TWM464798U - Molding inductor soldering point structure - Google Patents

Description

Molded inductor solder joint structure

This creation is about a solder joint structure of a die-cast inductor, especially a die-cast inductor solder joint structure that avoids the peeling of the silver layer at the end.

For the general die-casting inductance, please refer to the first figure. The inductor body 10 is mainly made of metal powder by Molding. The manufacturing methods of the details are all those of ordinary skill in the art. As is well known, the inductor body 10 is internally provided with a coil 11 , and the outer surface of the end edges 111 and 112 of the inductor body 10 is respectively plated with a silver electrode layer assembly 2 at one end. The electrode layer assembly 2 further includes an end silver layer 21 made of silver (Ag), a first plating layer 22 made of nickel (Ni), and a second plating layer 23 made of tin (Sn). The end silver layer 21, the first plating layer 22 and the second plating layer 23 are sequentially plated on the inductor body 10 from the inside to the outside, whereby the end silver electrode layer assembly 2 can be electrically connected to the coil 11. In turn, the surface-adhesive wafer coil can be suitably soldered to the circuit board using Surface Mount Technology (SMT).

The conventional molded inductor can achieve the purpose of SMT rapid soldering, but since the coil 11 is generally a round enameled wire (ie, copper wire), the end edges 111, 112 (cut) of the two ends are small, resulting in The contact area between the end edges 111, 112 of the coil 11 and the end silver layer 21 is very limited. Therefore, please refer to the second figure, the silver layer of the silver electrode layer assembly 2 at the end thereof. 21 and the edge 111, 112 are prone to peeling phenomenon, which leads to lower product yield and higher manufacturing costs. Therefore, how to improve the above-mentioned defects, that is, the technology that the creator of the case wants to solve The difficulty lies.

In view of the existing die-casting inductance, since the edge between the silver layer and the end edge is prone to peeling off, resulting in a decrease in product yield and an increase in manufacturing cost, the purpose of the present invention is to provide a die-cast inductor solder joint structure by which the die is molded. The auxiliary adhesive layer is disposed between the cast inductor body and the terminal silver electrode layer assembly, and the auxiliary adhesive layer is made of copper, so that the auxiliary adhesive layer can substantially have an extension and increase the edge area of both ends of the coil. The effect can avoid or reduce the occurrence of spalling between the silver layer and the edge of the end, thereby enabling the creation to greatly improve the product yield and reduce the manufacturing cost.

In order to achieve the above objective, the present invention provides a die-cast inductor solder joint structure, comprising: a die-cast inductor body, wherein a coil is disposed inside the die-cast inductor body, and an end edge of the coil is exposed to the inductor The surface of the body; two auxiliary adhesive layers respectively plated on the outer surface of the end edges of the coiled inductor body at both ends of the coil, and the auxiliary adhesive layer is made of copper; the two end silver electrode layers The two end silver electrode layer assemblies are respectively plated on the outer surface of the auxiliary adhesive layer, and the silver electrode layer assembly further includes a silver layer at one end, a first plating layer and a second plating layer. The first silver plating layer, the first plating layer and the second plating layer are sequentially plated on the auxiliary adhesive layer from the inside to the outside; the auxiliary adhesion is provided between the molded inductor body and the end silver electrode layer assembly. a layer, and the auxiliary adhesive layer is made of copper, so that the auxiliary adhesive layer can substantially have the effect of extending and increasing the edge area of both ends of the coil, so that the silver layer and the edge of the end can be avoided or reduced. There is a situation of spalling, which in turn enables the creation to achieve a significant increase in product yield and lower manufacturing costs.

[Use]

10‧‧‧Inductive body

11‧‧‧ coil

111‧‧‧ edge

112‧‧‧ edge

2‧‧‧End silver electrode layer assembly

21‧‧‧End silver layer

22‧‧‧First plating

23‧‧‧Second plating

[this creation]

3‧‧‧Molded inductor body

31‧‧‧ coil

311‧‧‧ edge

312‧‧‧ edge

4‧‧‧Auxiliary adhesive layer

5‧‧‧End silver electrode layer assembly

51‧‧‧End silver layer

52‧‧‧First plating

53‧‧‧Second plating

The first figure is a side view of the conventional use.

The second figure is a schematic diagram of the action of peeling off the edge of the coil with the end silver layer.

The third picture is a side view of the creation.

Referring to the third figure, the present invention provides a die-cast inductor solder joint structure, which comprises: a die-cast inductor body 3, and a coil 31 is disposed inside the die-cast inductor body 3, and the end edges of the coil 31 are 311 and 312 are exposed on the surface of the molded inductor body 3, and the coil 31 is a circular enamel line; two auxiliary adhesive layers 4 are respectively plated on the molded inductor body 3 The outer edges of the end edges 311 and 312 of the coil 31 and the auxiliary adhesive layer 4 may be made of copper; the two end silver electrode layer assemblies 5 are respectively plated on the auxiliary adhesive layer. The outer surface of the layer 4 further includes a silver layer 51, a first plating layer 52 and a second plating layer 53 in the silver electrode layer assembly 5, and the silver layer 51 and the first plating layer 52 are The second plating layer 53 is sequentially plated on the auxiliary adhesive layer 4 from the inside to the outside. The material of the first silver layer 51 may be silver, and the material of the first plating layer 52 may be nickel. 53 material can be tin; Referring to the third figure, the auxiliary adhesive layer 4 is disposed between the molded inductor body 3 and the terminal silver electrode layer assembly 5, and the auxiliary adhesive layer 4 is made of copper. The adhesive layer 4 may substantially have the effect of extending and increasing the area of the end edges 311, 312 of the coil 31 (because the coil 31 is also made of copper), that is, the end edges 311, 312 and the end silver layer 51 may be greatly increased. The contact area between the two can avoid or reduce the occurrence of spalling between the end silver layer 51 and the end edges 311, 312, thereby enabling the creation to greatly improve the product yield and reduce the manufacturing cost.

3‧‧‧Molded inductor body

31‧‧‧ coil

311‧‧‧ edge

312‧‧‧ edge

4‧‧‧Auxiliary adhesive layer

5‧‧‧End silver electrode layer assembly

51‧‧‧End silver layer

52‧‧‧First plating

53‧‧‧Second plating

Claims (3)

A die-casting inductor solder joint structure comprises: a die-cast inductor body, wherein a coil is arranged inside the die-cast inductor body, and an end edge of the coil is exposed on a surface of the die-cast inductor body; two auxiliary adhesive layers The two auxiliary adhesive layers are respectively plated on the outer surface of the end edges of the coiled inductor body at both ends of the coil, and the auxiliary adhesive layer is made of copper; the two end silver electrode layer assemblies, the two end silver electrodes The layer component is respectively plated on the outer surface of the auxiliary adhesive layer, and the silver electrode layer assembly further comprises a silver layer at one end, a first plating layer and a second plating layer, and the silver layer is first, The electroplated layer and the second electroplated layer are sequentially plated on the auxiliary adhesive layer from the inside to the outside. The molded inductive solder joint structure according to claim 1, wherein the coil is a circular enameled wire. The molded inductive solder joint structure according to claim 1, wherein the material of the silver layer is silver, the material of the first plating layer is nickel, and the material of the second plating layer is tin.