the seventh embodiment is different in that the first electrode portion 31B of the first conductive unit 30B has a first through hole 311B, and the first connecting portion 32B, The first inner conductive portion 33B and the first outer conductive portion 34B are tubular, and the first connecting portion 32B is inserted into the first through hole 311B, and the second electrode portion 41B of the second conductive unit 40B has a second through hole 411B. The second outer conductive portion 42B is tubular and inserted into the second through hole 411B and the first outer conductive portion 34B is insulated. The second conductive unit 40B is electrically connected to the second outer conductive portion. 42B is a tubular adjustment section 43B, the adjustment section 43B is located in the insulation layer 20B and is insulated from the first inner conductive section 33B, in order to achieve the purpose of improving the heating effect of the heating zone of the mold.

Referring to FIG. 16, a mold having a heating device according to the eighth embodiment of the present invention is also composed of a conductive layer 10, an insulating layer 20, and a heating device, because the configuration and the same effect are the same. The first embodiment is not described again. The eighth embodiment is different in that it further includes an upper mold 51 and a lower mold 52 that is adjacent to or away from the upper mold 51. The lower mold is electrically conductive. The layer 10 and the insulating layer 20 are composed, and the first conductive unit 30 and the second conductive unit 40 of the heating device are disposed on the lower mold 52.

Referring to FIG. 17, a mold having a heating device according to a ninth embodiment of the present invention is also composed of a conductive layer 10, an insulating layer 20, and a heating device, because its configuration and efficacy are the same. The first embodiment is not described again. The ninth embodiment is different in that it further includes an upper mold 51 and a lower mold 52 which is adjacent to or away from the upper mold 51, and the upper mold 51 is composed of the upper mold 51. The conductive layer 10 and the insulating layer 20 are formed, and the first conductive unit 30 and the second conductive unit 40 of the heating device are disposed on the upper mold 51, and the heating portion 13 of the conductive layer 10 is composed of the first conductive The surface 11 is convexly convex in a direction opposite to the second conductive surface 12.

In summary, the above embodiments and illustrations are only preferred embodiments of the present invention, and the scope of the present invention cannot be limited thereto, that is, the equal changes and modifications made by the patent application scope of the present invention are all It should be within the scope covered by this new patent.

10‧‧‧ Conductive layer

11‧‧‧First conductive surface

12‧‧‧Second conductive surface

13‧‧‧ heating department

14‧‧‧First conductive side

15‧‧‧Second conductive side

20‧‧‧Insulation

21‧‧‧First insulating surface

22‧‧‧Second insulation surface

23‧‧‧First insulated side

24‧‧‧Second insulation side

30‧‧‧First Conductive Unit

31‧‧‧First electrode section

32‧‧‧First connection

33‧‧‧First inner conductive section

34‧‧‧First outer conductive section

40‧‧‧Second conductive unit

41‧‧‧Second electrode section

42‧‧‧Second outer conductive section

90‧‧‧Power supply

Claims (10)

A mold having a heating device, comprising: a conductive layer having a first conductive surface, a second conductive surface opposite to the first conductive surface, a heating portion disposed on the first conductive surface, and a connection a first conductive side surface and a second conductive side surface of the first and second conductive surfaces; an insulating layer is insulatively bonded to the conductive layer, and has a first insulating surface bonded to the second conductive surface, and a reverse direction a second insulating surface of the first insulating surface, and first and second insulating sides connected to the first and second insulating surfaces and respectively on the same side of the first and second conductive sides; a heating device comprising at least one first a conductive unit and at least one second conductive unit, wherein: the first conductive unit has a first electrode portion electrically connected to the first conductive side, and is electrically connected to the first electrode portion and insulated from the conductive layer a first connecting portion, a first inner conductive portion electrically connected to the first connecting portion and located in the insulating layer and corresponding to the heating portion, and an electrical connection between the first inner conductive portion and the second insulating side Other than The second conductive unit has a second electrode portion electrically connected to the second conductive side, and a second electrode portion electrically connected to the second electrode portion and located outside the second insulating side and the first conductive portion The second outer conductive segment insulated by the outer conductive segment. The mold having a heating device according to claim 1, wherein the heating portion of the conductive layer is recessed in a groove shape from the first conductive surface toward the second conductive surface. A mold having a heating device according to claim 2, further comprising an upper mold and a lower mold adjacent to or away from the upper mold, the lower mold being composed of the conductive layer and the insulating layer . The mold having a heating device according to claim 1, wherein the heating portion of the conductive layer is convexly convex from the first conductive surface in a direction opposite to the second conductive surface. A mold having a heating device according to claim 4, further comprising an upper mold and a lower mold adjacent to or away from the upper mold, the upper mold being composed of the conductive layer and the insulating layer . The mold of the heating device of claim 1, wherein the second conductive unit further has an adjustment section electrically connected to the second outer conductive section, the adjustment section being located in the insulation layer and located in the heating Between the portion and the first inner conductive segment. A mold having a heating device according to claim 6, wherein the adjustment section of the second conductive unit is provided with a perforation corresponding to the heating portion. The mold having a heating device according to claim 6, wherein the second conductive unit further has a shielding segment electrically connected to the second outer conductive segment, the shielding segment being located in the insulating layer and located at the first An inner conductive segment and the second insulating surface. The mold having a heating device according to claim 1, wherein the first and second conductive units are in a plate shape. The mold having a heating device according to claim 1, wherein the first electrode portion of the first conductive unit has a first through hole, the first connecting portion, the first inner conductive portion and the first outer conductive portion. Is tubular, and the first connecting portion is inserted into the first through hole, the second electrode portion of the second conductive unit has a second through hole, and the second outer conductive portion is tubular and inserted into the second through hole and Insulating the first outer conductive segment, the second conductive unit further has a tubular adjustment section electrically connected to the second outer conductive segment, the adjusting segment is located in the insulating layer and the first sleeve is insulated Inner conductive section.