TWM478245U - A micro optical package structure with filter layer - Google Patents

Description

Micro-optical package structure with filter layer

The present invention relates to an optical package structure, and more particularly to a micro-optical package structure having a filter layer.

Nowadays, electronic technology is changing with each passing day, and optical sensing technology is widely used, such as fingerprints, pupil identification systems, or applications such as ambient light and low beam sensing systems.

The optical package structure 1 as shown in FIG. 1 mainly includes a substrate 2, a light-emitting wafer 3, a light-receiving wafer 4, and a package housing 5, wherein the light-emitting wafer 3 and the light-receiving wafer 4 are Provided on the substrate 2, the package housing 5 covers the light-emitting wafer 3 and the light-receiving wafer 4 and is bonded to the substrate 2, in order to avoid scattering or diffraction of the light source emitted by the light-emitting wafer 3. The interference problem caused by directly irradiating the light receiving wafer 4 is such that a spacer 6 is formed in the package housing 5, thereby blocking the light emitting wafer 3 and the light receiving wafer 4, so that the light emission The light source generated by the wafer 3 will be blocked by the spacer 6 without being transmitted to the light receiving wafer 4 by scattering or diffraction to increase the sensitivity of the light receiving wafer 4; however, such an optical package structure 1 Although the purpose of blocking the light-emitting wafer 3 from the light-receiving wafer 4 is achieved, in order to achieve the object, the package case 5 having the structure of the baffle 6 must be added, so that the volume of the optical package structure 1 cannot be effective. Shrinking, and this is obviously French packaging industry meet the needs of today's optical and miniaturization of thin.

In addition, the reason that affects optical sensitivity is not only in The light-emitting wafer 3 scatters or winds around the light-receiving wafer 4, and its different wavelengths of visible light (380 nm to 780 nm) are also important factors affecting optical sensitivity. As shown in FIG. 2, such an optical package structure 1' is to avoid The effect of the visible light on the sensitivity is such that a filter 9 is added to the light emitting hole 7 and the light receiving hole 8 of the package housing 5, thereby filtering different visible light to enhance the light of the optical package structure 1'. The discriminating force of the wafer 4 is received; however, the addition of the filter 9 not only reduces the volume of the optical package structure 1', but also requires a process in the process, and the material cost is relatively increased. This is a doubt.

In summary, the conventional optical package structure 1, 1' still has The description is missing and needs to be improved.

The main purpose of the present invention is to provide a micro-optical package structure with a filter layer, which does not need to provide a barrier member and a protective cover between and between the package bodies to achieve a thin and miniaturized effect, and further, the creation is not An additional filter is required to filter the visible light at a specific wavelength.

In order to achieve the above object, a micro optical package structure having a filter layer includes a substrate, a light emitting chip, a light receiving chip, two encapsulants, and a filter layer, wherein the substrate has a light emitting region. And a light receiving area, the light emitting chip and the light receiving chip are respectively disposed in the light emitting area and the light receiving area, and each of the encapsulants respectively covers the light emitting chip and the light receiving chip, and are spaced apart from each other The light emitting region and the light receiving region are disposed on the surface of each of the encapsulants. For filtering light sources of different wavelengths.

The filter layer has a light emitting hole and a light receiving hole, and the light emitting hole and the light receiving hole are respectively located above the light emitting chip and the light receiving chip.

The shape of the light emitting hole and the light receiving hole is circular, square or polygonal.

Each of the encapsulants may have a concentrating unit singly or entirely.

Wherein the filter layer has a light emitting hole, and the light emitting hole is located above the light emitting chip.

The filter layer has a light receiving hole, and the light receiving holes are respectively located above the light receiving chip.

A micro-optical package structure having a filter layer, comprising: a substrate having a light-emitting region; a light-emitting wafer disposed in the light-emitting region; and an encapsulant formed in the light-emitting region and coated The light emitting chip; and a filter layer formed on the surface of the encapsulant for filtering light sources of different wavelengths.

Wherein the filter layer has a light emitting hole, and the light emitting hole is located above the light emitting chip.

A micro-optical package structure having a filter layer, comprising: a substrate having a light receiving area; a light receiving chip disposed in the light receiving area; and an encapsulant formed in the light receiving area and coated The light receiving wafer; and a filter layer formed on the surface of the encapsulant for filtering light sources of different wavelengths.

The filter layer has a light receiving hole, and the light receiving hole is located above the light receiving chip.

The filter layer is made of a conductive material.

The filter layer is made of an opaque material.

The filter layer is formed on the surface of each of the encapsulants by a transfer method, a lamination method, a coating method, a spray coating method, a plating method, or a sputtering method.

Each of the encapsulant systems is formed by a molding process and coated on the luminescent wafer and the light receiving wafer.

Therefore, the micro-optical package structure with the filter layer of the present invention and the manufacturing method thereof can block the scattering or diffracting light source of the light-emitting chip without providing a barrier member and a protective cover between the package body and the outside. The light is transmitted to the light receiving chip to avoid light interference and achieve the effect of thinning and miniaturizing the structure. In addition, the filter layer of the present invention is formed on the surface of each of the encapsulants, so that no additional light emitting holes and light receiving holes are required. The addition of a filter has the effect of filtering visible light of a specific wavelength, thereby facilitating the reduction of the process and cost.

In order to enable the review committee to further understand the composition, characteristics and purpose of the creation, the following are some examples of the creation, and the detailed description of the creation is as follows, and at the same time, those skilled in the art can implement the following, but the following In addition, one embodiment is provided for the purpose of explaining the technical content and features of the present creation. Those who have general knowledge in the field of creation, after understanding the technical content and features of the creation, do not violate the creation. In the spirit of the present, all kinds of simple modifications, substitutions, or reductions in components should fall within the scope of this creative intent.

1‧‧‧Optical package structure

2‧‧‧Substrate

3‧‧‧Light emitting chip

4‧‧‧Light receiving chip

5‧‧‧Package housing

6‧‧‧Baffle

7‧‧‧Light emitting aperture

8‧‧‧Light receiving hole

9‧‧‧Filter

10‧‧‧Optical package structure

10'‧‧‧Optical package structure

10"‧‧‧Optical package structure

20‧‧‧Substrate

21‧‧‧Light emitting area

23‧‧‧Light receiving area

30‧‧‧Light emitting chip

40‧‧‧Light receiving chip

50‧‧‧Package colloid

51‧‧‧ concentrating unit

60‧‧‧Filter layer

61‧‧‧Light emitting aperture

63‧‧‧Light receiving hole

70‧‧‧welding line

80‧‧‧Shield

The technical contents and features of the present invention will be described in detail below with reference to the accompanying drawings, wherein: FIG. 1 is a cross-sectional view of a conventional optical package structure.

Figure 2 is a cross-sectional view of a conventional optical package having a filter.

3 is a cross-sectional view of a micro-optical package structure with a filter layer provided by the first preferred embodiment of the present invention.

4A to F are flowcharts showing a micro-optical package structure with a filter layer and a method of manufacturing the same according to the first preferred embodiment.

5A to D are top views of the micro-optical package structure with the filter layer provided by the first preferred embodiment, mainly showing the shapes of different shield members to form different filter layers.

FIG. 6 is a cross-sectional view showing the micro-optical package structure with the filter layer provided by the first preferred embodiment, which mainly shows the aspect of each of the encapsulants having different shapes of the concentrating unit.

FIG. 7 is a cross-sectional view showing a micro-optical package structure with a filter layer according to a second preferred embodiment of the present invention, mainly showing a package structure having only light emission.

FIG. 8 is a cross-sectional view showing a micro-optical package structure with a filter layer according to a third preferred embodiment of the present invention, mainly showing a package structure having only a light receiving function.

In order to explain in detail the structure, features and functions of the present invention, a first preferred embodiment will be described with reference to the following drawings, wherein: Please refer to FIG. 3, which is the first best implementation for the creation. example A micro-optical package structure 10 having a filter layer is provided, comprising: a substrate 20 having a light-emitting region 21 and a light-receiving region 23.

A light emitting wafer 30 is disposed in the light emitting region 21.

A light receiving wafer 40 is disposed in the light receiving region 23.

The two encapsulants 50 respectively cover the light-emitting wafer 30 and the light-receiving wafer 40, and are disposed at intervals with respect to the light-emitting region 21 and the light-receiving region 23.

A filter layer 60 is formed on the surface of each of the encapsulants 50 for filtering light sources of different wavelengths. In addition, the filter layer 60 can be made of a conductive material or an opaque material. If the filter layer 60 is made of a conductive material, it can prevent electromagnetic interference (Electro Magnetic). The effect of Interference, EMI); if the filter layer 60 is an opaque material, it will effectively block the external light source.

Please refer to FIG. 4, which is a manufacturing method of the micro-optical package structure 10 with a filter layer according to the first preferred embodiment, which comprises the following steps: Step A: providing the substrate and defining the a light emitting region and the light receiving region, and respectively providing the light emitting chip and the light receiving chip in the light emitting region and the light receiving region; Step B: providing the bonding wire 70 to wire the substrate 20 and the light The transmitting wafer 30 and the light receiving wafer 40 are electrically connected; Step C: providing each of the encapsulating bodies 40 to be formed by molding And the light-emitting chip 30 and the light-receiving wafer 40 are coated, and the structure is further as shown in FIG. 6 , and a concentrating unit 51 is synchronously provided on the single encapsulant 50 or each of the encapsulants 50 during molding; Step D: providing at least one shielding member 80 on the surface of each of the encapsulants 50, and may be located above the light-emitting wafer 30 or the light-receiving wafer 40; Step E: forming the filter layer 60 on each of the encapsulants 50 In the first preferred embodiment, the filter layer 60 is formed on the surface of each of the encapsulants 50 by a transfer method, a pasting method, a coating method, a spray coating method, a coating method, or a sputtering method. And step F: the step of removing the at least one mask 80.

In the first preferred embodiment of the present invention, the filter layer has a light emitting hole 61 and a light receiving hole 63, and the light emitting hole 61 and the light receiving hole 63 are respectively located above the light emitting chip 30 and the light receiving chip 40, and the light emitting hole 61 and the light receiving hole The shape of the hole 63 is circular, but the shape of the light emitting hole 61 and the light receiving hole 63 is not limited thereto, and it may be square or polygonal according to the requirements of the optimized design. It is worth mentioning that the filter layer 60 of the micro-optical package structure 10 having the filter layer of the present invention can also be presented in the form disclosed in FIG. 5, as shown in FIG. 5, the filter layer 60 is simultaneously The light emitting hole 61 and the light receiving hole 63 are respectively located above the light emitting chip 30 and the light receiving chip 40; and FIG. 5B, 5, the filter layer 60 is shown in FIG. The light emitting aperture 61 or the light receiving aperture 63 is provided only on one side of the light emitting wafer 30 or the light receiving wafer 40; or as shown in FIG. 5D, the filter layer 60 does not have any such light emission The aperture 61 and the light receiving aperture 63 are thereby provided to provide the effect of filtering at a particular wavelength.

Please refer to Figure 6, the miniature of the filter layer of this creation. Each of the encapsulants 50 of the optical package structure 10 has the concentrating unit 51, and the concentrating unit 51 is configured as a convex lens or a concave lens. As shown in FIG. 6 and FIG. 6B, the concentrating unit 51 of the convex lens structure is provided. The encapsulant 50 formed only on one side of the light receiving wafer 40, or the encapsulant 50 formed only on the side of the light emitting wafer 30; as shown in FIG. 6C and FIG. 6F, the convex lens or the concave lens structure is gathered The light units 51 are respectively formed on the respective encapsulants 50; as shown in FIG. 6D and FIG. 6E, the concentrating unit 51 of the concave lens structure is formed only on the encapsulant 50 on the side of the light receiving wafer 40, or only An encapsulating body 50 formed on one side of the light-emitting wafer 30; or as shown in FIG. 6G and FIG. 6H, a convex lens and a condensing unit 51 having a concave lens structure are respectively formed on each of the encapsulants 50, Therefore, the present invention is formed on each of the encapsulants 50 through the concentrating unit 51 having different structures and forms, so that the efficiency of the light-emitting chip and the light-receiving chip can be optimized.

The optical package structure 10 of the first preferred embodiment is omitted. In addition, the micro-optical package structure 10', 10" having the filter layer of the present invention can also be in the form of FIG. 7 and FIG. 8, which is the second preferred embodiment and the third preferred embodiment of the present invention. For example, as shown in FIG. 7, the filter of the second preferred embodiment has The difference between the micro-optical package structure 10' of the optical layer and the foregoing first preferred embodiment is that the optical package structure 10' has only the function of light emission, and comprises the substrate 20, the light-emitting wafer 30, and the encapsulant 50. And the light-emitting layer 30 is disposed on the light-emitting region 21 of the substrate 20, the encapsulant 50 is formed on the light-emitting region 21 and covers the light-emitting wafer 30, and the filter layer 60 is formed on the surface of the encapsulant 50 for filtering light sources of different wavelengths. In the structure of FIG. 7, the filter layer 60 has the light emitting aperture 61 above the light emitting wafer 30. The light source filtered by the filter layer 60 is only transmitted by the light emitting aperture 61. As shown in FIG. 8, the difference between the third preferred embodiment and the first preferred embodiment is that the optical package structure 10" has only the function of receiving light, and the substrate 20 and the light receiving wafer 40 are included. The encapsulating body 50 and the filter layer 60 are disposed on the light receiving area 23 of the substrate 20, and the encapsulant system is formed on the light receiving area 23 and covers the light receiving wafer 40, and The filter layer 60 is formed on the surface of the encapsulant 50 for filtering light sources of different wavelengths. In the structure of FIG. 8, the filter layer 60 has the light receiving hole 63 above the light emitting chip 30. Thereby, the light source generated by the external environment or the light source that does not need to be received will be filtered by the filter layer 60, and can only be transmitted to the light receiving wafer 40 via the light receiving hole 63 to reduce the externality. Interference with noise.

In summary, the micro-optical package of the filter layer of this creation The structure 10 and the manufacturing method thereof can block the scattering or diffracted light of the light-emitting wafer 30 without providing a barrier member and a protective cover between and outside each of the encapsulants 50. The source is transferred to the light receiving wafer 40 to avoid light interference and achieve the effect of thinning and miniaturizing the structure. In addition, the filter layer 60 of the present invention is formed on the surface of each of the encapsulants 50, so no additional light is needed. Adding a filter to the emission hole 61 and the light receiving hole 63 has the effect of filtering visible light of a specific wavelength.

The exemplified elements disclosed in the above embodiments are merely illustrative and are not intended to limit the scope of the present invention. The alternatives or variations of other equivalent elements are also covered by the scope of the patent application.

10‧‧‧Optical package structure

20‧‧‧Substrate

21‧‧‧Light emitting area

23‧‧‧Light receiving area

30‧‧‧Light emitting chip

40‧‧‧Light receiving chip

50‧‧‧Package colloid

60‧‧‧Filter layer

61‧‧‧Light emitting aperture

63‧‧‧Light receiving hole

Claims (14)

A micro-optical package structure having a filter layer, comprising: a substrate having a light emitting region and a light receiving region; a light emitting chip disposed in the light emitting region; and a light receiving chip disposed on the light a receiving region; two encapsulants respectively covering the light emitting chip and the light receiving chip, and are disposed at intervals between the light emitting region and the light receiving region; and a filter layer formed on each of the encapsulants The surface is used to filter light sources of different wavelengths. The micro-optical package structure with a filter layer according to the first aspect of the patent application, wherein the filter layer has a light emitting hole and a light receiving hole, and the light emitting hole and the light receiving hole are respectively located on the light emitting chip And above the light receiving wafer. A micro-optical package structure having a filter layer according to item 2 of the patent application, wherein the light-emitting aperture and the light-receiving aperture are circular, square or polygonal in shape. A micro-optical package structure having a filter layer according to the first aspect of the patent application, wherein each of the encapsulants may have a concentrating unit singly or entirely. A micro-optical package structure having a filter layer according to claim 1, wherein the filter layer has a light-emitting aperture, and the light-emitting aperture is located above the light-emitting wafer. A micro-optical package structure having a filter layer according to claim 1, wherein the filter layer has a light receiving hole, and the light receiving holes are respectively located above the light receiving chip. A micro-optical package structure having a filter layer, comprising: a substrate having a light-emitting region; a light-emitting wafer disposed in the light-emitting region; and an encapsulant formed in the light-emitting region and coated The light emitting chip; and a filter layer formed on the surface of the encapsulant for filtering light sources of different wavelengths. A micro-optical package structure having a filter layer according to claim 6 wherein the filter layer has a light-emitting aperture, and the light-emitting aperture is located above the light-emitting wafer. A micro-optical package structure having a filter layer, comprising: a substrate having a light receiving area; a light receiving chip disposed in the light receiving area; and an encapsulant formed in the light receiving area and coated The light receiving wafer; and a filter layer formed on the surface of the encapsulant for filtering light sources of different wavelengths. A micro-optical package structure having a filter layer according to claim 9 wherein the filter layer has a light receiving hole, and the light receiving hole is located above the light receiving chip. A micro-optical package structure having a filter layer according to claim 2, 8 or 10, wherein the filter layer is a conductive material. A micro-optical package structure having a filter layer according to claim 2, 8 or 10, wherein the filter layer is an opaque material. A micro-optical package structure having a filter layer according to the first, seventh or ninth aspect of the patent application, wherein the filter layer is transferred, pasted, coated, sprayed, coated or sputtered. Formed on the surface of each of the encapsulants. According to the micro-optical package structure of the filter layer of the first, seventh or ninth aspect of the patent application, each of the encapsulant systems is formed by a molding process and coated on the light-emitting chip and the light-receiving wafer.