TWI513295B - Image capturing module and actuator structure thereof - Google Patents

Description

Image capture module and actuator structure

The invention relates to an image capturing module and an actuator structure thereof, and more particularly to an image capturing module and an actuator structure thereof for improving image capturing quality.

In recent years, the trend of handheld devices such as mobile phones and PDAs has become increasingly popular, and with the market demand for better handheld devices and smaller size, The group has faced the dual requirements of higher image quality and miniaturization. In view of the improvement of the image quality of the image capture module, on the one hand, the pixel is improved. The market trend is from the original VGA level of 30 pixels, which has progressed to the current two million pixels and three million pixels commonly used in the market. Even worse, it has introduced a higher level of more than eight million pixels. In addition to the improvement of pixels, on the other hand, the resolution of the image is taken care of. Therefore, the image capturing module of the handheld device is also developed by the fixed focus image capturing function toward the camera-like optical autofocus function or even the optical zoom function.

The optical autofocus function is operated according to different distances and close distances of the target object to appropriately move the lens in the image capturing module, so that the optical image of the image capturing object can be accurately focused on the image sensor. To produce a clear image. At present, it is common to activate the lens movement in the image capturing module, which includes stepping motor actuation, piezoelectric actuation, and voice coil motor (VCM) actuation. However, in the case of insufficient light source, the image quality captured by the conventional image capturing module is lowered.

An embodiment of the present invention provides an image capturing module and an actuator structure thereof. It is used to effectively improve the overall image capture quality.

An image capturing module according to an embodiment of the present invention includes: an image sensing unit and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The actuator structure includes a first actuator unit and a second actuator unit that cooperates with the first actuator unit. The first actuator unit includes a first frame housing and a first movable component movably disposed in the first frame housing and above the image sensing unit, and the The first movable assembly includes a first movable housing movably disposed within the first frame housing and at least one optical lens assembly disposed within the first movable housing. The second actuator unit includes a second frame housing and a second movable component movably disposed in the second frame housing and located above the image sensing unit, and the The second movable component includes a second movable housing movably disposed in the second frame housing, a microlens array substrate disposed in the second movable housing, and a A non-conductive photosensitive film layer for enhancing light absorbing ability is provided on the microlens array substrate.

According to another embodiment of the present invention, an actuator structure is applied to an image sensing unit, and the actuator structure includes: a first actuator unit and a second Actuator unit. The first actuator unit includes a first frame housing and a first movable component movably disposed in the first frame housing and above the image sensing unit, wherein the first The movable assembly includes a first movable housing movably disposed within the first frame housing and at least one optical lens assembly disposed within the first movable housing. The second actuator unit cooperates with the first actuator unit, the second actuator unit includes a second frame housing and a movable frame disposed in the second frame housing a second movable component located above the image sensing unit, wherein the second movable component includes a second movable housing movably disposed within the second frame housing, a microlens array substrate in the second movable housing, and a A non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability.

The image capturing module and the actuator structure thereof provided by the embodiments of the present invention are permeable to "a microlens array substrate disposed in the second movable housing" and " A non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability is designed to effectively improve image quality captured by the image sensing unit of the image capturing module of the present invention.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

M‧‧‧Image Capture Module

1‧‧‧Image sensing unit

10‧‧‧Loading substrate

11‧‧‧Image sensing wafer

110‧‧‧Image sensing area

2‧‧‧First actuator unit

20‧‧‧First frame housing

21‧‧‧First movable component

210‧‧‧First movable housing

211‧‧‧ optical lens unit

3‧‧‧Second actuator unit

30‧‧‧Second frame housing

31‧‧‧Second movable component

310‧‧‧Second movable housing

311‧‧‧Microlens array substrate

3110‧‧‧Transparent substrate

3111‧‧‧Microlens array

31110‧‧‧Microlens

312‧‧‧Non-conductive photosensitive film layer

4‧‧‧Activity structure

40‧‧‧One-piece frame housing

41‧‧‧First movable component

410‧‧‧First movable housing

411‧‧‧Optical lens unit

42‧‧‧Second movable component

420‧‧‧Second movable housing

421‧‧‧Microlens array substrate

4210‧‧‧Transparent substrate

4211‧‧‧Microlens array

42110‧‧‧Microlens

422‧‧‧Non-conductive photosensitive film layer

W‧‧‧Flexible wire

1 is a side cross-sectional view of an image capturing module according to a first embodiment of the present invention.

2 is a side cross-sectional view showing the image capturing module of the first embodiment of the present invention using a voice coil actuator.

3 is a side cross-sectional view of an image capturing module according to a second embodiment of the present invention.

4 is a side cross-sectional view of an image capturing module according to a third embodiment of the present invention.

FIG. 5 is a side cross-sectional view of an image capturing module according to a fourth embodiment of the present invention.

[First Embodiment]

Referring to FIG. 1 and FIG. 2, a first embodiment of the present invention provides an image capturing module M, which includes an image sensing unit 1 and an actuator structure.

First, the image sensing unit 1 includes a carrier substrate 10 and an image sensing wafer 11 disposed on the carrier substrate 10 and electrically connected to the carrier substrate 10. The top surface of the image sensing wafer 11 has a sensing or The image sensing area 110 of the image is captured. For example, the image sensing wafer 11 may be disposed on the carrier substrate 10 by an adhesive (not labeled, such as a UV adhesive, a thermosetting adhesive, or an in-furnace hardening adhesive, etc.). In addition, the carrier substrate 10 can be a circuit substrate having a plurality of conductive pads (not labeled) on the upper surface, and the upper surface of the image sensing wafer 11 also has a plurality of conductive pads (not Each of the conductive pads of the image sensing wafer 11 can be electrically connected to the conductive pads of the carrier substrate 10 through a conductive line W to achieve electrical properties between the image sensing wafer 11 and the carrier substrate 10. Turn on.

Furthermore, the actuator structure includes a first actuator unit 2 and a second actuator unit 3 that cooperates with the first actuator unit 2. The first actuator unit 2 includes a first frame housing 20 and a first movable component 21 movably disposed in the first frame housing 20 and located above the image sensing unit 1 (ie, Moving the lens assembly), and the first movable assembly 21 includes a first movable housing 210 movably disposed within the first frame housing 20 and at least one optical lens disposed within the first movable housing 210 Group 211. In addition, the second actuator unit 3 includes a second frame housing 30 and a second movable component 31 movably disposed in the second frame housing 30 and located above the image sensing unit 1, and second The movable component 31 includes a second movable housing 310 movably disposed in the second frame housing 30, a microlens array substrate 311 disposed in the second movable housing 310, and a micro-mirror array substrate 311. A non-conductive photosensitive film layer 312 for enhancing light absorption capability is mounted on the lens array substrate 311.

Furthermore, the second frame housing 30 is disposed on the carrier substrate 10 to cover the image sensing wafer 11, and the first frame housing 20 is disposed on the second frame housing 30. In addition, the microlens array substrate 311 includes a transparent substrate 3110 disposed in the second movable housing 310 and a microlens array 3111 disposed on the lower surface of the transparent substrate 3110 and facing the image sensing unit 1. The microlens array 3111 may be composed of a plurality of microlenses 31110 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 312 is disposed on the upper surface of the light transmissive substrate 3110 and facing the optical lens group 311 of the first movable component 21.

Thereby, the present invention can guide more light sources to the plurality of microlenses 31110 of the microlens array 3111 of the microlens array substrate 311 by using the non-conductive photosensitive film layer 312 having the light absorbing ability. Therefore, the present invention can effectively improve the mutual cooperation of the microlens array substrate 311 and the non-conductive photosensitive film layer 312. The image quality captured by the image sensing unit 1 of the image capturing module M (for example, improving color sharpness and image resolution).

For example, the second frame housing 30 may be disposed on the carrier substrate 10 by an adhesive (for example, a UV adhesive, a thermosetting adhesive, or an in-furnace hardener, etc.), and the first frame housing 20 may also pass An adhesive (for example, a UV adhesive, a thermosetting adhesive, or an in-furnace hardener or the like) is provided on the second frame housing 30. The optical lens group 211 and the transparent substrate 3111 of the microlens array substrate 311 can be respectively fixed in the first movable housing 210 and the second movable housing 310, and the optical lens group 211 can be composed of a plurality of optical lenses, wherein The optical lens group 211 shown in Fig. 1 is exemplified by using two optical lenses. In addition, the non-conductive photosensitive film layer 312 may be made of a nano material having a light absorbing ability, and the non-conductive photosensitive film layer 312 may be laminated by lamination, coating, spraying, sputtering, or any forming means. On the microlens array substrate 311. In addition, as shown in FIG. 2, both the first actuator unit 2 and the second actuator unit 3 may be voice coil actuators, but the invention is not limited thereto.

[Second embodiment]

The image capture module M includes an image sensing unit 1 and an actuator structure 4 . It can be seen from the comparison between FIG. 3 and FIG. 1 that the greatest difference between the second embodiment of the present invention and the first embodiment is that the first frame housing 20 and the second frame housing 30 of the first embodiment can be integrally formed into one. The one-piece frame housing 40 is applied in the second embodiment, and the first movable component 41 and the second movable component 42 of the actuator structure 4 are movably disposed in the one-piece frame housing 40 . Moreover, the first movable component 41 includes a first movable housing 410 movably disposed in the one-piece frame housing 40 and at least one optical lens group 411 disposed in the first movable housing 410. . In addition, the second movable component 42 includes a second movable housing 420 movably disposed in the one-piece frame housing 40, a microlens array substrate 421 disposed in the second movable housing 420, And being disposed on the microlens array substrate 421 for improving light absorption capability A non-conductive photosensitive film layer 422.

Furthermore, the one-piece frame housing 40 is disposed on the carrier substrate 10 to cover the image sensing wafer 11 , and the microlens array substrate 421 includes a transparent substrate 4210 disposed in the second movable housing 420 and A microlens array 4211 disposed on the lower surface of the light transmissive substrate 4210 and facing the image sensing unit 1. In addition, the microlens array 4211 may be composed of a plurality of microlenses 42110 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 422 is disposed on the upper surface of the light transmissive substrate 4210 and faces the optical lens group of the first movable component 41. 411. In other words, the present invention can be used to form a two-piece frame housing (such as the first embodiment disclosed in FIG. 1) by using the first frame housing 20 and the second frame housing 30 to cooperate with each other according to different design requirements. Alternatively, a one-piece frame housing 40 (such as the second embodiment disclosed in FIG. 3) formed by integrally joining the first frame housing 20 and the second frame housing 30 is used.

[Third embodiment]

Referring to FIG. 4, a third embodiment of the present invention provides an image capturing module M, which includes an image sensing unit 1 and an actuator structure. It can be seen from the comparison between FIG. 4 and FIG. 1 that the greatest difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the first frame housing 20 is disposed on the carrier substrate 10 to cover the image sensing. The wafer 11 and the second frame housing 30 are disposed on the first frame housing 20. In addition, the microlens array substrate 311 includes a transparent substrate 3110 disposed in the second movable housing 310 and a microlens array 3111 disposed on the lower surface of the transparent substrate 3110 and facing the optical lens group 211, and The conductive photosensitive film layer 312 is disposed on the upper surface of the light-transmitting substrate 3111 and facing away from the optical lens group 211 of the first movable member 21. In other words, the second frame housing 30 and the first frame housing 20 can be sequentially stacked on the image sensing unit 1 according to different design requirements (such as the first embodiment disclosed in FIG. 1), or The first frame housing 20 and the second frame housing 30 are sequentially stacked on the image sensing unit 1 (as shown in the third embodiment disclosed in FIG. 4).

[Fourth embodiment]

Referring to FIG. 5, a fourth embodiment of the present invention provides an image capturing module. M, comprising: an image sensing unit 1 and an actuator structure 4. It can be seen from the comparison between FIG. 5 and FIG. 4 that the greatest difference between the fourth embodiment of the present invention and the third embodiment is that the first frame housing 20 and the second frame housing 30 of the third embodiment can be integrally formed into one. The one-piece frame housing 40 of the fourth embodiment is applied, and the first movable component 41 and the second movable component 42 of the actuator structure 4 are movably disposed within the one-piece frame housing 40 . Moreover, the first movable component 41 includes a first movable housing 410 movably disposed in the one-piece frame housing 40 and at least one optical lens group 411 disposed in the first movable housing 410. . In addition, the second movable component 42 includes a second movable housing 420 movably disposed in the one-piece frame housing 40, a microlens array substrate 421 disposed in the second movable housing 420, And a non-conductive photosensitive film layer 422 disposed on the microlens array substrate 421 for enhancing light absorption capability.

Furthermore, the one-piece frame housing 40 is disposed on the carrier substrate 10 to cover the image sensing wafer 11 , and the microlens array substrate 421 includes a transparent substrate 4210 disposed in the second movable housing 420 and A microlens array 4211 disposed on the lower surface of the light transmissive substrate 4210 and facing the optical lens group 411. In addition, the microlens array 4211 may be composed of a plurality of microlenses 42110 separated from each other by a predetermined distance, and the non-conductive photosensitive film layer 422 is disposed on the upper surface of the light transmissive substrate 4210 and opposed to the optical lens of the first movable component 41. Group 411. In other words, the present invention can be used to form a two-piece frame housing (such as the third embodiment disclosed in FIG. 4) by using the first frame housing 20 and the second frame housing 30 to cooperate with each other according to different design requirements. Alternatively, a one-piece frame housing 40 (such as the fourth embodiment disclosed in FIG. 5) formed by integrally joining the first frame housing 20 and the second frame housing 30 is used.

[Possible effects of the examples]

In summary, the image capturing module M and the actuator structure 1 thereof are provided by the embodiment of the present invention, and are permeable to a second movable housing (310 or 420) a microlens array substrate (311 or 421)" and "one disposed on the microlens array substrate (311 or 421) for enhancing light absorption capability The non-conductive photosensitive film layer (312 or 422) is designed to effectively improve the image quality captured by the image sensing unit 1 of the image capturing module M of the present invention.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by the present invention and the contents of the drawings are included in the scope of the present invention.

M‧‧‧Image Capture Module

1‧‧‧Image sensing unit

10‧‧‧Loading substrate

11‧‧‧Image sensing wafer

110‧‧‧Image sensing area

2‧‧‧First actuator unit

20‧‧‧First frame housing

21‧‧‧First movable component

210‧‧‧First movable housing

211‧‧‧ optical lens unit

3‧‧‧Second actuator unit

30‧‧‧Second frame housing

31‧‧‧Second movable component

310‧‧‧Second movable housing

311‧‧‧Microlens array substrate

3110‧‧‧Transparent substrate

3111‧‧‧Microlens array

31110‧‧‧Microlens

312‧‧‧Non-conductive photosensitive film layer

W‧‧‧Flexible wire

Claims (6)

An image capturing module, comprising: an image sensing unit, the image sensing unit comprising a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate; And an actuator structure including a first actuator unit and a second actuator unit cooperating with the first actuator unit; wherein the first actuator The unit includes a first frame housing and a first movable component movably disposed in the first frame housing and above the image sensing unit, and the first movable component includes an active component a first movable housing disposed within the first frame housing and at least one optical lens group disposed within the first movable housing; wherein the second actuator unit includes a second frame a housing and a second movable component movably disposed in the second frame housing and above the image sensing unit, and the second movable component includes a movable movable portion The second frame a movable housing, a microlens array substrate disposed in the second movable housing, and a non-conductive photosensitive film layer disposed on the microlens array substrate for enhancing light absorption capability; The first frame housing and the second frame housing are combined into a one-piece frame housing, and the first movable component and the second movable component of the actuator structure are movable Provided in the one-piece frame housing. The image capture module of claim 1, wherein the one-piece frame housing is disposed on the carrier substrate to cover the image sensing wafer, and the microlens array substrate comprises a single disposed on the single a transparent substrate in the frame of the frame and a microlens array disposed on the lower surface of the transparent substrate and facing the image sensing unit, wherein the microlens array is separated from each other by a predetermined distance A microlens is formed, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and faces at least one of the optical lens groups of the first movable component. The image capture module of claim 1, wherein the one-piece frame housing is disposed on the carrier substrate to cover the image sensing wafer, and the microlens array substrate comprises a single disposed on the single a light transmissive substrate in the frame housing and a microlens array disposed on a lower surface of the light transmissive substrate and facing at least one of the optical lens groups, wherein the microlens array is separated from each other by a predetermined distance The microlens is composed of the non-conductive photosensitive film layer disposed on the upper surface of the light transmissive substrate and facing away from at least one of the optical lens groups of the first movable component. An actuator structure, the actuator structure is applied to an image sensing unit, and the actuator structure includes: a first actuator unit, the first actuator unit including a first frame a first movable component movably disposed in the first frame housing and above the image sensing unit, wherein the first movable component includes a movable movable portion a first movable housing in a frame housing and at least one optical lens group disposed in the first movable housing; and a second actuator unit, the second actuator unit and the first The second actuator unit includes a second frame housing and a second movably disposed in the second frame housing and located above the image sensing unit a moving assembly, wherein the second movable assembly includes a second movable housing movably disposed within the second frame housing, a microlens array substrate disposed within the second movable housing, And a microlens array disposed Non-conductive photosensitive plate to be used to enhance the light absorptive layer of the thin film; wherein the housing and the second housing frame of the first frame into a single piece binding a frame housing, and the first movable component and the second movable component of the actuator structure are movably disposed within the one-piece frame housing. The actuator structure of claim 4, wherein the one-piece frame housing is disposed on a carrier substrate of the image sensing unit to cover an image sensing wafer of the image sensing unit, and The microlens array substrate includes a light transmissive substrate disposed in the one-piece frame housing and a microlens array disposed on a lower surface of the transparent substrate and facing the image sensing unit, wherein the micro lens array The lens array is composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and faces at least one of the optics of the first movable component Lens group. The actuator structure of claim 4, wherein the one-piece frame housing is disposed on a carrier substrate of the image sensing unit to cover an image sensing wafer of the image sensing unit, and The microlens array substrate includes a light transmissive substrate disposed in the one-piece frame housing and a microlens array disposed on a lower surface of the transparent substrate and facing at least one of the optical lens groups, wherein The microlens array is composed of a plurality of microlenses separated from each other by a predetermined distance, and the non-conductive photosensitive film layer is disposed on an upper surface of the light transmissive substrate and faces at least one of the first movable components An optical lens group.