TWM467223U - Thin type NGFF card edge connector - Google Patents
Thin type NGFF card edge connector Download PDFInfo
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- TWM467223U TWM467223U TW102210460U TW102210460U TWM467223U TW M467223 U TWM467223 U TW M467223U TW 102210460 U TW102210460 U TW 102210460U TW 102210460 U TW102210460 U TW 102210460U TW M467223 U TWM467223 U TW M467223U
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Description
本創作係關於一種連接器,特別是指不需破板或沈板即可降低高度之一種薄型化的NGFF卡緣連接器。 The present invention relates to a connector, in particular to a thinned NGFF card edge connector that can be lowered in height without breaking or sinking.
關於資料存取裝置的技術,目前已由硬式磁碟機進化到體積更小、速度更快的固態硬碟(Solid State Drive,SSD),愈來愈多的裝置開始配備固態硬碟,為了插接SSD卡(為固態硬碟擴充卡的簡稱),這些裝置乃需設置卡緣連接器。 The technology of data access devices has evolved from hard disk drives to smaller, faster Solid State Drives (SSDs). More and more devices are beginning to be equipped with solid state drives. Connect the SSD card (short for the solid state drive expansion card), these devices need to set the card edge connector.
固態硬碟的現有標準係為mSATA標準,惟其限制過多,導致容量受到限制,因此誕生固態硬碟的新標準,即NGFF(Next Generation Form Factor)標準,它相較於mSATA標準係具有體積更小、容量更高,同時亦具有利於降低成本的優點。 The existing standard for solid state drives is the mSATA standard, but its limitations are too limited, resulting in limited capacity. Therefore, the new standard for solid state drives, the NGFF (Next Generation Form Factor) standard, is smaller than the mSATA standard. The capacity is higher, and it also has the advantage of reducing the cost.
由於各家生產的SSD卡規格不一,再加上NGFF卡緣連接器的導接端子固定的關係,導致插接後的整體高度也各不相同,舉例而言,習知的NGFF卡緣連接器僅能正插SSD卡,正插的SSD卡將使快閃記憶體晶片朝上,因此,將會因為不同廠牌的記憶體晶片或不同製造廠的不同製造方式,使得某些記憶體晶片的高度過高而導致無法安裝,從而有了最大高度限制:2.45mm,它代表從電路板表 面到NGFF卡緣連接器的最上緣之間的最大高度,以適用於輕薄型電腦,甚至是超輕薄筆記型電腦(Ultrabook)。有此限制之後,某些因為記憶體晶片高度過高而導致整體高度超出2.45mm的NGFF卡緣連接器,乃必須在電路板上加工開設出一開口,以將NGFF卡緣連接器沈入開口內來降低高度,惟如此一來電路板用以插接電子零件的面積就減少了。 Due to the different specifications of the SSD cards produced by each manufacturer, and the fixed connection of the NGFF card edge connectors, the overall height after the plugging is also different. For example, the conventional NGFF card edge connection The SSD card can only be inserted, and the SSD card inserted will make the flash memory chip face up. Therefore, some memory chips will be made due to different manufacturing methods of different brands of memory chips or different manufacturers. The height is too high to be installed, resulting in a maximum height limit: 2.45mm, which represents the board from the board The maximum height between the top edge of the NGFF card edge connector for thin and light computers, even ultra-thin notebooks (Ultrabook). With this limitation, some NGFF card edge connectors with an overall height exceeding 2.45 mm due to the high memory chip height must be machined to open an opening on the board to sink the NGFF card edge connector into the opening. Internally, the height is lowered, but the area of the board for plugging in electronic parts is reduced.
其次則是將上排導接端子和下排導接端子一起下移,惟習知下排導接端子在下移後,其導接段的端部與NGFF卡緣連接器的底面之間的距離將相應縮小,進而導致插接SSD卡時沒有足夠的彈性裕度,影響SSD卡的插接穩定性。 Secondly, the upper row of lead terminals and the lower row of lead terminals are moved down together, but the distance between the end of the guiding section and the bottom surface of the NGFF card edge connector is known after the lower row of the leading terminal is moved downward. It will be reduced accordingly, which will result in insufficient elastic margin when plugging the SSD card, which will affect the plug stability of the SSD card.
三者係將下排導接端子改成沒有彈性,例如電鍍型導接端子,此等電鍍型導接端子由於不具有彈性,因此在插接SSD卡後,SSD卡將會有翹曲或彎曲的情況,從而無法與所有下排導接端子電性接觸。 The three are to change the lower row of lead terminals to have no elasticity, such as plated type lead terminals. Since these plated type lead terminals are not flexible, the SSD card will be warped or bent after the SSD card is inserted. In this case, it is impossible to make electrical contact with all the lower row of lead terminals.
本創作的目的之一在於提供一種薄型化的NGFF卡緣連接器,藉由能夠反插SSD卡的卡緣連接器,以能在不沈板或破板的前提下降低整體高度,以省去開設開口的麻煩且不會減少電路板用來插接電子零件的面積,並能適用於輕薄型電腦,甚至是超輕薄筆記型電腦(Ultrabook)。 One of the purposes of this creation is to provide a thinned NGFF card edge connector, which can reduce the overall height without sinking or breaking the board by being able to reversely insert the card edge connector of the SSD card, thereby eliminating the need to The trouble of opening the opening does not reduce the area that the board is used to plug in electronic parts, and it can be applied to thin and light computers, even ultra-thin notebooks (Ultrabooks).
本創作的目的之二在於提供一種薄型化的NGFF卡緣連接器,藉由反折式的下導電端子以及間隔距離的設計,以使下導接部具有足 夠的彈性力道和間隔距離,從而保證上導接部、下導接部都能電性接觸於SSD卡的下接觸部和上接觸部,不會有無法接觸的情況,進而還使SSD卡能夠斜插於卡緣連接器的插口,達到先斜插再下壓定位的方便性插卡功效。 The second objective of the present invention is to provide a thinned NGFF card edge connector, which has a design of a lower conductive terminal and a separation distance so that the lower guiding portion has a foot. The elastic force and the separation distance are sufficient to ensure that the upper guiding portion and the lower guiding portion can electrically contact the lower contact portion and the upper contact portion of the SSD card, and there is no inaccessibility, thereby enabling the SSD card to It is inserted into the socket of the card edge connector to achieve the convenience of inserting the card first and then pressing down the positioning.
為達上述目的,本創作係提供一種薄型化的NGFF卡緣連接器,用以插接一SSD卡,所述SSD卡具有多數上接觸部和多數下接觸部,該卡緣連接器包括:一緣絕本體,具有一頂板、一底板和位於該頂板與底板之間的一插口,該插口係供反插所述SSD卡;多數上導電端子,係並排設置於該頂板,每一該上導電端子係成型有一上導接部和一焊接部,各該上導接部係對應於所述SSD卡的各該下接觸部;以及多數下導電端子,係並排設置於該底板,每一該下導電端子係成型有一下導接部和一焊接部,各該下導接部係對應於所述SSD卡的各該上接觸部。 In order to achieve the above object, the present invention provides a thinned NGFF card edge connector for plugging an SSD card, the SSD card having a plurality of upper contacts and a plurality of lower contacts, the card edge connector comprising: The splicing body has a top plate, a bottom plate and a socket between the top plate and the bottom plate, the socket is for re-inserting the SSD card; a plurality of upper conductive terminals are arranged side by side on the top plate, each of which is electrically conductive The terminal is formed with an upper guiding portion and a soldering portion, each of the upper guiding portions corresponding to each of the lower contact portions of the SSD card; and a plurality of lower conductive terminals disposed side by side on the bottom plate, each of the lower portions The conductive terminal is formed with a lower guiding portion and a soldering portion, and each of the lower guiding portions corresponds to each of the upper contact portions of the SSD card.
相較於先前技術,本創作具有以下功效:能在不沈板或破板的前提下降低整體高度,以省去開設開口的麻煩且不會減少電路板用來插接電子零件的面積,並能適用於輕薄型電腦,甚至是超輕薄筆記型電腦(Ultrabook)。 Compared with the prior art, the present invention has the following effects: the overall height can be lowered without sinking or breaking the board, thereby eliminating the trouble of opening the opening and reducing the area for the board to be used for plugging electronic parts, and Can be applied to thin and light computers, even ultra-thin notebooks (Ultrabook).
1‧‧‧SSD卡 1‧‧‧SSD card
11‧‧‧載體 11‧‧‧ Carrier
111‧‧‧上接觸部 111‧‧‧Upper contact
112‧‧‧下接觸部 112‧‧‧Contacts
12‧‧‧記憶體晶片 12‧‧‧ memory chip
2‧‧‧電路板 2‧‧‧ boards
3‧‧‧卡緣連接器 3‧‧‧ card edge connector
31‧‧‧絕緣本體 31‧‧‧Insulated body
310‧‧‧插口 310‧‧‧ socket
311‧‧‧頂板 311‧‧‧ top board
312‧‧‧底板 312‧‧‧floor
313‧‧‧後側 313‧‧‧ Back side
32‧‧‧上導電端子 32‧‧‧Upper conductive terminal
321‧‧‧橫段 321‧‧‧ horizontal section
3211‧‧‧上導接部 3211‧‧‧Upper Guide
3222‧‧‧翹起部 3222‧‧‧ cocked
322‧‧‧縱段 322‧‧‧ vertical section
3221‧‧‧焊接部 3221‧‧‧Weld Department
323‧‧‧轉折部 323‧‧‧ Turning Department
33‧‧‧下導電端子 33‧‧‧ Lower conductive terminal
331‧‧‧前段 331‧‧‧
3311‧‧‧下導接部 3311‧‧‧ lower guide
3312‧‧‧自由端 3312‧‧‧Free end
332‧‧‧後段 332‧‧‧After
333‧‧‧反折部 333‧‧‧Reflexion
3321‧‧‧焊接部 3321‧‧‧Welding Department
3322‧‧‧彎折部 3322‧‧‧Bends
334‧‧‧間隔距離 334‧‧‧ separation distance
第一圖為本創作卡緣連接器的立體分解圖。 The first figure is an exploded perspective view of the creative card edge connector.
第二圖為本創作依據第一圖的立體組合圖。 The second figure is a three-dimensional combination diagram based on the first figure.
第三圖為本創作卡緣連接器的剖視圖。 The third figure is a cross-sectional view of the creative card edge connector.
第四圖為本創作卡緣連接器反插SSD卡時的示意圖。 The fourth figure is a schematic diagram of the original card edge connector when the SSD card is reversely inserted.
第五圖為本創作卡緣連接器反插SSD卡後的示意圖。 The fifth figure is a schematic diagram of the original card edge connector after the SSD card is reversely inserted.
為了能夠更進一步瞭解本創作之特徵、特點和技術內容,請參閱以下有關本創作之詳細說明與附圖,惟所附圖式僅提供參考與說明用,非用以限制本創作。 In order to further understand the features, features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, which are only for reference and description, and are not intended to limit the present invention.
本創作係提供一種薄型化的NGFF卡緣連接器,如第四、五圖所示,為將符合NGFF標準的卡緣連接器3在不破板、不沈板的前提下,電性配置於一電路板2上,以供插接一SSD卡1,並使插卡後的高度不超過最大高度限制:2.45mm,從而適用於輕薄型電腦,甚至是超輕薄筆記型電腦(Ultrabook)。 The creation system provides a thinned NGFF card edge connector. As shown in the fourth and fifth figures, the card edge connector 3 conforming to the NGFF standard is electrically disposed on the premise of not breaking the board or sinking the board. On the circuit board 2, for inserting an SSD card 1, and the height after the card does not exceed the maximum height limit: 2.45 mm, which is suitable for a thin and light computer, or even an ultra-thin notebook (Ultrabook).
如第一~三圖所示,本創作卡緣連接器3係包括一絕緣本體31、多數上導電端子32以及多數下導電端子33。 As shown in the first to third figures, the present card edge connector 3 includes an insulative housing 31, a plurality of upper conductive terminals 32, and a plurality of lower conductive terminals 33.
絕緣本體31具有如第一圖所示的一頂板311、一底板312以及分別連接於頂板和底板的二端之間的二側板(未標示符號),於頂板311、底板312和二側板之間則形成供插接SSD卡(見第四、五圖)1的一插口310。 The insulative housing 31 has a top plate 311, a bottom plate 312, and two side plates (not labeled) connected between the top ends of the top plate and the bottom plate, respectively, between the top plate 311, the bottom plate 312, and the two side plates. A socket 310 for plugging the SSD card (see fourth and fifth figures) 1 is formed.
這些上導電端子32係並排設置於頂板311,每一上導電端子32包含一橫段321、一縱段322以及連接於橫段321與縱段322之間的一轉折部323,橫段321係水平設置於頂板311並朝前成型有一上導接部3211,於本實施例中,橫段321係水平設置於頂板311的槽溝(未標示符號)內;縱段322係垂直設置於絕緣本體31的後側(見第三圖)313並朝後成型有一焊接部3221,於本實施例中,縱段322 係垂直設置於絕緣本體31之後側313的槽溝(未標示符號)內。較佳者,上導電端子32的轉折部323與上導接部3211之間係可連接有自橫段321翹起的一翹起部3222,以提供上導接部3211較佳的彈性力道。 The upper conductive terminals 32 are arranged side by side on the top plate 311. Each upper conductive terminal 32 includes a horizontal section 321 , a vertical section 322 , and a turning portion 323 connected between the horizontal section 321 and the vertical section 322 . The upper portion 311 is horizontally disposed on the top plate 311 and is formed with an upper guiding portion 3211. In the embodiment, the horizontal portion 321 is horizontally disposed in the groove (not shown) of the top plate 311; the vertical portion 322 is vertically disposed on the insulating body. The rear side of 31 (see the third figure) 313 is formed with a welded portion 3221, and in the present embodiment, the longitudinal section 322 It is vertically disposed in a groove (not shown) of the rear side 313 of the insulative housing 31. Preferably, a raised portion 3222 that is lifted from the horizontal portion 321 is connected between the turning portion 323 of the upper conductive terminal 32 and the upper guiding portion 3211 to provide a better elastic force of the upper guiding portion 3211.
這些下導電端子33係並排設置於底板312,每一下導電端子33包含一前段331、一後段332和連接於前段331與後段332之間的一反折部333,前段331係朝前成型有一下導接部3311,後段332則經由反折部333的反折而位於前段331的下方,後段332設置於底板312並朝前成型有一焊接部3321。於本實施例中,後段332與焊接部3321之間係還連接有一彎折部3322;再者,其下導接部3311的自由端(見第三圖)3312與後段332之間,係具有供前段331朝後段332彈性彎折的一間隔距離(見第三圖)334。其中,前段331及其下導接部3311係利用反折部333而具有較佳的彈性力道,再加上此一間隔距離334,以使卡緣連接器3具有能如同第四圖所示那樣斜插SSD卡1的斜插功能。進一步而言,縱使本創作進一步將上導電端子32和下導電端子33一起往下移,亦能因為反折部333和間隔距離334而仍具有足夠的彈性力道,進而保證與SSD卡1的電性接觸狀態,不會有無法接觸的情況。 The lower conductive terminals 33 are arranged side by side on the bottom plate 312. Each lower conductive terminal 33 includes a front portion 331, a rear portion 332 and a reverse portion 333 connected between the front portion 331 and the rear portion 332. The front portion 331 is formed forwardly. The guiding portion 3311, the rear portion 332 is located below the front portion 331 via the refolding of the folding portion 333, and the rear portion 332 is disposed on the bottom plate 312 and has a welded portion 3321 formed forward. In this embodiment, a bent portion 3322 is further connected between the rear portion 332 and the welded portion 3321; further, between the free end (see the third figure) 3312 and the rear portion 332 of the lower guiding portion 3311, A spacing distance (see FIG. 3) 334 for the front section 331 to be elastically bent toward the rear section 332. Wherein, the front section 331 and the lower guiding portion 3311 have a better elastic force by using the folding portion 333, and the spacing distance 334 is added, so that the card edge connector 3 can have the same function as shown in the fourth figure. The oblique insertion function of the SSD card 1 is obliquely inserted. Further, even if the present embodiment further moves the upper conductive terminal 32 and the lower conductive terminal 33 downward together, the elastic portion of the SSD card 1 can be ensured by the reflexing portion 333 and the separation distance 334. In the state of sexual contact, there will be no inaccessibility.
如第四、五圖所示,卡緣連接器3係電性配置於電路板2上以供插接SSD卡1。SSD卡1包含一載體11、設置於載體11頂面(如第四、五圖所示的SSD卡1係呈反插狀態)的多數上接觸部111和多數記憶體晶片12、和設置於載體11底面的多數下接觸部112。 As shown in the fourth and fifth figures, the card edge connector 3 is electrically disposed on the circuit board 2 for plugging the SSD card 1. The SSD card 1 includes a carrier 11 , a plurality of upper contact portions 111 and a plurality of memory chips 12 disposed on the top surface of the carrier 11 (the SSD card 1 shown in FIGS. 4 and 5 are reversely inserted), and a carrier 11 a plurality of lower contact portions 112 on the bottom surface.
值得注意的是:本創作卡緣連接器3中,那些上導電端子32的各 個上導接部3211係對應於所述SSD卡1的各個下接觸部112,那些下導電端子33的各個下導接部3311則對應於所述SSD卡1的各個上接觸部111,當然,還必須將上導電端子32之上導接部3211的數量和位置全部對應於SSD卡1之下接觸部112的數量和位置,並必須將下導電端子33之下導接部3311的數量和位置全部對應於SSD卡1之上接觸部111的數量和位置,如此一來,就能將SSD卡1反插於卡緣連接器3的插口310內,且反插時將可先斜插(見第四圖)、再下壓(見第五圖),突破習知薄型化NGFF卡緣連接器因為薄型而無法斜插的窠臼。藉由反插SSD卡1,使原本位於載體11頂面的記憶體晶片12,能夠反過來而讓未設置有任何記憶體晶片的載體11底面朝上(如第五圖所示),據以降低SSD卡1和卡緣連接器3的整體高度,不需進行破板或沈板(即:不需在電路板2開設用以沈入卡緣連接器的開口)的加工動作,亦不會減少電路板2的電子零件插接面積。 It is worth noting that: in the creation card edge connector 3, those of the upper conductive terminals 32 The upper guiding portions 3211 correspond to the respective lower contact portions 112 of the SSD card 1, and the respective lower guiding portions 3311 of the lower conductive terminals 33 correspond to the respective upper contact portions 111 of the SSD card 1, of course, It is also necessary to match the number and position of the upper connecting portions 3211 of the upper conductive terminals 32 to the number and position of the lower contact portions 112 of the SSD card 1, and to have the number and position of the lower guiding portions 3311 of the lower conductive terminals 33. All corresponding to the number and position of the contact portions 111 on the SSD card 1, so that the SSD card 1 can be reversely inserted into the socket 310 of the card edge connector 3, and the reverse insertion can be obliquely inserted first (see The fourth picture), and then press down (see the fifth picture), break through the conventional thin NGFF card edge connector because of the thin type can not be obliquely inserted. By re-inserting the SSD card 1, the memory chip 12 originally located on the top surface of the carrier 11 can be reversed so that the bottom surface of the carrier 11 not provided with any memory wafer faces upward (as shown in FIG. 5). The overall height of the SSD card 1 and the card edge connector 3 is lowered, and the processing action of the broken board or the sinking board (that is, the opening for sinking the card edge connector is not required to be opened in the circuit board 2) is not required, and Reduce the electronic component insertion area of the circuit board 2.
綜上所述,本創作相較於先前技術係具有以下功效:能在不沈板或破板的前提下降低整體高度,以省去開設開口的麻煩且不會減少電路板2用來插接電子零件的面積,並能適用於輕薄型電腦,甚至是超輕薄筆記型電腦(Ultrabook)。 In summary, the present invention has the following effects as compared with the prior art: it can reduce the overall height without sinking or breaking the board, so as to save the trouble of opening the opening and not reduce the board 2 for docking. The area of electronic components can be applied to thin and light computers, even ultra-thin notebooks (Ultrabooks).
此外,本創作係還具有其它功效:能在即使將上導電端子32和下導電端子33一起下移,亦仍能使下導接部3311具有足夠的彈性力道和間隔距離334,從而保證上導接部3211、下導接部3311都能電性接觸於SSD卡1的下接觸部112和上接觸部111,不會有無法接觸的情況;還能因為下導接部3311係具有足夠的彈性力道和間隔 距離334,以使SSD卡1能夠斜插於卡緣連接器3的插口310,達到先斜插再下壓定位的方便性插卡功效。 In addition, the creation system has other functions: the lower guiding portion 3311 can have sufficient elastic force and separation distance 334 even if the upper conductive terminal 32 and the lower conductive terminal 33 are moved down together, thereby ensuring the upper guide. The connecting portion 3211 and the lower guiding portion 3311 can be electrically contacted to the lower contact portion 112 and the upper contact portion 111 of the SSD card 1 without contact, and the lower guiding portion 3311 can be sufficiently flexible. Force and interval The distance 334 is such that the SSD card 1 can be obliquely inserted into the socket 310 of the card edge connector 3 to achieve the convenience of the card insertion function of the first oblique insertion and the lower pressure positioning.
以上所述者,僅為本創作之較佳可行實施例而已,非因此即侷限本創作之專利範圍,舉凡運用本創作說明書及圖式內容所為之等效結構變化,均理同包含於本創作之權利範圍內,合予陳明。 The above is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the creation, and the equivalent structural changes that are made by using the present specification and the contents of the schema are all included in the creation. Within the scope of the rights, it is given to Chen Ming.
1‧‧‧SSD卡 1‧‧‧SSD card
11‧‧‧載體 11‧‧‧ Carrier
111‧‧‧上接觸部 111‧‧‧Upper contact
112‧‧‧下接觸部 112‧‧‧Contacts
12‧‧‧記憶體晶片 12‧‧‧ memory chip
2‧‧‧電路板 2‧‧‧ boards
3‧‧‧卡緣連接器 3‧‧‧ card edge connector
31‧‧‧絕緣本體 31‧‧‧Insulated body
310‧‧‧插口 310‧‧‧ socket
32‧‧‧上導電端子 32‧‧‧Upper conductive terminal
3211‧‧‧上導接部 3211‧‧‧Upper Guide
3221‧‧‧焊接部 3221‧‧‧Weld Department
33‧‧‧下導電端子 33‧‧‧ Lower conductive terminal
3311‧‧‧下導接部 3311‧‧‧ lower guide
3321‧‧‧焊接部 3321‧‧‧Welding Department
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102210460U TWM467223U (en) | 2013-06-04 | 2013-06-04 | Thin type NGFF card edge connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102210460U TWM467223U (en) | 2013-06-04 | 2013-06-04 | Thin type NGFF card edge connector |
Publications (1)
Publication Number | Publication Date |
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TWM467223U true TWM467223U (en) | 2013-12-01 |
Family
ID=50154893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW102210460U TWM467223U (en) | 2013-06-04 | 2013-06-04 | Thin type NGFF card edge connector |
Country Status (1)
Country | Link |
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TW (1) | TWM467223U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10297938B2 (en) | 2015-06-10 | 2019-05-21 | Hewlett-Packard Development Company, L.P. | Card edge connector couplings |
-
2013
- 2013-06-04 TW TW102210460U patent/TWM467223U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10297938B2 (en) | 2015-06-10 | 2019-05-21 | Hewlett-Packard Development Company, L.P. | Card edge connector couplings |
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