TWM479511U - Nozzle - Google Patents

Description

nozzle

This creation relates to a nozzle, particularly to a nozzle for increasing air tightness and reducing particle sticking.

In the semiconductor process, the nozzles are mounted on the wafer transfer cassette storage table, and when the wafer transfer cassette is placed on the wafer transfer cassette storage table, the air inlets of the wafer transfer cassette are aligned and connected through the positioning pins. The nozzle, through which the gas (for example, nitrogen) is filled into the wafer transfer cassette, prevents the wafer contained in the wafer transfer cassette from being oxidized and contaminated by particles. Recently, as the size of the semiconductive member is miniaturized, the demand for reducing the particles is becoming stricter, and it is desirable that the nozzle can have characteristics of reducing particle adhesion at the same time in addition to the gas.

In addition, due to the poor surface flatness of the nozzle, vibration and air leakage problems often occur when nitrogen is filled into the wafer transfer cassette. Therefore, how to create a nozzle for reducing particle adhesion while increasing the airtightness between the nozzle and the wafer cassette will be actively disclosed by the present invention.

One of the purposes of this creation is to increase the airtightness between the nozzle and the wafer transfer cassette to prevent particles from being brought into the gas transfer path from the interface between the wafer transfer cassette and the nozzle and into the wafer transfer cassette.

Another object of the present invention is to provide a nozzle for reducing particle adhesion, which can further reduce the introduction of particles into the wafer transfer cassette when the wafer transfer cassette is placed on the storage table and must be in contact with the nozzle. The chance.

For the above purposes and other purposes, the nozzles of the present invention are used to be placed on a wafer transfer cassette storage table to engage the wafer transfer cassette for gas transport, including an upper portion, a mounting portion, and a consistent aperture. The upper portion has a first annular convex portion and a second annular convex portion protruding from a top surface thereof. The mounting portion is connected to the upper portion and extends downward from the upper portion for mounting and fixing to the wafer transfer cassette storage table. The through hole extends through the upper portion and the mounting portion. The first annular convex portion and the second annular convex portion surround the through hole.

In an embodiment of the present invention, the first annular convex portion and the second annular convex portion are respectively annularly disposed on the top surface of the upper portion centering on the through hole.

In an embodiment of the present invention, the height of the first annular convex portion is the same as the height of the second annular convex portion.

In an embodiment of the present invention, an anti-dust coating is further included, and the anti-dust coating is applied to the surface of the upper portion.

In an embodiment of the present creation, the coating is a high molecular polymer.

Thereby, the nozzle of the present invention enhances the airtightness between the nozzle and the wafer transfer cassette by the structure of the first annular convex portion and the second annular convex portion, and further transmits the airtightness Anti-dust coating to reduce the adhesion of particles on the nozzle, so that the nozzle of the present invention can not only bring the surrounding particles into the air passage by close contact with the wafer cassette, the anti-dust coating The adhesion of the particles on the nozzle can be avoided, and the disadvantage that the particles in the process of engaging the wafer transfer box with the nozzle are further avoided.

In order to fully understand the purpose, features and effects of this creation, the following specific examples, together with the attached drawings, provide a detailed description of the creation, as explained below:

First, please refer to Figures 1 to 3 at the same time. Figure 1 is a perspective view of the nozzle in the embodiment of the present invention, and Figure 2 is a cross-sectional view of the nozzle of Figure 1 along the line A-A'. The top view of the nozzle of Figure 1. The nozzle 1 of the present invention includes an upper portion 11, a mounting portion 12, and a constant hole 13.

The upper portion 11 is used to interface with the wafer transfer cassette, and the top surface 111 is coupled to the interface of the bottom of the wafer transfer cassette for the wafer transfer cassette storage table to deliver gas through the through hole 13 of the nozzle 1 to Inside the wafer transfer box. The upper portion 11 has a first annular convex portion 112 and a second annular convex portion 113 protruding from the top surface 111 thereof. The convex portions 112 and 113 are used for better close contact with the wafer transfer cassette. . Through the arrangement of the first annular convex portion 112 and the second annular convex portion 113 around the through hole 13 , the present invention provides two convex portions 112 , 113 for stopping particles or dust from entering the through hole 13 , and also This is in close proximity to the interface of the bottom of the wafer transfer box. The convex portions 112 and 113 surrounding the through hole 13 in this embodiment are exemplified by a circular shape. However, other shapes are as follows: Square, oval, triangle, etc. can be applied to this creation, and the corresponding configuration can be made according to the requirements.

In a preferred embodiment, the first annular protrusion 112 and the second annular protrusion 113 have the same height on the top surface 111 of the upper portion 11. Further, the through hole 13 is The center is separately connected, thereby further increasing the degree of adhesion of the wafer transfer cassette through the nozzle 1 to the wafer transfer cassette storage table, thereby further improving the airtight effect, so that the nozzle 1 of the present invention can be further improved. It is more difficult to bring surrounding particles into the airway by intimate contact with the wafer transfer cassette.

The mounting portion 12 is connected to the upper portion 11 and extends downwardly from the upper portion 11 for mounting and fixing to the wafer transfer cassette storage table, so that the nozzle 1 of the present invention can be mounted to the wafer by the mounting portion 12. On the box storage table. The through hole 13 extends through the upper portion 11 and the mounting portion 12 for providing a desired passage into the wafer transfer cassette.

In a further embodiment of the present invention, the nozzle 1 further comprises an anti-dust coating 14 (see Figure 2). For example, the anti-dust coating 14 can be applied by physical or chemical means under vacuum. A vapor deposition processing technique is formed to further uniformly and tightly form the coating particles on the surface of the upper portion 11 of the nozzle 1 so that the surface of the nozzle is smooth, and the adhesion of the particles on the nozzle can be further prevented. The dust coating 14 can also be applied to other parts of the nozzle 1 as needed. Therefore, the anti-dust coating 14 formed by the vapor deposition technique has a uniform thickness and no micro pinholes on the surface, and has excellent applicability and a low coefficient of friction, so that the surface of the upper portion 11 of the nozzle 1 is smooth, and is not only dust-proof. It reduces the effect of particle adhesion and is also easy to be wiped and cleaned.

In addition, the anti-dust coating 14 can be a high molecular polymer, and has better solvent resistance and acid and alkali resistance, thereby greatly improving the quality and service life of the nozzle 1.

4 and 5, FIG. 4 is a perspective view showing the nozzle 1 disposed on the wafer transfer cassette storage table 2. FIG. 5 is a wafer transfer cassette 3 placed through the nozzle 1 and placed in the wafer transfer cassette for storage. A three-dimensional diagram on the table 2. The nozzle 1 is fixed to the wafer cassette storage table 2 by its mounting portion. When the wafer transfer cassette 3 is placed on the wafer transfer cassette storage table 2, the connection portion at the bottom of the wafer transfer cassette 3 (not shown) The nozzle 1 is coupled to the nozzle 1 to allow the through hole of the nozzle 1 to communicate with the wafer transfer cassette 3 for gas delivery.

In summary, the nozzle of the present invention enhances the airtightness between the nozzle and the wafer transfer cassette by the structure of the first annular convex portion and the second annular convex portion. Further, Through the anti-dust coating, the effect of reducing the particle adhesion on the nozzle is achieved, so that the nozzle of the present invention can prevent the particles from being brought into the gas transmission channel and into the wafer transfer box from the interface between the wafer cassette and the nozzle. Further, the probability of the particles being carried into the wafer transfer cassette is further reduced, thereby avoiding the disadvantage that the particles in the process of joining the wafer transfer cassette and the nozzle are brought in.

The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of patent application.

1‧‧‧ nozzle
2‧‧‧ wafer transfer box storage table
3‧‧‧ wafer transfer box
11‧‧‧ upper
111‧‧‧ top surface
112‧‧‧First annular convex
113‧‧‧Second annular projection
12‧‧‧Installation Department
13‧‧‧Tongkong
14‧‧‧Anti-dust coating
A-A'‧‧‧ line segment

Fig. 1 is a perspective view of a nozzle according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of the nozzle of Fig. 1 taken along line A-A'. Figure 3 is a top view of the nozzle of Figure 1. Figure 4 is a perspective view showing the nozzles disposed on the wafer transfer cassette storage table. Figure 5 is a perspective view of the wafer transfer cassette placed on the wafer transfer cassette storage table through the nozzle.

1‧‧‧ nozzle

111‧‧‧ top surface

112‧‧‧First annular convex

113‧‧‧Second annular projection

13‧‧‧Tongkong

A-A’‧‧‧ segment

Claims (5)

A nozzle is disposed on a wafer transfer cassette storage table for engaging a wafer transfer cassette for gas transmission, comprising: an upper portion having a first annular convex portion protruding from a top surface thereof and a first a second annular projection; a mounting portion that connects the upper portion and extends downwardly from the upper portion for mounting and fixing to the wafer transfer cassette storage table; and a continuous hole extending through the upper portion and the mounting portion, wherein The first annular convex portion and the second annular convex portion surround the through hole. The nozzle of claim 1, wherein the first annular convex portion and the second annular convex portion are respectively annularly disposed on a top surface of the upper portion centering on the through hole. The nozzle of claim 2, wherein the height of the first annular convex portion is the same as the height of the second annular convex portion. The nozzle of any one of claims 1 to 3, further comprising an anti-dust coating applied to the surface of the upper portion. The nozzle of claim 4, wherein the coating is a high molecular polymer.