TWM481236U - Double-sided adhesive tape used in panel manufacturing process - Google Patents

Description

Double-sided tape for panel manufacturing

This creative department is related to the field of panel manufacturing, in particular to a double-sided tape for panel manufacturing, which is used for bonding an optical substrate and a carrier to facilitate the back-end process, and can be easily achieved after being irradiated with ultraviolet light. The purpose and effect of tearing off.

Generally, in the manufacturing process of the panel, a plurality of carriers are used to carry the layers of the process to be processed. For example, in the process of manufacturing a flexible substrate, it is often used for processing or handling based on a carrier plate made of glass or plastic. In general, the surface of the flexible substrate is mostly coated with a silicone adhesive layer for attaching the carrier to facilitate the multilayer substrate process of the flexible substrate, for example, including a Color filter, a TFT array, a Touch sensor, and the like. This is the so-called after-stage process. In addition, the main purpose of using the carrier plate is to use it as a carrier during the post-stage process, so as to avoid the problem of chipping or breakage of various optical substrates during transportation or back-end processes, such as tearing.

Please refer to the "Picture 1" for the process diagram of the conventional flexible substrate. As shown in the figure, the figure shows some processes in the flexible substrate process, in order to facilitate the description of the lamination and separation of the multilayer structure. As for the detailed process of the soft substrate, the focus of the application is not to be repeated here.

In order to facilitate the processing on the production line and the convenience of transportation in the factory, the flexible substrate of the multi-layer structure is mainly produced by an adhesive layer 12 and an optical substrate 13 is produced or combined. It is adhered to the surface of a carrier 11, and the carrier 11 is used as an object for carrying, and then the process of the multilayer structure 14 is performed. The multilayer structure 14 showing the surface of the optical substrate 13 in the figure may be provided with a color filter, a TFT array, a touch sensor, and the like.

When the multilayer structure 14 is formed into a color filter, a TFT array, a touch sensor, or the like, the optical substrate 13 and the carrier 11 can be used. After separation, a plastic film 15 is attached to the surface of the adhesive layer 12 on the bottom of the optical substrate 13, for example, by PET, to avoid the micro-adhesive adsorption of the adhesive layer 12.

Therefore, when the adhesive layer 12 is bonded to the optical substrate 13 and the carrier 11, the silicone adhesive layer 12 is directly coated, and the organic adhesive layer 12 itself contains an organic solvent, which may easily cause atomization of some of the film. (corrosion). Furthermore, when the adhesive layer 12 is applied or baked, in addition to the operation in a clean room with high cleanliness requirements, the working temperature during baking needs to be at least 150 ° C to be dense. Sexual phenomena occur; on the other hand, at this high temperature, a material with a high coefficient of thermal expansion may be warped or bent, which is quite difficult for process control.

At the same time, in order to achieve the above-mentioned process environmental control, the equipment cost will be greatly increased, and the production cost will indirectly increase. Finally, when the optical substrate 13 and the carrier 11 are to be separated, the characteristics of the adhesive layer are required to provide a large external force from the carrier 11 and to be removed, but during the tearing process, It may cause damage to other layers of structure such as brittleness and cracking.

In view of the above-mentioned deficiencies, this creation uses a new double-sided tape for panel manufacturing to provide good adhesion to any material. Also, using heat and activation energy The adhesive layer of the chemical property can be easily peeled off by, for example, ultraviolet light in the tearing operation, without causing brittle cracking of layers such as ITO, and the material loss rate is greatly reduced.

One of the aims of the present invention is to provide a double-sided tape for a panel process, which is capable of effectively providing a double-sided tape with better adhesion and adhesion during the process of the panel process for using an optical substrate. It can be effectively bonded to a carrier plate, and at the same time, it can be easily removed by first irradiating ultraviolet light in the separation operation without causing other cracks such as ITO layer. At the same time, after the tearing off, the powder layer can be prevented from being adsorbed due to the micro-viscosity phenomenon, thereby affecting the yield of the process.

In order to achieve the above object, the double-sided tape for the panel process of the present invention is for bonding an optical substrate and a carrier to each other for a back-end process, comprising: a substrate; a subtractive layer comprising a prepolymer a diluent monomer and a photoinitiator having heat and activation energy curing properties disposed on one side of the substrate; and an adhesive layer disposed on the other side of the substrate.

The selection of the substrate may be selected from one of PET (polyethylene terephthalate), PEN (polyethylene naphthalate), or PES (polyether sulfone). The silicone adhesive layer is a polyoxyalkylene structure pressure sensitive adhesive. The prepolymerization system is an acrylate structure pressure sensitive adhesive. In addition, the acrylate structure pressure sensitive adhesive may further be one of epoxy acrylate, polyester acrylate, and urethane acrylate. Of course, if it is convenient to use and protect the orientation of the double-sided tape, the double-sided tape for the panel process may further comprise a two-release film, which is respectively disposed on the surface of the adhesion-reducing layer and the adhesive layer for the adhesive layer. The release film can be easily adhered to the substrate to be adhered when it is to be used.

The effect of this creation lies in the current soft board design, in order to meet the requirements of light and thin, it is necessary to fix the optical substrate, for example, on a solid carrier board during the process. After the process of each layer structure, the optical substrate is removed from the carrier. The author uses a double-sided tape to bond one side of the optical substrate to the side of the optical substrate, and uses a reduced adhesion layer having heat and activation energy curing characteristics, and the other side bonded to the carrier plate uses a low adhesion force. Adhesive. In the tearing operation, it can be easily peeled off by, for example, ultraviolet light, without causing brittle cracking of layers such as ITO, greatly reducing the wear rate of the material, and there is no residual glue phenomenon. produce.

[Practical]

11‧‧‧ Carrier Board

12‧‧‧矽 adhesive layer

13‧‧‧Optical substrate

14‧‧‧Multilayer structure

15‧‧‧Plastic film

[This creation]

S20~S24‧‧‧Process steps

30‧‧‧Substrate

31‧‧‧ Viscosity

32‧‧‧矽 adhesive layer

33‧‧‧ Carrier Board

34‧‧‧Optical substrate

35‧‧‧Multilayer structure

36‧‧‧ release film

Fig. 1 is a schematic view showing the process of a conventional flexible substrate.

Figure 2 is a schematic view showing the structure of a preferred embodiment of the present invention.

Figure 3 is a schematic diagram of the process for implementing the process using this creation.

Fig. 4A is a schematic view showing the structure of the adhesive optical substrate and the carrier.

Figure 4B is a schematic view showing the structure after bonding the optical substrate and the carrier and performing the back-end process.

Fig. 4C is a schematic view showing the separation structure after the ultraviolet light is irradiated by the process structure of the present invention.

Fig. 5 is a schematic view showing the structure after the release film is adhered by the present invention.

In order for your review board to have a clear understanding of the content of this creation, please use the following instructions to match the drawings.

Please refer to FIG. 1 , which is a schematic structural view of a preferred embodiment of the present invention. As shown in the figure, a double-sided tape for a panel process proposed by the present invention comprises a substrate 30, a reduced adhesion layer 31 and a silicone adhesive layer 32. The substrate 30 may be selected from one of PET (polyethylene terephthalate), PEN (polyethylene naphthalate), or PES (polyether sulfone), and the substrate 30 may be in the form of a roll or a sheet. Double-sided adhesive for general industrial use, The main system can be divided into two major categories: acrylic adhesive and rubber adhesive. In these two categories, both the substrate and the substrate-free can be distinguished. The so-called substrate is to add a layer of structure to the glue to enhance the amount and strength of the glue. No substrate means only pure gum, the main purpose is to ensure the transparency of the double-sided adhesive as a whole. In addition, the type and thickness of the gel will also affect its adhesive properties.

In this regard, the author of this creation is a type of double-sided tape with a base material for acrylic. One of the two sides of the substrate 30 is a thinned layer 31, and the other side is an adhesive layer 32. The structure of the adhesion reducing layer 31 is composed of a prepolymer, a diluent monomer and a photoinitiator. The polymerization system is the main material body to determine the main performance of the cured material. The proportion is often more than 40% by weight of ≧; the structure is acrylate structure pressure sensitive adhesive, for example, one of epoxy acrylate, polyester acrylate, urethane acrylate as the material. The function of the diluted monomer is to adjust the viscosity, and participate in the reaction to affect the properties of the cured film. The proportion often accounts for 5~50wt% or more; the type can be selected from monofunctional, difunctional, or polyfunctional species. The main function of the photoinitiator is to attract ultraviolet light and initiate polymerization. The proportion often accounts for 10% by weight of ≦; the type has a radical type or a cationic type. Of course, for different purposes, some other materials such as defoamers, leveling agents, stabilizers and the like may be added to the adhesion reducing layer 31.

In summary, the reduced adhesion layer 31 of the present invention has thermal and activation energy curing characteristics, that is, when irradiated with ultraviolet light, the photoinitiator absorbs ultraviolet light energy and causes a chain chemical reaction. For example, the effect of curing by diluting the diluted monomer to achieve curing is achieved. As for the silicone adhesive layer 32 coated on the other side of the substrate 30, a polyoxymethane structure pressure sensitive adhesive is used as the material. Since the adhesive layer 32 is only adhered to one side of the carrier 11, it is only required to be implemented with a low adhesion material, and there is no need to worry about the existence of the optical substrate 13 Any damage or damage caused by tearing off.

The following is an experimental analysis data based on the physical properties, retention and initial adhesive properties of the double-sided tape of the present invention, which is used to illustrate that the double-sided tape of the present invention can be implemented and different from the prior art. Adhesive properties.

The physical property detection part was determined experimentally for the 180 degree adhesion. The condition is SUS (stainless steel), Glass (glass) and PET as the composite; SUS surface roughness is 280 water sandpaper, longitudinal rubbing 60 times, surface roughness 0.05mm; double-sided tape width 25mm; traction material is 25um PET; the bonding condition is manually applied by 2kg roller back and forth, the bonding speed is 300mm/min; the bonding time is 24 hours after bonding; the test condition is 23°± 5 ° C, 60% RH ± 20%; detection speed is a tensile speed of 300 mm / min. The experimental data is as follows:

It can be seen from the above experiment that after the ultraviolet light is irradiated, the viscosity of the reduced-viscosity layer 31 after solidification is indeed greatly reduced, which is favorable for the execution of the tearing operation.

The holding force detecting part is made of SUS (304) as a composite; the surface roughness of SUS is 280 water sanding paper, longitudinal rubbing 60 times, surface roughness 0.05 mm; double-sided tape bonding area is 25 m* 25mm; the fitting condition is manually applied by a 2kg roller back and forth, the bonding speed is 300mm/min; the load is 1kg; the test conditions and time are 23°±5°C, 24 hours and 80°±1°C, respectively. 1 hour. The experimental data is as follows:

From the above experiments, it is known that there is still a relatively good adhesion/retention force regardless of the high temperature or room temperature.

The initial adhesion test part is characterized by a tape width of 25 mm; the test condition is 23 ° ± 5 ° C, 60% RH ± 20%; the detection angle is 30 °; the steel ball material is according to the steel specified in JIS G 4805, 1/32~32/32 size steel ball; steel ball number (N): N=(32/25.4)*D (D is the diameter of the steel ball, the unit is mm). The experimental data is as follows:

In summary, no matter the adhesion, retention and initial adhesion test, it can be seen from the experimental data that the double-sided tape of the creation can provide the better physical properties required for the panel process.

Please refer to the 3rd and 4th to 4th drawings together, which is a schematic diagram of the process for implementing the process and the schematic diagram of the structure of the bonded optical substrate and the carrier, the structure diagram after the post-process and the process structure are irradiated with ultraviolet light. Schematic diagram of the separation structure after light. As shown in Fig. 2, an optical substrate 34 and a carrier 33 are first provided (S20), and then the optical substrate 34 and the carrier 33 are bonded by the double-sided tape of the present invention (S21). Structurally, as shown in FIG. 4A, the corresponding surface is adhered to the optical substrate 34 by the adhesion-reducing layer 31; the adhesive layer 32 is adhered to the carrier 33. Then, a multilayer structure 35 is formed on the optical substrate 34 on the optical substrate 34 (S22), for example, a color filter, a TFT array, and a touch. A touch sensor or the like is structurally as shown in FIG. 4B. Finally, the double-sided tape is irradiated with ultraviolet light to cure and reduce the adhesion, so as to facilitate the subsequent separation of the double-sided tape from the optical substrate 34 and the carrier 33 (S23) (S24), and the structure is as follows. Figure 4C shows.

Please refer to Figure 5 again, which is a schematic diagram of the structure after bonding the release film. In order to facilitate the use and protect the orientation of the double-sided tape, the double-sided tape for the panel process may further comprise a release film 36 disposed on the surface of the adhesion-reducing layer 31 and the adhesive layer 32, respectively. The release film 36 can be easily adhered to the substrate to be adhered when it is to be used. Further, the release film 36 can be made of a release film, a fluorine release film, or a release paper. At the same time, according to different needs, the selection of the different types of force can also be used for selection, such as ultra-light release (1~3gf/25mm), light release (3~5gf/25mm), medium release (5~8gf) /25mm), heavy release type (8~12gf/25mm), and overweight release type (12gf/25mm or more) for its selection.

The effect of this creation lies in the current soft board design, in order to meet the requirements of light and thin, it is necessary to fix the optical substrate, for example, on a solid carrier board during the process. After the process of each layer structure, the optical substrate is removed from the carrier. The author uses a double-sided tape to bond one side of the optical substrate to the side of the optical substrate, and uses a reduced adhesion layer having heat and activation energy curing characteristics, and the other side bonded to the carrier plate uses a low adhesion force. Adhesive. In the tearing operation, it can be easily peeled off by, for example, ultraviolet light, without causing brittle cracking of layers such as ITO, greatly reducing the wear rate of the material, and there is no residual glue phenomenon. produce.

However, the above descriptions are only for the preferred embodiment of the present invention and are not intended to limit the scope of the present invention; therefore, the equivalent changes and modifications made without departing from the spirit and scope of the present invention should be Within the scope of this creation's patent.

30‧‧‧Substrate

31‧‧‧ Viscosity

32‧‧‧矽 adhesive layer

Claims (6)

A double-sided tape for a panel process for bonding an optical substrate and a carrier to facilitate a back-end process, comprising: a substrate; a subtractive layer comprising a prepolymer, a diluent monomer and a a photoinitiator having heat and activation energy curing properties disposed on one side of the substrate; and an adhesive layer disposed on the other side of the substrate. The double-sided tape according to claim 1, wherein the substrate is one selected from the group consisting of PET (polyethylene terephthalate), PEN (polyethylene naphthalate), and PES (polyethersulfone). The double-sided tape of claim 2, wherein the silicone adhesive layer is a polyoxyalkylene structure pressure sensitive adhesive. The double-sided tape according to any one of claims 1 to 3, wherein the prepolymerization system is an acrylate structure pressure sensitive adhesive. The double-sided tape of claim 4, wherein the acrylate structure pressure sensitive adhesive is one of epoxy acrylate, polyester acrylate, and urethane acrylate. The double-sided tape according to claim 4, further comprising: a two-parting film disposed on the surface of the adhesive layer and the adhesive layer.