TWM480636U - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
TWM480636U
TWM480636U TW103203779U TW103203779U TWM480636U TW M480636 U TWM480636 U TW M480636U TW 103203779 U TW103203779 U TW 103203779U TW 103203779 U TW103203779 U TW 103203779U TW M480636 U TWM480636 U TW M480636U
Authority
TW
Taiwan
Prior art keywords
cover
base
heat dissipation
conductive sheet
lighting device
Prior art date
Application number
TW103203779U
Other languages
Chinese (zh)
Inventor
Min-Hua Zhou
Ying-Zhen Huang
Original Assignee
Dbm Reflex Of Taiwan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dbm Reflex Of Taiwan Co Ltd filed Critical Dbm Reflex Of Taiwan Co Ltd
Priority to TW103203779U priority Critical patent/TWM480636U/en
Publication of TWM480636U publication Critical patent/TWM480636U/en
Priority to DE202014105890.7U priority patent/DE202014105890U1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14Light emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19Attachment of light sources or lamp holders
    • F21S43/195Details of lamp holders, terminals or connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

照明裝置Lighting device

本創作係一種照明裝置,尤指一種提供照明的照明裝置。The present invention is a lighting device, especially a lighting device that provides illumination.

具有體積小且亮度高之特點的發光二極體被廣泛應用於車燈上,車燈包含有一燈座及一燈罩,以及該燈座與燈罩之間形成一容置空間,並該燈座上設有一伸入容置空間的照明裝置,其中,該照明裝置包含有一基座,該基座上設有一主機板,並於主機板的末端處設有發光二極體模組,發光二極體模組包括有一連接主機板的電路板,以及電路板上設有發光二極體,且在主機板的一側面上設有散熱鰭片。A light-emitting diode having a small size and a high brightness is widely used in a vehicle lamp. The lamp includes a lamp holder and a lamp cover, and an accommodation space is formed between the lamp holder and the lamp cover, and the lamp holder is mounted on the lamp holder. There is a lighting device extending into the accommodating space, wherein the illuminating device comprises a base, the base is provided with a motherboard, and a light emitting diode module and a light emitting diode are arranged at the end of the motherboard The module includes a circuit board connected to the motherboard, and a light-emitting diode on the circuit board, and heat-dissipating fins are disposed on one side of the motherboard.

其中,發光二極體發光時所產生的熱能經由電路板而傳導至主機板,再傳導至散熱鰭片,形成單面向的散熱路徑,所以散熱效率不佳。The heat generated by the light emitting diode is transmitted to the motherboard through the circuit board, and then transmitted to the heat dissipation fins to form a heat dissipation path of a single surface, so the heat dissipation efficiency is not good.

本創作之主要目的在於提供一種照明裝置,希藉此改善現有照明裝置僅提供單面向的散熱路徑而造成散熱效率不佳的問題。The main purpose of the present invention is to provide a lighting device, thereby improving the problem that the existing lighting device provides only a single-face heat dissipation path and causes poor heat dissipation efficiency.

為達成前揭目的,本創作之照明裝置包含:  一基座;  一主機板,其係設於該基座;  一傳導片,其係豎設於該基座,該傳導片包含有一第一散熱面及一第二散熱面;以及  一發光二極體模組,其係設於該傳導片的端部且伸出該基座,以及該發光二極體模組電性連接該主機板。In order to achieve the foregoing, the lighting device of the present invention comprises: a pedestal; a motherboard disposed on the pedestal; a conductive sheet erected on the pedestal, the conductive sheet including a first heat dissipation And a second heat dissipating surface; and a light emitting diode module disposed at an end of the conductive sheet and extending from the base, and the LED module is electrically connected to the motherboard.

據上所述,該發光二極體模組發光所產生的熱能傳導至該傳導片,透過該傳導片的第一散熱面與第二散熱面而形成雙面向的散熱路徑,達到提高散熱效率的目的,以及該照明裝置設於車輛的燈具時,所述發光二極體模組位於傳導片的端部,讓發光二極體模組可正確地配合燈具之燈座的反射空間,使發光二極體模組發出的光線可投射至燈座的反光面且有效反射,進而提升勻光度,並可適用於各式燈具以達到各車種之亮度與光型分佈的法規規定。According to the above, the thermal energy generated by the illumination of the LED module is transmitted to the conductive sheet, and the heat dissipation path is formed through the first heat dissipation surface and the second heat dissipation surface of the conductive sheet to improve the heat dissipation efficiency. The light-emitting diode module is located at the end of the conductive sheet, so that the light-emitting diode module can correctly match the reflection space of the lamp socket of the lamp, so that the illumination device is disposed on the lamp of the vehicle. The light emitted by the diode module can be projected onto the reflective surface of the lamp holder and effectively reflected, thereby enhancing the uniformity, and can be applied to various types of lamps to meet the regulations on the brightness and light distribution of each type of vehicle.

請參閱圖1至圖3,為本創作照明裝置之一種較佳實施例,其包含一基座10、一主機板20、一傳導片30及一發光二極體模組40。Referring to FIG. 1 to FIG. 3 , a preferred embodiment of the lighting device of the present invention comprises a base 10 , a motherboard 20 , a conductive sheet 30 , and a light emitting diode module 40 .

該基座10包含有一座體11、一第一罩體12及一第二罩體13,該座體11內設有一裝配空間14,以及該座體11上設有一承載部15,該第一罩體12與第二罩體13皆設於該座體11的承載部15上,另外,該座體11的外側面設有組接部16。The base 10 includes a body 11 , a first cover 12 and a second cover 13 . The base 11 is provided with an assembly space 14 , and the base 11 is provided with a bearing portion 15 . Both the cover 12 and the second cover 13 are disposed on the carrying portion 15 of the base 11. Further, the outer surface of the base 11 is provided with a joint portion 16.

該主機板20係設於該基座10並位於該座體11的裝配空間14,該主機板20進一步可豎設於該座體11。The main board 20 is disposed on the base 10 and located in the assembly space 14 of the base 11. The main board 20 is further erected on the base 11.

該傳導片30係豎設於該基座10,該傳導片30包含有相對的一第一端部31及一第二端部32,該第二端部32鄰接該座體11的承載部15,以及該傳導片30包含有一第一散熱面33與第二散熱面34,該第一散熱面33鄰接該第一罩體12,該第二散熱面34鄰接該第二罩體13,上述中,該傳導片30可以為銅片。The conductive sheet 30 is erected on the base 10 . The conductive sheet 30 includes a first end portion 31 and a second end portion 32 . The second end portion 32 abuts the receiving portion 15 of the base 11 . And the conductive sheet 30 includes a first heat dissipation surface 33 and a second heat dissipation surface 34. The first heat dissipation surface 33 is adjacent to the first cover body 12, and the second heat dissipation surface 34 is adjacent to the second cover body 13, The conductive sheet 30 may be a copper sheet.

該發光二極體模組40係設於該傳導片30的第一端部31且伸出該基座10,以及該發光二極體模組40電性連接該主機板20,其中,該發光二極體模組40包含有一鄰接該傳導片30的導熱板41,並於該導熱板41的側面上設有電路板42,以及電路板42上設有發光二極體43,並於電路板42上設置電線44以連接該主機板20,其中,該導熱板41的一側面上設有一電路板42,並於該電路板42上設有至少一發光二極體43,或如圖3所示,該導熱板41的兩側面上皆設有一電路板42,所述電路板42上設有至少一發光二極體43。The LED module 40 is disposed on the first end portion 31 of the conductive sheet 30 and extends out of the base 10 , and the LED module 40 is electrically connected to the motherboard 20 . The diode module 40 includes a heat conducting plate 41 adjacent to the conductive sheet 30, and a circuit board 42 is disposed on a side of the heat conducting board 41. The circuit board 42 is provided with a light emitting diode 43 and is disposed on the circuit board. An electric wire 44 is disposed on the 42 to be connected to the main board 20, wherein a circuit board 42 is disposed on one side of the heat conducting board 41, and at least one light emitting diode 43 is disposed on the circuit board 42, or as shown in FIG. A circuit board 42 is disposed on both sides of the heat conducting plate 41. The circuit board 42 is provided with at least one light emitting diode 43.

上述中,該基座10包含有一鎖固組件,該鎖固組件包含有一螺絲17及一螺帽18,該螺絲17通過該第一罩體12、該傳導片30及該第二罩體13,該螺帽18鎖設於該螺絲17,或者該基座10包含有一卡接組件以卡組第一罩體12與第二罩體13。In the above, the base 10 includes a locking component, and the locking component includes a screw 17 and a nut 18. The screw 17 passes through the first cover 12, the conductive piece 30 and the second cover 13. The nut 18 is locked to the screw 17 or the base 10 includes a latching assembly for engaging the first cover 12 and the second cover 13 .

請參閱圖5所示,該照明裝置的第一罩體12a與第二罩體13a為具有散熱鰭片的構件,可提高散熱效率。Referring to FIG. 5, the first cover 12a and the second cover 13a of the illumination device are members having heat dissipation fins, which can improve heat dissipation efficiency.

其中,該照明裝置可裝設於一具有反光面的燈座,以及該燈座上罩設一燈罩,該照明裝置的發光二極體模組40發出光線並照射至該燈座的反光面,透過反光面將光線反射而照射出該燈罩,其中,發光二極體模組40伸入燈座圈圍的反射空間,請參閱圖4所示,該照明裝置之發光二極體模組40於發光時所產生的熱能,進一步傳導至鄰接的傳導片30,藉由傳導片30的第一散熱面33並透過傳導的方式將熱能傳至第一罩體12,並形成第一面向的散熱路徑,另外,傳導至傳導片30的熱能同時可藉由傳導片30的第二散熱面34,透過傳導的方式將熱能進一步傳至第二罩體13,以形成第二面向的散熱路徑,傳導至第一罩體12與第二罩體13的熱能進而採用對流方式進行散熱。The illuminating device can be mounted on a lamp holder having a reflective surface, and the lamp holder is covered with a lamp cover. The illuminating diode module 40 of the illuminating device emits light and illuminates the reflective surface of the lamp holder. The light-emitting diode module 40 is reflected by the light-reflecting surface, and the light-emitting diode module 40 extends into the reflection space around the lamp holder ring. Referring to FIG. 4, the light-emitting diode module 40 of the illumination device is The thermal energy generated during the illumination is further transmitted to the adjacent conductive sheet 30, and the thermal energy is transmitted to the first cover 12 through the first heat dissipation surface 33 of the conductive sheet 30 and transmitted, and the heat dissipation path of the first surface is formed. In addition, the thermal energy transmitted to the conductive sheet 30 can be further transmitted to the second cover 13 through conduction through the second heat dissipation surface 34 of the conductive sheet 30 to form a heat dissipation path of the second surface. The thermal energy of the first cover 12 and the second cover 13 is further convectively dissipated.

綜上所述,該照明裝置的發光二極體模組40所產生的熱能可傳導至該傳導片30,透過該傳導片30的第一散熱面33與第二散熱面34,而同時採取不同方向的散熱路徑散熱,進而達到提高散熱效率的目的,另外,該照明裝置的發光二極體模組40位於豎設於基座10之傳導片30的端部,於照明裝置裝設於燈座時,發光二極體模組40可正確地配合燈座的反射空間,使發光二極體模組40發出的光線可投射至燈座的反光面並有效反射,以收提升勻光度之功效,使整體光學系統性能之亮度與光型分佈可符合法規規定。In summary, the thermal energy generated by the LED module 40 of the illumination device can be transmitted to the conductive sheet 30, through the first heat dissipation surface 33 and the second heat dissipation surface 34 of the conductive sheet 30, while taking different The heat dissipation path of the direction is dissipated to achieve the purpose of improving the heat dissipation efficiency. In addition, the LED module 40 of the illumination device is disposed at the end of the conductive sheet 30 of the base 10, and the illumination device is mounted on the lamp holder. The light-emitting diode module 40 can correctly match the reflection space of the lamp holder, so that the light emitted by the LED module 40 can be projected onto the reflective surface of the lamp holder and effectively reflected to enhance the uniformity. The brightness and light distribution of the overall optical system performance can be in compliance with regulations.

10‧‧‧基座
11‧‧‧座體
12‧‧‧第一罩體
13‧‧‧第二罩體
14‧‧‧裝配空間
15‧‧‧承載部
16‧‧‧組接部
17‧‧‧螺絲
18‧‧‧螺帽
20‧‧‧主機板
30‧‧‧傳導片
31‧‧‧第一端部
32‧‧‧第二端部
33‧‧‧第一散熱面
34‧‧‧第二散熱面
40‧‧‧發光二極體模組
41‧‧‧導熱板
42‧‧‧電路板
43‧‧‧發光二極體
44‧‧‧電線
10‧‧‧ Pedestal
11‧‧‧
12‧‧‧First cover
13‧‧‧Second cover
14‧‧‧ Assembly space
15‧‧‧Loading Department
16‧‧‧Team
17‧‧‧ screws
18‧‧‧ nuts
20‧‧‧ motherboard
30‧‧‧Conveying film
31‧‧‧ first end
32‧‧‧second end
33‧‧‧First heat sink
34‧‧‧second heat sink
40‧‧‧Lighting diode module
41‧‧‧heat conducting plate
42‧‧‧ boards
43‧‧‧Lighting diode
44‧‧‧Wire

圖1:為本創作照明裝置之一較佳實施例之立體分解示意圖。圖2:為本創作照明裝置之一較佳實施例之立體組合示意圖。圖3:為本創作照明裝置之一較佳實施例之組合側視示意圖。圖4:為本創作照明裝置之一較佳實施例之散熱路徑局部放大示意圖。圖5:為本創作照明裝置之另一較佳實施例之立體分解示意圖。FIG. 1 is a perspective exploded view of a preferred embodiment of the present lighting device. 2 is a perspective view of a preferred embodiment of a lighting device of the present invention. Figure 3 is a side elevational view of the combination of a preferred embodiment of the authored illumination device. 4 is a partially enlarged schematic view showing a heat dissipation path of a preferred embodiment of the present illumination device. FIG. 5 is a perspective exploded view of another preferred embodiment of the present lighting device.

10‧‧‧基座10‧‧‧ Pedestal

11‧‧‧座體11‧‧‧

12‧‧‧第一罩體12‧‧‧First cover

13‧‧‧第二罩體13‧‧‧Second cover

14‧‧‧裝配空間14‧‧‧ Assembly space

15‧‧‧承載部15‧‧‧Loading Department

16‧‧‧組接部16‧‧‧Team

17‧‧‧螺絲17‧‧‧ screws

18‧‧‧螺帽18‧‧‧ nuts

20‧‧‧主機板20‧‧‧ motherboard

30‧‧‧傳導片30‧‧‧Conveying film

31‧‧‧第一端部31‧‧‧ first end

32‧‧‧第二端部32‧‧‧second end

33‧‧‧第一散熱面33‧‧‧First heat sink

34‧‧‧第二散熱面34‧‧‧second heat sink

40‧‧‧發光二極體模組40‧‧‧Lighting diode module

41‧‧‧導熱板41‧‧‧heat conducting plate

42‧‧‧電路板42‧‧‧ boards

43‧‧‧發光二極體43‧‧‧Lighting diode

44‧‧‧電線44‧‧‧Wire

Claims (10)

一種照明裝置,其包含:一基座;一主機板,其係設於該基座;一傳導片,其係豎設於該基座,該傳導片包含有一第一散熱面及一第二散熱面;以及一發光二極體模組,其係設於該傳導片的端部且伸出該基座,以及該發光二極體模組電性連接該主機板。 A lighting device comprising: a base; a motherboard disposed on the base; a conductive sheet erected on the base, the conductive sheet including a first heat dissipation surface and a second heat dissipation And a light emitting diode module disposed at an end of the conductive sheet and extending from the base, and the LED module is electrically connected to the motherboard. 如請求項1所述之照明裝置,其中,該基座包括有一座體、一第一罩體及一第二罩體,該座體內設有一提供主機板設置的裝配空間,以及該座體上設有一鄰接該傳導片的承載部,該第一罩體與第二罩體皆設於該座體的承載部上,以及該第一罩體鄰接該傳導片的第一散熱面,該第二罩體鄰接該傳導片的第二散熱面。 The illuminating device of claim 1, wherein the base comprises a body, a first cover and a second cover, wherein the base is provided with an assembly space for providing a motherboard, and the base And a first cover body and a second cover body are disposed on the bearing portion of the base body, and the first cover body abuts the first heat dissipation surface of the conductive piece, the second The cover abuts the second heat dissipation surface of the conductive sheet. 如請求項2所述之照明裝置,其中,該基座包含有一鎖固組件,該鎖固組件包含有一螺絲及一螺帽,該螺絲通過該第一罩體、該傳導片及該第二罩體,該螺帽鎖設於該螺絲。 The lighting device of claim 2, wherein the base comprises a locking component, the locking component comprises a screw and a nut, the screw passing through the first cover, the conductive piece and the second cover The nut is locked to the screw. 如請求項2所述之照明裝置,其中,該第一罩體與第二罩體為具有散熱鰭片的構件。 The lighting device of claim 2, wherein the first cover and the second cover are members having heat dissipation fins. 如請求項3所述之照明裝置,其中,該第一罩體與第二罩體為具有散熱鰭片的構件。 The lighting device of claim 3, wherein the first cover and the second cover are members having heat dissipation fins. 如請求項1所述之照明裝置,其中,該發光二極體模組包含有一鄰接該傳導片的導熱板,並於該導熱板的側面上設有電路板,以及電路板上設有發光二極體。 The illuminating device of claim 1, wherein the illuminating diode module comprises a heat conducting plate adjacent to the conductive sheet, and a circuit board is disposed on a side of the heat conducting board, and the circuit board is provided with a light emitting diode Polar body. 如請求項2至5中任一項所述之照明裝置,其中,該發光二極體模組包含有一鄰接該傳導片的導熱板,並於該導熱板的側面上設有電路板,以及電路板上設有發光二極體。 The illuminating device according to any one of claims 2 to 5, wherein the illuminating diode module comprises a heat conducting plate adjacent to the conductive sheet, and a circuit board and a circuit are disposed on a side of the heat conducting board A light-emitting diode is provided on the board. 如請求項2至5中任一項所述之照明裝置,其中,該座體的外側面設有組接部。 The illuminating device according to any one of claims 2 to 5, wherein the outer side of the seat body is provided with a joint portion. 如請求項7所述之照明裝置,其中,該座體的外側面設有組接部。 The lighting device of claim 7, wherein the outer side of the seat body is provided with a joint portion. 如請求項2或4所述之照明裝置,其中,該基座之第一罩體與第二罩體以卡接組件組合。The lighting device of claim 2 or 4, wherein the first cover and the second cover of the base are combined by a snap-fit assembly.
TW103203779U 2014-03-06 2014-03-06 Lighting device TWM480636U (en)

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TW103203779U TWM480636U (en) 2014-03-06 2014-03-06 Lighting device
DE202014105890.7U DE202014105890U1 (en) 2014-03-06 2014-12-05 lighting device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014105890U1 (en) 2014-03-06 2015-02-04 Dbm Reflex Of Taiwan Co., Ltd. lighting device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM480636U (en) 2014-03-06 2014-06-21 Dbm Reflex Of Taiwan Co Ltd Lighting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014105890U1 (en) 2014-03-06 2015-02-04 Dbm Reflex Of Taiwan Co., Ltd. lighting device

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