TWM481119U - Mold and positioning member thereof - Google Patents

Description

Mold and its positioning parts

The present invention relates to a mold, and more particularly to a mold and a positioning member thereof for use in a circuit board process.

The board process typically includes the steps of blanking, drilling, making lines, applying a solder mask, and forming a cut. In the circuit board manufacturing process, for example, before the die blanking of the circuit board, the circuit board needs to be processed by the mold.

For example, a mold used to die cut a circuit board typically has an upper mold and a lower mold. Before punching, the circuit board is placed on the lower mold, and the circuit board is positioned, and then the upper mold is used to punch or punch the circuit board. Further, the lower mold is provided with a plurality of positioning elements, and the circuit board is provided with a plurality of positioning holes. When the circuit board is positioned, the positioning holes of the circuit board are respectively placed on the corresponding positioning components to achieve the purpose of positioning the circuit board. In the board process, the accuracy of the above positioning process may have a certain degree of impact on the board yield.

The present invention provides a mold and its positioning member, wherein the positioning member is used to position the circuit board. When the positioning member is inserted into the positioning hole of the template, the positioning member abuts against the template by the pin head to prevent the pin head of the positioning member from being depressed into the positioning hole by an external force.

One embodiment of the present invention provides a positioning member for positioning a circuit board on a template in a circuit board process, the template having at least one positioning hole. The positioning member includes a pin head and a pin. The pin head is bullet-shaped and the pin head has a bottom end face. One end of the pin is connected to the bottom end surface, and when the pin is inserted into the positioning hole, the bottom end surface abuts against the surface of the template to suspend the positioning member in the positioning hole.

Another embodiment of the present invention provides a mold for processing a circuit board in a circuit board process. The mold includes a template and a positioning member. The template has at least one locating hole and is used to place a circuit board. The positioning member is used to insert a positioning hole to position the circuit board. The positioning member includes a pin head and a pin. The pin head has a bullet shape and the pin head has a bottom end surface. One end of the pin is connected to the bottom end surface, and when the pin is inserted into the positioning hole, the bottom end surface abuts against the surface of the template to suspend the positioning member in the positioning hole.

In the mold of the present embodiment and its positioning member, the bottom end surface of the positioning member pin head is abutted against the surface of the template. Even if the positioning member receives an external force during the processing of the circuit board, the cylinder of the pin head does not fall into the positioning hole, thereby affecting the alignment of the circuit board.

In order to further understand the techniques, methods and effects of this creation, please refer to the following detailed descriptions and schemas of this creation. I believe that the characteristics of this creation can be deeply and specifically understood. However, the drawings are The attachments and attachments are for reference and explanation only and are not intended to limit the creation.

1‧‧‧Mold

10‧‧‧floor

100‧‧‧through hole

11‧‧‧ Template

T‧‧‧ template thickness

11a‧‧‧ upper surface

11b‧‧‧ lower surface

110‧‧‧Positioning holes

12‧‧‧ Positioning parts

120‧‧ ‧ pin head

120e‧‧‧ bottom end

121‧‧‧ pin

L3‧‧‧ pin length

122‧‧‧ cone

L2‧‧‧ cone length

122a‧‧‧ bottom

123‧‧‧Cylinder

L1‧‧‧Cylinder length

2‧‧‧ boards

2a‧‧‧ first surface

2b‧‧‧ second surface

20‧‧‧Fixed holes

t‧‧‧PCB thickness

1A shows a schematic cross-sectional view of a circuit board positioned in front of a mold of the presently-created embodiment.

Figure 1B shows a schematic cross-sectional view of the circuit board positioned on the mold of the presently-created embodiment.

Fig. 2 is a perspective view showing the positioning member of the present embodiment.

Please refer to FIG. 1A and FIG. 1B. 1A shows a schematic cross-sectional view of a circuit board positioned in front of a mold of the presently-created embodiment. Figure 1B shows a schematic cross-sectional view of the circuit board positioned on the mold of the presently-created embodiment. The mold 1 of the present embodiment can be used to process the board 2 or allow the board to be tested during the board process. For example, the mold 1 can be a mold used in stamping, punching or punching. In the present embodiment, the mold 1 includes a bottom plate 10, a template 11 and a positioning member 12.

The bottom plate 10 is used to carry the template 11 and the circuit board 2, and the template 11 and the circuit board 2 can be placed on a machine (not shown). The bottom plate 10 has at least one through hole 100 (pictured in the drawing One) is shown, and the template 11 is provided with at least one positioning hole 110 (one is shown) corresponding to the position of the through hole 100. In the present embodiment, the positioning hole 110 extends from the upper surface 11a of the template 11 to the lower surface 11b of the template 11. In this embodiment, when the template 11 is placed on the bottom plate 10, the upper surface 11a of the template 11 refers to the surface for carrying the circuit board 2, and the lower surface 11b of the template 11 is opposed to the upper surface 11a and placed toward the bottom plate 10. . When the positioning member 12 is inserted into the positioning hole 110, the through hole 100 of the bottom plate 10 can facilitate the operator to apply force to the positioning member 12 to take out the positioning member 12 to achieve the purpose of repeatedly using the positioning member 12.

It should be noted that the circuit board 2 has a first surface 2a and a second surface 2b opposite to the first surface 2a. Moreover, in conjunction with the positioning member 12 described above, the circuit board 2 has at least one fixing hole 20 (one is shown), and the fixing hole 20 extends from the first surface 2a to the second surface 2b. In the present embodiment, the circuit board 2 may be a flexible circuit board.

The positioning member 12 can be inserted into the positioning hole 110 to position the circuit board 2. Referring to FIG. 1A and FIG. 1B , in detail, after the positioning member 12 is inserted into the positioning hole 110 , the circuit board 2 is further sleeved on the positioning member 12 by the fixing hole 20 , and is fixed on the template 11 .

Referring to FIG. 2, a perspective view of the positioning member of the present embodiment is shown. The positioning member 12 of the present embodiment includes a pin head 120 and a pin 121. The pin head 120 has a bottom end surface 120e, and the outer shape of the pin head 120 is substantially in the shape of a bullet. That is to say, the cross-sectional area of the pin head 120 is substantially increasing from the top to the bottom end surface 120e, so that the circuit board 2 can be easily sleeved onto the positioning member 12.

One end of the pin 121 is connected to the bottom end surface 120e. When the pin 121 is inserted into the positioning hole 110, at least a portion of the bottom end surface 120e abuts against the surface of the template 11 to suspend the positioning member 12 in the positioning hole 110. In one embodiment, the pin 121 is sized to fit the aperture of the locating aperture 110. In detail, the diameter of the pin 121 is slightly smaller than the diameter of the positioning hole 110, so that the pin 121 can be smoothly inserted into the positioning hole 110. When the positioning member 12 is inserted into the positioning hole 110, the pin 121 is tightly fitted to the positioning hole 110, so as to prevent the positioning member 12 from moving during the punching process of the circuit board 2, resulting in inaccurate positioning. However, in an embodiment, when the pin 121 is inserted into the positioning hole 110, the bottom end surface 120e of the pin head 120 can completely cover the positioning hole 110 when viewed from the upper surface 11a of the template 11. That is, the cross-sectional area of the pin 121 is smaller than the area of the bottom end surface 120e. In this way, the pin head 120 of the positioning member 12 can be prevented from sinking into the positioning hole 110 due to mechanical external force or artificial external force or vibration.

In the present embodiment, the pin head 120 has a tapered body 122 and a column 123. One end of the column 123 is connected to the bottom surface 122a of the cone 122, and the bottom end surface 120e is located at the other side of the column 123. One end. The size of the cylinder 123 is designed to fit the fixing hole 20 of the circuit board 2. That is, the diameter of the cylinder 123 is substantially the same as the diameter of the fixing hole 20. In one embodiment, the aperture of the fixing hole 20 is maintained by the upper surface 2a to the lower surface 2b of the circuit board 2, and the diameter of the pillar 123 is also substantially uniform from the bottom surface 122a to the bottom end surface 120a. In other words, the bottom surface 122a of the tapered body 122 has substantially the same shape and area as the bottom end surface 120e. In addition, the length L1 of the pillar 123 may be greater than or equal to the thickness t of the circuit board 2.

In the above structure, the tapered body 122 can make the circuit board 2 easier to be placed on the positioning member 12, and after the circuit board 2 is sleeved on the positioning member 12, the column 123 can make the circuit board 2 less likely to be displaced. Thus, when the circuit board 2 is processed, the yield reduction due to the inaccuracy of the alignment between the circuit board 2 and the mold 1 can be avoided. In an embodiment, the ratio of the length L2 of the cone 122 to the length L1 of the cylinder 123 ranges from 0.09 to 0.5, which can be adjusted according to the thickness of the circuit board 2.

In addition, the length L3 of the pin 121 is greater than or equal to the thickness T of the template 11. In another embodiment, the ratio of the length L3 of the pin 121 to the length (L1+L2) of the pin head 120 ranges from 0.5 to 1.

In summary, when the positioning member of the present embodiment is applied to the mold, by pressing the bottom end surface of the positioning member pin against the surface of the template, the cylinder of the pin head can be prevented from sinking into the positioning hole due to an external force. And affect the alignment of the board. Since the aperture of the fixing hole of the circuit board is opened to match the cylinder, the cylinder can be used to assist the fixing and alignment of the circuit board. If the cylinder of the pin head sinks into the positioning hole, when the circuit board is placed in the positioning piece with the fixing hole sleeve The mounting holes of the board will be placed over the cone instead of the cylinder. Since the aperture of the fixing hole is larger than the diameter of the cross-section of the cone, it is highly probable that the board will be slightly displaced during the processing, and the accuracy of the alignment and the yield of the product are lowered. In view of this, the mold and the positioning member of the present embodiment can reduce the probability of occurrence of the above situation.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any skilled person skilled in the art, without departing from the spirit and scope of the present invention, is equivalent to the replacement of the modifiers and retouchings. Within the scope of patent protection.

12‧‧‧ Positioning parts

120‧‧ ‧ pin head

120e‧‧‧ bottom end

121‧‧‧ pin

L3‧‧‧ pin length

122‧‧‧ cone

L2‧‧‧ cone length

122a‧‧‧ bottom

123‧‧‧Cylinder

L1‧‧‧Cylinder length

Claims (11)

a positioning member for positioning a circuit board on a template, the template having at least one positioning hole, the positioning member comprising: a pin head, the pin head is bullet-shaped, and the pin head has a bottom end surface; a pin, one end of which is connected to the bottom end surface, and when the pin is inserted into the positioning hole, the bottom end surface abuts against the surface of the template, so that the positioning member is suspended in the positioning hole. The locating member of claim 1, wherein the pin head comprises a cone and a cylinder, one end of the cylinder is connected to the cone, and the bottom end is located at the other end of the cylinder. The locating member of claim 2, wherein the length of the cylinder is greater than the thickness of the circuit board. The locating member of claim 2, wherein the ratio of the length of the cone to the length of the cylinder ranges between 0.09 and 0.5. The locating member of claim 2, wherein the bottom surface area of the cone is the same as the area of the bottom end surface. The locating member of claim 1, wherein the pin has a cross-sectional area smaller than the bottom end surface area. A mold for positioning a circuit board, the mold comprising: a template having at least one positioning hole for placing the circuit board; and a positioning member for inserting the positioning hole to position the circuit board The positioning member includes: a pin head having a bullet shape, the pin head having a bottom end surface; and a pin, one end of the pin being connected to the bottom end surface, when the pin When the post is inserted into the positioning hole, the bottom end surface abuts against the surface of the template, so that the positioning member is suspended in the positioning hole. The mold of claim 7, wherein the pin head comprises a cone and a cylinder, one end of the cylinder being connected to the cone, and the bottom end is located at the other end of the cylinder. The mold of claim 8, wherein the length of the cylinder is greater than the thickness of the circuit board. The mold of claim 8, wherein the bottom surface area of the cone is the same as the area of the bottom end surface. The mold of claim 7, wherein when the pin is inserted into the positioning hole, the pin is tightly fitted to the positioning hole, and the cross-sectional area of the pin is smaller than the bottom end surface area.