TWM467896U - Image capturing module and its optical aiding unit - Google Patents

Description

Image capture module and optical auxiliary unit

The present invention relates to an image capturing module and an optical auxiliary unit thereof, and more particularly to an image capturing module for improving image capturing quality and an optical auxiliary unit thereof.

In recent years, the trend of handheld devices such as mobile phones and PDAs has become increasingly popular, and with the market demand for better handheld devices and smaller size, The group has faced the dual requirements of higher image quality and miniaturization. In view of the improvement of the image quality of the image capture module, on the one hand, the pixel is improved. The market trend is from the original VGA level of 30 pixels, which has progressed to the current two million pixels and three million pixels commonly used in the market. Even worse, it has introduced a higher level of more than eight million pixels. In addition to the improvement of pixels, on the other hand, the resolution of the image is taken care of. Therefore, the image capturing module of the handheld device is also developed by the fixed focus image capturing function toward the camera-like optical autofocus function or even the optical zoom function.

The optical autofocus function is operated according to different distances and close distances of the target object to appropriately move the lens in the image capturing module, so that the optical image of the image capturing object can be accurately focused on the image sensor. To produce a clear image. At present, it is common to activate the lens movement in the image capturing module, which includes stepping motor actuation, piezoelectric actuation, and voice coil motor (VCM) actuation. However, in the case of insufficient light source, the image quality captured by the conventional image capturing module is lowered.

The present invention provides an image capturing module and an optical auxiliary unit thereof for effectively improving the overall image capturing quality.

An image capturing module provided by one embodiment of the present invention includes: an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a frame housing disposed on the carrier substrate to cover the image sensing wafer and a movable lens assembly movably disposed in the frame housing, wherein the movable lens The assembly includes a movable housing movably disposed within the frame housing, at least one optical lens assembly disposed within the movable housing, a microlens array substrate disposed within the movable housing, and A non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability.

An optical auxiliary unit is provided in another embodiment of the present invention. The optical auxiliary unit is applied to an image sensing unit, and the optical auxiliary unit comprises: a frame housing and a movable lens assembly. The movable lens assembly is movably disposed within the frame housing, wherein the movable lens assembly includes a movable housing movably disposed within the frame housing, at least one disposed on the movable An optical lens group in the housing, a microlens array substrate disposed in the movable housing, and a non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability.

Preferably, the microlens array substrate comprises a light transmissive substrate disposed in the movable housing and a microlens array disposed on a lower surface of the transparent substrate and facing the image sensing unit. The microlens array is composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and faces at least one of the optical lens groups.

Preferably, the microlens array substrate comprises a light transmissive substrate disposed in the movable housing and a microlens array disposed on a lower surface of the transparent substrate and facing at least one of the optical lens groups The microlens array is composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate opposite to at least one of the optical lens groups.

Preferably, at least one of the optical lens groups includes a first lens unit and a second lens unit, and the microlens array substrate includes a first lens unit disposed in the movable housing and a transparent substrate between the second lens units and a microlens array disposed on a lower surface of the transparent substrate and facing the first lens unit, wherein the microlens array is separated from each other by a predetermined one A microlens of distance is formed, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and faces the second lens unit.

The image capture module and the optical auxiliary unit provided by the present invention can be transmitted through a "microlens array substrate disposed in the movable housing" and "one set in The non-conductive photosensitive film layer on the microlens array substrate is designed to enhance the light absorption capability, so as to effectively improve the image quality captured by the image sensing unit of the image capturing module.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

M‧‧‧Image Capture Module

1‧‧‧Image sensing unit

10‧‧‧Loading substrate

11‧‧‧Image sensing wafer

110‧‧‧Image sensing area

2‧‧‧Optical Auxiliary Unit

20‧‧‧Frame housing

201‧‧‧ first frame

202‧‧‧ second framework

21‧‧‧Removable lens assembly

210‧‧‧Removable housing

211‧‧‧ optical lens unit

2111‧‧‧First lens unit

2112‧‧‧second lens unit

212‧‧‧Microlens array substrate

2120‧‧‧Transparent substrate

2121‧‧‧Microlens array

21210‧‧‧Microlens

213‧‧‧Non-conductive photosensitive film layer

W‧‧‧Flexible wire

FIG. 1 is a side cross-sectional view of the image capturing module of the first embodiment of the present invention.

2 is a side cross-sectional view showing the image capturing module of the first embodiment of the present invention using a voice coil actuator.

3 is a side cross-sectional view of the image capturing module of the second embodiment of the present invention.

4 is a side cross-sectional view of the image capturing module of the third embodiment of the present invention.

[First Embodiment]

As shown in FIG. 1 and FIG. 2 , the first embodiment of the present invention provides an image capturing module M, which includes an image sensing unit 1 and an optical auxiliary unit 2 .

First, the image sensing unit 1 includes a carrier substrate 10 and an image sensing wafer 11 disposed on the carrier substrate 10 and electrically connected to the carrier substrate 10. The top surface of the image sensing wafer 11 has a sensing or Capture the image sensing area of the image 110. For example, the image sensing wafer 11 may be disposed on the carrier substrate 10 by an adhesive (not labeled, such as a UV adhesive, a thermosetting adhesive, or an in-furnace hardening adhesive, etc.). In addition, the carrier substrate 10 can be a circuit substrate having a plurality of conductive pads (not labeled) on the upper surface thereof. The upper surface of the image sensing wafer 11 also has a plurality of conductive pads (not labeled), and the image sensing wafer 11 Each of the conductive pads can be electrically connected to the conductive pads of the carrier substrate 10 through a conductive line W to achieve electrical conduction between the image sensing wafer 11 and the carrier substrate 10.

Furthermore, the optical auxiliary unit 2 includes a frame housing 20 disposed on the carrier substrate 10 to cover the image sensing wafer 11 and a movable lens assembly 21 movably disposed within the frame housing 20. The movable lens assembly 21 includes a movable housing 210 movably disposed in the frame housing 20, at least one optical lens group 211 disposed in the movable housing, and a movable lens housing 20 disposed therein. The microlens array substrate 212, and a non-conductive photosensitive film layer 213 for improving light absorption capability, and the non-conductive photosensitive film layer 213 are disposed in the movable case 20 and disposed on the microlens array substrate 212. Furthermore, the microlens array substrate 212 includes a light transmissive substrate 2120 disposed in the movable housing 210 and a microlens array 2121 disposed on the lower surface of the transparent substrate 2120 and facing the image sensing unit 1. The microlens array 2121 may be composed of a plurality of microlenses 21210 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 213 is disposed on the upper surface of the transparent substrate 2120 and faces the optical lens group 211, wherein the non-conductive photosensitive film layer 213 Adjacent to the optical lens group 211.

Thereby, the present invention can guide more light sources to the plurality of microlenses 21210 of the microlens array 2121 of the microlens array substrate 212 by using the non-conductive photosensitive film layer 213 having the light absorbing ability. Therefore, the creation of the microlens array substrate 212 and the non-conductive photosensitive film layer 213 can effectively improve the image quality captured by the image sensing unit 1 of the image capturing module M (for example, improving the color sharpness). (sharpness) and image resolution (resolution).

For example, the frame housing 20 may be disposed on the carrier substrate 10 by an adhesive (not labeled, such as a UV adhesive, a thermosetting adhesive, or an in-furnace hardener, etc.). The optical lens group 211 and the transparent substrate 2120 of the microlens array substrate 212 are all fixed in the movable housing 210, and the optical lens group 211 can be composed of a plurality of optical lenses, wherein the optical lens group 211 shown in FIG. 1 is used. Two optical lenses are taken as an example for illustration. In addition, the non-conductive photosensitive film layer 213 may be made of a nano material having a light absorbing ability, and the non-conductive photosensitive film layer 213 may be set by lamination, coating, spraying, sputtering, or any forming means. On the microlens array substrate 212. In addition, as shown in FIG. 2, the optical auxiliary unit 2 may be a voice coil actuator. The frame housing 20 includes a first frame 201 disposed on the carrier substrate 10 and a second frame 202 disposed on the first frame 201. The image sensing wafer 11 is disposed in the first frame 201 of the frame housing 20. And the movable lens assembly 21 is movably disposed within the second frame 202 of the frame housing 20. However, the present invention is not limited thereto. For example, the optical auxiliary unit 2 may be composed of a fixed plastic frame and a non-moving lens assembly that is positioned in the fixed plastic frame by a fixing glue.

[Second embodiment]

As shown in FIG. 3 , the second embodiment of the present invention provides an image capturing module M including an image sensing unit 1 and an optical auxiliary unit 2 . As can be seen from the comparison between FIG. 3 and FIG. 1, the greatest difference between the second embodiment of the present invention and the first embodiment is that, in the second embodiment, the microlens array substrate 212 includes a transparent lens housing 210 disposed therein. The optical substrate 2120 and a microlens array 2121 disposed on the lower surface of the transparent substrate 2120 and facing the optical lens group 211, wherein the microlens array 2121 is adjacent to the optical lens group 211. In addition, the microlens array 2121 may be composed of a plurality of microlenses 21210 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 213 is disposed on the upper surface of the light transmissive substrate 2120 and opposed to the optical lens group 211. In other words, the present invention can dispose the microlens array substrate 212 having the non-conductive photosensitive film layer 213 under the optical lens group 211 and near the bottom end of the movable housing 210 according to different design requirements (as disclosed in FIG. 1). The first embodiment) is disposed above the optical lens group 211 and near the top end of the movable housing 210 (as disclosed in FIG. 3) Two embodiments).

[Third embodiment]

As shown in FIG. 4 , the third embodiment of the present invention provides an image capturing module M, which includes an image sensing unit 1 and an optical auxiliary unit 2 . The comparison between FIG. 4 and FIG. 1 shows that the third embodiment differs from the first embodiment in that the optical lens unit 211 includes a first lens unit 2111 and a second lens unit. 2112, wherein the first lens unit 2111 shown in FIG. 4 is exemplified by using one optical lens, and the second lens unit 2112 is exemplified by using one optical lens. Furthermore, the microlens array substrate 212 includes a transparent substrate 2120 disposed in the movable housing 210 and disposed between the first lens unit 2111 and the second lens unit 2112, and a lower surface disposed on the transparent substrate 2120. The microlens array 2121 that faces up and faces the first lens unit 2111. In addition, the microlens array 2121 may be composed of a plurality of microlenses 21210 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 213 is disposed on the upper surface of the light transmissive substrate 2120 and faces the second lens unit 2112. In other words, the present invention can dispose the microlens array substrate 212 having the non-conductive photosensitive film layer 213 under the optical lens group 211 and near the bottom end of the movable housing 210 according to different design requirements (as disclosed in FIG. 1). The first embodiment) is disposed above the optical lens group 211 and near the top end of the movable housing 210 (such as the second embodiment disclosed in FIG. 3), or is disposed on the first lens unit 2111 and the second Between the lens units 2112 (the third embodiment as disclosed in Fig. 4).

[Possible effects of the examples]

In summary, the image capture module M and the optical auxiliary unit 1 provided by the present embodiment can be transmitted through a microlens array disposed in the movable housing 210. The substrate 212" and the "non-conductive photosensitive film layer 213 disposed on the microlens array substrate 212 for enhancing the light absorbing ability" are designed to effectively enhance the image sensing unit 1 of the present image capturing module M. The image quality captured.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Therefore, equivalent technical changes made using the present specification and the contents of the drawings are included in the scope of the present invention.

M‧‧‧Image Capture Module

1‧‧‧Image sensing unit

10‧‧‧Loading substrate

11‧‧‧Image sensing wafer

110‧‧‧Image sensing area

2‧‧‧Optical Auxiliary Unit

20‧‧‧Frame housing

21‧‧‧Removable lens assembly

210‧‧‧Removable housing

211‧‧‧ optical lens unit

212‧‧‧Microlens array substrate

2120‧‧‧Transparent substrate

2121‧‧‧Microlens array

21210‧‧‧Microlens

213‧‧‧Non-conductive photosensitive film layer

W‧‧‧Flexible wire

Claims (10)

An image capturing module, comprising: an image sensing unit, the image sensing unit comprising a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate; And an optical auxiliary unit comprising: a frame housing disposed on the carrier substrate to cover the image sensing wafer; and a movable lens assembly movably disposed in the frame housing, Wherein the movable lens assembly includes a movable housing movably disposed in the frame housing, at least one optical lens group disposed in the movable housing, and a movable lens housing disposed in the movable housing A microlens array substrate, and a non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability. The image capturing module of claim 1, wherein the microlens array substrate comprises a transparent substrate disposed in the movable housing and a lower surface of the transparent substrate facing the image a microlens array of the sensing unit, the microlens array being composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the transparent substrate and facing at least one The optical lens group. The image capturing module of claim 1, wherein the microlens array substrate comprises a transparent substrate disposed in the movable housing and a lower surface of the transparent substrate facing at least one a microlens array of an optical lens group, the microlens array being composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and facing away from At least one of the optical lens groups. The image capturing module of claim 1, wherein at least one of the optical lens groups comprises a first lens unit and a second lens unit, and the microlens array substrate comprises a transparent substrate disposed in the movable housing and disposed between the first lens unit and the second lens unit, and a lower surface disposed on the transparent substrate and facing the first a microlens array of a lens unit, the microlens array being composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and facing the first Two lens unit. The image capture module of claim 1, wherein the frame housing comprises a first frame disposed on the carrier substrate and a second frame disposed on the first frame, the image sensing a wafer disposed within the first frame of the frame housing, and the movable lens assembly is movably disposed within the second frame of the frame housing, wherein at least one of the optical lenses The group and the microlens array substrate are both fixed in the movable housing, and at least one of the optical lens groups is composed of a plurality of optical lenses. An optical auxiliary unit, the optical auxiliary unit is applied to an image sensing unit, and the optical auxiliary unit comprises: a frame housing; and a movable lens assembly, the movable lens assembly is movably disposed at the In the frame housing, wherein the movable lens assembly includes a movable housing movably disposed in the frame housing, at least one optical lens group disposed in the movable housing, and a A microlens array substrate in the movable housing, and a non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability. The optical auxiliary unit of claim 6, wherein the microlens array substrate comprises a transparent substrate disposed in the movable housing and a lower surface of the transparent substrate facing the image sensing a microlens array of cells, the microlens array being composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and facing at least one of Optical lens group. The optical auxiliary unit of claim 6, wherein the microlens array substrate comprises a light transmissive substrate disposed in the movable housing and a lower surface disposed on the transparent substrate and facing at least one of the optics a microlens array of a lens group, the microlens array being composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and facing away from at least one The optical lens group. The optical auxiliary unit of claim 6, wherein at least one of the optical lens groups comprises a first lens unit and a second lens unit, and the microlens array substrate comprises a disposing body disposed in the movable housing and disposed at the a light transmissive substrate between the first lens unit and the second lens unit and a microlens array disposed on a lower surface of the light transmissive substrate and facing the first lens unit, wherein the microlens array is A plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and facing the second lens unit. The optical auxiliary unit of claim 6, wherein the frame housing comprises a first frame disposed on the image sensing unit and a second frame disposed on the first frame, the image sensing a unit disposed within the first frame of the frame housing, and the movable lens assembly is movably disposed within the second frame of the frame housing, wherein at least one of the optical lenses The group and the microlens array substrate are both fixed in the movable housing, and at least one of the optical lens groups is composed of a plurality of optical lenses.