TWM480162U - Thin film resistor - Google Patents

Description

Thin film resistor

The present invention is a thin film resistor, in particular, a thin film resistor that prevents moisture from penetrating into the interior.

Please refer to FIG. 2, which shows a schematic cross-sectional view of a thin film resistor. The structure of the thin film resistor includes a substrate 101, a surface electrode 103, a resistive layer 105, a plurality of insulating protective layers 106, 107, and a plurality of plating layers 109. , 111.

The surface electrodes 103 are disposed on both sides of the substrate 101. The resistance layer 105 covers the surface of the substrate 101 and extends onto the partial surface electrode 103. In the present embodiment, the plurality of insulating layers 106, 107 comprise a glass layer 106 and an insulating resin layer 107. The glass layer 106 covers the resistive layer 105. The insulating resin layer 107 covers the glass layer 106 and is formed as a multilayer insulating layer. The protective layer. The plating layer 109 is simultaneously extended to cover the insulating resin layer 107 and the surface electrode 103, and the other plating layer 111 covers the plating layer 109.

However, the thin film resistor is in a position as shown in the area A, that is, at the joint interface of the insulating resin layer 107 and the plating layer 109, because the characteristics of the two materials are different, resulting in poor bonding force of the interface, and external moisture may enter the interface. Internally affecting the resistive layer 105 adversely affects the electrical characteristics of the thin film resistor.

In order to solve the problem that the existing thin film resistor is susceptible to external moisture infiltration, the main purpose of the present invention is to provide a thin film resistor which improves the tightness of the component itself and prevents moisture from entering.

The novel thin film resistor includes:

An insulating substrate, two surface electrodes are disposed on both sides of the surface thereof;

a resistive layer disposed on a surface of the insulating substrate and located between the two surface electrodes, the resistive layer extending over a portion of each surface electrode;

An insulating protective layer is formed by completely covering the resistive layer and extending over a portion of each surface electrode;

An auxiliary conductive layer covering the surface of the insulating protective layer adjacent to the two surface electrodes and not extending to cover the surface electrode;

The plurality of layers of the plating layer are coated on both sides of the auxiliary conductive layer, the surface electrode and the insulating substrate.

The auxiliary conductive layer is a resin-based conductive material, and can form a good tight bond with the plating layer and the insulating protective layer at the same time. Therefore, when the auxiliary conductive layer is coated on the insulating protective layer and then subjected to the plating operation, the plating layer can be tight at the same time. Covering the auxiliary conductive layer provides a good adhesion effect, preventing moisture from entering the inside of the thin film resistor and affecting the resistance layer.

Please refer to FIG. 1 , which is a schematic cross-sectional view of a thin film resistor including an insulating substrate 10 , two surface electrodes 11 , a resistive layer 12 , an insulating protective layer 13 , an auxiliary conductive layer 14 , and a plurality of Electroplated layers 15, 16.

The two surface electrodes 11 are provided on both sides of the surface of the insulating substrate 10.

The resistive layer 12 is disposed on the surface of the insulating substrate 10 and is located between the two surface electrodes 11 and extends to cover a portion of each of the surface electrodes 11. Therefore, the resistive layer 12 can electrically connect the two surface electrodes 11.

The insulating protective layer 13 covers all of the resistive layers 12 and extends outwardly to cover a portion of each surface electrode. In the preferred embodiment, the insulating protective layer 13 is gradually accumulated in a plurality of printing manners and extended to a predetermined position, and the material thereof may be composed of an insulating resin.

The auxiliary conductive layer 14 covers the insulating protective layer 13 close to the two surface electrodes 11 and does not extend to cover the surface electrode 11. The auxiliary conductive layer 14 is a resin-based conductive paint layer, that is, composed of resin-mixed conductive particles.

The plurality of plating layers 15 and 16 cover the auxiliary conductive layer 14, the surface electrode 11 and both sides of the insulating substrate 10 layer by layer.

The auxiliary conductive layer 14 of the present invention can produce a good bonding force with the plating layer 15 and the insulating protective layer 13, so when the auxiliary conductive layer 14 is coated on the insulating protective layer 13 and then subjected to the plating operation, the subsequently covered plating layer 15 can tightly cover the surface of the auxiliary conductive layer 14 and the surface electrode 11, providing a good adhesion effect, preventing moisture from entering the inside of the thin film resistor without affecting the resistance layer 12, maintaining the thin film resistor Good electrical properties. Moreover, the present invention can provide a good protective effect on the resistive layer 12 by using only one insulating protective layer 13, and does not need to be stacked with different materials such as resin or glass to form a protective layer, because the protective layer of a plurality of materials is stacked. It is necessary to consider the interfacial bonding of the different materials and the bonding with the surface electrode 11 and the insulating substrate 10. If the mutual bonding of different materials is not good, the anti-waterproof effect is obtained. Therefore, the present invention uses a single material insulating protective layer. 13 can avoid the combination of poor protection to achieve the protection effect, so the process is also simplified.

10‧‧‧Insert substrate
11‧‧‧ surface electrode
12‧‧‧resistance layer
13‧‧‧Insulating protective layer
14‧‧‧Auxiliary Conductive Layer
15,16‧‧‧Electroplating
101‧‧‧Substrate
103‧‧‧ surface electrode
105‧‧‧resistance layer
106‧‧‧ glass layer
107‧‧‧Insulating resin layer
109,111‧‧‧Electroplating

Figure 1: Schematic diagram of the novel thin film resistor. Figure 2: A schematic cross-sectional view of a conventional thin film resistor.

10‧‧‧Insert substrate

11‧‧‧ surface electrode

12‧‧‧resistance layer

13‧‧‧Insulating protective layer

14‧‧‧Auxiliary Conductive Layer

15,16‧‧‧Electroplating

Claims (3)

A thin film resistor comprising: an insulating substrate, two surface electrodes disposed on two sides of a surface thereof; a resistive layer disposed on a surface of the insulating substrate and located between the two surface electrodes, the resistive layer extending to cover each a portion of the surface electrode; an insulating protective layer completely covering the resistive layer and extending over a portion of each surface electrode; an auxiliary conductive layer covering the surface of the insulating protective layer adjacent to the two surface electrodes, and not extending Covering the surface electrode; a plurality of layers of plating layer coating the auxiliary conductive layer, the surface electrode and both sides of the insulating substrate layer by layer. The thin film resistor according to claim 1, wherein the auxiliary conductive layer is a resin-based conductive paint layer. The thin film resistor according to claim 1 or 2, wherein the plurality of plating layers comprise a first plating layer and a second plating layer.