TWM466413U - Temperature sensing circuit with circuit abnormality self-detection function - Google Patents

Temperature sensing circuit with circuit abnormality self-detection function Download PDF

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TWM466413U
TWM466413U TW102211602U TW102211602U TWM466413U TW M466413 U TWM466413 U TW M466413U TW 102211602 U TW102211602 U TW 102211602U TW 102211602 U TW102211602 U TW 102211602U TW M466413 U TWM466413 U TW M466413U
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temperature sensing
sensing circuit
thermocouple
error
unit
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TW102211602U
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Chinese (zh)
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zhong-cheng Li
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Jin Sheng Technology Co Ltd
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Description

具有迴路異常自我檢測之溫度感應電路Temperature sensing circuit with loop abnormal self-detection

  本創作係有關於一種具有迴路異常自我檢測之溫度感應電路,尤其是指一種判斷是否有故障損壞情況發生,以能防止檢測結果錯誤之情況發生,而在其整體施行使用上能直接取代舊有之電路,以更增實用便利性與提升可靠度的具有迴路異常自我檢測之溫度感應電路創新設計者。This creation is about a temperature sensing circuit with loop abnormal self-detection, especially a way to determine whether a faulty damage has occurred, so as to prevent the detection result from being wrong, and can directly replace the old one in its overall implementation. The circuit is an innovative designer of temperature sensing circuits with loop abnormal self-detection to increase practical convenience and improve reliability.

  按,IC於製作過程中,其大致上可分為:According to IC, in the production process, it can be roughly divided into:

  設計:首先需定義產品的功能,接著設計電路,透過模擬驗證[Simulation]與電路佈局[Circuit Layout],將電路圖轉製在數層光罩上,再以矽晶圓為基材進行晶圓製造、封裝、電性測試;Design: First, define the function of the product, then design the circuit, through the simulation verification [Simulation] and circuit layout [Circuit Layout], convert the circuit diagram on the enamel mask, and then use the germanium wafer as the substrate for wafer fabrication. Packaging, electrical testing;

  光罩:積體電路設計[IC Design]電路,藉由電腦輔助設計系統的協助,以電子束[E-Beam]或雷射光[Laser Beam]曝光,將電路刻印在玻璃基板上,此時刻印電路的玻璃基板,就稱為光罩[Mask];Photomask: Integrated circuit design [IC Design] circuit, with the aid of computer-aided design system, with electron beam [E-Beam] or laser beam [Laser Beam] exposure, the circuit is imprinted on the glass substrate, this moment is printed The glass substrate of the circuit is called a mask [Mask];

  製造:光罩完成後,運用微影成像的技術,以光阻劑等化學品為材料,將光罩上極細的線路圖一層層複製在矽晶圓上,接著利用蝕刻[Etching]技術,將部份未被光阻保護的氮化矽層加以除去,留下的就是所需要的線路圖部份,再來以磷為離子源[Ion Source],對整片晶圓進行磷原子的植入[Ion Implantation],然後再把光阻劑去除[Photoresist Scrip],接著進行金屬化製程[Metallization],製作金屬導線,以便將各個電晶體與元件加以連接;Manufacture: After the reticle is completed, using the technology of lithography, using a photoresist and other chemicals as a material, a very fine circuit pattern on the reticle is layered on the enamel wafer, and then etched [Etching] technology. Part of the layer of tantalum nitride that has not been protected by photoresist is removed, leaving the required part of the circuit diagram, and then phosphorus is used as an ion source [Ion Source] to implant the entire wafer with phosphorus atoms. [Ion Implantation], then remove the photoresist [Photoresist Scrip], and then carry out the metallization process [Metallization] to make metal wires to connect the various transistors to the components;

  封裝:封裝製程[Packaging]則是利用塑膠或陶瓷包裝晶粒與配線以成積體電路[Integrated Circuit,IC],此製程的目的是為了製造出所生產的電路的保護層,避免電路受到機械性刮傷或是高溫破壞,最後整個積體電路的周圍會向外拉出腳架[Pin],稱之為打線,作為與外界電路板連接之用;Package: The packaging process [Packaging] is to use a plastic or ceramic package die and wiring to form an integrated circuit [Integrated Circuit, IC], the purpose of this process is to create a protective layer of the circuit produced, to avoid mechanical damage to the circuit Scratches or high temperature damage, and finally the entire integrated circuit will pull out the tripod [Pin], which is called wire bonding, as a connection with the external circuit board;

  測試:在初步測試階段,封裝後的晶粒將會被置於各種環境下測試其電氣特性,例如消耗功率、速度、電壓容忍度等,測試後的IC將會將會依其電氣特性劃分等級而置入不同的Bin中[此過程稱之為Bin Splits],最後因應顧客之需求規格,於相對應的Bin中取出部份IC做特殊的測試及燒機[Burn-In],此即為最終測試,最終測試的成品將被貼上規格標籤[Brand]並加以包裝而後交與顧客,未通過的測試的產品將被降級[Downgrading]或丟棄。Testing: In the initial testing phase, the packaged die will be placed in various environments to test its electrical characteristics, such as power consumption, speed, voltage tolerance, etc., after testing, the IC will be graded according to its electrical characteristics. And put in different Bin [this process is called Bin Splits], and finally, according to the customer's demand specifications, take out some ICs in the corresponding Bin to do special test and burn [Burn-In], this is In the final test, the finished product will be labeled [Brand] and packaged and then delivered to the customer. Products that fail the test will be downgraded [Downgrading] or discarded.

  其中,在IC半導體或工業加工製程中需使用加熱裝置進行加熱動作,而於加熱裝置加熱過程中,為能準確控制其加熱狀態,皆會對加熱裝置進行溫度檢測;請參閱第六圖現有之架構示意圖及第七圖現有之電路示意圖所示,該溫度檢測電路(2)係於輸入端設有雜訊濾波單元(21),於該雜訊濾波單元(21)則連接有熱電耦放大器(22),以令加熱裝置之感溫元件連接至該溫度檢測電路(2)之雜訊濾波單元(21)進行雜訊濾波後,再予以傳輸至熱電耦放大器(22)進行放大輸出,以輸出檢測到的溫度狀態。Among them, in the IC semiconductor or industrial processing process, a heating device is required to perform the heating operation, and in the heating process of the heating device, in order to accurately control the heating state, the heating device is subjected to temperature detection; The schematic diagram of the structure and the schematic diagram of the seventh circuit shown in the prior art, the temperature detecting circuit (2) is provided with a noise filtering unit (21) at the input end, and a thermocouple amplifier is connected to the noise filtering unit (21). 22), the noise filtering component (21) of the heating device is connected to the noise filtering unit (21) of the temperature detecting circuit for noise filtering, and then transmitted to the thermocouple amplifier (22) for amplification output to output The detected temperature status.

  然而,上述溫度檢測電路雖可達到進行溫度檢測之預期功效,但也在其實際操作使用上發現,該電路並無任何比較、判斷之設計,而該熱電耦放大器在使用過程中較為容易產生損壞,使得當該熱電耦放大器損壞故障時,由於其並無法進行比對、判斷,即會輸出錯誤的訊號,影響檢測結果,甚至於會造成IC製作過程的損失,致令其在整體結構設計上仍存有改進之空間。However, although the above temperature detecting circuit can achieve the expected effect of performing temperature detection, it is also found in its practical operation that the circuit does not have any comparison and judgment design, and the thermocouple amplifier is more likely to be damaged during use. When the thermocouple amplifier is damaged, because it cannot be compared and judged, it will output an erroneous signal, affecting the detection result, and even causing loss of the IC manufacturing process, resulting in its overall structural design. There is still room for improvement.

  緣是,創作人有鑑於此,秉持多年該相關行業之豐富設計開發及實際製作經驗,針對現有之結構及缺失予以研究改良,提供一種具有迴路異常自我檢測之溫度感應電路,以期達到更佳實用價值性與可靠度提升之目的者。The reason is that, in view of this, the creators have been researching and improving the existing structures and deficiencies by providing rich experience in design and development of the relevant industries for many years, and providing a temperature sensing circuit with loop abnormal self-testing in order to achieve better practicality. The purpose of value and reliability improvement.

  本創作之主要目的在於提供一種具有迴路異常自我檢測之溫度感應電路,其主要係分別設有第一、二熱電耦放大器,利用對該第一、二熱電耦放大器之輸出訊號進行計算、比對,使得能藉由比對第一、二熱電耦放大器之輸出訊號誤差值判斷其是否有故障損壞情況發生,以能防止檢測結果錯誤之情況發生,而在其整體施行使用上能直接取代舊有之電路,以更增實用便利性與提升可靠度者。The main purpose of the present invention is to provide a temperature sensing circuit with loop abnormal self-detection, which is mainly provided with first and second thermocouple amplifiers, respectively, for calculating and comparing the output signals of the first and second thermocouple amplifiers. Therefore, it can be judged whether the faulty damage condition occurs by comparing the output signal error values of the first and second thermocouple amplifiers, so as to prevent the detection result from being erroneous, and the overall implementation can directly replace the old one. Circuits to increase practical convenience and improve reliability.

  本創作具有迴路異常自我檢測之溫度感應電路之主要目的與功效,係由以下具體技術手段所達成:The main purpose and effect of the temperature sensing circuit with loop abnormal self-detection are achieved by the following specific technical means:

  其主要係設有溫度感應電路,該溫度感應電路於輸入端設有雜訊濾波單元,令該雜訊濾波單元分別連接有第一熱電耦放大器及第二熱電耦放大器,於該第一、二熱電耦放大器皆連接至一誤差計算單元,該誤差計算單元則連接有一誤差範圍比較器,再於該誤差範圍比較器連結設有輸出信號整合單元,同時亦令該第一、二熱電耦放大器與輸出信號整合單元相連接。The temperature sensing circuit is provided with a noise sensing unit, and the noise filtering unit is respectively connected with a first thermocouple amplifier and a second thermocouple amplifier, in the first and second The thermocouple amplifiers are all connected to an error calculation unit, and the error calculation unit is connected with an error range comparator, and then the output range integration unit is connected to the error range comparator, and the first and second thermocouple amplifiers are also The output signal integration unit is connected.

  本創作具有迴路異常自我檢測之溫度感應電路之另一目的與功效,係由以下具體技術手段所達成:Another purpose and effect of the temperature sensing circuit with loop abnormal self-detection is achieved by the following specific technical means:

  其主要係設有溫度感應電路,該溫度感應電路於輸入端分別設有兩相對應之雜訊濾波單元,且於兩雜訊濾波單元連結設有信號切換開關,再令該信號切換開關分別連接有第一熱電耦放大器及第二熱電耦放大器,於該第一、二熱電耦放大器皆連接至一誤差計算單元,該誤差計算單元則連接有一誤差範圍比較器,再於該誤差範圍比較器連結設有輸出信號整合單元,同時亦令該第一、二熱電耦放大器與輸出信號整合單元相連接。The temperature sensing circuit is provided with two corresponding noise filtering units at the input end, and the signal switching switch is connected to the two noise filtering units, and then the signal switching switches are respectively connected. The first thermocouple amplifier and the second thermocouple amplifier are connected to an error calculation unit, and the error calculation unit is connected with an error range comparator, and then connected to the error range comparator An output signal integration unit is provided, and the first and second thermocouple amplifiers are also connected to the output signal integration unit.

  本創作具有迴路異常自我檢測之溫度感應電路的較佳實施例,其中,該誤差計算單元與誤差範圍比較器建構於內建有類比數位轉換器[ADC]之微處理器[MCU]內。The present invention has a preferred embodiment of a temperature sensing circuit for loop abnormal self-detection, wherein the error calculating unit and the error range comparator are constructed in a microprocessor [MCU] having an analog digital converter [ADC] built therein.

  本創作具有迴路異常自我檢測之溫度感應電路的較佳實施例,其中,該誤差計算單元與誤差範圍比較器建構於微處理器[MCU]內,且令該微處理器[MCU]連結搭配有類比數位轉換器[ADC]。The present invention has a preferred embodiment of a temperature sensing circuit for loop abnormal self-detection, wherein the error calculating unit and the error range comparator are constructed in a microprocessor [MCU], and the microprocessor [MCU] is coupled with Analog to digital converter [ADC].

  本創作具有迴路異常自我檢測之溫度感應電路的較佳實施例,其中,於有故障情況發生時,令該誤差範圍比較器輸出誤差範圍過大訊號,經輸出信號整合單元整合輸出超過溫度範圍之警示訊號,供機台端辨識得知。The present invention has a preferred embodiment of a temperature sensing circuit for loop abnormal self-detection, wherein when the fault condition occurs, the error range comparator output error range is too large, and the output signal integration unit integrates the output exceeding the temperature range warning. The signal is known to the machine.

(1)‧‧‧溫度感應電路(1) ‧‧‧temperature sensing circuit

(11)‧‧‧雜訊濾波單元(11)‧‧‧ Noise Filter Unit

(111)‧‧‧信號切換開關(111)‧‧‧Signal switch

(12)‧‧‧第一熱電耦放大器(12)‧‧‧First thermocouple amplifier

(13)‧‧‧第二熱電耦放大器(13)‧‧‧Second thermocouple amplifier

(14)‧‧‧誤差計算單元(14) ‧‧‧Error calculation unit

(15)‧‧‧誤差範圍比較器(15)‧‧‧Error Range Comparator

(16)‧‧‧輸出信號整合單元(16)‧‧‧Output signal integration unit

(2)‧‧‧溫度檢測電路(2) ‧ ‧ temperature detection circuit

(21)‧‧‧雜訊濾波單元(21)‧‧‧ Noise Filter Unit

(22)‧‧‧熱電耦放大器(22)‧‧‧Thermal Coupled Amplifier

第一圖:本創作之架構示意圖The first picture: Schematic diagram of the creation

第二圖:本創作之第一實施例架構示意圖Second picture: Schematic diagram of the first embodiment of the present creation

第三圖:本創作之第一實施例電路示意圖Third figure: schematic diagram of the circuit of the first embodiment of the present creation

第四圖:本創作之第二實施例電路示意圖Figure 4: Circuit diagram of the second embodiment of the present creation

第五圖:本創作之第三實施例電路示意圖Figure 5: Circuit diagram of the third embodiment of the present creation

第六圖:現有之架構示意圖Figure 6: Schematic diagram of the existing architecture

第七圖:現有之電路示意圖Figure 7: Existing circuit schematic

  為令本創作所運用之技術內容、創作目的及其達成之功效有更完整且清楚的揭露,茲於下詳細說明之,並請一併參閱所揭之圖式及圖號:In order to make the technical content, creative purpose and the effect achieved by this creation more complete and clear, please elaborate below, and please refer to the drawings and drawings:

  首先,請參閱第一圖本創作之架構示意圖所示,本創作主要係設有溫度感應電路(1),該溫度感應電路(1)於輸入端設有雜訊濾波單元(11),令該雜訊濾波單元(11)分別連接有第一熱電耦放大器(12)及第二熱電耦放大器(13),於該第一、二熱電耦放大器(12)、(13)皆連接至一誤差計算單元(14),該誤差計算單元(14)則連接有一誤差範圍比較器(15),該誤差計算單元(14)與誤差範圍比較器(15)可建構於內建有類比數位轉換器[ADC]之微處理器[MCU]內,或令類比數位轉換器[ADC]搭配建構該誤差計算單元(14)與誤差範圍比較器(15)之微處理器[MCU],以能利用微電腦軔體程式執行誤差計算與誤差範圍比較,再於該誤差範圍比較器(15)連結設有輸出信號整合單元(16),同時亦令該第一、二熱電耦放大器(12)、(13)與輸出信號整合單元(16)相連接。First, please refer to the schematic diagram of the first diagram of the creation. The creation is mainly provided with a temperature sensing circuit (1). The temperature sensing circuit (1) is provided with a noise filtering unit (11) at the input end. The noise filtering unit (11) is respectively connected with a first thermocouple amplifier (12) and a second thermocouple amplifier (13), and the first and second thermocouple amplifiers (12) and (13) are connected to an error calculation. a unit (14), the error calculating unit (14) is connected to an error range comparator (15), and the error calculating unit (14) and the error range comparator (15) can be constructed with an analog digital converter built in [ADC] In the microprocessor [MCU], or the analog-to-digital converter [ADC] is used to construct the error calculation unit (14) and the error range comparator (15) microprocessor [MCU] to be able to utilize the microcomputer body The program execution error calculation is compared with the error range, and the output signal integration unit is connected to the error range comparator (15). 16), and also led to the first and second thermocouple amplifier (12), (13) an output signal of the integration unit (16) is connected.

  另,請再一併參閱第二圖本創作之第一實施例架構示意圖及第三圖本創作之第一實施例電路示意圖所示,本創作之溫度感應電路(1)亦可於輸入端分別設有兩相對應之雜訊濾波單元(11),且於兩雜訊濾波單元(11)連結設有信號切換開關(111),再令該信號切換開關(111)分別連接有第一熱電耦放大器(12)及第二熱電耦放大器(13),於該第一、二熱電耦放大器(12)、(13)皆連接至一誤差計算單元(14),該誤差計算單元(14)則連接有一誤差範圍比較器(15),該誤差計算單元(14)與誤差範圍比較器(15)同樣可建構於內建有類比數位轉換器[ADC]之微處理器[MCU]內[請再一併參閱第四圖本創作之第二實施例電路示意圖所示],或令類比數位轉換器[ADC]搭配建構該誤差計算單元(14)與誤差範圍比較器(15)之微處理器[MCU][請再一併參閱第五圖本創作之第三實施例電路示意圖所示],再於該誤差範圍比較器(15)連結設有輸出信號整合單元(16),同時亦令該第一、二熱電耦放大器(12)、(13)與輸出信號整合單元(16)相連接。In addition, please refer to the second embodiment of the first embodiment of the present invention and the third embodiment of the present invention. The temperature sensing circuit (1) of the present invention can also be respectively input at the input end. There are two corresponding noise filtering units (11), and a signal switching switch (111) is connected to the two noise filtering units (11), and the signal switching switch (111) is respectively connected with the first thermocouple. The amplifier (12) and the second thermocouple amplifier (13) are connected to an error calculation unit (14) in the first and second thermocouple amplifiers (12), and the error calculation unit (14) is connected. There is an error range comparator (15), and the error calculation unit (14) and the error range comparator (15) can be constructed in the microprocessor [MCU] with the analog digital converter [ADC] built in [please again Referring to the fourth circuit diagram of the second embodiment of the present invention, or by using an analog-to-digital converter [ADC], the error calculation table is constructed. (14) Microprocessor [MCU] with error range comparator (15) [please refer to the circuit diagram of the third embodiment of the present invention as shown in the fifth figure], and then the error range comparator (15) The connection is provided with an output signal integration unit (16), and the first and second thermocouple amplifiers (12), (13) are also connected to the output signal integration unit (16).

  如此一來,使得本創作在操作使用上,其係依IC製程機台之加熱裝置所能提供的感溫元件輸出信號,當僅能提供單一溫度感測元件輸出訊號時,令該溫度感溫元件與該溫度感應電路(1)之雜訊濾波單元(11)連結,或令溫度感溫元件與該溫度感應電路(1)之兩相對應設置之雜訊濾波單元(11)其中之一連結,同時利用信號切換開關(111)切換選擇接收單一雜訊濾波單元(11)傳輸之訊號,而當能提供兩個溫度感溫元件輸出訊號時,則令兩輸出訊號分別連接至該溫度感應電路(1)之兩相對應設置之雜訊濾波單元(11),且利用信號切換開關(111)切換為接收兩雜訊濾波單元(11)交互傳輸之訊號,溫度感溫元件輸出訊號於經雜訊濾波單元(11)進行雜訊濾波後會分別輸入第一熱電耦放大器(12)及第二熱電耦放大器(13)中予以訊號放大,且放大後之訊號會同時輸入誤差計算單元(14)內進行計算,而計算後之誤差值則會輸入誤差範圍比較器(15)進行比對,當比對出第一熱電耦放大器(12)及第二熱電耦放大器(13)所輸出的訊號誤差值小於預設值時,即表示該第一、二熱電耦放大器(12)、(13)並無故障,所檢測出的數值即為正確值,而當比對出該第一熱電耦放大器(12)及第二熱電耦放大器(13)所輸出的訊號誤差值大於預設值時,即表示該第一、二熱電耦放大器(12)、(13)有產生故障之情況,再將該誤差範圍比較器(15)所比對的數值連同該第一、二熱電耦放大器(12)、(13)之輸出訊號傳輸至輸出信號整合單元(16)進行整合輸出,於無故障情況發生時,所輸出之訊號供進行後續相關處理,而有故障情況發生時,則能利用由誤差範圍比較器(15)輸出之誤差範圍過大訊號,經輸出信號整合單元(16)整合輸出直接取代溫度訊號,使其發出超過溫度範圍之警示訊號,以令機台端辨識得知後,供相關人員進行維修處理。In this way, the creation of the creation is based on the temperature sensing component output signal that can be provided by the heating device of the IC processing machine. When only the output signal of the single temperature sensing component can be provided, the temperature is sensed. The component is connected to the noise filtering unit (11) of the temperature sensing circuit (1), or one of the noise filtering units (11) corresponding to the temperature sensing element and the temperature sensing circuit (1) is connected. At the same time, the signal switching switch (111) is used to switch to receive the signal transmitted by the single noise filtering unit (11), and when the two temperature sensing element output signals can be provided, the two output signals are respectively connected to the temperature sensing circuit. (1) The two corresponding noise filtering units (11) are arranged, and the signal switching switch (111) is switched to receive signals transmitted by the two noise filtering units (11), and the temperature sensing element outputs signals in the interfering After the noise filtering unit (11) performs noise filtering, the first thermocouple amplifier (12) and the second thermocouple are respectively input. The signal is amplified in the device (13), and the amplified signal is simultaneously input into the error calculation unit (14) for calculation, and the calculated error value is input to the error range comparator (15) for comparison. When the signal error value output by the first thermocouple amplifier (12) and the second thermocouple amplifier (13) is less than a preset value, it means that the first and second thermocouple amplifiers (12) and (13) are not faulty. The detected value is the correct value, and when the signal error value outputted by the first thermocouple amplifier (12) and the second thermocouple amplifier (13) is greater than a preset value, The first and second thermocouple amplifiers (12) and (13) have faults, and the values compared by the error range comparator (15) are combined with the first and second thermocouple amplifiers (12) and (13). The output signal is transmitted to the output signal integration unit (16) for integrated output. When no fault occurs, the output signal is used for subsequent correlation processing, and there is a reason When the situation occurs, the error range excessively outputted by the error range comparator (15) can be used, and the integrated output of the output signal integration unit (16) directly replaces the temperature signal, so that the warning signal exceeding the temperature range is issued to make the machine After the station end is identified, it is provided for maintenance by relevant personnel.

  藉由以上所述,本創作結構之組成與使用實施說明可知,本創作與現有結構相較之下,本創作主要係分別設有第一、二熱電耦放大器,利用對該第一、二熱電耦放大器之輸出訊號進行計算、比對,使得能藉由比對第一、二熱電耦放大器之輸出訊號誤差值判斷其是否有故障損壞情況發生,以能防止檢測結果錯誤之情況發生,而在其整體施行使用上能直接取代舊有之電路,以更增實用便利性與提升可靠度者。By the above, the composition and use of the creation structure can be seen that, compared with the existing structure, this creation mainly has first and second thermocouple amplifiers, respectively, using the first and second thermoelectrics. The output signals of the coupled amplifiers are calculated and compared, so that the output signal error values of the first and second thermocouple amplifiers can be compared to determine whether there is a fault damage condition, so as to prevent the detection result from being erroneous, and The overall implementation can directly replace the old circuit, in order to increase the practical convenience and improve the reliability.

  前述之實施例或圖式並非限定本創作之結構樣態,任何所屬技術領域中具有通常知識者之適當變化或修飾,皆應視為不脫離本創作之專利範疇。The above-mentioned embodiments or drawings are not intended to limit the structure of the present invention, and any suitable variations or modifications of those skilled in the art should be considered as not departing from the scope of the invention.

  綜上所述,本創作實施例確能達到所預期之使用功效,又其所揭露之具體構造,不僅未曾見於同類產品中,亦未曾公開於申請前,誠已完全符合專利法之規定與要求,爰依法提出新型專利之申請,懇請惠予審查,並賜准專利,則實感德便。In summary, the present embodiment can achieve the expected use efficiency, and the specific structure disclosed is not only found in similar products, nor has it been disclosed before the application, and has fully complied with the requirements and requirements of the Patent Law.爰Proposing an application for a new type of patent in accordance with the law, and pleading for a review and granting a patent, it is really sensible.

(1)‧‧‧溫度感應電路 (1) ‧‧‧temperature sensing circuit

(11)‧‧‧雜訊濾波單元 (11)‧‧‧ Noise Filter Unit

(12)‧‧‧第一熱電耦放大器 (12)‧‧‧First thermocouple amplifier

(13)‧‧‧第二熱電耦放大器 (13)‧‧‧Second thermocouple amplifier

(14)‧‧‧誤差計算單元 (14) ‧‧‧Error calculation unit

(15)‧‧‧誤差範圍比較器 (15)‧‧‧Error Range Comparator

(16)‧‧‧輸出信號整合單元 (16)‧‧‧Output signal integration unit

Claims (5)

一種具有迴路異常自我檢測之溫度感應電路,其主要係設有溫度感應電路,該溫度感應電路於輸入端設有雜訊濾波單元,令該雜訊濾波單元分別連接有第一熱電耦放大器及第二熱電耦放大器,於該第一、二熱電耦放大器皆連接至一誤差計算單元,該誤差計算單元則連接有一誤差範圍比較器,再於該誤差範圍比較器連結設有輸出信號整合單元,同時亦令該第一、二熱電耦放大器與輸出信號整合單元相連接。A temperature sensing circuit with loop abnormal self-detection, which is mainly provided with a temperature sensing circuit, wherein the temperature sensing circuit is provided with a noise filtering unit at the input end, so that the noise filtering unit is respectively connected with the first thermocouple amplifier and the first The second thermocouple amplifier is connected to an error calculation unit in the first and second thermocouple amplifiers, wherein the error calculation unit is connected with an error range comparator, and the output signal integration unit is connected to the error range comparator. The first and second thermocouple amplifiers are also connected to the output signal integration unit. 一種具有迴路異常自我檢測之溫度感應電路,其主要係設有溫度感應電路,該溫度感應電路於輸入端分別設有兩相對應之雜訊濾波單元,且於兩雜訊濾波單元連結設有信號切換開關,再令該信號切換開關分別連接有第一熱電耦放大器及第二熱電耦放大器,於該第一、二熱電耦放大器皆連接至一誤差計算單元,該誤差計算單元則連接有一誤差範圍比較器,再於該誤差範圍比較器連結設有輸出信號整合單元,同時亦令該第一、二熱電耦放大器與輸出信號整合單元相連接。A temperature sensing circuit with loop abnormal self-detection is mainly provided with a temperature sensing circuit, wherein the temperature sensing circuit is provided with two corresponding noise filtering units at the input end, and the signals are connected to the two noise filtering units. Switching the switch, and then connecting the signal switching switch to the first thermocouple amplifier and the second thermocouple amplifier respectively, wherein the first and second thermocouple amplifiers are connected to an error calculation unit, and the error calculation unit is connected with an error range The comparator is further provided with an output signal integration unit connected to the error range comparator, and the first and second thermocouple amplifiers are also connected to the output signal integration unit. 如申請專利範圍第1或2項所述具有迴路異常自我檢測之溫度感應電路,其中,該誤差計算單元與誤差範圍比較器建構於內建有類比數位轉換器[ADC]之微處理器[MCU]內。The temperature sensing circuit with loop abnormal self-detection as described in claim 1 or 2, wherein the error calculating unit and the error range comparator are constructed in a microprocessor (MCU) with an analog digital converter [ADC] ]Inside. 如申請專利範圍第1或2項所述具有迴路異常自我檢測之溫度感應電路,其中,該誤差計算單元與誤差範圍比較器建構於微處理器[MCU]內,且令該微處理器[MCU]連結搭配有類比數位轉換器[ADC]。A temperature sensing circuit having a loop abnormal self-detection as described in claim 1 or 2, wherein the error calculating unit and the error range comparator are constructed in a microprocessor [MCU], and the microprocessor is [MCU] ] The link is matched with an analog digital converter [ADC]. 如申請專利範圍第1或2項所述具有迴路異常自我檢測之溫度感應電路,其中,於有故障情況發生時,令該誤差範圍比較器輸出誤差範圍過大訊號,經輸出信號整合單元整合輸出超過溫度範圍之警示訊號,供機台端辨識得知。The temperature sensing circuit with loop abnormal self-detection as described in claim 1 or 2, wherein when the fault condition occurs, the error range comparator output error range is too large, and the output signal integration unit integrates the output more than The warning signal of the temperature range is known to the machine.
TW102211602U 2013-06-20 2013-06-20 Temperature sensing circuit with circuit abnormality self-detection function TWM466413U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647432B (en) * 2015-10-14 2019-01-11 電裝股份有限公司 Composite sensor
TWI721182B (en) * 2017-04-21 2021-03-11 鴻海精密工業股份有限公司 Motherboard analysis device and method
TWI834322B (en) * 2022-09-30 2024-03-01 新唐科技股份有限公司 Comparator testing circuit and testing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647432B (en) * 2015-10-14 2019-01-11 電裝股份有限公司 Composite sensor
TWI721182B (en) * 2017-04-21 2021-03-11 鴻海精密工業股份有限公司 Motherboard analysis device and method
TWI834322B (en) * 2022-09-30 2024-03-01 新唐科技股份有限公司 Comparator testing circuit and testing method thereof

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