TWM471036U - Light-emitting diode packaging structure - Google Patents

Description

Light emitting diode package structure

The present invention relates to a light emitting diode package structure, and more particularly to a light emitting diode package structure for preventing side leakage.

In recent years, due to the rapid development of the information industry, users may use portable electronic devices such as notebook computers or smart phones in different environments. For a notebook computer, in a weak light environment, the user may not be able to see the numbers and characters marked on the keyboard keys, which may cause difficulty in the operation. In serious cases, the user may even be obsessed with the identification of the button. damage. In the prior art, the addition of an indicator number to a particular button may improve the above problem. In addition, the light-emitting configuration with different indicator numbers allows the user who uses the keyboard to know whether the input command is turned on or off, such as the antenna function or the Caps Lock key is turned on or off.

In the prior art, the backplane module of the keyboard with the indicator number added to the specific button has a circuit board, a light source, and a prefabricated metal cover. The light source is disposed on the circuit board, and the prefabricated metal cover covers the light source and the circuit board. Further, a position of the corresponding light source on the prefabricated metal cover may be opened with a first opening. The button is disposed above the prefabricated metal cover, and the key cap of the button has a second opening corresponding to the first opening. Thereby, the light emitted by the light source can pass through the first opening of the prefabricated metal cover and the second opening of the keycap to be visually observable by the user. However, the light emitted by conventional light sources still produces side leakage from the sides of the prefabricated metal cover.

The present invention provides a light emitting diode package structure that can solve the conventional problem that the light emitted by the light source will still generate side from the side of the prefabricated metal cover. The lack of light leakage.

A light-emitting diode package structure according to one embodiment of the present invention includes: a substrate unit, a light-emitting unit, a light-transmitting unit, and a light-shielding unit. The substrate unit includes a substrate body. The light emitting unit includes at least one light emitting diode chip disposed on the substrate body. The light transmissive unit includes a light transmissive colloid disposed on the substrate body and covering at least one of the light emitting diode chips, and the light transmissive colloid has a light emitting surface. The light shielding unit includes a light shielding colloid disposed on the substrate body for covering the light transmissive colloid to expose only the light emitting surface of the light transmissive colloid.

A light emitting diode package structure according to another embodiment of the present invention includes: a substrate unit, a light emitting unit, a light transmitting unit, and a light blocking unit. The substrate unit includes a substrate body. The light emitting unit includes a plurality of light emitting diode chips disposed on the substrate body. The light transmissive unit includes a light transmissive colloid disposed on the substrate body and covering a plurality of the light emitting diode wafers, and the light transmissive colloid has a plurality of corresponding light emitting diodes respectively The light exit surface of the bulk wafer. The light shielding unit includes a light shielding colloid disposed on the substrate body for covering the light transmissive colloid and only a plurality of the light emitting surfaces of the light transmissive colloid are exposed.

The beneficial effect of the present invention is that the LED package structure provided by the present embodiment can be transparently disposed on the substrate body for covering the transparent colloid. a light-shielding colloid which is exposed on the light-emitting surface of the colloid" and a light-shielding colloid disposed on the substrate body for covering the light-transmitting colloid to expose only a plurality of the light-emitting surfaces of the light-transmitting colloid The design is such that the creation can achieve the effect of completely preventing side leakage.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

Z‧‧‧LED package structure

1‧‧‧Substrate unit

10‧‧‧ circuit board

100‧‧‧ surrounding surface

101‧‧‧Top pad

102‧‧‧Bottom pad

103‧‧‧ conductive through hole

2‧‧‧Lighting unit

20‧‧‧Light Diode Wafer

3‧‧‧Lighting unit

30‧‧‧Translucent colloid

30A‧‧‧First light transmission department

30B‧‧‧Second light transmission department

300B‧‧‧Glossy surface

301B‧‧‧ surrounding surface

D1, d2‧‧‧ diameter

D3, d4, d5, d6‧‧ diameter

H1, H2‧‧‧ height

31‧‧‧Fluorescent particles

32‧‧‧Diffusion particles

4‧‧‧ shading unit

40‧‧‧ shading gel

400‧‧‧ upper surface

401‧‧‧ surrounding surface

5‧‧‧Anti-surge unit

50‧‧‧Anti-burst chip

K‧‧‧Reservation of the keycap

K100‧‧‧Light opening

FIG. 1A is a front view of a light emitting diode package structure according to a first embodiment of the present invention.

FIG. 1B is a schematic top view of a light emitting diode package structure according to a first embodiment of the present invention.

2A is a schematic top plan view of a circuit substrate of the light emitting diode package structure of the first embodiment of the present invention.

2B is a bottom view of the circuit substrate of the light emitting diode package structure of the first embodiment of the present invention.

FIG. 3 is a front elevational view showing the light emitting diode package structure of the second embodiment of the present invention.

4A is a front elevational view showing the light-emitting surface of the light-emitting diode package structure of the third embodiment of the present invention having a diameter d5.

FIG. 4B is a schematic top plan view showing the light-emitting surface of the light-emitting diode package structure according to the third embodiment of the present invention having a diameter d5.

FIG. 5A is a front elevational view showing the light-emitting surface of the light-emitting diode package structure according to the third embodiment of the present invention having a diameter d6.

FIG. 5B is a top plan view showing the light-emitting surface of the light-emitting diode package structure according to the third embodiment of the present invention having a diameter d6.

FIG. 6 is a front view of a light emitting diode package structure according to a fourth embodiment of the present invention.

FIG. 7 is a front elevational view showing the light emitting diode package structure of the fifth embodiment of the present invention.

FIG. 8 is a top plan view showing the LED package structure of the sixth embodiment disposed under a predetermined key cap.

[First Embodiment]

Referring to FIG. 1A and FIG. 1B , the first embodiment of the present invention provides a light emitting diode (LED) package structure Z for preventing side leakage, comprising: a substrate unit 1 , a light emitting unit 2 , and a through The light unit 3 and a light shielding unit 4.

First, the substrate unit 1 includes a circuit substrate 10. The light emitting unit 2 includes at least one light emitting diode chip 20 disposed on the circuit substrate 10 and electrically connected to the circuit substrate 10, and the light emitting diode chip 20 can be electrically connected to the circuit through two wires (not labeled). Substrate 10. The light transmissive unit 3 includes a package disposed on the circuit substrate 10 The light-transmitting colloid 30 of the light-emitting diode chip 20 has a first light-transmitting portion 30A disposed on the circuit substrate 10 and covering the light-emitting diode wafer 20 and at least one light-transmitting from the first light-transmitting body 30. The portion 30A protrudes upward and corresponds to the second light transmitting portion 30B of the light emitting diode chip 20, and the second light transmitting portion 30B has a light emitting surface 300B and is connected between the light emitting surface 300B and the first light transmitting portion 30A. The surrounding surface 301B (or around the surface). The light shielding unit 4 includes a light shielding colloid 40 disposed on the circuit substrate 10 for exposing the light surface 300B (that is, a light shielding surface disposed on the substrate body 10 for covering the light transmitting colloid 30 to allow only the light emitting colloid 30 to be emitted. 300B exposed light-shielding gel 40, which may be opaque black plastic), wherein the light-shielding gel 40 covers the first light-transmitting portion 30A and covers the peripheral surface 301B of the second light-transmitting portion 30B, and the light-shielding gel 40 has a first The upper surface 400 of the light-emitting surface 300B of the light-transmitting portion 30B is flush.

Furthermore, the first light transmitting portion 30A may be a first cylindrical body disposed on the circuit substrate 10 and covering the light emitting diode wafer 20. The second light transmitting portion 30B may be a second cylinder integrally formed from the first light transmitting portion 30A and protruding upwardly and directly above the light emitting diode wafer 20, and the light emitting surface 300B of the second light transmitting portion 30B may be It is a circular surface directly above the light emitting diode wafer 20, and the diameter d2 of the second light transmitting portion 30B is smaller than the diameter d1 of the first light transmitting portion 30A. In addition, the circuit substrate 10 has a peripheral surface 100 (or a surrounding surface), and the light shielding colloid 40 has a peripheral surface 401 (or a surrounding surface) connected to the upper surface 400, and the peripheral surface 100 of the circuit substrate 10 and the periphery of the light shielding colloid 40 The surfaces 401 are flush with each other.

Furthermore, as shown in FIG. 2A and FIG. 2B, the circuit substrate 10 has at least two top pads 101, at least two bottom pads 102 corresponding to the two top pads 101, and two electrical connections respectively. A conductive via 103 is formed between one of the top pads 101 and one of the bottom pads 102 and between the other of the top pads 101 and the other bottom pad 102. In addition, the LED package structure Z of the present invention further includes: an anti-surge unit 5. The anti-surge unit 5 includes at least one anti-surge chip 50 (for example, a Zener diode having an antistatic function) disposed on the circuit substrate 10 and electrically connected to the circuit substrate 10, and is protected against Surge unit 5 can The light-emitting unit 2 is electrically connected in parallel. Further, in the step of disposing the plurality of light emitting units 2 on the carrier substrate 1', the method further includes: disposing a plurality of anti-surge wafers 50 respectively corresponding to the plurality of light emitting units 2 on the carrier substrate 1' The plurality of anti-surge chips 50 are electrically connected to the plurality of light emitting units 2 in parallel, and the plurality of anti-surge chips 50 are respectively covered by the plurality of transparent colloids 30. Therefore, since the LED chip 20 and the anti-surge chip 50 are electrically connected between the two top pads 101, both the light-emitting unit 2 and the anti-surge unit 5 can be electrically connected to each other in parallel. Connected to protect the light unit 2 and increase the life of the light unit 2.

[Second embodiment]

As shown in FIG. 3, the second embodiment of the present invention can provide a light emitting diode package structure Z for preventing side leakage, comprising: a substrate unit 1, a light emitting unit 2, a light transmitting unit 3, and a Shading unit 4. It can be seen from the comparison between FIG. 3 and FIG. 1A that the greatest difference between the second embodiment of the present invention and the first embodiment is that, in the second embodiment, the light transmitting unit 3 further includes a plurality of uniformly distributed in the transparent colloid 30. The fluorescent particles 31 and a plurality of diffusion particles 32 uniformly distributed in the transparent colloid 30, wherein the plurality of diffusion particles 32 can be used to increase the light extraction efficiency of the present invention. In other words, the light transmitting unit 3 can be formed by mixing the light transmitting colloid 30, the plurality of fluorescent particles 31, and the plurality of diffusion particles 32 which are made of epoxy resin or silicone.

[Third embodiment]

Referring to FIG. 4A to FIG. 5B , the third embodiment of the present invention can provide a light emitting diode package structure Z for preventing side leakage, comprising: a substrate unit 1 , a light emitting unit 2 , and a light transmitting unit 3 and a shading unit 4. 4A and FIG. 1A, the greatest difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the diameter of the second light transmitting portion 30B can be oriented from the first light transmitting portion 30A. The direction of the light-emitting surface 300B of the second light-transmitting portion 30B is gradually reduced, wherein the maximum diameter d4 of the second light-transmitting portion 30B is smaller than the diameter d3 of the first light-transmitting portion 30A, and the minimum diameter of the second light-transmitting portion 30B (d5, D6) may follow the upper surface 400 of the light-shielding body 40 The change in the inversion is performed with respect to the change in the height (H1, H2) of the first light transmitting portion 30A. For example, when the height of the upper surface 400 of the light shielding colloid 40 relative to the first light transmitting portion 30A is adjusted from H1 (as shown in FIG. 4A) to H2 by grinding (as shown in FIG. 5A), the second through The diameter of the light-emitting surface 300B of the light portion 30B can be increased from d5 to d6. In other words, the diameter (d5, d6) or the width of the light-emitting surface 300B of the second light-transmitting portion 30B of the present invention is not in a fixed state, but may be changed or adjusted according to different use requirements.

[Fourth embodiment]

Referring to FIG. 6 , a fourth embodiment of the present invention can provide a light emitting diode package structure Z for preventing side leakage, comprising: a substrate unit 1 , a light emitting unit 2 , a light transmitting unit 3 , and a light emitting unit 3 . Shading unit 4. It can be seen from the comparison between FIG. 6 and FIG. 1A that the fourth embodiment of the present invention is the most different from the first embodiment in that, in the fourth embodiment, the light-emitting unit 2 includes a plurality of light-emitting units 2 disposed on the circuit substrate 10 and electrically connected thereto. The LED substrate 20 of the circuit substrate 10. Therefore, each of the single LED package structures Z can be disposed on the circuit substrate 10, the plurality of LED packages 20 disposed on the circuit substrate 10 and electrically connected to the circuit substrate 10, and disposed on the circuit substrate 10 and packaged. The light-transmitting colloid 30 covering the plurality of light-emitting diode wafers 20 and the light-shielding colloid 40 disposed on the circuit board 10 for exposing the light-emitting surface 300B of the light-transmitting colloid 30 are composed of four.

[Fifth Embodiment]

Referring to FIG. 7 , a fifth embodiment of the present invention can provide a light emitting diode package structure Z for preventing side leakage, comprising: a substrate unit 1 , a light emitting unit 2 , a light transmitting unit 3 , and a light emitting unit 3 . Shading unit 4. It can be seen from the comparison between FIG. 7 and FIG. 1A that the fifth embodiment of the present invention is the most different from the first embodiment in that, in the fifth embodiment, the light-emitting unit 2 includes a plurality of light-emitting units 2 disposed on the circuit substrate 10 and electrically connected thereto. The LED substrate 20 of the circuit substrate 10. The light transmissive unit 3 includes a light transmissive colloid 30 disposed on the circuit substrate 10 and covering the plurality of light emitting diode chips 20, wherein the light transmissive colloid 30 has a plurality of light emitting diodes disposed on the circuit substrate 10. Body wafer 20 The first light transmitting portion 30A and the plurality of second light transmitting portions 30B protruding upward from the first light transmitting portion 30A and respectively corresponding to the plurality of light emitting diode wafers 20, and each of the second light transmitting portions 30B has A light emitting surface 300B and a peripheral surface 301B connected between the light emitting surface 300B and the first light transmitting portion 30A. The light shielding unit 4 includes a light shielding colloid 40 disposed on the circuit substrate 10 for exposing the light emitting surface 300B of each of the second light transmitting portions 30B (that is, disposed on the substrate body 10 for covering the light transmitting colloid 30). The light-shielding gel 40 which is exposed to the plurality of light-emitting surfaces 300B of the light-transmitting colloid 30 at the same time may be an opaque black rubber, wherein the light-shielding gel 40 covers the first light-transmitting portion 30A and covers each of the second light-transmitting portions. The peripheral surface 301B of 30B, and the light shielding colloid 40 has an upper surface 400 that is flush with the light exiting surface 300B of each of the second light transmitting portions 30B.

[Sixth embodiment]

Referring to FIG. 8 , the sixth embodiment of the present invention can provide a light emitting diode package structure Z applied to a predetermined key cap K, wherein the light emitting diode package structure Z is disposed under the predetermined key cap K, and The predetermined keycap K has at least one light-transmissive opening K100 (for example, a solid transparency or a hollowed out opening) corresponding to the light-emitting surface 300B of the second light-transmitting portion 30B. For example, the predetermined keycap K can be a keycap with a Caps Lock function. When the user presses the predetermined keycap K, the LED package structure Z can illuminate the LED chip. The generated light beam is projected from the light-transmitting opening K100 of the predetermined keycap K to be provided to the user as an indication. Therefore, the user can easily judge that the keycap having the uppercase key lock function is in an open or closed state by the light beam projected from the light-transmitting opening K100 of the predetermined keycap K by the light-emitting diode wafer 20.

[Possible effects of the examples]

In summary, the beneficial effect of the present invention may be that the LED package structure Z provided by the present embodiment can be transparently disposed on the substrate body 10 for covering the transparent colloid 30. The light-shielding colloid 40" of the light-emitting surface 300B of the light-transmitting colloid 30 and the "light-shielding gel 40 disposed on the substrate body 10 for covering the light-transmitting colloid 30 to expose only the plurality of light-emitting surfaces 300B of the light-transmitting colloid 30" of Designed to make this creation completely prevent side leakage.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Therefore, the equivalent technical changes that are made by using the present specification and the contents of the drawings are included in the scope of the present invention.

Z‧‧‧LED package structure

1‧‧‧Substrate unit

10‧‧‧ circuit board

100‧‧‧ surrounding surface

2‧‧‧Lighting unit

20‧‧‧Light Diode Wafer

3‧‧‧Lighting unit

30‧‧‧Translucent colloid

30A‧‧‧First light transmission department

30B‧‧‧Second light transmission department

300B‧‧‧Glossy surface

301B‧‧‧ surrounding surface

4‧‧‧ shading unit

40‧‧‧ shading gel

400‧‧‧ upper surface

401‧‧‧ surrounding surface

Claims (14)

A light emitting diode package structure comprising: a substrate unit, the substrate unit comprises a substrate body; a light emitting unit, wherein the light emitting unit comprises at least one light emitting diode chip disposed on the substrate body; a light transmissive unit, the light transmissive unit includes a light transmissive colloid disposed on the substrate body and covering at least one of the light emitting diode chips, and the light transmissive colloid has a light emitting surface; and a light shielding unit The light shielding unit includes a light shielding colloid disposed on the substrate body for covering the light transmissive colloid to expose only the light emitting surface of the light transmissive colloid. The light-emitting diode package structure of claim 1, wherein the light-transmitting colloid has a first light-transmitting portion disposed on the substrate body and covering at least one of the light-emitting diode chips And at least one second light transmitting portion protruding upward from the first light transmitting portion and corresponding to at least one of the light emitting diode chips, and at least one of the second light transmitting portions has the light emitting surface and a light emitting surface Connecting to a peripheral surface between the light-emitting surface and the first light-transmitting portion, wherein the light-shielding gel covers the first light-transmitting portion and covers the surrounding surface of at least one of the second light-transmitting portions And the light shielding colloid has an upper surface that is flush with the light emitting surface of the at least one second light transmitting portion. The light emitting diode package structure of claim 2, wherein the first light transmitting portion is a first cylinder disposed on the substrate body and covering at least one of the light emitting diode wafers The at least one second light transmitting portion is a second cylinder integrally formed from the first light transmitting portion and protruding upwardly of the at least one of the light emitting diode chips, and at least one The light emitting surface of the second light transmitting portion is a circular surface directly above the at least one light emitting diode wafer. The light emitting diode package structure according to claim 3, wherein at least one of the second light transmitting portions has a diameter smaller than a diameter of the first light transmitting portion. The light emitting diode package structure according to claim 3, wherein the diameter of at least one of the second light transmitting portions is from the first light transmitting portion toward the at least one of the second light transmitting portions The direction of the light exiting surface is gradually reduced, and the maximum diameter of at least one of the second light transmitting portions is smaller than the diameter of the first light transmitting portion. The light emitting diode package structure according to claim 2, wherein the substrate body has a peripheral surface, the light shielding colloid has a peripheral surface connected to the upper surface, and the substrate body is The surrounding surface and the surrounding surface of the light shielding colloid are flush with each other, wherein the light transmitting unit comprises a plurality of fluorescent particles uniformly distributed in the transparent colloid and a plurality of uniformly distributed in the transparent adhesive Diffusion particles in the body. The light emitting diode package structure of claim 1, further comprising: an anti-surge unit, wherein the anti-surge unit comprises at least one disposed on the substrate body and electrically connected to the An anti-surge chip of the substrate body, wherein the anti-surge unit is electrically connected to the light emitting unit by a parallel connection. A light emitting diode package structure comprising: a substrate unit, the substrate unit comprises a substrate body; a light emitting unit, wherein the light emitting unit comprises a plurality of light emitting diode chips disposed on the substrate body; a light transmissive unit, the light transmissive unit includes a light transmissive colloid disposed on the substrate body and covering the plurality of the light emitting diode chips, and the light transmissive colloid has a plurality of corresponding to the plurality of a light-emitting surface of the light-emitting diode wafer; and a light-shielding unit, wherein the light-shielding unit includes a plurality of the light-shielding colloids disposed on the substrate body for covering the light-transmitting colloid The exposed light-shielding gel on the shiny side. The light emitting diode package structure of claim 8, wherein the light transmissive colloid has a plurality of the light emitting bodies disposed on the substrate body a first light transmitting portion of the diode wafer and a plurality of second light transmitting portions protruding upward from the first light transmitting portion and respectively corresponding to the plurality of the light emitting diode chips, and each of the The light-transmitting portion has a corresponding light-emitting surface and a peripheral surface connected between the corresponding light-emitting surface and the first light-transmitting portion, wherein the light-shielding gel covers the first light-transmitting surface And covering the surrounding surface of each of the second light transmitting portions, and the light shielding colloid has an upper surface that is flush with the light emitting surface of each of the second light transmitting portions. The light emitting diode package structure of claim 9, wherein the first light transmitting portion is a first cylinder disposed on the substrate body and covering at least one of the light emitting diode wafers Each of the second light transmitting portions is a second cylinder integrally formed from the first light transmitting portion and protruding upwardly and corresponding to the corresponding light emitting diode wafer, and each The light exiting surface of one of the second light transmitting portions is a circular surface directly above the corresponding light emitting diode wafer. The light emitting diode package structure according to claim 10, wherein each of the second light transmitting portions has a diameter smaller than a diameter of the first light transmitting portion. The light emitting diode package structure according to claim 10, wherein a diameter of each of the second light transmitting portions gradually decreases from a direction of the first light transmitting portion toward a corresponding light emitting surface, And a maximum diameter of the second light transmitting portion is smaller than a diameter of the first light transmitting portion. The light emitting diode package structure according to claim 9, wherein the substrate body has a peripheral surface, the light shielding colloid has a peripheral surface connected to the upper surface, and the substrate body is The surrounding surface and the surrounding surface of the light shielding colloid are flush with each other, wherein the light transmitting unit comprises a plurality of fluorescent particles uniformly distributed in the transparent colloid and a plurality of uniformly distributed in the transparent adhesive Diffusion particles in the body. The light emitting diode package structure of claim 8, further comprising: an anti-surge unit, wherein the anti-surge unit comprises at least one disposed in the An anti-surge chip on the substrate body and electrically connected to the substrate body, wherein the anti-surge unit is electrically connected to the light emitting unit by a parallel connection.