TWM472305U - Inspection device - Google Patents

Abstract

An inspection device includes a circuit board, a plurality of fixing members and a plurality of probes. The circuit board has a first surface, a second surface opposite to the first surface and at least one first slot through the circuit board. The fixing member is coupled to the first surface. Each probe has a probe end, an arm, an extension portion and a welding portion. The arm connecting the probe end and the extension portion is fixed to the fixing member. The extension portion is connected to the welding portion. A first angle is formed between the arm and the extension portion, and a second angle is formed between the arm and the probe end. The extension portion extends through the circuit board via the first slot. The welding portion is welded to the second surface.

Description

Testing device

The present invention relates to a device for detecting electronic components, and more particularly to a vertical cantilever type detecting device for a plurality of DUTs.

Generally, the die pads for electrical connection on the semiconductor die often have different settings according to the characteristics of the circuit components in the die, so the probe card required for performing the wafer level test project also needs to have a corresponding The circuit transmission structure and the test point touch probe, usually the die is called the device under test (DUT); when the electronic product is more versatile, the more types of circuit components are integrated in the die. The pads required to transmit the control signals such as the die input and output are also increased at the same time, and the probes are required to have a high density and corresponding arrangement distribution at the corresponding probes touching the pads. In particular, in order to perform wafer level testing quickly and efficiently to perform multi-die electrical testing on a large number of dies on each wafer, the probe card needs to match the grain distribution structure on the wafer and has a corresponding probe distribution structure. This allows the probe card to measure as many of the dies as possible in a single measurement to reduce the number of man-hours for wafer level testing.

For example, the probe card provided by Japanese Laid-Open Patent Publication No. 2004-12212 has a plurality of probe arrangement structures capable of providing a single test of multiple test objects (or multi-grain test). Referring to Fig. 2 of Japanese Laid-Open Patent Publication No. 2004-12212, a cantilever type probe card is disclosed. The soldering portions of the probes 5 are soldered to the lower surface of the circuit board 6, and the cantilever of the probe 5 is fixed by The material 7 is fixed so that the detecting end of the probe 5 can be suspended on the lower surface of the circuit board 6, and the probe 5 will face the object to be tested, and when testing the object to be tested, the probe 5 The detecting end can measure the object to be tested and perform electrical testing.

However, the above-mentioned cantilever probe card also has the limitation of probe layout, and only about 4 die tests can be tested in a single time. Moreover, for a logic die (Logic IC) structure, if more than one die can be tested in a single pass, the test time can be saved. Further, the cantilever type probe card is soldered to the lower surface of the circuit board because the probe soldering portion is soldered to the lower surface of the circuit board, and the probe needs to extend from the cantilever to the soldering Department, so the fixing materials can not be independent, so that all the probes need to be fixed by the same fixing material. When multiple crystal grains are tested, there will be too many needle layers on the fixing parts, no space to arrange the probes, and cross needles. The problem of increasing the difficulty in arranging the probe (or the needle). Therefore, it is not possible to test more dies at the same time, so it is also impossible to reduce the labor of wafer testing.

In view of this, the main purpose of the present invention is to provide a detecting device for an electronic component, in which the probe is arranged in a manner that it is not easy to have too many needle layers on the fixing member and the problem of crossing the needles with each other, so the detecting device of the present invention can simultaneously treat Simultaneous detection of multiple electronic components on the wafer saves probe placement space on the probe card and man-hours for wafer testing.

A preferred embodiment of the inventive detection device includes a circuit board, a plurality of fasteners, and a plurality of probes. The circuit board has a first surface, a second surface, and at least one first slot. The first surface is opposite to the second surface. The at least one first slot extends through the circuit board and communicates with the first surface. The second side. The fixing members are fixed to the first surface. Each of the plurality of probes has a detecting portion, an extending portion, and a soldering portion. The detecting portion has a detecting end and a cantilever. The cantilever is connected to the detecting end and the end of the extending portion. And the cantilever is connected to one of the fixing members, and the other end of the extending portion is connected to the welding portion, wherein the cantilever has a first angle with the extending portion, and the detecting end and the cantilever have a first The second angle is that the extension passes through the circuit board through the first slot, and the soldering portion is soldered to the second surface.

A further preferred embodiment of the inventive detection device includes a circuit board, a spacer, a plurality of fasteners, and a plurality of probes. The circuit board has a first surface, a second surface, and at least one first slot. The first surface is opposite to the second surface. The at least one first slot extends through the circuit board and communicates with the first surface. The second side. The spacer is fixed to the first face and has at least one second slot corresponding to the first slot. The fixing members are fixed to the spacer. Each of the plurality of probes has a detecting portion, an extending portion, and a soldering portion. The detecting portion has a detecting end and a cantilever. The cantilever is connected to the detecting end and the end of the extending portion. And the cantilever is connected to one of the fixing members, and the other end of the extending portion is connected to the welding portion, wherein the cantilever has a first angle with the extending portion, and the detecting end and the cantilever have a first The two angles, the extension portion passes through the spacer and the circuit board respectively through the second slot and the first slot, and the soldering portion is soldered to the second surface.

Another preferred embodiment of the detection device of the present invention includes a circuit board and a supplement A strong piece, at least one spacer, a plurality of fixing members, and a plurality of probes. The circuit board has a first surface, a second surface, and at least one through hole. The first surface is opposite to the second surface. The at least one through hole extends through the circuit board and is respectively opened to the first surface and the second surface. . The reinforcing member is disposed on the second surface and has at least one slit. The at least one spacer is fixed to the reinforcing member and disposed in the at least one through hole, and forms at least one gap corresponding to the at least one slit. The plurality of fixing members are fixed to the at least one spacer. Each of the plurality of probes has a detecting portion, an extending portion, and a soldering portion. The detecting portion has a detecting end and a cantilever. The cantilever is connected to the detecting end and the end of the extending portion. And the cantilever is connected to one of the fixing members, and the other end of the extending portion is connected to the welding portion, wherein the cantilever has a first angle with the extending portion, and the detecting end and the cantilever have a first The two angles, the extension portion passes through the circuit board and the reinforcing member respectively through the gap and the slit, and the welding portion is welded to the second surface.

The above and other objects, features, and advantages of the present invention will become more apparent and understood.

5‧‧‧Adhesive materials

8‧‧‧ bolt

10, 10’, 10”‧‧‧ boards

12‧‧‧ first side

14‧‧‧ second side

15‧‧‧First slot

16, 16'‧‧‧ Through Hole

20, 20’, 20” ‧ ‧ spacers

24‧‧‧ recess

25‧‧‧second slot

26, 27‧‧ ‧ gap

28‧‧‧ bottom

30‧‧‧Fixed parts

30A, 30B‧‧‧Fixed parts structure

40‧‧‧ probe

41‧‧‧Detection

42‧‧‧cantilever

43‧‧‧Extension

44‧‧‧Weld Department

50, 50'‧‧‧ reinforcements

55‧‧‧slit

56‧‧‧ accommodating space

60‧‧‧Reinforcement spacer

100, 200, 300, 400, 500, 600‧‧‧ detection devices

θ 1‧‧‧ first angle

θ 2‧‧‧ first angle

D‧‧‧Distance

1 is a cross-sectional view of a detecting device provided by a first preferred embodiment of the present invention.

2 and 3 are perspective views of the two integrally formed fastener structures provided by the present invention.

Figure 4 is a cross-sectional view of the detecting device provided by a second preferred embodiment of the present invention.

Figure 5 is a top plan view showing the circuit board of the detecting device provided by the second preferred embodiment.

Fig. 6 and Fig. 7 are cross-sectional views showing the combination of the two reinforcing members and the spacer provided by the creation.

Figure 8 is a cross-sectional view of the detecting device provided by a third preferred embodiment of the present invention.

Figure 9 is a top plan view showing the circuit board of the detecting device provided by the third preferred embodiment.

Figure 10 is a cross-sectional view of the detecting device provided by a fourth preferred embodiment of the present invention.

Figure 11 is a cross-sectional view of the detecting device provided by a fifth preferred embodiment of the present invention.

Figure 12 is a cross-sectional view of the detecting device provided by a sixth preferred embodiment of the present invention.

Since the present invention discloses a detecting device for testing a probe card, wherein the principle and basic functions of the probe card have been known to those of ordinary skill in the related art, therefore, the description below is no longer Make a full description. At the same time, the drawings in the following texts express the structural schematics related to the creative features, and do not need to be completely drawn according to the actual size, which is described first.

Referring to FIG. 1 , a detecting apparatus 100 according to a first preferred embodiment of the present invention includes a circuit board 10 , a plurality of fixing members 30 , and a plurality of probes 40 . The construction thereof will be described below.

The circuit board 10 has a first surface 12 and a second surface 14. The first surface 12 and the second surface 14 are oppositely disposed. At least one first slot 15 is formed on the circuit board 10. The first slot 15 extends through the circuit. The plate 10 is open to the first face 12 and the second face 14.

The fixing members 30 are fixed to the first surface 12 of the circuit board 10 and hold the probes 40.

Each of the probes 40 is a vertical cantilever probe, and includes a detecting portion formed by a detecting end 41 and a cantilever 42 , an extending portion 43 , and a soldering portion 44 . The detecting end 41 is used for contacting the object to be tested for testing, the cantilever 42 is connected to the detecting end 41 and the extending portion 43, and the cantilever 42 is connected to one of the fixing members 30, and the extending portion 43 passes through the circuit through the first slot 15. In the board 10, one end of the soldering portion 44 is connected to the extending portion 43, and the other end is soldered to the second surface 14 of the circuit board 10. A first angle θ is formed between the extending portion 43 and the cantilever 42, and a first portion is formed between the detecting end 41 and the cantilever 42. The two angles θ 2 , the cantilever 42 extends from the edge of the fixing member 30 toward the extending portion 43 by a distance D and is connected to the extending portion 43 and forms the first angle θ 1 .

In addition, in the first embodiment, in order to strengthen the fixing relationship between the fixing member 30 and the probe 40, an adhesive material 5 (for example, epoxy resin (commonly known as vinyl rubber) or other suitable adhesive material) may be used. The cantilever 42 of the probe 40 is fixed to the fixture 30. It should be particularly noted that in other embodiments, the plurality of fixing members 30 may be connected to each other to form an integrally formed fixing member structure, for example, the U-shaped fixing member structure 30A shown in FIG. The figure-shaped fastener structure 30B shown in Fig. 3 can be determined according to actual needs. It should be particularly noted that the above-mentioned fixing member structure 30A or 30B corresponds to one object to be tested, so that the creation can simultaneously measure four or more objects to be tested, please refer to the following description. In addition, the material of the fixing member 30 may be made of engineering plastics, bakelite, or the like, and ceramic materials are preferred.

In the above structure, since the fixing member 30 is adjacent to the first slot 15, and the distance D between the extending portion 43 of the probe 40 and the fixing member 30 is about 2 mm, the extending portion 43 is substantially perpendicular to the circuit board 10. The manner of passing through the circuit board 10 allows the probes 40 to be arranged relatively tightly, and the number of detections can be reduced for the objects to be closely arranged in the wafer. That is to say, the layout of the vertical cantilever probe 40 of the present invention on the detecting device is reduced compared to the prior art cantilever probe card, since the cantilever probe is fixed from the fixing member to the circuit board segment. The distance, and there is no problem with the cantilever probe creating too many needle layers on the fixture and crossing the needles. Also, since the problem of the prior art is solved, the probe card of the present invention can be designed such that the above-mentioned fixture structure 30A or 30B can correspond to one object to be tested. Therefore, the detection device of the present invention can measure more objects to be tested simultaneously than the cantilever probe card of the prior art, for example, four or more objects to be tested can be simultaneously measured (for example, six or eight simultaneous measurements) Or twelve items to be tested, depending on the actual needs of the design. Of course, since the creation can measure a plurality of objects to be tested at the same time, the creation can also effectively save the probe layout space on the probe card and the working time of the wafer test.

4 to 10 show another embodiment of the detecting device of the present invention. In some higher temperature test environments, the board may be warped due to temperature, which may cause some probes to over-contact the wafer to be tested, while some probes are inaccessible to the wafer under test. The problem. Detection devices tested in these higher temperature environments will increase on the board A piece of reinforcement to avoid warpage on the board. The detailed construction thereof will be described below.

Please refer to FIG. 4 and FIG. 5 . The detecting device 200 provided by the second preferred embodiment includes a circuit board 10 ′ and at least one spacer 20 (the embodiment is provided with a plurality of spacers 20, but There may be only one spacer 20), a plurality of fixing members 30, a plurality of probes 40, and a reinforcing member 50.

The circuit board 10' has a first surface 12 and a second surface 14. The first surface 12 and the second surface 14 are oppositely disposed, and a through hole 16 is formed in a central portion of the circuit board 10' (refer to FIG. 5, FIG. 5 is a top plan view of the circuit board 10 ′, the size of which is only schematically shown, and does not correspond to FIG. 4 . The through hole 16 extends through the circuit board 10 ′ and opens on the first surface 12 and the second surface 14 .

The at least one spacer 20 is fixed to the reinforcing member 50 and disposed in the through hole 16 of the circuit board 10'. The reinforcing member 50 is disposed on the second surface 14 of the circuit board 10'. The edge of the spacer 20 is spaced apart from the wall surface of the through hole 16 to form a gap 26, and a gap 27 is formed between each two adjacent spacers 20, and a slit 55 is formed on the reinforcing member 50, and the slit 55 corresponds to The gaps 26, 27, as shown in FIG. 4, the at least one spacer 20 may further have a plurality of recesses 24, such that the fixing members 30 are disposed in the recesses 24; or the at least one spacer 20 may not have The recess 24 is fixed to the bottom surface of the spacer 20 as described in the sixth preferred embodiment hereinafter. The fixing member 30 is preferably a ceramic substrate.

The probe 40 is a vertical cantilever probe similar to that described in the first preferred embodiment, and the cantilever 42 is fixed to the fixing member 30 by the adhesive material 5, and the extending portion 43 sequentially passes through the gap 26 or 27 and the slit 55. Passing through the circuit board 10' and the reinforcing member 50, one end of the soldering portion 44 is soldered to the second surface 14 of the circuit board 10'.

In the above structure, since the fixing member 30 is adjacent to the gap 26 or 27, and the distance D between the extending portion 43 of the probe 40 and the fixing member 30 is about 2 mm, the extending portion 43 is substantially perpendicular to the circuit board 10'. The method passes through the circuit board 10' and the spacer 20, so that the probes 40 can be arranged relatively tightly. For the object to be tested with a tight array of wafers, the number of detections can be reduced, and the effect is determined by the first comparison. The preferred embodiment is disclosed and will not be described herein.

In FIG. 4, the reinforcing member 50 and the spacers 20 are bonded to each other. However, the reinforcing member 50 and the spacer 20 may be combined in other ways, for example, as shown in FIGS. 6 and 7. Combination method. In detail, the reinforcing member 50 and the at least one spacer 20 shown in FIG. 6 are fixed by bolts 8. Moreover, the reinforcing member 50 and the spacer 20 shown in Fig. 7 are A reinforcing spacer 60 is formed integrally. As for the method used, it can be selected according to actual needs.

Please refer to FIG. 8 and FIG. 9 . The difference between the detecting device 300 provided by the third preferred embodiment and the detecting device 200 is that the circuit board 10 ′ of the detecting device 300 has a plurality of through holes 16 ′. (Refer to FIG. 9, FIG. 9 is a top view of the circuit board 10, the size of which is only schematically shown, and does not correspond to FIG. 8). The spacers 20' are respectively provided with the spacers 20 Each of the spacers 20 is spaced apart from the wall surface of the through hole 16' where it is located to form a gap 26. The remaining structural features of the third preferred embodiment have been disclosed in the above-described second preferred embodiment, and the functions thereof have also been disclosed in the first preferred embodiment, and are not described herein.

Referring to FIG. 10, the detecting device 400 provided in the fourth preferred embodiment of the present invention is similar to the detecting device 100 provided in the first preferred embodiment, but the detecting device 400 further includes a reinforcing member. 50 ′, the reinforcing member 50 ′ is fixed to the second surface 14 of the circuit board 10 , and the accommodating space 56 of the soldering portion 44 of the probe 40 is formed between the reinforcing member 50 ′ and the circuit board 10 , This also prevents the board 10 from being deformed due to high temperatures. The remaining structural features of the fourth preferred embodiment are disclosed in the first preferred embodiment, and the functions thereof have been disclosed in the first preferred embodiment, and are not described herein.

Referring to FIG. 11 , the detecting device 500 provided by the fifth preferred embodiment of the present invention is similar to the detecting device 100 provided by the first preferred embodiment, but the detecting device 500 is required for space configuration. Further comprising a spacer 20 ′, the spacer 20 ′ is fixed to the first surface 12 of the circuit board 10 , and has at least one second slot 25 corresponding to the first slot 15 , the fixing member 30 . The recesses 24 are fixed to the spacers 20 ′, and the extensions 43 of the probes 40 respectively pass through the spacers 20 ′ and the circuit board 10 via the second slots 25 and the first slots 15 . The remaining structural features of the fifth preferred embodiment are disclosed in the first or second preferred embodiment, and the functions thereof have also been disclosed in the first preferred embodiment, and are not described herein.

It is to be noted that in the foregoing second, third and fifth preferred embodiments, the spacers 20, 20' have recesses 24 for the fixing members 30 to be firmly fixed to the recesses 24; however, each of the spacers 20 20' may also have no recess 24. For example, the detecting device 600 provided in the sixth preferred embodiment shown in FIG. 12 is similar to the detecting device 500 described above, but the spacer 20 of the detecting device 600. There is no recess 24, and the fixing members 30 are fixed to the bottom surface 28 of the spacer 20".

In summary, in the detection device provided by the present invention, since the probe is soldered to the second surface through the circuit board, the manner in which the probe is disposed is not easy to have too many needle layers on the fixing member and cross each other. The problem is that the detection device of the present invention can simultaneously detect a plurality of electronic components on the wafer to be tested, thereby effectively saving the probe layout space on the probe card and the working time of the wafer test.

The present invention is disclosed in the above embodiments, but it is not intended to limit the scope of the present invention. Anyone skilled in the art can make some changes and refinements without departing from the spirit of the present invention. The scope of protection is subject to the definition of the scope of the patent application attached.

5‧‧‧Adhesive materials

10‧‧‧ boards

12‧‧‧ first side

14‧‧‧ second side

15‧‧‧First slot

30‧‧‧Fixed parts

40‧‧‧ probe

41‧‧‧Detection

42‧‧‧cantilever

43‧‧‧Extension

44‧‧‧Weld Department

100‧‧‧Detection device

θ 1‧‧‧ first angle

θ 2‧‧‧second angle

D‧‧‧Distance

Claims (16)

A detecting device includes: a circuit board having a first surface, a second surface, and at least one first slot, the first surface being opposite to the second surface, the at least one first slot extending through the The circuit board is connected to the first surface and the second surface; a plurality of fixing members are fixed on the first surface; and a plurality of probes each having a detecting portion, an extending portion and a soldering portion The detecting portion has a detecting end and a cantilever, the cantilever is connected to the detecting end and one end of the extending portion, and the cantilever is connected to one of the fixing members, and the other end of the extending portion is connected to the welding portion, wherein the detecting portion a first angle between the cantilever and the extending portion, the detecting end and the cantilever having a second angle, the extending portion passing through the circuit board via the first slot, the soldering portion being soldered to the The second side. A detecting device includes: a circuit board having a first surface, a second surface, and at least one first slot, the first surface being opposite to the second surface, the at least one first slot extending through the The circuit board is connected to the first surface and the second surface; a spacer is fixed to the first surface and has at least one second slot corresponding to the first slot; a plurality of fixing members are fixed to the And a plurality of probes, each of the probes has a detecting portion, an extending portion and a soldering portion, the detecting portion has a detecting end and a cantilever, and the cantilever is connected to the detecting end and the extending portion One end of the portion, and the cantilever is connected to one of the fixing members, and the other end of the extending portion is connected to the welding portion, wherein the cantilever and the extension Between the protrusions having a first angle, the detection end and the cantilever having a second angle, the extension passing through the spacer and the circuit respectively through the second slot and the first slot The plate is welded to the second surface. The detecting device of claim 1 or 2, wherein the first slot is adjacent to the fixing members. The detecting device according to claim 1 or 2, further comprising a reinforcing member fixed to the second surface of the circuit board, and the reinforcing member and the circuit board are formed to be received The accommodation space of the welded portion of the probe. A detecting device includes: a circuit board having a first surface, a second surface, and at least one through hole, wherein the first surface is opposite to the second surface, the at least one through hole penetrating through the circuit board and respectively opening The first surface and the second surface; a reinforcing member disposed on the second surface and having at least one slit; at least one spacer fixed to the reinforcing member and disposed in the at least one through hole and forming at least a gap corresponding to the at least one slit; a plurality of fixing members fixed to the at least one spacer; and a plurality of probes each having a detecting portion, an extending portion, and a soldering The detecting portion has a detecting end and a cantilever, the cantilever is connected to the detecting end and one end of the extending portion, and the cantilever is connected to one of the fixing members, and the other end of the extending portion is connected to the welding portion, wherein a first angle between the cantilever and the extension, and a detection between the cantilever and the cantilever a second angle, the extension passes through the gap between the circuit board and the reinforcing member, and the soldering portion is soldered to the second surface. The detecting device of claim 5, wherein the at least one spacer is spaced apart from the wall surface of the at least one through hole to form the gap. The detecting device according to claim 6, comprising a plurality of the spacers, and another gap is formed between each two adjacent spacers. The detecting device of claim 6, wherein the circuit board has a plurality of the through holes, and the spacers are respectively disposed in the through holes. The detecting device of claim 5, wherein the spacer is fixed to the reinforcing member by a bolt. The detecting device of claim 5, wherein the reinforcing member and the spacer are integrally formed as a reinforcing spacer. The detecting device of claim 2, wherein the spacer has a recess in which the fixing member is received. The detecting device according to any one of the preceding claims, wherein the cantilever of each of the probes extends from the fixing member toward the extending portion by a distance, and the extending portion forms the same The first angle. The detecting device according to claim 12, wherein the distance is less than 2 mm. The detecting device of any one of claims 1, 2, and 5, wherein the extension of each of the probes is disposed substantially perpendicular to the circuit board. The detecting device according to any one of claims 1 to 2, wherein the plurality of fixing members are connected to each other to form an integral fixing member structure, and the fixing member has a mouth-shaped or a U-shaped structure. The detecting device of claim 15, wherein each of the fixing members corresponds to a test object.