TWM461003U - Light illumination device - Google Patents

Light illumination device Download PDF

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Publication number
TWM461003U
TWM461003U TW101220318U TW101220318U TWM461003U TW M461003 U TWM461003 U TW M461003U TW 101220318 U TW101220318 U TW 101220318U TW 101220318 U TW101220318 U TW 101220318U TW M461003 U TWM461003 U TW M461003U
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Taiwan
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light source
heat dissipation
substrate
layout layer
unit
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TW101220318U
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Chinese (zh)
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Huan-Qiu Zhou
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Huan-Qiu Zhou
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Priority to TW101220318U priority Critical patent/TWM461003U/en
Publication of TWM461003U publication Critical patent/TWM461003U/en

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Description

光源照明裝置 Light source lighting device

本創作係一種光源照明裝置,特別是產生全周光源照明。 This creation is a light source illumination device, in particular to produce full-circumference light source illumination.

傳統中,係藉由發光二極體取代舊有的鎢絲燈泡等傳統的光源,用以達到節能減碳的功效。其中,該發光二極體係具有高使用壽命的優點。 Traditionally, traditional light sources such as old tungsten filament bulbs have been replaced by light-emitting diodes to achieve energy-saving and carbon-reducing effects. Among them, the light-emitting diode system has the advantage of high service life.

然而,單一顆的該發光二極體所產生的光強度尚不足以取代舊有的燈泡,故藉由多顆的該發光二極體增加光強度。又,製造商通常將多顆的該發光二極體封裝成單一燈泡產品,使得多顆的該發光二極體容置在密封的外殼裡,導致多顆的該發光二極體所產生的大量熱能在該外殼內會累積該熱能,造成該發光二極體的發光效率降低,進而有光衰現象產生。 However, the light intensity generated by the single LED is not enough to replace the old bulb, so the light intensity is increased by a plurality of the LEDs. Moreover, the manufacturer usually packs a plurality of the LEDs into a single bulb product, so that the plurality of the LEDs are housed in the sealed casing, resulting in a large number of the LEDs. The thermal energy accumulates in the outer casing, causing the luminous efficiency of the light-emitting diode to decrease, and a light decay phenomenon.

然而不管是該發光二極體所產生的點光源或是平面投射光片(Chip On Board)所產生的面光源等的發光元件,為使得出射的光線看起來均勻,通常會以附加具有擴散劑的半圓形燈罩達到上述的功效,但加上該燈罩會減少出射的光通量(約莫10%~15%),因此如何能夠維持原有的光通量,又能夠產生均勻地光源,變成是一種亟 欲解決的問題。 However, the light-emitting element such as the point light source generated by the light-emitting diode or the surface light source generated by the Chip On Board, in order to make the emitted light appear uniform, usually has an additional diffusing agent. The semi-circular lampshade achieves the above-mentioned effects, but the lampshade reduces the luminous flux (about 10% to 15%), so how to maintain the original luminous flux and generate a uniform light source becomes a kind of 亟 The problem to be solved.

故本創作係提供一種光源照明裝置,用以解決習知技術的缺失。 Therefore, the creation department provides a light source illumination device to solve the lack of the prior art.

本創作之一目的係提供一種光源照明裝置,藉由特殊設計的聚光單元降低光源之光損耗、增加光源通過透鏡的光通量以及擴大發光角度,用以達到提供全周光源的功效。 One of the purposes of the present invention is to provide a light source illumination device that reduces the light loss of the light source, increases the light flux of the light source through the lens, and expands the light angle by a specially designed concentrating unit to achieve the effect of providing a full-circumference light source.

本創作之另一目的係根據上述的光源照明裝置,藉由基板上的散熱佈局層用以增加散熱截面積,並且透過具有散熱結構的座體單元達到快速地散熱的功效。 Another object of the present invention is to increase the heat dissipation cross-sectional area by the heat dissipation layout layer on the substrate according to the above-mentioned light source illumination device, and achieve the effect of rapidly dissipating heat through the base unit having the heat dissipation structure.

本創作之又一目的係根據上述的光源照明裝置,在該基板同時地形成電路佈局層與散熱佈局層,用以增加散熱的截面積。 Another object of the present invention is to simultaneously form a circuit layout layer and a heat dissipation layout layer on the substrate according to the above-described light source illumination device for increasing the cross-sectional area of heat dissipation.

本創作之再一目的係根據上述的光源照明裝置,係藉由散熱佈局層、具有散熱結構的外殼及導熱膠層等多種散熱方式,用以達到高散熱效率的功效。 A further object of the present invention is to achieve high heat dissipation efficiency by using a plurality of heat dissipation methods such as a heat dissipation layout layer, a heat dissipation structure, and a heat conductive adhesive layer according to the above-mentioned light source illumination device.

為達到上述目的及其它目的,本創作係一種光源照明裝置,係供在接收電源之後產生全周光源照明,且該光源照明裝置係包含電連接單元、座體單元、基板、光源模組與聚光單元。其中,該電連接單元係供接收該電 源,且該電連接單元根據該電源產生相對應的供應電壓;該座體單元係具有散熱結構之外殼部與容置部,該座體單元藉由該容置部之一端供與該電連接單元結合;該基板係設置於該容置部之另一端,且該基板與該座體單元接觸結合,以及該基板與該電連接單元連接以接收該供應電壓;該光源模組係設置於該基板,該光源模組係透過該基板接收該供應電壓而產生熱能與光源,且該熱能藉由該基板傳導至該座體單元;以及該聚光單元係具有容置槽與導光體,且該容置槽形成在該導光體,且該聚光單元供與該座體單元結合,又該容置槽對應於該光源模組,而該導光體將該光源以一擴散角度散發以形成該全周光源射出。 To achieve the above and other objects, the present invention is a light source illumination device for generating full-circumference light source illumination after receiving power, and the light source illumination device comprises an electrical connection unit, a base unit, a substrate, a light source module, and a Light unit. Wherein the electrical connection unit is for receiving the electricity a source, and the electrical connection unit generates a corresponding supply voltage according to the power source; the base unit has a housing portion and a receiving portion of the heat dissipation structure, and the base unit is electrically connected to the one end of the receiving portion The substrate is disposed at the other end of the receiving portion, and the substrate is in contact with the base unit, and the substrate is connected to the electrical connecting unit to receive the supply voltage; the light source module is disposed on the a substrate, the light source module receives the supply voltage through the substrate to generate thermal energy and a light source, and the thermal energy is transmitted to the base unit by the substrate; and the concentrating unit has a receiving groove and a light guide body, and The accommodating groove is formed in the light guiding body, and the concentrating unit is coupled to the base unit, and the accommodating groove corresponds to the light source module, and the light guiding body scatters the light source at a diffusion angle The entire peripheral light source is formed to be emitted.

與習知技術相較,本創作之光源照明裝置在接收電源之後產生全周光源照明,用以形成可提供全周光源照明的球泡燈等。其中,光源模組係設置於該基板的中央的部分,且該基板係同時地供該光源模組所需供應電壓的供電路徑(於本創作係稱電路佈局層),以及供與該光源模組產生熱能散熱的散熱區域(於本創作係稱散熱佈局層),用以減少該熱能對該光源的影響,進而維持該光源原有的使用壽命,以及避免該熱能造成該光源的發光效率。 Compared with the prior art, the light source illumination device of the present invention generates full-circumference light source illumination after receiving power, to form a bulb lamp or the like that can provide full-circumference light source illumination. Wherein, the light source module is disposed at a central portion of the substrate, and the substrate is simultaneously supplied with a power supply path for the required voltage supply of the light source module (referred to as a circuit layout layer in the present invention), and is supplied to the light source module. The heat dissipation area (referred to as the heat dissipation layout layer) for generating heat energy is used to reduce the influence of the heat energy on the light source, thereby maintaining the original service life of the light source and avoiding the heat energy of the light source.

再者,該光源模組所產生的光源又經由聚光單元, 將該光源以一擴散角度散發以形成該全周光源。 Furthermore, the light source generated by the light source module passes through the concentrating unit. The light source is emitted at a diffusion angle to form the full-circumference light source.

此外,該基板更進一步可在該散熱區域與該供電路徑將散熱塗覆層塗覆於該供電路徑與該散熱區域,用以更加快速地散發該熱能,以及透過具有散熱結構的該座體單元加速該光源模組之該熱能散發。 In addition, the substrate further applies a heat dissipation coating layer to the power supply path and the heat dissipation area in the heat dissipation region and the power supply path for dissipating the heat energy more quickly, and transmitting the body unit having the heat dissipation structure. Accelerating the heat dissipation of the light source module.

為充分瞭解本創作之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本創作做一詳細說明,說明如後:參考第1圖,係本創作第一實施例之光源照明裝置的分解示意圖。於第1圖中,該光源照明裝置10接收電源PW(例如變壓器、市電、一次電池或二次電池)之後產生全周光源照明的全周光源L輸出。其中,該光源L輸出具有一擴散角度,例如該擴散角度係等於或等於260度角。 In order to fully understand the purpose, features and effects of this creation, the following specific examples are used, together with the attached drawings, to give a detailed explanation of the creation, as follows: Refer to Figure 1, which is the first An exploded schematic view of a light source illumination device of an embodiment. In FIG. 1, the light source illumination device 10 receives the power source PW (for example, a transformer, a commercial power supply, a primary battery, or a secondary battery), and generates an all-circumference light source L output of the full-circumference light source. Wherein, the light source L output has a diffusion angle, for example, the diffusion angle is equal to or equal to 260 degrees.

該光源照明裝置10係包含電連接單元12、座體單元14、基板16、光源模組18與聚光單元20。 The light source illumination device 10 includes an electrical connection unit 12, a base unit 14, a substrate 16, a light source module 18, and a concentrating unit 20.

該電連接單元12係供接收該電源PW,且該電連接單元12根據該電源PW產生相對應的供應電壓(圖未示)。於另外一實施例中,該電連接單元12係可在接收該電源PW之後,經由一電源轉換單元(圖未示)將例如 市電轉換成可供驅動該光源模組18的直流電。 The electrical connection unit 12 is configured to receive the power source PW, and the electrical connection unit 12 generates a corresponding supply voltage (not shown) according to the power source PW. In another embodiment, the electrical connection unit 12 can receive, for example, a power conversion unit (not shown) after receiving the power supply PW. The utility power is converted into a direct current that can drive the light source module 18.

該座體單元14係具有外殼部142與容置部144。其中,該外殼部142形成散熱結構(例如可為魚鰭狀散熱結構、片狀散熱結構與柱狀散熱結構,如第2圖),以及該座體單元14藉由該外殼部142形成該容置部144,且該容置部144之一端供與該電連接單元12結合。 The seat unit 14 has a housing portion 142 and a receiving portion 144. The outer casing portion 142 forms a heat dissipation structure (for example, a fin fin heat dissipation structure, a sheet heat dissipation structure, and a columnar heat dissipation structure, as shown in FIG. 2), and the base unit 14 forms the capacity by the outer casing portion 142. The portion 144 is disposed, and one end of the receiving portion 144 is coupled to the electrical connection unit 12.

該基板16係設置於該容置部144之另一端。一併可參考第3圖,該第3圖係說明第1圖中基板16的詳細示意圖。於第3圖中,該基板16係具有基板162、電路佈局層164與散熱佈局層166,且該電路佈局層164與該散熱佈局層166係同時地形成在該基板162,又該電路佈局層164與該電連接單元12連接,用以接收該供應電壓,以及該散熱佈局層166係形成在基板162且非與該電路佈局層164重疊的部分。其中,該電路佈局層164與該電連接單元12連接的方式係可透過電線或電性接觸的方式傳導該供應電壓。 The substrate 16 is disposed at the other end of the receiving portion 144. 1 and FIG. 3, which is a detailed schematic view of the substrate 16 in FIG. In FIG. 3, the substrate 16 has a substrate 162, a circuit layout layer 164 and a heat dissipation layout layer 166, and the circuit layout layer 164 and the heat dissipation layout layer 166 are simultaneously formed on the substrate 162, and the circuit layout layer 164 is coupled to the electrical connection unit 12 for receiving the supply voltage, and the heat dissipation layout layer 166 is formed on the substrate 162 and does not overlap the circuit layout layer 164. The circuit layout layer 164 is connected to the electrical connection unit 12 in such a manner that the supply voltage can be conducted through wires or electrical contacts.

於另外一實施例,若該供應電壓係藉由前述的該電源轉換單元轉換,則該電路佈局層164係透過該電源轉換單元連接至該電連接單元12。 In another embodiment, if the supply voltage is converted by the power conversion unit, the circuit layout layer 164 is connected to the electrical connection unit 12 through the power conversion unit.

值得注意的是,於本實施例中,該電路佈局層164與該散熱佈局層166係形成在該基板162的同一側面,然而,於其它實施例中,該電路佈局層164與該散熱佈 局層166係可分別地設置在該基板162相對的側面。 It should be noted that, in this embodiment, the circuit layout layer 164 and the heat dissipation layout layer 166 are formed on the same side of the substrate 162. However, in other embodiments, the circuit layout layer 164 and the heat dissipation cloth are The local layers 166 can be disposed on opposite sides of the substrate 162, respectively.

再者,該電路佈局層164更包含傳輸該供應電壓之正性電壓的第一線路FL,以及傳輸該供應電壓之負性電壓的第二線路SL。此外,該電路佈局層164係自邊緣延伸至該基板162的中央部分,且在該中央部分具有複數連接點1642,用以供該光源模組18電性連接,於本實施例中,該等連接點1642係以提供10顆發光二極體連接為例說明。換言之,該電路佈局層164以縱向與橫向之至少其一者排列在該基板162的該中央部分。 Furthermore, the circuit layout layer 164 further includes a first line FL that transmits a positive voltage of the supply voltage, and a second line SL that transmits a negative voltage of the supply voltage. In addition, the circuit layout layer 164 extends from the edge to the central portion of the substrate 162, and has a plurality of connection points 1642 for electrically connecting the light source module 18 in the central portion. The connection point 1642 is exemplified by providing 10 LED connections. In other words, the circuit layout layer 164 is arranged in the central portion of the substrate 162 in at least one of a longitudinal direction and a lateral direction.

又,該電路佈局層164係形成電路區域1644與該散熱佈局層166係形成散熱區域1662,且該電路區域1644係小於該散熱區域1662。 Moreover, the circuit layout layer 164 forms a circuit region 1644 and the heat dissipation layout layer 166 forms a heat dissipation region 1662, and the circuit region 1644 is smaller than the heat dissipation region 1662.

另外,該基板16更包含複數孔洞168,該等孔洞168係設於該基板162。其中,該等孔洞168係例如可為透氣孔、出線孔與固定孔之至少其一者。 In addition, the substrate 16 further includes a plurality of holes 168 , and the holes 168 are disposed on the substrate 162 . The holes 168 may be, for example, at least one of a venting hole, an outlet hole, and a fixing hole.

回到第1圖,該光源模組18係設置於該基板162,且該光源模組18係透過該基板162接收該供應電壓而產生熱能與光源,且該熱能藉由該基板162傳導至該座體單元14。於本實施例中,該光源模組18係以複數發光單元182為例說明,該等發光單元182係可為平面投射光片(Chip On Board)或複數發光二極體。其中,該等發光單元182係集中地設置於該基板162的中央部分,且 該光源模組18係藉由該電路佈局層164接收該供應電壓,以及該光源模組18產生的熱能透過該散熱佈局層166散熱。 Returning to FIG. 1 , the light source module 18 is disposed on the substrate 162 , and the light source module 18 receives the supply voltage through the substrate 162 to generate thermal energy and a light source, and the thermal energy is transmitted to the substrate through the substrate 162 . Seat unit 14. In the embodiment, the light source module 18 is exemplified by a plurality of light emitting units 182, which may be a chip on board or a plurality of light emitting diodes. The light emitting units 182 are collectively disposed at a central portion of the substrate 162, and The light source module 18 receives the supply voltage through the circuit layout layer 164, and the heat generated by the light source module 18 is dissipated through the heat dissipation layout layer 166.

於一實施例中,該等發光單元182的具有正極端與負極端與散熱接點。其中,該正極端與該負極端係分別地連接該第一線路FL與該第二線路SL,以及該散熱接點係與該散熱區域1662連接。 In one embodiment, the light emitting units 182 have positive and negative ends and heat sink contacts. The positive terminal and the negative terminal are respectively connected to the first line FL and the second line SL, and the heat dissipation contact is connected to the heat dissipation region 1662.

於另外一實施例中,該等發光單元的該負極端係有可能取代該散熱接點,亦即該等發光單元的底部具有正極端與負極端。 In another embodiment, the negative end of the light emitting unit may replace the heat dissipating contact, that is, the bottom of the light emitting unit has a positive end and a negative end.

回到第1圖,該聚光單元20係形成容置槽202與導光體204。其中,該容置槽202形成在該導光體204的內部,且該聚光單元20供與該座體單元14結合,又該容置槽202對應於該光源模組18,而該導光體204將該光源以一擴散角度散發以形成該全周光源L射出,例如該擴散角度係不小於260度角。 Returning to FIG. 1 , the concentrating unit 20 forms the accommodating groove 202 and the light guide 204 . The accommodating groove 202 is formed in the interior of the light guiding body 204, and the concentrating unit 20 is coupled to the base unit 14. The accommodating groove 202 corresponds to the light source module 18, and the light guiding device The body 204 emits the light source at a diffusion angle to form the full-circumference light source L, for example, the diffusion angle is not less than 260 degrees.

其中,該導光體204係更具有入射面2042與出射面2044,使得該光源係透過該入射面2042入射至該導光體204,該光源係在該導光體204內進行反射與折射。其中,大部分該光源係經由該出射面2044出射,而部分的該光源係又反射至該導光體204中,最後經由多次的反射,並且在不規則形狀的該導光體204中,使得該光源 最後自出射面2044以形成該全周光源L,一併可參考第4圖,係說明第一實施例之光源照明裝置之聚光單元的詳細剖面與俯視示意圖。於第4圖中,該聚光單元20更進一步包含環狀部208與凹陷部2010,該環狀部208環繞該凹陷部2010,且該凹陷部2010係呈現倒錐形狀,以及該凹陷部2010之中心部分係鄰近該容置槽202。 The light guide body 204 further has an incident surface 2042 and an exit surface 2044, such that the light source enters the light guide body 204 through the incident surface 2042, and the light source is reflected and refracted in the light guide body 204. Wherein, most of the light source is emitted through the exit surface 2044, and part of the light source is reflected into the light guide body 204 again, and finally, through multiple reflections, and in the irregular shape of the light guide body 204, Make the light source Finally, the self-exiting surface 2044 is formed to form the full-circumferential light source L. One can refer to FIG. 4 to illustrate a detailed cross-sectional view and a plan view of the concentrating unit of the light source illuminating device of the first embodiment. In FIG. 4, the concentrating unit 20 further includes an annular portion 208 and a recessed portion 2010, the annular portion 208 surrounds the recessed portion 2010, and the recessed portion 2010 exhibits an inverted cone shape, and the recessed portion 2010 The central portion is adjacent to the accommodating groove 202.

於另外一實施例中,該聚光單元204更包含固定部206。其中,該固定部206係供該聚光單元204透過該等孔洞168固定於該座體單元14。 In another embodiment, the concentrating unit 204 further includes a fixing portion 206. The fixing portion 206 is configured to fix the concentrating unit 204 to the base unit 14 through the holes 168.

參考第5圖,係本創作第二實施例之光源照明裝置的結構示意圖。於第5圖中,該光源照明裝置10’除係該電連接單元12、該座體單元14、該基板16、該光源模組18與該聚光單元20之外,更可包含導熱膠層22。 Referring to Fig. 5, there is shown a schematic structural view of a light source lighting device of the second embodiment of the present invention. In FIG. 5 , the light source illumination device 10 ′ may further include a thermal conductive adhesive layer in addition to the electrical connection unit 12 , the base unit 14 , the substrate 16 , the light source module 18 , and the concentrating unit 20 . twenty two.

該導熱膠層22係塗覆在該散熱佈局層166之非與該基板接觸的側面,用以供該外殼部142在進行二次散熱之前,將該散熱佈局層166所散發的該熱能再進行散熱。 The thermal adhesive layer 22 is coated on the side of the heat dissipation layout layer 166 that is not in contact with the substrate, and the thermal energy emitted by the heat dissipation layout layer 166 is further performed before the second heat dissipation of the outer casing portion 142. Cooling.

一併參考第6圖,係說明該第5圖中該導熱膠層22形成在該基板16的詳細示意圖。於第6圖中,該基板16除具有該基板162、該電路佈局層164、該散熱佈局層166與該等孔洞1610之外,該散熱佈局層166更塗覆有該導熱膠層22。 Referring to Fig. 6, a detailed schematic view of the thermally conductive adhesive layer 22 formed on the substrate 16 in the fifth embodiment will be described. In FIG. 6 , the heat dissipation layout layer 166 is further coated with the thermal conductive adhesive layer 22 except for the substrate 162 , the circuit layout layer 164 , the heat dissipation layout layer 166 , and the holes 1610 .

本創作在上文中已以較佳實施例揭露,然熟習本項 技術者應理解的是,該實施例僅用於描繪本創作,而不應解讀為限制本創作之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本創作之範疇內。因此,本創作之保護範圍當以申請專利範圍所界定者為準。 This creation has been disclosed above in the preferred embodiment, but is familiar with this item. It should be understood by those skilled in the art that this embodiment is only used to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.

10、10’‧‧‧光源照明裝置 10, 10'‧‧‧Light source lighting

12‧‧‧電連接單元 12‧‧‧Electrical connection unit

14‧‧‧座體單元 14‧‧‧ seat unit

142‧‧‧外殼部 142‧‧‧ Shell Department

144‧‧‧容置部 144‧‧‧ 容部

16‧‧‧基板 16‧‧‧Substrate

162‧‧‧基板 162‧‧‧Substrate

164‧‧‧電路佈局層 164‧‧‧Circuit layout layer

1642‧‧‧連接點 1642‧‧‧ Connection point

1644‧‧‧電路區域 1644‧‧‧Circuit area

166‧‧‧散熱佈局層 166‧‧‧ Thermal layout layer

1662‧‧‧散熱區域 1662‧‧‧heating area

168‧‧‧孔洞 168‧‧‧ hole

18‧‧‧光源模組 18‧‧‧Light source module

182‧‧‧發光單元 182‧‧‧Lighting unit

20‧‧‧聚光單元 20‧‧‧ concentrating unit

202‧‧‧容置槽 202‧‧‧ accommodating slots

204‧‧‧導光體 204‧‧‧Light guide

2042‧‧‧入射面 2042‧‧‧Incoming surface

2044‧‧‧出射面 2044‧‧‧Outlet

206‧‧‧固定部 206‧‧‧ fixed department

208‧‧‧環狀部 208‧‧‧Rings

2010‧‧‧凹陷部 2010‧‧‧Depression

22‧‧‧導熱膠層 22‧‧‧thermal adhesive layer

PW‧‧‧電源 PW‧‧‧ power supply

L‧‧‧光源 L‧‧‧Light source

FL‧‧‧第一線路 FL‧‧‧First line

SL‧‧‧第二線路 SL‧‧‧second line

第1圖係本創作第一實施例之光源照明裝置的分解示意圖;第2圖係說明第1圖中座體單元之外殼部的俯視示意圖;第3圖係說明第1圖中基板的詳細示意圖;第4圖,係說明第一實施例之光源照明裝置之聚光單元的詳細剖面與俯視示意圖;第5圖係本創作第二實施例之光源照明裝置的結構示意圖;以及第6圖係說明該第5圖中導熱膠層形成在基板的詳細示意圖。 1 is an exploded perspective view of a light source illumination device according to a first embodiment of the present invention; FIG. 2 is a schematic plan view showing a housing portion of the base unit in FIG. 1; and FIG. 3 is a detailed schematic view of the substrate in FIG. 4 is a detailed sectional view and a plan view showing a concentrating unit of the light source lighting device of the first embodiment; FIG. 5 is a schematic structural view of the light source illuminating device of the second embodiment of the present invention; and FIG. 6 is a view The heat conductive adhesive layer in FIG. 5 is formed in a detailed schematic view of the substrate.

10‧‧‧光源照明裝置 10‧‧‧Light source lighting

12‧‧‧電連接單元 12‧‧‧Electrical connection unit

14‧‧‧座體單元 14‧‧‧ seat unit

142‧‧‧外殼部 142‧‧‧ Shell Department

144‧‧‧容置部 144‧‧‧ 容部

16‧‧‧基板 16‧‧‧Substrate

162‧‧‧基板 162‧‧‧Substrate

168‧‧‧孔洞 168‧‧‧ hole

18‧‧‧光源模組 18‧‧‧Light source module

182‧‧‧發光單元 182‧‧‧Lighting unit

20‧‧‧聚光單元 20‧‧‧ concentrating unit

202‧‧‧容置槽 202‧‧‧ accommodating slots

204‧‧‧導光體 204‧‧‧Light guide

2042‧‧‧入射面 2042‧‧‧Incoming surface

2044‧‧‧出射面 2044‧‧‧Outlet

206‧‧‧固定部 206‧‧‧ fixed department

PW‧‧‧電源 PW‧‧‧ power supply

L‧‧‧光源 L‧‧‧Light source

Claims (12)

一種光源照明裝置,係供在接收電源之後產生全周光源照明,該光源照明裝置係包含:電連接單元,係供接收該電源,且該電連接單元根據該電源產生相對應的供應電壓;座體單元,係具有散熱結構之外殼部與容置部,該座體單元藉由該容置部之一端供與該電連接單元結合;基板,係設置於該容置部之另一端,且該基板與該座體單元接觸結合,以及該基板與該電連接單元連接以接收該供應電壓;光源模組,係設置於該基板,該光源模組係透過該基板接收該供應電壓而產生熱能與光源,且該熱能藉由該基板傳導至該座體單元;以及聚光單元,係具有容置槽與導光體,且該容置槽形成在該導光體的內部,且該聚光單元供與該座體單元結合,又該容置槽對應於該光源模組,而該導光體將該光源以一擴散角度散發以形成該全周光源射出。 A light source lighting device for generating full-circumference light source illumination after receiving a power source, the light source lighting device comprising: an electrical connection unit for receiving the power source, and the electrical connection unit generates a corresponding supply voltage according to the power source; The body unit is a housing portion and a receiving portion having a heat dissipation structure, and the base unit is coupled to the electrical connection unit by one end of the receiving portion; the substrate is disposed at the other end of the receiving portion, and the The substrate is in contact with the base unit, and the substrate is connected to the electrical connection unit to receive the supply voltage; the light source module is disposed on the substrate, and the light source module receives the supply voltage through the substrate to generate thermal energy and a light source, and the thermal energy is transmitted to the base unit by the substrate; and the concentrating unit has a receiving groove and a light guiding body, and the receiving groove is formed inside the light guiding body, and the concentrating unit In combination with the body unit, the receiving groove corresponds to the light source module, and the light guiding body emits the light source at a diffusion angle to form the full-circumference light source. 如申請專利範圍第1項所述之光源照明裝置,其中該導光體係更包含環狀部與凹陷部,該環狀部環繞該凹陷部,且該凹陷部係呈現倒錐形狀,以及該凹陷部之中心部分係鄰近該容置槽。 The light source illumination device of claim 1, wherein the light guiding system further comprises an annular portion and a concave portion, the annular portion surrounding the concave portion, and the concave portion has an inverted cone shape, and the concave portion The central portion of the portion is adjacent to the receiving slot. 如申請專利範圍第2項所述之光源照明裝置,其中該擴 散角度係不小於260度角。 The light source lighting device of claim 2, wherein the expansion The angle of dispersion is not less than 260 degrees. 如申請專利範圍第1項所述之光源照明裝置,其中該基板更包含電路佈局層與散熱佈局層,該電路佈局層與該散熱佈局層係形成在該基板,又該電路佈局層與該電連接單元連接以接收該供應電壓,以及該散熱佈局層形成在基板且非與該電路佈局層重疊的部分。 The light source illumination device of claim 1, wherein the substrate further comprises a circuit layout layer and a heat dissipation layout layer, the circuit layout layer and the heat dissipation layout layer are formed on the substrate, and the circuit layout layer and the electricity The connection unit is connected to receive the supply voltage, and the heat dissipation layout layer is formed on the substrate and does not overlap the circuit layout layer. 如申請專利範圍第4項所述之光源照明裝置,其中該電路佈局層與該散熱佈局層形成在該基板之同一側面與相對的另一側面之至少其一者。 The light source illumination device of claim 4, wherein the circuit layout layer and the heat dissipation layout layer are formed on at least one of a same side and an opposite side of the substrate. 如申請專利範圍第5項所述之光源照明裝置,其中該電路佈局層係形成電路區域與該散熱佈局層係形成散熱區域,且該電路區域係小於該散熱區域。 The light source illumination device of claim 5, wherein the circuit layout layer forming circuit region and the heat dissipation layout layer form a heat dissipation region, and the circuit region is smaller than the heat dissipation region. 如申請專利範圍第4項所述之光源照明裝置,其中該外殼部之該散熱結構係為魚鰭狀散熱結構、片狀散熱結構與柱狀散熱結構之至少其一者,且該外殼部係將該散熱佈局層所散發的熱能進行二次散熱。 The light source illumination device of claim 4, wherein the heat dissipation structure of the outer casing portion is at least one of a fin fin heat dissipation structure, a sheet heat dissipation structure and a columnar heat dissipation structure, and the outer casing portion is The heat energy radiated from the heat dissipation layout layer is thermally dissipated twice. 如申請專利範圍第7項所述之光源照明裝置,更包含導熱膠層,係塗覆在該散熱佈局層之非與該基板接觸的一側面,用以供該外殼部在進行二次散熱之前,將該散熱佈局層所散發的熱能再進行散熱。 The light source lighting device of claim 7, further comprising a thermal conductive adhesive layer coated on a side of the heat dissipation layout layer that is not in contact with the substrate, wherein the outer casing portion is subjected to secondary heat dissipation. The heat energy radiated from the heat dissipation layout layer is further dissipated. 如申請專利範圍第1項所述之光源照明裝置,其中該光源模組係以縱向與橫向之至少其一者排列並設置在該基 板的中央部分。 The light source lighting device of claim 1, wherein the light source module is arranged in at least one of a longitudinal direction and a lateral direction and is disposed at the base The central part of the board. 如申請專利範圍第9項所述之光源照明裝置,其中該光源模組係為平面投射光片(Chip On Board)或複數發光二極體。 The light source illumination device of claim 9, wherein the light source module is a chip on board or a plurality of light emitting diodes. 如申請專利範圍第1項所述之光源照明裝置,其中該基板更包含複數孔洞,該等孔洞係設於該基板。 The light source illumination device of claim 1, wherein the substrate further comprises a plurality of holes, the holes being disposed on the substrate. 如申請專利範圍第11項所述之光源照明裝置,其中該聚光單元更包含固定部,該固定部係供該聚光單元透過該等孔洞固定於該座體單元。 The light source illuminating device of claim 11, wherein the concentrating unit further comprises a fixing portion, wherein the fixing portion is configured to fix the concentrating unit to the base unit through the holes.
TW101220318U 2012-10-22 2012-10-22 Light illumination device TWM461003U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI686688B (en) * 2018-06-08 2020-03-01 芝奇國際實業股份有限公司 Light guide element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI686688B (en) * 2018-06-08 2020-03-01 芝奇國際實業股份有限公司 Light guide element

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