TWM467289U - Heat spreader support back plate of motherboard - Google Patents

Description

Main board radiator support back board

The present invention relates to a radiator support backboard for a motherboard, and particularly relates to a support structure that prevents the motherboard from being deformed due to the weight of the heat sink assembled thereon.

With the advancement of technology, the processing speed and efficiency of the processor are accelerating, and the problem associated with it is that the amount of waste heat generated by the hardware during the processing operation is also increasing, and in order to maintain the hardware operation. Stabilization and increased hardware life, so the heat sink level of the heat sink is increasingly required.

However, the higher the heat dissipation level of the radiator, such as the liquid cooling method such as water cooling, will occupy a larger volume and weight, and when this type of heavy radiator is assembled on the motherboard, it will also bring more A large burden, which tends to start to cause a downward deformation of the motherboard corresponding to the processor portion after a period of use, is known in the prior art by fixing the reinforcing plate made of a thin metal plate to the back side of the motherboard. However, because the metal material is heavy, it cannot have sufficient thickness, and the stress deformation ability that can be resisted is insufficient. When the heat sink is heavy, it is still difficult to avoid the problem of bending deformation, and after the motherboard is bent, it is impossible to The part that should be bent is to be straightened up and pushed upwards. Moreover, the possibility that the reinforcing plate made of metal has instability due to electrical conductivity causes the internal circuit of the main board to be unstable, which is to be improved.

Therefore, the creators of this creation thought about and designed a radiator support backplane for the motherboard, in order to improve the lack of existing technology, and thus enhance the implementation and utilization of the industry.

In view of the above-mentioned shortcomings of the prior art, the present invention designs a radiator supporting backboard of a motherboard having novelty, progressiveness and industrial utilization, etc., in order to overcome the difficulties of the prior art.

In order to achieve the above objective, the technical means adopted in the present invention is to design a heat sink supporting backboard of a motherboard, which is supported on a CPU backplane of a back side of a motherboard, which comprises: a body, which is a hard board The body has a certain thickness to carry the weight of a heat sink without bending, and the body includes a fixing portion and at least one adjusting hole; wherein the fixing portion can be correspondingly fixed to the main board; wherein the adjusting hole is Corresponding to a position corresponding to the CPU base plate on the body; and an adjustment support portion corresponding to the body and passing through the adjustment hole, thereby allowing the user to control the adjustment support from the bottom side of the body The portion protrudes toward the CPU base plate and abuts against the CPU base plate.

The adjustment support portion includes an adjustment member corresponding to the adjustment hole and movable up and down through the adjustment hole, and can be selectively protruded from the upper side of the body to be abutted by the user's operation. The CPU board; wherein the adjustment hole is a screw hole, and the adjustment member is a screw.

Wherein, the body is a non-conductive insulating material, such as an acrylic plate; wherein the fixing portion is a plurality of locking holes disposed on a periphery of the body, and the corresponding locking member passes through the body and the host The plate is correspondingly fixed; wherein the number of the adjustment holes is more than three, one of the adjustment holes is located at the center and the other adjustment holes are equiangularly distributed around the central adjustment hole; The body includes at least one flashing portion correspondingly disposed on the body to evade the protruding object on the motherboard.

The heat sink support backplane of the motherboard of the present invention is designed to be locked by the back side of the motherboard to allow the user to adjust the adjustment member and push it upward toward the host. The CPU backplane on the back side of the board, in turn, has the effect of resisting the downward bending stress. In addition, it can also provide a reverse-supporting correction function of the partially bent main board, and the light-transmitting and non-conductive material can be used. The thickness is increased without increasing the weight to increase the strength, and the radiator can be supported by a large weight, and there is no such problem as the presence of conductivity, which has a high advantage in practical applications.

In order to make the above-mentioned objects, technical features, and gains after actual implementation more obvious, a more detailed description will be given below with reference to the corresponding drawings in the preferred embodiments.

(10) ‧‧‧ Ontology
(11) ‧‧‧Fixed Department
(12) ‧ ‧ adjustment holes
(13) ‧‧‧Flash Department
(14) ‧‧‧ 容容
(20) ‧‧‧Adjustment support
(21) ‧‧‧Revising parts
(22)‧‧‧Support board
(70)‧‧‧CPU backplane
(80)‧‧‧ radiator
(90)‧‧‧ motherboard
(91) ‧‧‧ protruding objects

The first figure is an exploded view of the heat sink supporting backboard of the main board of the creation.
The second figure is an exploded view of an embodiment of the heat sink supporting backboard of the motherboard of the present invention.
The third figure is a combination diagram of embodiments of the heat sink supporting backboard of the motherboard of the present invention.
The fourth figure is a side elevational cross-sectional view of an embodiment of a heat sink supporting backing plate of the main board of the present invention.
The fifth figure is an exploded view of a modified embodiment of the heat sink supporting backboard of the main board of the present invention.
The sixth figure is an exploded view of a modified embodiment of the heat sink supporting backboard of the main board of the present invention.
Figure 7 is a side elevational cross-sectional view showing an embodiment of a deformation embodiment of a heat sink supporting backing plate of the main board of the present invention.
The eighth figure is a partial view of a partial component of a modified embodiment of the heat sink supporting backboard of the main board of the present invention.
The ninth drawing is an external view of a modified embodiment of the heat sink supporting backboard of the main board of the present invention.

In order to understand the creative characteristics, content and advantages of this creation and the effects that can be achieved by the examiner, the author will use the drawings in detail and explain the following in the form of the examples, and the drawings used therein The subject matter is only for the purpose of illustration and supplementary instructions. It is not necessarily the true proportion and precise configuration after the implementation of the creation. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited in the actual implementation scope.

The advantages, features, and technical methods of the present invention will be more readily understood by referring to the exemplary embodiments and the accompanying drawings, and the present invention may be implemented in various forms and should not be construed as limited thereto. The embodiments set forth herein, and vice versa, will provide a more thorough and complete and complete disclosure of the scope of the present invention, and the present invention will only be The scope of the patent application is defined.

Unless otherwise defined, all terms (including scientific and scientific terms) and proper nouns used hereinafter are used in the same meaning as commonly understood by those skilled in the art to which the present invention belongs. Those terms defined by the dictionary should be understood to have the meaning consistent with the relevant fields, and unless explicitly defined in the following text, they will not be understood in terms of excessive idealization or excessive formality.

Please refer to the first to fourth figures. The present invention proposes a heat sink supporting backboard for a motherboard, which is applied to support the back side of a motherboard (90) corresponding to the heat sink (80) thereon. Wherein, in order to improve the support strength against the deformation of the motherboard (90), the back side of the motherboard (90) corresponds to the heat sink (80) is provided with a CPU backplane (70), in a preferred embodiment A body (10) and an adjustment support (20) may be included.

The body (10) is a rigid plate material, which is a non-conductive insulating material, such as an acrylic plate, having a certain thickness to carry the weight of the heat sink (80) without bending, and the body (10) ) comprising a fixing portion (11), at least one adjusting hole (12) and at least one flashing portion (13).

The fixing portion (11) may be correspondingly fixed to the main body plate (90), or may be a plurality of locking holes provided at a periphery of the main body (10), and the corresponding locking member may be used ( 70) Passing through to fix the body (10) to the motherboard (90), wherein the lock member (70) may be a combination of a screw and a gasket.

The adjustment hole (12) corresponds to a position corresponding to the CPU base plate (70) on the body (10), and the number of the adjustment holes (12) is three or more, for example, five. One of the adjustment holes (12) is located at the center and the other adjustment holes (12) are equiangularly distributed around the central adjustment hole (12), wherein the adjustment hole (12) is It is a screw hole.

The flashing portion (13) is correspondingly disposed on the body (10), and is used to evade a protruding object (91) such as a screw protruding from the motherboard (90), wherein the flashing portion (13) Or it may be a digging groove, but it may also be at least one hole.

The adjustment support portion (20) is correspondingly disposed on the body (10) and passes through the adjustment hole (12), thereby allowing the user to control the adjustment support portion (20) from the bottom side of the body (10). Projecting toward the CPU base plate (70) and abutting against the CPU base plate (70) to provide a supporting force; and wherein the adjusting support portion (20) includes a plurality of adjusting members corresponding to the adjusting hole (12) (21), each of the adjustment members (21) may be a screw that is selectively protruded from the upper side of the body (10) by the user's operation to abut against the CPU base plate (70).

Please further refer to the fifth figure, wherein the number of adjustment holes (12) can correspond to the type of CPU backplane (70) used, and a different number of adjustments (21) can be selectively used.

Please further refer to the sixth and seventh figures, wherein the present invention is in a modified embodiment, the upper side surface of the body (10) is further recessed to be provided with a receiving groove (14); and wherein the adjusting support portion (20) Further comprising a supporting plate (22), wherein the upper side of the supporting plate (22) is a flat surface, and correspondingly disposed in the receiving groove (14), covering the adjusting holes (12), and further When the adjustment member (21) passes through the adjustment hole (12), the support plate (22) can be pushed up, and the support plate (22) is pressed against the CPU bottom plate (70) to achieve strength resistance. The purpose of stress deformation.

The design of the heat sink support backplane of the motherboard of the present invention can be locked on the back side of the motherboard (90), allowing the user to adjust the adjustment member (21) Pushing up the top side of the CPU board (70) on the back side of the motherboard (90), thereby generating a function of resisting downward bending stress, and also providing a reverse supported support of the partially bent main board (90). The function is lighter and non-conductive material, and can increase the thickness without increasing the weight to increase the strength. It can correspond to the heat sink (80) with a large weight support, and there is no conductivity. The doubts and so on, have a high degree of advantage in practical applications, and are inaccessible to the conventional technology, so the gain is visible.

In addition, please refer to the eighth and ninth diagrams for further cooperation. In the present modification, the number of adjustment holes (12) is plural (at least five), one of which is adjusted. The hole (12) is located at the center and the other adjustment holes (12) are equiangularly distributed, and are arranged in two turns, surrounding the adjustment hole (12) located at the center, thereby allowing the user to The degree of bending of the plate (90) or the weight of the heat sink (80) is selectively used, for example, the motherboard (90) requires a stronger force correction than the bending, or the weight of the radiator (80) is greater. , the user can use the adjustment hole (12) of the inner ring, and the motherboard (90) is less curved, or the weight of the heat sink (80) is smaller, or the adjustment hole of the outer ring can be selected ( 12).

The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.

Looking at the above, it can be seen that under the breakthrough of the previous technology, this creation has indeed achieved the desired effect, and it is also unfamiliar to those skilled in the art. The progress and practicality of the creation are in line with the patent. Apply for the requirements, and file a patent application in accordance with the law. You are requested to approve the creation of a patent application for this article to encourage creation.

(10) ‧‧‧ Ontology

(11) ‧‧‧Fixed Department

(12) ‧ ‧ adjustment holes

(13) ‧‧‧Flash Department

(20) ‧‧‧Adjustment support

(21) ‧‧‧Revising parts

(70)‧‧‧CPU backplane

(80)‧‧‧ radiator

(90)‧‧‧ motherboard

(91) ‧‧‧ protruding objects

Claims (18)

A heat sink supporting backboard of a motherboard is supported on a CPU backplane of a back side of a motherboard, and includes:
The body is a hard plate having a certain thickness to carry the weight of a heat sink without bending, and the body comprises a fixing portion and at least one adjusting hole; wherein the fixing portion is corresponding to the body being fixed to the host a calibration hole corresponding to the position corresponding to the CPU base plate; and an adjustment support portion corresponding to the body and passing through the adjustment hole, thereby allowing the user to The bottom side of the body controls the adjustment support to protrude toward the CPU base plate and abut against the CPU base plate. The heat sink supporting backboard of the motherboard of claim 1, wherein the adjusting support portion includes a plurality of adjusting members corresponding to the adjusting holes and configured to be vertically movable to be disposed in the adjusting hole, It can be selectively protruded from the upper side of the body to be placed against the CPU backing by the user's operation. The heat sink supporting backboard of the motherboard of claim 2, wherein the adjusting hole is a screw hole, and the adjusting component is a screw. The heat sink supporting backboard of the motherboard according to claim 2, wherein the body is a non-conductive insulating material. The heat sink supporting backboard of the motherboard according to claim 2, wherein the body is an acrylic sheet. The heat sink supporting backboard of the motherboard of claim 2, wherein the fixing portion is a plurality of locking holes disposed on a periphery of the body, and the corresponding locking member passes through the body and the host The board is fixed accordingly. The heat sink supporting backboard of the motherboard of claim 2, wherein the number of the adjusting holes is three or more, one of the adjusting holes is located at the center and the other adjusting holes are equiangular. The adjustment hole is distributed around the center. The heat sink supporting backplane of the motherboard of claim 2, wherein the body comprises at least one flashing portion correspondingly disposed on the body to evade the protruding object on the motherboard. The heat sink supporting backboard of the motherboard of claim 8, wherein the flashing portion is a digging groove or at least one hole. The heat sink supporting backboard of the motherboard of claim 2, wherein the number of the adjusting holes is five or more, one of the adjusting holes is located at the center and the other adjusting holes are equal. The angle is distributed, and the arrangement is two rounds inside and outside, and the adjustment hole is located around the center. The heat sink supporting the backboard of the main board of claim 1, wherein the upper side wall surface of the main body is further recessed with a receiving groove, and the adjusting supporting portion comprises a quantity corresponding to the adjusting hole and can move up and down The adjusting member is disposed in the adjusting hole and the supporting plate; the adjusting member is selectively protruded from the upper side of the body by the operation of the user; and the supporting plate is correspondingly disposed in the receiving groove, The upper side is a flat surface, and the supporting plate covers the adjusting holes, so that when the adjusting members pass through the adjusting holes, the supporting plate can be pushed to abut the supporting plate against the CPU bottom plate. The heat sink supporting backboard of the motherboard of claim 11, wherein the adjusting hole is a screw hole, and the adjusting component is a screw. The heat sink supporting backboard of the motherboard of claim 11, wherein the body is a non-conductive insulating material. The heat sink supporting backboard of the motherboard according to claim 11, wherein the body is an acrylic sheet. The heat sink supporting backboard of the motherboard of claim 11, wherein the fixing portion is a plurality of locking holes disposed on a periphery of the body, and the corresponding locking member passes through the body and the host The board is fixed accordingly. The heat sink supporting backboard of the motherboard of claim 11, wherein the number of the adjusting holes is three or more, one of the adjusting holes is located at the center and the other adjusting holes are equal angles. The adjustment hole is distributed around the center. The heat sink supporting backplane of the motherboard of claim 11, wherein the body comprises at least one flashing portion correspondingly disposed on the body to evade the protruding object on the motherboard. The heat sink supporting backboard of the motherboard of claim 11, wherein the number of the adjusting holes is five or more, wherein one of the adjusting holes is located at the center and the other adjusting holes are equal. The angle is distributed, and the arrangement is two rounds inside and outside, and the adjustment hole is located around the center.