TW202231437A - Radio frequency plate heating mold and mold heating method - Google Patents

Abstract

A radio frequency plate heating mold and a mold heating method are provided to solve the problem of uneven current distribution in the conventional radio frequency heating mold. They include: a lower mold set with a lower conductive plate, the lower conductive plate is in the shape of a flat plate, the lower insulating part is combined with the lower conductive plate, and the lower molding die is located above the lower insulating part; and an upper mold set with An upper conductive plate, the upper conductive plate is in the shape of a flat plate, an upper insulating part is combined with the upper conductive plate, and an upper molding die is located below the upper insulating part, and the upper molding die moves up and down against to the lower molding die.

Description

High frequency flat plate heating mold and mold heating method

The invention relates to a heating mould and a mould heating method, in particular to a high frequency flat plate heating mould and a mould heating method.

Generally, when pressing a thermoplastic material, in order to make the thermoplastic material form a shapeable state by the heat of the mold, the mold must be heated to a predetermined temperature before pressing. With the advantages of precision and convenient control, it has become a widely used mold heating method.

However, high-frequency heating molds that generally use multi-layer coils to transmit high-frequency energy are prone to uneven current distribution, resulting in poor temperature uniformity of the mold, which in turn affects the processing quality, and even causes the mold to locally generate excessive temperature. and oxidative damage.

In view of this, it is still necessary to improve the conventional high-frequency heating mold and mold heating method.

In order to solve the above problems, the purpose of the present invention is to provide a high-frequency flat plate heating mold, which can make the mold core evenly heated.

Another object of the present invention is to provide a mold heating method, which can uniformly heat the mold core.

The directional or similar terms used throughout this disclosure, such as "front", "back", "left", "right", "top (top)", "bottom (bottom)", "inside", "outside" , "side surface", etc., mainly refer to the directions of the attached drawings, each directionality or its similar terms are only used to assist the description and understanding of the various embodiments of the present invention, and are not intended to limit the present invention.

The use of the quantifier "a" or "an" for the elements and components described throughout the present invention is only for convenience and provides a general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and a single The concept of also includes the plural case unless it is obvious that it means otherwise.

Similar terms such as "combined", "combined" or "assembled" mentioned in the whole text of the present invention mainly include the components that can be separated without destroying the components after the connection, or the components can not be separated after being connected, which are common knowledge in the field. It can be selected according to the material of the components to be connected or the assembly requirements.

The high-frequency flat plate heating mold of the present invention comprises: a lower mold set with a lower conductive member, the lower conductive member is in the shape of a flat plate, a lower insulating member is combined with the lower conductive member, and a lower mold core is located above the lower insulating member ; And an upper die set, which has an upper conductive member, the upper conductive member is in the shape of a flat plate, an upper insulating member is combined with the upper conductive member, and an upper mold core is located below the upper insulating member, the upper mold core The lower die core is raised and lowered relative to the lower die.

The molding die heating method of the present invention uses the above-mentioned high-frequency flat plate heating die, comprising: applying a high-frequency current to a flat-shaped lower conductive member, so as to utilize the high-frequency energy to heat up the lower mold core; A cycle current is applied to an upper conductive member in the shape of a flat plate, so as to utilize the high cycle energy to heat up an upper die.

Accordingly, the high-frequency flat plate heating mold and the mold heating method of the present invention can make the high-frequency current evenly distributed by the flat-shaped lower conductive member and the upper conductive member, so that the lower mold core and the upper conductive member can be uniformly distributed. The temperature of each part of the upper mold core is evenly heated, which can improve the temperature uniformity of the upper mold core and the lower mold core, and can also avoid local over-temperature and oxidation, thereby achieving the effect of improving the durability of the mold core.

Wherein, the lower conductive member is electrically connected with the upper conductive member. In this way, current can be introduced into the lower conductive member and the upper conductive member from the same power source, which has the effect of simplifying the circuit and control procedure.

Wherein, the lower conductive member is electrically detachably connected to the upper conductive member through a wire. When the upper mold set rises to a standby position, the lower conductive member and the upper conductive member are in an open circuit state. When descending to a heating position, the lower conductive member and the upper conductive member are in a connected state. In this way, the conduction state of the current loop can be changed by controlling the lifting and lowering of the upper die set, which has the effect of improving the convenience of control.

Wherein, the lower die set may have a lower non-magnetic conductive part, the lower non-magnetic conductive part is combined with the lower insulating part, and the lower mold core is combined with the lower non-magnetic conductive part. In this way, the lower non-magnetic conductive member will not generate heat due to the induction of the high-frequency magnetic field, which has the effect of transferring energy to the lower mold core in a concentrated manner.

Wherein, the upper mold set may have an upper non-magnetic conductive member, the upper non-magnetic conductive member is combined with the upper insulating member, and the upper mold core is combined with the upper non-magnetic conductive member. In this way, the upper non-magnetic conductive element will not generate heat due to the induction of the high-frequency magnetic field, which has the effect of transferring energy to the upper mold core in a concentrated manner.

Wherein, the lower conductive member may have an opposite first surface and a second surface, the first surface is bonded to an insulating substrate, and the lower insulating member is bonded to the second surface. In this way, the current only flows through the lower conductive member, which has the effect of avoiding affecting other components of the lower mold set.

Wherein, the upper conductive member may have an opposite first surface and a second surface, the first surface is bonded to an insulating substrate, and the upper insulating member is bonded to the second surface. In this way, the current only flows through the upper conductive member, which has the effect of avoiding affecting other components of the upper die set.

Wherein, the lower mold core has a plate-shaped lower molding portion, and the thickness of the lower molding portion is substantially uniform, and/or the upper mold core has a plate-shaped upper molding portion, and the thickness of the upper molding portion is substantially uniform. In this way, the lower molding part and/or the upper molding part can induce heat evenly, which has the effect of uniform temperature distribution.

Wherein, the power of the high-frequency wave can be 20 KW-100 KW, and the frequency of the high-frequency wave is 5 KHz-100 KHz. In this way, the system has the effect of adjusting the high frequency energy.

Wherein, the heating rate of the lower mold core and/or the upper mold core may be increased by 1°C to 4°C per second. In this way, the lower molding portion and/or the upper molding portion can be heated evenly and rapidly, which has the effect of improving temperature uniformity and mold operation efficiency.

Wherein, the distance between the lower conductive member and the lower mold core may be 3-50 mm, and/or the distance between the upper conductive member and the upper mold core may be 3-50 mm. In this way, the strong high-frequency energy can be induced, which has the effect of improving the energy transfer efficiency.

In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings:

Please refer to FIG. 1 , which is a preferred embodiment of the high-frequency flat-plate heating mold of the present invention, which includes a lower mold group 1 and an upper mold group 2 , and the upper mold group 2 can operate relative to the lower mold group 1 . Lifting movement.

The lower die set 1 has a lower conductive member 11 , which is in the shape of a flat plate and can be made of materials such as aluminum, copper, gold or silver with good electrical conductivity. In this way, the lower conductive member 11 is Can be used to conduct a high-frequency current, and has a more uniform current distribution. Preferably, the lower conductive member 11 may have a first surface 111 and a second surface 112 opposite to each other, and the first surface 111 may be combined with an insulating substrate 12 to ensure that current only flows through the lower conductive member 11 . It will not affect other components of the lower die set 1 . The lower mold set 1 further has a lower insulating member 13 , and the lower insulating member 13 is combined with the second surface 112 . The lower insulating member 13 can be used to further ensure that the current only flows through the lower conductive member 11 . The lower mold set 1 further has a lower mold core 14, the lower mold core 14 is located above the lower insulating member 13, the material of the lower mold core 14 can be steel with magnetic conductivity, and the lower mold core 14 can be subjected to the The magnetic field of the high frequency current induces the temperature rise. The lower mold core 14 has a conventional structure such as a cavity or a punch with a predetermined shape, so as to mold the thermoplastic material into a predetermined shape, which can be understood by those in the art, and the present invention will not be repeated here. In this embodiment, The lower mold core 14 may have a plate-shaped lower molding portion 141 , and the lower molding portion 141 preferably has a substantially uniform thickness, so that heat can be induced evenly to make the temperature evenly distributed in the lower molding portion 141 .

Based on the above, preferably, the lower mold set 1 can further have a lower non-magnetic conductive member 15, the lower non-magnetic conductive member 15 can be combined with the lower insulating member 13, and the lower mold core 14 can be combined with the lower mold core 14. Lower non-magnetic conductive member 15 . The lower non-magnetic-conductive member 15 can be aluminum with both high mechanical strength and low magnetic permeability, so that the lower non-magnetic-conductive member 15 can stably support the lower mold core 14, and will not be affected by the induction of the high-frequency magnetic field. Heat generation has the effect of concentrating and transferring energy to the lower die core 14 .

The upper die set 2 has substantially the same structure as the lower die set 1, and has an upper conductive member 21. Preferably, the upper conductive member 21 may also have a first surface 211 and a second surface 212 opposite to each other. The first surface 211 may be bonded to an insulating substrate 22 , and an upper insulating member 23 may be bonded to the second surface 212 . The upper mold set 2 has an upper mold core 24, and the upper mold core 24 is located below the upper insulating member 23. The material of the upper mold core 24 can also be steel with magnetic conductivity. In this embodiment, the upper mold core 24 is The mold core 24 may have a plate-shaped upper molding portion 241, and the upper molding portion 241 preferably has a substantially uniform thickness. The upper die set 2 can also have an upper non-magnetic conductive member 25, the upper non-magnetic conductive member 25 can be combined with the upper insulating member 23, the upper mold core 24 can be combined with the upper non-magnetic conductive member 25, and the upper non-magnetic conductive member 25 can be combined with the upper non-magnetic conductive member 25. The non-magnetic conductive member 24 can also be aluminum with low magnetic permeability. The upper die set 2 moves up and down relative to the lower die set 1 to press the thermoplastic material to form.

The lower conductive member 11 and the upper conductive member 21 may be electrically connected to belong to the same current loop, or may belong to two current loops respectively, which is not limited in the present invention. In this embodiment, the lower conductive member 11 can be A wire E is electrically connected to the upper conductive member 21, so that the lower conductive member 11 and the upper conductive member 21 belong to the same current loop, whereby the same power supply can introduce current, which can simplify the circuit and control procedures.

Preferably, when the upper die set 2 is raised to a standby position, the lower conductive member 11 and the upper conductive member 21 can be in an open circuit state, and when the upper die set 2 is lowered to a heating position, the lower conductive member The conduction state of the current loop can be changed by controlling the lifting and lowering of the upper die set 2, which has the effect of improving the convenience of control. In detail, please refer to Fig. 2, when the upper die set 2 rises to the standby position, the wire E is only connected to the upper conductive member 21, and is disconnected from the lower conductive member 11, so that the current cannot flow, Thereby, the consumption of electric energy can be stopped. Referring to FIG. 3, when the upper die set 2 is lowered to the heating position, the wire E can connect the upper conductive member 21 and the lower conductive member 11 at the same time, and the current can flow.

Referring to FIG. 1 again, the high-frequency flat plate heating mold of the present invention can perform a mold heating method, which includes: applying a high-frequency current to the lower conductive member 11 and the upper conductive member 21, and the magnetic field is induced to make The lower mold core 14 and the upper mold core 24 are heated.

Specifically, the lower conductive member 11 and the upper conductive member 21 can respectively heat up the lower mold core 14 and the upper mold core 24 in a manner of transmitting the energy of the high-frequency current. As mentioned above, since the lower conductive member 11 and the upper conductive member 21 are both flat-shaped, they have a relatively uniform current distribution. Relatively, the energy of the high-frequency current can also be uniformly transmitted to the lower mold core. 14 and the upper mold core 24, so that each part of the lower mold core 14 and the upper mold core 24 can be heated evenly, which can improve the temperature uniformity of the upper mold core 14 and the lower mold core 24.

The user can use different high-frequency powers and frequencies depending on the heating target temperature, the thickness and material of the lower mold core 14 and the upper mold core 24 . In this embodiment, the power of the high-frequency wave can preferably be 20 KW-100 KW, and the frequency of the high-frequency wave can preferably be 5 KHz-100 KHz. In this way, the user can select the power and frequency of the high-frequency wave. The system has the function of adjusting the high frequency energy.

In addition, the heating rate of the lower mold core 14 is preferably 1°C to 4°C per second, and the upper mold core 24 can also be heated at this rate. In this way, heat can be generated in the lower molding portion 141 and/or the upper molding portion. 241 conducts uniformly, so that the lower molding part 141 or/and the upper molding part 241 can be heated evenly and rapidly, which has the effect of improving temperature uniformity and mold operation efficiency.

Preferably, the lower conductive member 11 and the lower mold core 14 can be heated within a distance range, and the distance range is preferably 3-50 mm, and the upper conductive member 21 and the upper mold core 24 can also be within this distance. The temperature is increased within the range, so that the lower mold core 14 or/and the upper mold core 24 can induce the strong high-frequency current magnetic field, which has the effect of improving the energy transfer efficiency.

When the traditional metal coil is used to transmit high-frequency current to heat up the mold core, the surface of the mold core is measured, and the maximum temperature difference is greater than 50 °C. After that, the five positions on the surface of the mold core were measured to obtain 262 ℃, 252 ℃, 270 ℃, 251 ℃ and 258 ℃, of which the maximum temperature difference was only 19 ℃. The method can indeed reduce the temperature difference between each part of the upper die core and the lower die core, and can also avoid local over-temperature and oxidation.

To sum up, the high-frequency flat plate heating mold and the mold heating method of the present invention can make the high-frequency current evenly distributed by the flat-shaped lower conductive member and the upper conductive member, so that the lower mold can be uniformly distributed. The temperature of the core and each part of the upper mold core is evenly heated, which can improve the temperature uniformity of the upper mold core and the lower mold core, and can also avoid local over-temperature and oxidation, thereby improving the durability of the mold core. effect. In addition, the lower molding portion and the upper molding portion may be in the form of plates with uniform thickness, which has the effect of further forming a uniform temperature distribution. In addition, the conduction state of the current loop can be changed by controlling the lifting and lowering of the upper die set, which has the effect of improving the convenience of control. In addition, the lower conductive member and the lower mold core, or/and the upper conductive member and the upper mold core can be heated at a distance of 3-50 mm respectively, which has the effect of improving the energy conduction efficiency.

Although the present invention has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the patent application attached hereto.

﹝this invention﹞ 1: Lower die set 11: Lower conductive parts 111: First surface 112: Second Surface 12: Insulating substrate 13: Lower insulation 14: Lower die 141: Lower forming part 15: Lower non-magnetic conductive parts 2: Upper die set 21: Upper conductive parts 211: First Surface 212: Second Surface 22: Insulating substrate 23: Upper insulation 24: Upper Mourin 241: Upper forming part 25: Upper non-magnetic conductive part E: wire

[Fig. 1] A side view of the mold according to the preferred embodiment of the present invention. [FIG. 2] The current loop open-circuit state diagram of the preferred embodiment of the present invention. [FIG. 3] The current loop conduction state diagram of the preferred embodiment of the present invention.

1: Lower die set

11: Lower conductive parts

111: First surface

112: Second Surface

12: Insulating substrate

13: Lower insulation

14: Lower die

141: Lower forming part

15: Lower non-magnetic conductive parts

2: Upper die set

21: Upper conductive parts

211: First Surface

212: Second Surface

22: Insulating substrate

23: Upper insulation

24: Upper Mourin

241: Upper forming part

25: Upper non-magnetic conductive part

E: wire

Claims (12)

A high-frequency flat plate heating mold, comprising: A lower die set has a lower conductive member, the lower conductive member is in the shape of a flat plate, a lower insulating member is combined with the lower conductive member, and a lower mold core is located above the lower insulating member; and An upper mold set has an upper conductive member, the upper conductive member is in the shape of a flat plate, an upper insulating member is combined with the upper conductive member, and an upper mold core is located below the upper insulating member, and the upper mold core is opposite to the upper conductive member. The lower die core is raised and lowered. The high-frequency flat-plate heating mold of claim 1, wherein the lower conductive member is electrically connected to the upper conductive member. The high-frequency flat-plate heating mold of claim 1, wherein the lower conductive member is electrically detachably connected to the upper conductive member through a wire, and when the upper mold set rises to a standby position, the lower conductive member and the upper conductive member The conductive member is in an open circuit state, and when the upper die set is lowered to a heating position, the lower conductive member and the upper conductive member are in a connected state. The high-frequency flat-plate heating mold of claim 1, wherein the lower mold set has a lower non-magnetic-conductive part, the lower non-magnetic-conductive part is combined with the lower insulating part, and the lower mold core is combined with the lower non-magnetic-conductive part. The high-frequency flat-plate heating mold of claim 1, wherein the upper mold set has an upper non-magnetic conductive member, the upper non-magnetic conductive member is coupled to the upper insulating member, and the upper mold core is coupled to the upper non-magnetic conductive member . The high-frequency flat plate heating mold of claim 1, wherein the lower conductive member has a first surface and a second surface opposite to each other, the first surface is bonded to an insulating substrate, and the lower insulating member is bonded to the second surface . The high-frequency flat plate heating mold of claim 1, wherein the upper conductive member has a first surface and a second surface opposite to each other, the first surface is bonded to an insulating substrate, and the upper insulating member is bonded to the second surface . The high-frequency flat-plate heating mold of claim 1, wherein the lower mold core has a plate-shaped lower molding portion, the thickness of the lower molding portion is approximately equal, and/or the upper mold core has a plate-shaped upper molding portion part, the thickness of the upper molding part is approximately equal. A mold heating method, comprising: applying a high-frequency current to the flat bottom conductive member, so as to utilize the high-frequency energy to heat up the bottom mold core; and A high-frequency current is applied to a flat upper conductive member, so as to utilize the high-frequency energy to heat up an upper mold core. The mold heating method of claim 9, wherein the power of the high-frequency wave is 20 KW-100 KW, and the frequency of the high-frequency wave is 5 KHz-100 KHz. The mold heating method of claim 9, wherein the heating rate of the lower mold core and/or the upper mold core is 1°C to 4°C per second. The mold heating method of claim 9, wherein the distance between the lower conductive member and the lower mold core is 3-50 mm, and/or the distance between the upper conductive member and the upper mold core is 3-50 mm.

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