TWM478601U - Release element for wafer packaging - Google Patents

Description

Detached component for wafer packaging

This creation is about transfer molding of wafer packages, especially one that is used in transfer molded wafer packages.

According to the current compression molding, the most important processing method for thermosetting plastics, but the thermosetting plastics must be cooled to harden them. Therefore, the compression molding needs to wait for the mold to cool before returning, which greatly reduces the production efficiency. In view of this, a transfer molding technique has been proposed, in which the equipment required for transfer molding mainly includes a mold, a heated transfer chamber, and a power source. Please refer to the first figure, which is a schematic diagram of a conventional transfer molding process. As shown in the first figure, the transfer molding system includes the following process steps: (1) placing a molding plastic 11' in a transfer chamber 15'; Place a component 60' to be formed in a closed mold 14', and the closed mold 14' is connected to the transfer chamber 15' by a gate 16'; (3) heating to make the molded plastic 11' Liquefaction in the transfer chamber 15'; (4) pouring the liquefied plastic 13' from the gate 16' into the heated closed mold 14'; (5) cooling the closed mold 14' to harden the plastic in the closed mold 14' ; (6) opening the closed mold 14' and separating the formed member 60' from the mold; (7) taking out the molded member 60'; (8) having a small amount of hardened plastic remaining in the transfer chamber 15' and the gate 16' It must be removed before the second molding starts.

In general, the above-described transfer molding technique requires a release member to be disposed on the inner surface of the closed mold, so that the formed member can be easily separated from the mold when the above step (7) is performed. In view of this, the creators of this case tried their best to research and create a distracting component for wafer packaging.

The main purpose of the present invention is to provide a release component for a wafer package, which is composed of a carrier material and a release layer; the release component of the present invention is applied to a mold attached to a transfer molding process. The upper mold and the inner surface of the lower mold, such that when the transfer molding process is completed and the molding member and the mold are separated, the release member can provide a stable release force, making the molding member easy to separate the mold and avoiding plastic residue On the mold.

Therefore, in order to achieve the above-mentioned purpose of the present creation, the creator of the present invention proposes a release component applied to a wafer package, which is applied to a transfer molding process of an integrated circuit and attached to one of the molding dies. The inner surface of the mold and the lower mold comprises: a carrier material having a thickness of between 16 μm and 500 μm; and a release layer coupled to the carrier material Above, and the thickness thereof is between 20 μm and 2000 μm.

In the above-mentioned release member, the carrier material is a plastic material, and the plastic material is selected from any one of the following groups: PET, PP, PC, PE, PI, and PVC. Also, the material of the release layer 12 is selected from any of the following groups: pure tannin and tannin/rubber compound.

In addition, in order to achieve the above object of the present invention, the creator of the present invention further proposes a second embodiment of a release member applied to a wafer package, which is a release layer, and the thickness of the release layer is It is between 20 μm and 2000 μm, and its manufacturing material is selected from any of the following group of tissue groups: pure tannin and tannin/rubber compound.

<this creation>

1‧‧‧Digital components

10‧‧‧Mold

101‧‧‧Upper mold

102‧‧‧Next mold

11‧‧‧Package

12‧‧‧Fractal layer

<知知>

11'‧‧‧ molding plastic

15’‧‧‧Transfer room

60'‧‧‧ Components to be molded

13’‧‧‧Liquid plastic

14’‧‧‧Closed mold

16’‧‧‧Gate

The first figure is a schematic diagram of a conventional process of transfer molding; the second figure is a schematic diagram of a process of transfer molding; the third figure is a side cross-sectional view of a release component applied to a wafer package of the present invention; and a fourth figure A side cross-sectional view of a second embodiment of a drop element that is applied to a wafer package.

In order to be able to more clearly describe one of the A preferred embodiment of the present invention will be described in detail below with reference to the drawings.

Please refer to the second figure, which is a schematic diagram of a process of transfer molding; and also refers to the third figure, which is a side cross-sectional view of a release component of the present invention applied to a wafer package. As shown, the present invention is applied to a wafer packaged release member 1 for attachment to the inner surfaces of the upper mold 101 and the lower mold 102 of a mold 10 of a transfer molding process. The release element 1 comprises a carrier 11 and a release layer 12, wherein the release layer 12 is bonded to the carrier 11.

In particular, the carrier 11 is a plastic base film having a thickness of between 16 μm and 500 μm, and the material of manufacture may be PET, PP, PC, PE, PI or PVC film. The release layer 12 is a pure tannin having a thickness of between 20 μm and 2000 μm. Moreover, preferably, the material of the release layer 12 may be a ruthenium rubber (ie, a silicone rubber/rubber compound); in the present invention, the enamel rubber is composed of silicone rubber, rubber and plastic materials, wherein the silicone rubber The composition ratio of the rubber is 100%: 0% to 5%: 90%, and the remaining proportion is added to the plastic material to make up. Thus, the release member 1 which is applied to the wafer package by the above-mentioned respective materials according to a specific composition ratio may have a hardness ranging from 1 to 80 (SHORE Type A) (according to ASTM D2240).

It must be added that in order to make the present invention apply to the wafer package, the release element 1 has a better and appropriate hardness, and the carrier 11 is the most The thickness must be between 16 μm and 100 μm, and the optimum thickness of the release layer 12 must be between 30 μm and 600 μm; in addition, the release layer 12 made of tantalum rubber has a composition ratio of silicone to rubber of 80%. : 10%~50%: 40%, and the remaining proportion is added with plastic materials to make up. Thus, the hardness of the release layer 12 can be varied between 30 and 60 (SHORE Type A) (according to ASTM D2240).

Thus, the above-described system clearly illustrates a first embodiment of the present invention for a release component of a wafer package. Next, the second embodiment of the present creation will be described. Please refer to the fourth figure, which is a side cross-sectional view of a second embodiment of the present invention for a release component of a wafer package. As shown, the release member 1 can be a separate release layer 12 having a thickness of between 20 μm and 2000 μm, and is made of pure tannin. Moreover, preferably, the material of the release layer 12 may be a ruthenium rubber (ie, a silicone rubber/rubber compound); in the present invention, the enamel rubber is composed of silicone rubber, rubber and plastic materials, wherein the silicone rubber The composition ratio of the rubber is 100%: 0% to 5%: 90%, and the remaining proportion is added to the plastic material to make up. Thus, the hardness of the release layer 12 composed of the above respective materials according to a specific composition ratio may fall between 1 and 80 (SHORE Type A) (according to ASTM D2240).

It must be added that in order to make the present invention apply to the wafer package, the release element 1 has a better proper hardness, the optimum thickness of the release layer 12 must be between 30 μm and 600 μm; production The release layer 12 has a composition ratio of silicone to rubber of 80%: 10% to 50%: 40%, and the remaining proportion is added with a plastic material to make up. Thus, the hardness of the release layer 12 can be varied between 30 and 60 (SHORE Type A) (according to ASTM D2240).

Thus, the above embodiments have completely and clearly explained all embodiments of the present invention for the off-chip component of the wafer package, and the main advantage of the present invention is that the off-chip component applied to the wafer package is It can provide a stable release force when separating the forming element and the mold of the transfer molding process, so that the molding element can be easily separated from the mold and the plastic is prevented from remaining on the mold.

It is to be understood that the foregoing detailed description of the embodiments of the present invention is not intended to limit the scope of the present invention. Both should be included in the scope of the patent in this case.

1‧‧‧Digital components

11‧‧‧Package

12‧‧‧Fractal layer

Claims (9)

A release component for a wafer package is applied to a transfer molding process of an integrated circuit, and is attached to one of a molding die and an inner surface of a lower die, the system comprising: a carrier The thickness is between 16 μm and 500 μm; and a release layer is bonded to the carrier, and the thickness thereof is between 20 μm and 2000 μm. The detachable component for wafer package according to claim 1, wherein the carrier is a plastic material, and the plastic material is selected from any one of the following groups: Ethylene terephthalate, polypropylene, polycarbonate, polyethylene, polyimine, and polyvinyl chloride. The release component for a wafer package as described in claim 2, wherein the carrier preferably has a thickness ranging from 16 μm to 100 μm, and the preferred thickness range of the release layer is Between 30μm~600μm. The release member for a wafer package according to claim 1, wherein the material for the release layer is selected from any one of the group consisting of pure silicone rubber and silicone rubber/rubber compound. The release element applied to the wafer package as described in claim 4 of the patent application scope The silicone/rubber compound is composed of a silicone rubber, a rubber and a plastic material, wherein the composition ratio of the silicone rubber to the rubber is 100%: 0% to 5%: 90%, and the remaining ratio Then add the plastic material to make up. The release component for a wafer package according to claim 1, wherein the wafer component has a hardness of 1 to 80 Shore A. A wafer packaged release component is applied to a transfer molding process of an integrated circuit and attached to one of a molding die and an inner surface of a lower die, wherein the wafer package is separated from the die The component is a release layer, and the thickness of the release layer is between 20 μm and 2000 μm, and the material of manufacture is selected from any one of the following groups: pure tannin and tannin/rubber compound. The release component for a wafer package according to claim 7, wherein the silicone/rubber compound is composed of a silicone rubber, a rubber and a plastic material, wherein the silicone rubber and the rubber The composition ratio is 100%: 0%~5%: 90%, and the remaining proportion is added to the plastic material to make up. The release element applied to the wafer package as described in claim 7 The hardness of the release layer is 1 to 80 Shore A (SHORE Type A).