TWM464810U - Spraying device - Google Patents
Spraying device Download PDFInfo
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- TWM464810U TWM464810U TW102206830U TW102206830U TWM464810U TW M464810 U TWM464810 U TW M464810U TW 102206830 U TW102206830 U TW 102206830U TW 102206830 U TW102206830 U TW 102206830U TW M464810 U TWM464810 U TW M464810U
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- liquid
- spraying device
- substrate
- spacing
- nozzles
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- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
本新型創作是有關於一種噴灑裝置，且特別是有關於一種應用於線路基板的濕式製程的噴灑裝置。The present invention relates to a spray device, and more particularly to a spray device for a wet process applied to a circuit substrate.
線路基板之濕式製程所採用的噴灑法主要是透過噴灑裝置來讓液態的物質能夠散佈在空氣中並降落至物體表面。因此，使用者無須使用塗抹工具將這些噴灑物質塗抹在物體表面，並可藉由噴灑裝置在物體表面噴灑一層薄薄的噴灑物質。在實際應用上，盛裝噴灑物質的容器會配置有噴頭，並藉由操作噴頭將噴灑物質噴出，以使之均勻地分佈在空氣中。The spraying method used in the wet process of the circuit substrate is mainly to allow the liquid substance to be dispersed in the air and landed on the surface of the object through the spraying device. Therefore, the user does not need to apply the spraying material to the surface of the object by using an application tool, and a thin spray material can be sprayed on the surface of the object by a spraying device. In practical applications, the container containing the spray material is provided with a spray head, and the spray material is sprayed out by operating the spray head so as to be evenly distributed in the air.
由於現今各式電子裝置要求外型要輕、薄、短、小且功能也需具備多樣化，因此電子裝置內所設在基板上的銅箔電路相對的也要越來越精，以便能夠在同一面積的基板上，佈局出足以符合需求的電路。如何使噴灑裝置所噴出的液體能進入至更小的線路間隙中，已成為現今設計噴灑裝置所要解決的主要課題。Since various types of electronic devices are required to be light, thin, short, small, and functionally diverse, the copper foil circuit disposed on the substrate in the electronic device is relatively more sophisticated so that On the substrate of the same area, a circuit sufficient to meet the requirements is laid out. How to make the liquid sprayed by the spray device can enter the smaller line gap has become the main problem to be solved in today's design of the spray device.
本新型創作提供一種噴灑裝置，其藉由泵浦將一液體以不同流量分別注入於液體輸送管中，且每一液體輸送管中的液體透過對應的噴嘴以霧狀的方式噴灑至基板上。The novel creation provides a spraying device for injecting a liquid into a liquid delivery tube at different flow rates by pumping, and the liquid in each liquid delivery tube is sprayed onto the substrate in a mist manner through a corresponding nozzle.
本新型創作的噴灑裝置，配置於一基板的上方。噴灑裝置包括多個液體輸送管、多個噴嘴以及一泵浦。噴嘴分別連接液體輸送管。泵浦連接液體輸送管，其中泵浦適於將一液體以不同流量分別注入於液體輸送管中，且每一液體輸送管中的液體透過對應的噴嘴以一霧狀的方式噴灑至基板上。The spray device created by the present invention is disposed above a substrate. The spray device includes a plurality of liquid delivery tubes, a plurality of nozzles, and a pump. The nozzles are respectively connected to the liquid delivery tube. The pump is connected to the liquid delivery tube, wherein the pump is adapted to inject a liquid into the liquid delivery tube at different flow rates, and the liquid in each liquid delivery tube is sprayed onto the substrate in a mist through the corresponding nozzle.
在本新型創作的一實施例中，上述的液體包括蝕刻液或水。In an embodiment of the novel creation, the liquid includes an etchant or water.
在本新型創作的一實施例中，上述基板與每一噴嘴之間具有一第一間距，且第一間距介於10公釐至20公釐之間。In an embodiment of the present invention, the substrate has a first spacing between each nozzle and a first spacing of between 10 mm and 20 mm.
在本新型創作的一實施例中，上述的兩相鄰的噴嘴之間具有一第二間距，且第二間距介於數十公釐至數百公釐之間。In an embodiment of the present invention, the two adjacent nozzles have a second spacing therebetween, and the second spacing is between tens of millimeters and hundreds of millimeters.
在本新型創作的一實施例中，上述的每一噴嘴的孔徑介於50微米至500微米之間。In an embodiment of the present invention, each of the nozzles has a pore size between 50 microns and 500 microns.
基於上述，本新型創作的噴灑裝置是透過泵浦將一液體以不同流量分別注入於液體輸送管中，且每一液體輸送管中的液體透過對應的噴嘴以一霧狀的方式噴灑至基板上。因此，當將此噴灑裝置應用於對線路基板的濕式製程時，除了可有效避免對細線路產生過蝕，以確保線路的完整性之外，亦可以有效將線路基 板均勻地蝕刻至一預定厚度。Based on the above, the spray device of the present invention is designed to inject a liquid into the liquid delivery tube at different flow rates through the pump, and the liquid in each liquid delivery tube is sprayed onto the substrate in a mist manner through the corresponding nozzle. . Therefore, when the spraying device is applied to the wet process of the circuit substrate, in addition to effectively avoiding over-etching of the thin circuit to ensure the integrity of the circuit, the line base can be effectively The plate is uniformly etched to a predetermined thickness.
為讓本新型創作的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
10‧‧‧基板10‧‧‧Substrate
100‧‧‧噴灑裝置100‧‧‧Spray device
110‧‧‧液體輸送管110‧‧‧Liquid delivery tube
120‧‧‧噴嘴120‧‧‧Nozzles
130‧‧‧泵浦130‧‧‧ pump
D1‧‧‧第一間距D1‧‧‧first spacing
D2‧‧‧第二間距D2‧‧‧second spacing
L‧‧‧液體L‧‧‧Liquid
圖1繪示為本新型創作的一實施例之一種噴灑裝置的示意圖。1 is a schematic view of a spray device according to an embodiment of the present invention.
圖1繪示為本新型創作的一實施例之一種噴灑裝置的示意圖。請參考圖1，在本實施例中，噴灑裝置100配置於一基板10的上方，其中噴灑裝置100包括多個液體輸送管110、多個噴嘴120以及一泵浦130。噴嘴120分別連接液體輸送管110。泵浦130連接液體輸送管110。特別是，泵浦130適於將一液體L以不同流量分別注入於液體輸送管110中，且每一液體輸送管110中的液體L透過對應的噴嘴120以一霧狀的方式噴灑至基板10上。1 is a schematic view of a spray device according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the spraying device 100 is disposed above a substrate 10 , wherein the spraying device 100 includes a plurality of liquid delivery tubes 110 , a plurality of nozzles 120 , and a pump 130 . The nozzles 120 are connected to the liquid delivery tube 110, respectively. The pump 130 is connected to the liquid delivery tube 110. In particular, the pump 130 is adapted to inject a liquid L into the liquid delivery tube 110 at different flow rates, and the liquid L in each liquid delivery tube 110 is sprayed to the substrate 10 in a mist manner through the corresponding nozzle 120. on.
更具體來說，液體L例如是蝕刻液或水，而泵浦130例如是施加一工作壓力，較佳地，工作壓力介於15公斤/平方公分至30公斤/平方公分之間，並透過壓力控制閥(未繪示)而將液體L以不同流量分別注入於液體輸送管110中。在本實施例中，基板10與每一噴嘴120之間具有一第一間距D1，且第一間距D1例如 是介於10公釐至20公釐之間，可有效是霧化狀的液體L噴灑至基板10上。再者，兩相鄰的噴嘴120之間具有一第二間距D2，且第二間距D2可介於數十公釐至數百公釐之間。如此一來，相鄰兩噴嘴120所噴出的霧化狀的液體L僅一小部份重疊，可有效控制每一噴嘴120噴灑至基板10局部區域上的量，以提高製程良率。此外，在本實施例中，噴嘴120的孔徑例如是介於50微米至500微米之間。More specifically, the liquid L is, for example, an etchant or water, and the pump 130 is, for example, applied with a working pressure, preferably, the working pressure is between 15 kg/cm 2 and 30 kg/cm 2 and is transmitted through the pressure. A control valve (not shown) injects the liquid L into the liquid delivery tube 110 at different flow rates. In this embodiment, the substrate 10 and each of the nozzles 120 have a first spacing D1, and the first spacing D1 is, for example. It is between 10 mm and 20 mm, and the liquid L which is effectively atomized is sprayed onto the substrate 10. Furthermore, the two adjacent nozzles 120 have a second spacing D2 between them, and the second spacing D2 may be between tens of millimeters and hundreds of millimeters. In this way, only a small portion of the atomized liquid L ejected from the adjacent nozzles 120 overlaps, and the amount of each nozzle 120 sprayed onto a partial area of the substrate 10 can be effectively controlled to improve the process yield. Further, in the present embodiment, the aperture of the nozzle 120 is, for example, between 50 micrometers and 500 micrometers.
由於本實施例的噴灑裝置100是透過泵浦130將一液體L以不同流量分別注入於液體輸送管110中，且每一液體輸送管110中的液體L透過對應的噴嘴120以一霧狀的方式噴灑至基板10上。因此，當將此噴灑裝置100應用於對線路基板(未繪示)的濕式製程時，除了可有效避免對細線路(未繪示)產生過蝕，以確保線路的完整性之外亦可以有效將線路基板均勻地蝕刻至一預定厚度。Since the spraying device 100 of the embodiment is configured to inject a liquid L into the liquid delivery tube 110 through the pump 130 at different flow rates, and the liquid L in each liquid delivery tube 110 passes through the corresponding nozzle 120 in a mist. The method is sprayed onto the substrate 10. Therefore, when the spraying device 100 is applied to a wet process for a circuit substrate (not shown), in addition to effectively avoiding over-etching of thin wires (not shown), it is also possible to ensure the integrity of the circuit. The circuit substrate is effectively etched uniformly to a predetermined thickness.
綜上所述，本新型創作的噴灑裝置是透過泵浦將一液體以不同流量分別注入於液體輸送管中，且每一液體輸送管中的液體透過對應的噴嘴以一霧狀的方式噴灑至基板上。因此，當將此噴灑裝置應用於對線路基板的濕式製程時，可有效避免對細線路產生過蝕，以確保線路的完整性。In summary, the spray device of the present invention is designed to inject a liquid into a liquid delivery tube through a pump at different flow rates, and the liquid in each liquid delivery tube is sprayed through the corresponding nozzle in a mist manner. On the substrate. Therefore, when the spraying device is applied to the wet process of the circuit substrate, the over-etching of the thin circuit can be effectively avoided to ensure the integrity of the circuit.
雖然本新型創作已以實施例揭露如上，然其並非用以限定本新型創作，任何所屬技術領域中具有通常知識者，在不脫離 本新型創作的精神和範圍內，當可作些許的更動與潤飾，故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the novel creation has been disclosed above by way of example, it is not intended to limit the creation of the novel, and any one of ordinary skill in the art does not deviate. Within the spirit and scope of this new creation, when a little change and refinement can be made, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
10‧‧‧基板10‧‧‧Substrate
100‧‧‧噴灑裝置100‧‧‧Spray device
110‧‧‧液體輸送管110‧‧‧Liquid delivery tube
120‧‧‧噴嘴120‧‧‧Nozzles
130‧‧‧泵浦130‧‧‧ pump
D1‧‧‧第一間距D1‧‧‧first spacing
D2‧‧‧第二間距D2‧‧‧second spacing
L‧‧‧液體L‧‧‧Liquid
Claims (5)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102206830U TWM464810U (en) | 2013-04-15 | 2013-04-15 | Spraying device |
| CN 201320284825 CN203264929U (en) | 2013-04-15 | 2013-05-22 | Spraying device |
| JP2013003218U JP3185455U (en) | 2013-04-15 | 2013-06-06 | Spraying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102206830U TWM464810U (en) | 2013-04-15 | 2013-04-15 | Spraying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM464810U true TWM464810U (en) | 2013-11-01 |
Family
ID=49495423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102206830U TWM464810U (en) | 2013-04-15 | 2013-04-15 | Spraying device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3185455U (en) |
| CN (1) | CN203264929U (en) |
| TW (1) | TWM464810U (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9113591B2 (en) | 2012-06-18 | 2015-08-25 | Raven Industries, Inc. | Implement for adjustably metering an agricultural field input according to different frame sections |
| US11160204B2 (en) | 2013-03-15 | 2021-11-02 | Raven Industries, Inc. | Localized product injection system for an agricultural sprayer |
| US10173236B2 (en) | 2013-10-17 | 2019-01-08 | Raven Industries, Inc. | Nozzle control system and method |
| US9781916B2 (en) | 2013-10-17 | 2017-10-10 | Raven Industries, Inc. | Nozzle control system and method |
| CN106192933B (en) * | 2016-07-06 | 2019-04-09 | 中国科学院声学研究所 | A kind of atomising device, device and method |
| CN106391338A (en) * | 2016-12-01 | 2017-02-15 | 无锡溥汇机械科技有限公司 | Spray nozzle of ultrasonic lithium battery diaphragm spraying machine |
| CA3185961A1 (en) | 2017-01-05 | 2018-07-12 | Raven Industries, Inc. | Configurable nozzle assembly and methods for same |
| US11612160B2 (en) | 2019-10-04 | 2023-03-28 | Raven Industries, Inc. | Valve control system and method |
| BR112022006486A2 (en) | 2019-10-04 | 2022-08-23 | Raven Ind Inc | VALVE CONTROL SYSTEM AND METHOD |
-
2013
- 2013-04-15 TW TW102206830U patent/TWM464810U/en not_active IP Right Cessation
- 2013-05-22 CN CN 201320284825 patent/CN203264929U/en not_active Expired - Fee Related
- 2013-06-06 JP JP2013003218U patent/JP3185455U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN203264929U (en) | 2013-11-06 |
| JP3185455U (en) | 2013-08-15 |
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| MM4K | Annulment or lapse of a utility model due to non-payment of fees |