TWM477041U - Heater assembly - Google Patents
Heater assemblyInfo
- Publication number
- TWM477041U TWM477041U TW102220470U TW102220470U TWM477041U TW M477041 U TWM477041 U TW M477041U TW 102220470 U TW102220470 U TW 102220470U TW 102220470 U TW102220470 U TW 102220470U TW M477041 U TWM477041 U TW M477041U
- Authority
- TW
- Taiwan
- Prior art keywords
- heating element
- processing apparatus
- filaments
- heating
- filament
- Prior art date
Links
Landscapes
- Resistance Heating (AREA)
Abstract
A wafer processing apparatus and heating assembly for use in such processing apparatus. In particular, a heating element having a plurality of heating element filaments and mechanical support of the heating element filaments in a wafer processing apparatus where the heating element is mounted within the processing apparatus for heating wafers mounted on a wafer carrier and allows for unrestricted thermal expansion of the radiant heating elements. Heating element is substantially planar. Heating element can be dimensioned to be approximately 675 mm in diameter, ±5%. Filaments are curved and lie substantially in one plane. The structure of each filament is configured so that filaments follow the structure of its adjacent filament but do not make contact with its adjacent filament.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102220470U TWM477041U (en) | 2013-11-04 | 2013-11-04 | Heater assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102220470U TWM477041U (en) | 2013-11-04 | 2013-11-04 | Heater assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM477041U true TWM477041U (en) | 2014-04-21 |
Family
ID=60625119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102220470U TWM477041U (en) | 2013-11-04 | 2013-11-04 | Heater assembly |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM477041U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108728828A (en) * | 2017-04-20 | 2018-11-02 | 中微半导体设备(上海)有限公司 | CVD equipment and its temprature control method and heater |
US11804388B2 (en) | 2018-09-11 | 2023-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
-
2013
- 2013-11-04 TW TW102220470U patent/TWM477041U/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108728828A (en) * | 2017-04-20 | 2018-11-02 | 中微半导体设备(上海)有限公司 | CVD equipment and its temprature control method and heater |
US11804388B2 (en) | 2018-09-11 | 2023-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
TWI821379B (en) * | 2018-09-11 | 2023-11-11 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing apparatus and method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |