TWM478948U - Multilayer stack structure of induction coils module - Google Patents

Description

Multi-layer stack structure of induction coil module

The present invention is a multi-layer stack structure of an induction coil module, and particularly relates to a multi-layer stack structure in an induction coil module used in a portable device.

Portable electronic devices, such as mobile phones, PDAs (personal digital assistants), palmtop computers, notebook computers or tablets, etc., are all powered by batteries, so that users can use them when there is no mains power, and These electronic devices come with a wired power supply for battery charging or utility power.

The new type of wireless charging (WLC) technology allows portable devices to use no power lines, but can directly transmit power to the portable device to charge the battery by means of electromagnetic induction. As shown in FIG. 1 , it is a schematic diagram of a conventional wireless charging transmission, including a power transmission module 10 and a power receiving module 20 . The power transmission module 10 has a transmitting end coil 11 and a transmitting end core plate. 12, the power receiving module 20 also has a receiving end coil 21 and a receiving end core plate 22. When the power receiving module 20 is close to the power transmitting module 10, a current flows through the transmitting end coil 11 of the power transmitting module 10 to generate a magnetic field, so that the receiving end coil 21 of the power receiving module 20 senses the magnetic field generating current. .

In addition, in the portable electronic device, Near Field Communication (NFC) module can be combined, and the Near Field Communication (NFC) module can provide portable devices with non-contact point-to-point communication, which is extremely convenient. Connection method for quick and easy communication.

Both the near field communication (NFC) module and the wireless charging (WLC) module require the use of induction coils. Therefore, the applicant of this case filed a new patent No. 100136884 on November 12, 2011, "Induction mode shared by near field communication and wireless charging. "Group" and "New Patent No. 100136883" "Selection Method and Selection Circuit of Near Field Communication and Wireless Charging Sharing Sensing Module", integrating the near-field communication (NFC) module and the wireless charging (WLC) module's sensing coil An induction core is used, and a set of line selection circuits are used to automatically switch the signals to achieve the purpose of sharing the sensing module and automatically switching the selection.

However, there are other induction coils on the portable device, such as Bluetooth module, WIFI module, LTE module or other 3G module, etc., and the current induction coils are independent of each other, and must use their respective The sensing module receives the signals of different frequencies. If the sensing modules of different frequency signals are designed on the same core board, mutual interference may occur, which makes the portable electronic device more and more light and short. In terms of internal space, integration is quite difficult.

To this end, the creator of the case designed an induction coil module for use on a portable device, which has a multi-layer induction coil stack structure, which can combine a wireless charging module, a near field communication module and any other induction coil module. In a coil module, the signal is automatically switched by a set of switching circuits to achieve the purpose of multiplexing and sharing the induction coil module.

In order to achieve the above object, the present invention provides a multi-layer stack structure of an induction coil module, comprising a first induction plate; a first coil is disposed on the first surface of the first induction plate, and is wound into a planar shape of a central hollow; a second sensing plate is stacked on the first surface of the first sensing plate, and the second sensing plate is smaller in size than the first sensing plate and is received in the center hollow of the first coil; and at least one second coil is disposed on The second surface of one of the second sensing plates is wound into a planar shape with a central hollow.

In order to achieve the above object, the present invention provides a multi-layer stack structure of the above-mentioned induction coil module, wherein the second sensor board comprises a plurality of layers of the second sensor board layer stack, and the second surface of each second sensor board is disposed on the second surface. The second coil is wound into a planar hollow shape, and the second sensing plate of each upper layer is smaller in size than the second sensing plate of the next layer, and is accommodated in the central hollow of the second coil of the lower layer.

In order to achieve the above object, the present invention provides a multi-layer stack structure of the above-mentioned induction coil module, wherein the center of the first sensor board and the second sensor board can be uniformly perforated, and a core post is embedded in the through hole, and is convex. Extending from the second surface of the second sensing plate, and the second coil is wrapped around the outer side of the core post.

In order to achieve the above object, the present invention provides a multi-layer stack structure of the above-mentioned induction coil module, which further includes: a first adhesive layer disposed on the first surface of the first sensor board for using the second sensor board and the first The coil is adhered to the first surface of the first sensing plate; at least one second adhesive layer is disposed on the second surface of the second sensing plate, and the second sensing plate and the second coil of the upper layer are adhered to the second sensing layer of the lower layer And a third adhesive layer is disposed on the second surface of the uppermost second sensing plate for bonding the second coil of the uppermost layer to the second sensing plate of the uppermost layer.

10‧‧‧Power transmission module

11‧‧‧Transmission end coil

12‧‧‧Transport end core plate

20‧‧‧Power receiving module

21‧‧‧ receiving coil

22‧‧‧ receiving end core plate

30‧‧‧Induction coil module

31‧‧‧First sensor board

311‧‧‧ first surface

32‧‧‧Second sensor board

32'‧‧‧3rd sensor board

321‧‧‧ second surface

321'‧‧‧ third surface

33‧‧‧through holes

34‧‧‧ iron core column

41‧‧‧First coil

42‧‧‧second coil

42’‧‧‧third coil

51‧‧‧First adhesive layer

52‧‧‧Second Adhesive Layer

53‧‧‧ third adhesive layer

60‧‧‧Selection circuit

61‧‧‧Line selection unit

611‧‧‧Selection

612‧‧‧Common

613‧‧‧shared end

62‧‧‧Functional Wafer Unit

63‧‧‧Control unit

L1, L2‧‧‧ gap

Figure 1 is a schematic diagram of the architecture of a conventional wireless charging transmission.

FIG. 2 is a schematic top view of an embodiment of the creation of a two-layer sensor board stack.

Figure 3 is a perspective exploded view of the embodiment of Figure 2.

Figure 4 is a side elevational view of the embodiment of Figure 2.

FIG. 5 is a schematic top view of an embodiment of a two-layer sensor board stack capable of having a core post.

Figure 6 is an exploded perspective view of the fifth embodiment of the Figure.

FIG. 7 is a schematic top view of an embodiment of the creation of a three-layer sensor board stack.

Figure 8 is an exploded perspective view of the embodiment of Figure 7.

Figure 9 is a side elevational view of the embodiment of Figure 7.

FIG. 10 is a top view showing an embodiment of a three-layer sensor board stack capable of having a core post.

Figure 11 is a perspective exploded view of Figure 10.

Figure 12 is a circuit diagram of the first embodiment of the inventive induction coil selection circuit.

FIG. 13 is a schematic circuit diagram of a second embodiment of the inventive induction coil selection circuit.

FIG. 14 is a schematic circuit diagram of a third embodiment of the inventive induction coil selection circuit.

The present invention firstly uses a two-layer stacked sensor board as an example. Please refer to FIG. 2, FIG. 3 and FIG. 4 together. FIG. 2 is a schematic diagram of an embodiment of the creation of a two-layer sensor board stack. 2 is a schematic exploded perspective view of the embodiment of FIG. 2, and FIG. 4 is a schematic side view of the embodiment of FIG. In this embodiment, the inductive coil module 30 includes a layer of first sensing plates 31 and a The first coil 41, the second inductive plate 32 and the second coil 42 are disposed on the first surface of the first inductive plate 31, and are wound into a planar hollow plane. The second inductive plate 32 is formed. Stacked on the first surface 311 of the first sensing plate 31, and the second sensing plate 32 is smaller than the first sensing plate 31 and received in the central hollow of the first coil 41, preferably, the first coil There is a gap L1 between the 41 and the second sensing plate. The second coil 42 is disposed on the second surface 321 of the second sensing plate 32, and is also wound into a planar shape that is hollowed out at the center. The first sensing plate 31 and the second sensing plate 32 may be rectangular, circular, elliptical or other polygonal shapes, etc., and any of the above shapes may be combined, but the shape of the sensing plate of the present invention is not limited to the aforementioned shape.

As shown in FIG. 3 and FIG. 4 , the inductive coil module 30 further includes a first adhesive layer 51 and a second adhesive layer 52 . The first adhesive layer 51 is disposed on the first sensing plate 31 and the second sensing plate 32 . Between the first coils 41, the second sensing plate 32 and the first coil 41 are adhered to the first surface 311 of the first sensing plate 31, and the second adhesive layer 52 is disposed on the second sensing plate 32 and the second The second coil 42 is adhered to the second surface 321 of the second sensing plate 32. Preferably, the first adhesive layer 51 or the second adhesive layer 52 can be a double-sided tape. Or adhesive.

In addition, please refer to FIG. 5 and FIG. 6 together. FIG. 5 is a schematic top view of an embodiment of a two-layer induction board stack having a core column, and FIG. 6 is an exploded perspective view of the fifth embodiment. The structure of this embodiment is substantially the same as that of the embodiment of FIG. 3. The difference is that the first insulative plate 31 and the second inductive plate 32 are respectively provided with a continuous through hole 33 at the center of the second inductive plate 31, in other words, the through hole 33 is in the first coil 41 and The center of the second coil 42 is hollowed out, and the embodiment further includes a core post 34 embedded in the through hole 33, but protruding from the second surface 321 of the second sensing plate 32, so that the second coil 42 is surrounded by iron. The outer side of the stem 34. Preferably, there is a gap L2 between the second coil 42 and the core post 34. Preferably, the core studs 34 can be used in the through holes 33 using an adhesive.

The following is a detailed description of the embodiment of the three-layer or more-layer sensor board stack of the present invention. For convenience of description, the three-layer sensor board stack is taken as an example, but the present embodiment is not limited to only three layers. Please refer to FIG. 8 and FIG. 9, FIG. 7 is a schematic top view of the embodiment of the three-layer stacked sensor board of the present invention, FIG. 8 is an exploded perspective view of the embodiment of FIG. 7, and FIG. 9 is a side view of the embodiment of FIG. . In this embodiment, the inductive coil module 30 includes a first inductive plate 31 and a plurality of second inductive plates 32. In this embodiment, the second inductive plate 32 of the second layer is stacked in layers, that is, the third inductive plate 32. 'Stacked on the second sensing board 32. Similarly, the first surface 311 of the first sensing board 31 is provided with a first coil 41, which is wound into a planar shape of the center hollow, and the second sensing board 32 is stacked first. The first surface 311 of the sensing plate 31 is received in the central hollow of the first coil 41, and the second surface 321 of the second sensing plate 32 is disposed with a second coil 42 wound into a planar shape with a central hollow, and The third sensing plate 32' is smaller in size than the second sensing plate 32 and is received in the central hollow of the second coil 42. The third surface 321' of the third sensing plate 32' is disposed with a third coil 42'. The four-, five-, or more-layer sensing board stack of the present invention is the same as the three-layer sensing board stack, and therefore will not be described again.

As shown in FIG. 8 and FIG. 9 , the induction coil module 30 further includes a first adhesive layer 51 and a plurality of second adhesive layers 52. In this embodiment, the second adhesive layer 52 is a two-layer adhesive layer 52. The second adhesive layer 52 and the third adhesive layer 53 are disposed between the first sensing board 31 and the second sensing board 32 and the first coil 41 for using the second sensing board 32 and the first coil The first adhesive layer 52 is disposed on the first surface 311 of the first sensor board 31, and the second adhesive layer 52 is disposed between the second sensor board 32 and the third sensor board 32' and the second coil 42 for using the third sensor. The plate 32' and the second coil 42 are adhered to the second surface 321 of the second sensing plate 32, and the third adhesive layer 53 is disposed between the third sensing plate 32' and the third coil 42' for The third coil 42' is adhered to the third surface of the third sensing plate 32' Preferably, the first adhesive layer 51, the second adhesive layer 52 or the third adhesive layer 53 may be a double-sided tape or an adhesive.

In addition, please refer to the tenth and FIG. 11 together. FIG. 10 is a schematic diagram of an embodiment of a three-layer sensor board stack with a core column. FIG. 11 is a perspective exploded view of FIG. The structure of this embodiment is substantially the same as that of the embodiment of FIG. 7. The difference is that the first inductive plate 31 and the second inductive plate 32 of the second layer are respectively provided with a continuous through hole 33. In other words, the through hole 33 is at the first The center of the coil 41 and all the second coils 42 are hollowed out, and the embodiment further includes a core post 34 embedded in the through hole 33, but protruding from the second surface 321' of the uppermost second sensing plate 32', The second coil 42' of the uppermost layer is caused to surround the outer side of the core post 34. Preferably, the iron core post 34 can be used in the through hole 33 using an adhesive.

As shown in the embodiment of FIG. 2, the first coil 41 and the second coil 42 may be wireless charging (WLC) or near field communication (NFC) induction coils respectively, because the first coil 41 and the second coil 42 are different from each other. The induction coil of the frequency signal, so that the two sets of induction coils 41, 42 can determine the frequency induced by the induction coil by a selection circuit, and automatically select the induction coil electrically connected to one of the groups. Similarly, as shown in the embodiment of FIG. 7, the first coil 41 and the second coil 42 of the plurality of layers may be a wireless charging (WLC) induction coil, a near field communication (NFC) induction coil, a Bluetooth antenna, a WIFI antenna, and an LTE antenna, respectively. Or 3G antennas...etc., or any combination of the above functional coils or antennas. The coils or antennas of various functions are induction coils of different frequencies. Therefore, the selection frequency can also be used to determine the frequency sensed, and the one or more sets of induction coils are electrically connected.

FIG. 12 is a schematic circuit diagram of a first embodiment of the present invention. In this embodiment, a three-layer induction coil module 30 is taken as an example. The selection circuit 60 includes a line selection unit 61, a functional chip unit 62, and a control unit 63. The selection unit 61 is provided with three selection ends 611 electrically connected to the first coil 41 and the two second coils 42 and 42', respectively, and the first coil 41 can sense a first frequency signal, and a second coil 42 can sense one. The second frequency signal, the other second coil 42' can sense a third frequency signal.

The functional chip unit 62 is a multi-function module integrated into a single chip, and the functional modules include a wireless power (WLC) function module, a near field communication (NFC) function module, a Bluetooth function module, and a WIFI function module. Group, LTE function module or 3G function module, etc., any combination of the above function modules. The functional chip unit 62 is electrically connected to the common terminal 612 of the line selection unit 61, and is selectively electrically connected to any of the selection terminals 611 through the selection of the line selection unit 61, so that the functional wafer unit 62 is electrically connected to the first coil 41 or Any of the second coils 42, 42' to capture the first frequency signal, the second frequency signal, or the third frequency signal. The control unit 63 is electrically connected to the function chip unit 62 and the line selection unit 61. The control unit 63 can determine that the frequency signal induced by the induction coil module 30 is a first frequency signal, a second frequency signal or a third frequency signal. The control line selection unit 61 switches the selection terminal 611 to electrically connect the first coil 41 or any of the second coils 42, 42'.

As shown in FIG. 13, it is a schematic circuit diagram of a second embodiment of the circuit for selecting an induction coil. In this embodiment, the first coil 41 and the two second coils 42 and 42' are each electrically connected to a common end 613. Therefore, one of the selection terminals 611 of the line selection unit 61 is often connected to the common terminal 613. The other selection terminal 611 of the line selection unit 61 can be selectively electrically connected to the first coil 41 or any of the second coils 42, 42 ′ so that the functional wafer unit 62 can be electrically connected to the first coil 41 or any of the first The two coils 42, 42' are for extracting the first frequency signal, the second frequency signal or the third frequency signal.

As shown in FIG. 14, it is a schematic circuit diagram of a third embodiment of the present invention. In this embodiment, the three-layer induction coil is still taken as an example, and the selection circuit 60 includes The line selection unit 61, the three functional chip units 62 and the control unit 63, wherein the line selection unit 61 is provided with three selection ends 611 electrically connected to the first coil 41 and the two second coils 42, 42', respectively. The coil 41 can sense a first frequency signal, wherein a second coil 42 can sense a second frequency signal and another second coil 42' can sense a third frequency signal.

The functional modules of the three functional chip units 62 can respectively include a wireless power (WLC) function module, a near field communication (NFC) function module, a Bluetooth function module, a WIFI function module, an LTE function module or 3G. Function modules...etc., any combination of the above functional modules. The functional chip unit 62 is electrically connected to the common terminal 612 of the line selection unit 61, and is selectively electrically connected to any of the selection terminals 611 through the selection of the line selection unit 61, so that the functional wafer unit 62 is electrically connected to the first coil 41 or Any of the second coils 42, 42' to capture the first frequency signal, the second frequency signal, or the third frequency signal. The control unit 63 is electrically connected to all the functional chip units 62 and the line selection unit 61. The control unit 63 can determine that the frequency signal induced by the induction coil module 30 is the first frequency signal, the second frequency signal or the third frequency signal. The control line selection unit 61 switches the selection terminal 611 to electrically connect the first coil 41 or any of the second coils 42, 42'.

In this embodiment, the first coil 41 and the two second coils 42 and 42' are each electrically connected to a common end 613. Therefore, one of the selection terminals 611 of the line selection unit 61 is often connected to the common terminal 613. The other selection terminal 612 of the line selection unit 61 can be selectively electrically connected to the first coil 41 or any of the second coils 42 and 42', so that the functional wafer unit 62 can be electrically connected to the first coil 41 or any of the first The two coils 42, 42' are for extracting the first frequency signal, the second frequency signal or the third frequency signal.

The job is that this creation can indeed provide a design that is quite different from the well-known ones by the above-mentioned techniques, which can improve the overall use value, and it has not been seen in publications or public before the application. Open use, Cheng has already met the requirements of the new patent, and proposed a new type of patent application according to law.

30‧‧‧Induction coil module

31‧‧‧First sensor board

311‧‧‧ first surface

32‧‧‧Second sensor board

321‧‧‧ second surface

33‧‧‧through holes

34‧‧‧ iron core column

41‧‧‧First coil

42‧‧‧second coil

51‧‧‧First adhesive layer

52‧‧‧Second Adhesive Layer

Claims (16)

A multi-layer stack structure of an induction coil module, comprising: a first induction plate; a first coil disposed on a first surface of the first induction plate and wound into a planar shape with a central hollow; at least one second induction a board stacked on the first surface of the first sensing board, wherein the second sensing board is smaller in size than the first sensing board and received in a central cutout of the first coil; and at least a second coil And disposed on the second surface of one of the second sensing plates, and wound into a planar shape with a central hollow. The multi-layer stack structure of the induction coil module of claim 1, wherein the second sensor board comprises a plurality of second sensor board layer stacks, and the second surface of each second sensor board The second coil is arranged to be wound into a planar hollow shape, and the second sensing plate of each upper layer is smaller than the second sensing plate of the next layer, and is accommodated in the central hollow of the second coil of the lower layer. . The multi-layer stack structure of the induction coil module of claim 1, wherein the first induction plate and the second induction plate are provided with a continuous perforation at a center thereof, and a core post is embedded in the through hole. And protruding from the second surface of the second sensing plate, and the second coil is wrapped around the outer side of the core column. The multi-layer stack structure of the induction coil module according to claim 3, wherein the shape of the iron core column is a circular column shape, an elliptical column shape, a rectangular column shape, a triangular column shape or a polygonal column shape. The through hole should be a circular hole, an elliptical hole, a rectangular hole, a triangular hole or a multilateral Shaped hole. The multi-layer stack structure of the induction coil module of claim 1, further comprising: a first adhesive layer disposed on the first surface of the first sensor board for using the second sensor board And the first coil is adhered to the first surface of the first sensing plate; and the at least one second adhesive layer is disposed on the second surface of the second sensing plate for bonding the second coil to the second surface On the sensor board. The multi-layer stack structure of the induction coil module of claim 2, further comprising: a first adhesive layer disposed on the first surface of the first sensor board for using the second sensor board And the first coil is adhered to the first surface of the first sensor board; at least one second adhesive layer is disposed on the second surface of the second sensor board for the second sensor board of the upper layer and the a second coil is adhered to the second sensing plate of the lower layer; and a third adhesive layer is disposed on the second surface of the uppermost second sensing plate for bonding the second coil of the uppermost layer to the second coil The second sensor board on the uppermost layer. The multi-layer stack structure of the induction coil module of claim 5, wherein the first or second adhesive layer is a double-sided tape or an adhesive. The multi-layer stack structure of the induction coil module of claim 6, wherein the first, second or third adhesive layer is a double-sided tape or an adhesive. The multi-layer stack structure of the induction coil module of claim 1, wherein a gap is formed between the first coil and the second induction plate. The multi-layer stack structure of the induction coil module according to claim 2, wherein the A gap is formed between the second coil and the second sensing plate of the upper layer. The multi-layer stack structure of the induction coil module of claim 2, further comprising a selection circuit, the selection circuit comprising: a line selection unit, and a plurality of selection ends, respectively electrically connected to the first coil And the second coils, wherein the first coils can sense a first frequency signal, and the second coils can sense a plurality of second frequency signals; a functional chip unit electrically connected to the line selection unit and permeable to the line The selection unit is electrically connected to the first coil or the second coils to capture the first frequency or the second frequency signals; and a control unit electrically connected to the functional chip unit and the line selection unit And determining that the induction coil module senses the first frequency signal or the second frequency signals, and controls the line selection unit to switch to the first coil and the second coils. The multi-layer stack structure of the induction coil module of claim 11, wherein one of the selection ends of the line selection unit is a common end, and is electrically connected to the first coil and the second coils. One of the electrical connections. The multi-layer stack structure of the induction coil module of claim 11, wherein the functional chip unit is a multi-function module integrated in a single chip, and the multi-function module comprises a wireless power (WLC) function module. Near Field Communication (NFC) function module, Bluetooth function module, WIFI function module, LTE function module or 3G function module. The multi-layer stack structure of the induction coil module of claim 2, further comprising a selection circuit, the selection circuit comprising: a line selection unit, and a plurality of selection ends, respectively electrically connected to the first coil And the first a second coil, wherein the first coil can sense a first frequency signal, and the second coils can sense a plurality of second frequency signals; the plurality of functional wafer units are electrically connected to the line selection unit, and can be respectively electrically connected through the line selection unit Connected to the first coil or the second coils to capture the first frequency signal or the second frequency signals; and a control unit electrically connected to the functional chip unit and the line selection unit Determining that the induction coil module senses the first frequency signal or the second frequency signals, and controls the line selection unit to switch to any of the functional chip units to be electrically connected to the first coil or any of the Two coils. The multi-layer stack structure of the inductive coil module of claim 14, wherein one of the selection ends of the line selection unit is a common end electrically connected to one of the common units of the chip unit to the first One end of the coil and the second coils. The multi-layer stack structure of the induction coil module of claim 14, wherein the functional chip unit is a multi-function module integrated in a single chip, and the multi-function module comprises a wireless power (WLC) function. Module, Near Field Communication (NFC) function module, Bluetooth function module, WIFI function module, LTE function module or 3G function module.