TWM462847U - Frame type thin circuit board bracket - Google Patents
Frame type thin circuit board bracket Download PDFInfo
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- TWM462847U TWM462847U TW102204661U TW102204661U TWM462847U TW M462847 U TWM462847 U TW M462847U TW 102204661 U TW102204661 U TW 102204661U TW 102204661 U TW102204661 U TW 102204661U TW M462847 U TWM462847 U TW M462847U
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- lower limit
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Description
本創作係涉及一種於烘烤過程中固定電路板的架體,尤指一種框架式薄型電路板板架。The present invention relates to a frame for fixing a circuit board during baking, and more particularly to a frame type thin circuit board frame.
印刷電路板製作時,會在板體上印刷複數層銀漿、銅箔等材料以形成所需之電路,而每印刷一層或複數層材料之後,便須經過烘烤手續來使該等材料乾燥。When a printed circuit board is produced, a plurality of layers of silver paste, copper foil and the like are printed on the board to form a desired circuit, and after printing one or more layers of materials, a baking process is required to dry the materials. .
而現有技術中,烘烤電路板時,會將電路板設置於板架上,板架上設有複數夾具夾持住電路板的頂側,並藉由在烤箱中移動板架以連帶移動電路板。In the prior art, when the circuit board is baked, the circuit board is placed on the board frame, and the board holder is provided with a plurality of clamps for clamping the top side of the circuit board, and the moving circuit board is moved by moving the board frame in the oven. board.
然而,隨著電子裝置的輕薄化,電路板的厚度亦大幅降低,市面上也已出現厚度為0.04mm至0.15mm的薄型電路板,而薄型電路板因為厚度小,因此重量較輕,結構強度亦較低;因此薄型電路板於烤箱內烘烤時,由於現有技術之板架僅夾持薄型電路板的頂側,所以薄型電路板可能會因為烤箱內的熱氣流動等因素而飄動,如此除了可能導致電路板本身皺摺及變形外,更可能接觸到前後相鄰的電路板,並造成兩電路板上尚未乾燥的印刷材料互相沾染。However, with the thinning of the electronic device, the thickness of the circuit board is also greatly reduced, and a thin circuit board having a thickness of 0.04 mm to 0.15 mm has appeared on the market, and the thin circuit board has a small thickness, so the weight is light, and the structural strength is small. It is also low; therefore, when the thin circuit board is baked in the oven, since the prior art plate holder only holds the top side of the thin circuit board, the thin circuit board may flutter due to factors such as the flow of hot air in the oven, etc. It may cause wrinkles and deformation of the board itself, and it is more likely to contact the adjacent boards before and after, and cause the printed materials on the two boards to be contaminated with each other.
此外,雖有業者想出於板架上增設夾具以夾持住薄型電路板的底側或兩側,藉以避免薄型電路板飄動; 然而薄型電路板在烘烤過程中會因受熱而膨脹,因此若電路板於相對兩側皆夾持固定,則會無法自由膨脹伸張,進而同樣會產生皺摺及變形。In addition, although the manufacturer wants to add a fixture on the board to hold the bottom side or both sides of the thin circuit board, to avoid the thin circuit board fluttering; However, the thin circuit board expands due to heat during the baking process. Therefore, if the circuit board is clamped and fixed on the opposite sides, it will not be able to expand and expand freely, and wrinkles and deformation will also occur.
而對於薄型電路板來說,些微的皺摺、變形以及印刷材料沾染皆會對其電路造成一定之影響,因此前述缺點實有待加以改良。For a thin circuit board, slight wrinkles, deformation, and contamination of the printed material may have a certain influence on the circuit, so the above disadvantages need to be improved.
有鑑於前述現有技術之電路板板架,其使用時薄型電路板恐會飄動導致變形,或是因無法因應熱膨脹而同樣導致變形的缺點及不足,本創作提供一種框架式薄型電路板板架,其可有效解決上述缺點。In view of the above-mentioned prior art circuit board board frame, the thin circuit board may be fluttered to cause deformation, or the shortcomings and disadvantages caused by the thermal expansion may also cause deformation. The present invention provides a frame type thin circuit board board frame. It can effectively solve the above shortcomings.
為達到上述的創作目的,本創作所採用的技術手段為設計一種框架式薄型電路板板架,其中包含:一架體,其為矩形;至少一夾具,其設於架體上,且鄰接架體頂側;一下限位具,其設於架體上,且鄰接架體底側;下限位具設有一下限位槽,下限位槽於橫向兩端及向上對外相通。In order to achieve the above-mentioned creative purpose, the technical means adopted in the present invention is to design a frame type thin circuit board board frame, which comprises: a frame body which is rectangular; at least one fixture is arranged on the frame body, and the abutment frame The top side of the body; a lower limit position, which is disposed on the frame body and adjacent to the bottom side of the frame body; the lower limit position is provided with a lower limit position groove, and the lower limit position groove is communicated to the outside at the lateral ends and upward.
本創作使用時,薄型電路板的頂側夾設於夾具,而電路板的底側則穿設於下限位具的下限位槽中,由於下限位具位於相對夾具之側,因此下限位具可有效限制電路板飄動;此外,電路板的底側與下限位槽的槽底尚有一段距離,因此縱使電路板因熱膨脹,電路板亦可向下自由延伸,藉此以避免變形及產生皺折;本創作藉此使薄型電路板在烘烤過程中保持平直的板體表面,而不會變形或 產生皺摺狀,亦不會與相鄰電路板相接觸,進而獲得良好的產品品質。In the present use, the top side of the thin circuit board is clamped to the clamp, and the bottom side of the circuit board is inserted in the lower limit slot of the lower limit position. Since the lower limit position is located on the side of the opposite clamp, the lower limit can be Effectively limit the board to flutter; in addition, the bottom side of the board is still at a distance from the bottom of the lower slot, so that even if the board is thermally expanded, the board can be freely extended downward to avoid deformation and wrinkles. This creation allows the thin board to remain flat on the surface of the board during baking without distortion or It produces wrinkles and does not come into contact with adjacent boards, resulting in good product quality.
進一步而言,所述之框架式薄型電路板板架,其中進一步包含有一側限位具,其設於架體上,且鄰接架體橫向一側;側限位具設有一側限位槽,側限位槽於上下兩端及橫向向內對外相通。藉此可進一步限制住電路板的橫向一側邊,以避免電路板飄動。Further, the frame type thin circuit board board frame further includes a side limiting device, which is disposed on the frame body and adjacent to the lateral side of the frame body; the side limiting device is provided with a side limiting slot. The side limiting slots communicate with each other at the upper and lower ends and laterally inward. This further limits the lateral side of the board to prevent the board from fluttering.
10‧‧‧架體10‧‧‧ ‧ body
11‧‧‧頂桿11‧‧‧Pole
12‧‧‧底桿12‧‧‧ bottom pole
13‧‧‧側桿13‧‧‧ Sidebar
20‧‧‧夾具20‧‧‧ fixture
21‧‧‧裝設座21‧‧‧Installation seat
22‧‧‧按壓板22‧‧‧ Press plate
23‧‧‧內夾板23‧‧‧Internal splint
24‧‧‧外夾板24‧‧‧ outer splint
25‧‧‧彈性元件25‧‧‧Flexible components
30‧‧‧下限位具30‧‧‧lower limit
31‧‧‧裝設座31‧‧‧Installation seat
32‧‧‧按壓板32‧‧‧ Press plate
33‧‧‧內限位條33‧‧‧Limited bars
331‧‧‧包覆層331‧‧‧Cladding
34‧‧‧外限位條34‧‧‧External bars
341‧‧‧包覆層341‧‧‧Cladding
35‧‧‧彈性元件35‧‧‧Flexible components
36‧‧‧下限位槽36‧‧‧lower slot
40‧‧‧側限位具40‧‧‧ side limit
41‧‧‧裝設座41‧‧‧Installation seat
42‧‧‧按壓板42‧‧‧ Press plate
43‧‧‧內限位條43‧‧‧Limited bars
44‧‧‧外限位條44‧‧‧ outer limit strip
45‧‧‧彈性元件45‧‧‧Flexible components
50‧‧‧電路板50‧‧‧ boards
10A‧‧‧架體10A‧‧‧ frame
13A‧‧‧側桿13A‧‧‧ sidebar
20A‧‧‧夾具20A‧‧‧ fixture
30A‧‧‧下限位具30A‧‧‧lower limit
40A‧‧‧側限位具40A‧‧‧ side limit
50A‧‧‧電路板50A‧‧‧PCB
20B‧‧‧夾具20B‧‧‧Clamp
30B‧‧‧下限位具30B‧‧‧lower limit
50B‧‧‧電路板50B‧‧‧Board
30C‧‧‧限位具30C‧‧‧ Limits
33C‧‧‧限位條33C‧‧‧Limited bars
331C‧‧‧包覆層331C‧‧‧ coating
34C‧‧‧限位條34C‧‧‧Limited bars
341C‧‧‧包覆層341C‧‧‧ coating
36C‧‧‧限位槽36C‧‧‧ Limit slot
10D‧‧‧架體10D‧‧‧ frame
11D‧‧‧頂桿11D‧‧‧Pole
111D‧‧‧長孔111D‧‧‧ long hole
112D‧‧‧抵靠壁112D‧‧‧ against the wall
20D‧‧‧夾具20D‧‧‧ fixture
50D‧‧‧電路板50D‧‧‧PCB
60D‧‧‧位移裝置60D‧‧‧displacement device
61D‧‧‧本體61D‧‧‧ Ontology
62D‧‧‧彈性元件62D‧‧‧Flexible components
63D‧‧‧螺栓63D‧‧‧Bolts
圖1係本創作之第一實施例之立體外觀圖。Figure 1 is a perspective view of the first embodiment of the present invention.
圖2係本創作之第一實施例之大部元件分解圖。Figure 2 is an exploded view of most of the components of the first embodiment of the present invention.
圖3係本創作之第一實施例之夾具之元件分解圖。Figure 3 is an exploded view of the jig of the first embodiment of the present invention.
圖4係本創作之第一實施例之夾具之側視剖面圖。Figure 4 is a side cross-sectional view of the jig of the first embodiment of the present invention.
圖5係本創作之第一實施例之下限位具之元件分解圖。Figure 5 is an exploded view of the lower limit of the first embodiment of the present invention.
圖6係本創作之第一實施例之下限位具之側視剖面圖。Figure 6 is a side cross-sectional view of the lower limit member of the first embodiment of the present invention.
圖7係本創作之第二實施例之前視示意圖。Figure 7 is a front elevational view of a second embodiment of the present invention.
圖8係本創作之第二實施例之另一態樣之前視示意圖。Figure 8 is a front elevational view of another aspect of the second embodiment of the present invention.
圖9係本創作之第三實施例之前視示意圖。Figure 9 is a front elevational view of a third embodiment of the present invention.
圖10係本創作之第四實施例之下限位具之放大側視剖面圖。Figure 10 is an enlarged side elevational cross-sectional view of the lower limit member of the fourth embodiment of the present invention.
圖11係本創作之第五實施例之位移裝置之放大立體外觀圖。Figure 11 is an enlarged perspective view of the displacement device of the fifth embodiment of the present invention.
圖12係本創作之第五實施例之位移裝置之放大元件分解圖。Figure 12 is an exploded perspective view of the displacement device of the fifth embodiment of the present invention.
圖13係本創作之第五實施例之位移裝置之放大前視示 意圖。Figure 13 is an enlarged front view of the displacement device of the fifth embodiment of the present invention. intention.
圖14係本創作之第五實施例之位移裝置之使用示意圖。Figure 14 is a schematic view showing the use of the displacement device of the fifth embodiment of the present invention.
以下配合圖式及本創作之較佳實施例,進一步闡述本創作為達成預定創作目的所採取的技術手段。The technical means adopted by the present invention for achieving the intended purpose of creation are further explained below in conjunction with the drawings and the preferred embodiment of the present invention.
請參閱圖1及圖2所示,本創作之框架式薄型電路板板架之第一實施例包含有一架體10、兩夾具20、一下限位具30及兩側限位具40。Referring to FIG. 1 and FIG. 2, the first embodiment of the frame type thin circuit board board frame of the present invention comprises a frame body 10, two clamps 20, a lower limit position member 30 and two side limit members 40.
前述之架體10包含有一頂桿11、一底桿12及兩側桿13,兩側桿13連接於頂桿11及底桿12之間,頂桿11、底桿12及兩側桿13形成一矩形。The frame body 10 includes a top rod 11, a bottom rod 12 and two side rods 13. The two side rods 13 are connected between the top rod 11 and the bottom rod 12. The top rod 11, the bottom rod 12 and the two side rods 13 are formed. A rectangle.
請參閱圖2至圖4所示,前述之兩夾具20間隔設於架體10的頂桿11上,且分別位於架體10頂側的兩個角落;各夾具20包含有一裝設座21、一按壓板22、一內夾板23、一外夾板24及一彈性元件25;裝設座21固設於架體10的頂桿11上;按壓板22樞設於裝設座21上;內夾板23固設於裝設座21上;外夾板24固設於按壓板22的內側,內夾板23及外夾板24可相對夾合;彈性元件25設於裝設座21上,且抵靠於按壓板22,並透過按壓板22使外夾板24朝向內夾板23轉動。Referring to FIG. 2 to FIG. 4 , the two clamps 20 are disposed on the top pole 11 of the frame body 10 and are respectively located at two corners on the top side of the frame body 10 . Each clamp 20 includes a mounting seat 21 . a pressing plate 22, an inner clamping plate 23, an outer clamping plate 24 and an elastic member 25; the mounting seat 21 is fixed on the top rod 11 of the frame body 10; the pressing plate 22 is pivotally mounted on the mounting seat 21; the inner clamping plate 23 is fixed on the mounting seat 21; the outer clamping plate 24 is fixed on the inner side of the pressing plate 22, the inner clamping plate 23 and the outer clamping plate 24 can be oppositely clamped; the elastic member 25 is disposed on the mounting seat 21 and abuts against the pressing The plate 22 and the outer plate 24 are rotated toward the inner plate 23 by the pressing plate 22.
請參閱圖2、圖5及圖6所示,前述之下限位具30設於架體10的底桿12上;下限位具30包含有兩裝設座31、兩按壓板32、一內限位條33、一外限位條34及兩彈性元件35;兩裝設座31固設於架體10的底桿12上, 且分別位於架體10底側的兩個角落;兩按壓板32分別樞設於兩裝設座31上;內限位條33固設於兩裝設座31上;外限位條34固設於兩按壓板32上,兩限位條33、34相向之側皆凹設有一凹槽,而該兩凹槽形成一下限位槽36,下限位槽36於橫向兩端及向上對外相通;兩限位條33、34外皆包覆有一包覆層331、341,包覆層331、341具有極低之摩擦係數,在本實施例中,包覆層331、341之材質為聚四氟乙烯,即美國杜邦公司所生產之鐵氟龍® ,但不以此為限;兩彈性元件35分別設於兩裝設座31上,且分別抵靠兩按壓板32,並透過按壓板32使外限位條34朝向內限位條33轉動。Referring to FIG. 2, FIG. 5 and FIG. 6, the lower limit position 30 is disposed on the bottom rod 12 of the frame body 10; the lower limit position 30 includes two mounting seats 31, two pressing plates 32, and an inner limit. a strip 33, an outer limiting strip 34 and two elastic elements 35; the two mounting seats 31 are fixed on the bottom rod 12 of the frame body 10, and are respectively located at two corners on the bottom side of the frame body 10; the two pressing plates 32 The inner limiting strips 33 are fixed on the two mounting seats 31; the outer limiting strips 34 are fixed on the two pressing plates 32, and the two limiting strips 33, 34 are opposite to each other. A recess is formed in the recess, and the two recesses form a lower limit slot 36. The lower limit slot 36 is externally communicated at both ends and upwardly; the two limiting strips 33 and 34 are covered with a covering layer 331, 341. , 331, 341 having a cladding layer of low coefficient of friction, in the present embodiment, the cladding layer 331, 341 made of PTFE, i.e., DuPont's Teflon ® produced by, but not For example, the two elastic members 35 are respectively disposed on the two mounting seats 31 and respectively abut against the two pressing plates 32, and the outer limiting strips 34 are rotated toward the inner limiting strips 33 through the pressing plates 32.
請參閱圖1及圖2所示,前述之兩側限位具40分別設於架體10的兩側桿13上;各側限位具40包含有一裝設座41、一按壓板42、一內限位條43、一外限位條44及一彈性元件45;裝設座41固設於架體10的相對應的側桿13的中央;按壓板42樞設於裝設座41上;內限位條43固設於裝設座41上;外限位條44固設於按壓板42上,兩限位條43、44相向之側皆凹設有一凹槽,而該兩凹槽形成一側限位槽,側限位槽於上下兩端及橫向向內對外相通;兩限位條43、44外皆包覆有一包覆層,包覆層具有極低之摩擦係數,在本實施例中,包覆層之材質為聚四氟乙烯,即美國杜邦公司所生產之鐵氟龍® ,但不以此為限;彈性元件45設於裝設座41上,且抵靠於按壓板42,並透過按壓板42使外限位條44朝向內限位條43轉動。Referring to FIG. 1 and FIG. 2 , the two side limiting devices 40 are respectively disposed on the rods 13 on the two sides of the frame body 10 ; each side limiting device 40 includes a mounting seat 41 , a pressing plate 42 , and a The inner limiting strip 43, the outer limiting strip 44 and an elastic element 45; the mounting seat 41 is fixed to the center of the corresponding side rod 13 of the frame body 10; the pressing plate 42 is pivotally mounted on the mounting seat 41; The inner limiting strip 43 is fixed on the mounting seat 41; the outer limiting strip 44 is fixed on the pressing plate 42, and a recess is formed on the opposite sides of the two limiting strips 43 and 44, and the two recesses are formed. One side limiting groove, the side limiting groove is open to the outside at the upper and lower ends and laterally inward; the two limiting strips 43 and 44 are covered with a coating layer, and the coating layer has a very low friction coefficient. embodiment, the material of the cladding layer of polytetrafluoroethylene, i.e., DuPont's Teflon ® produced by, but not limited to; an elastic member 45 disposed on the mounting base 41, and abuts against the pressing plate 42, the outer limiting strip 44 is rotated toward the inner limiting strip 43 by the pressing plate 42.
請參閱圖1、圖4及圖6所示,本創作使用時,薄型電路板50的頂側夾持固定於兩夾具20的內夾板23及 外夾板24之間,薄型電路板50的兩側分別穿設於兩側限位具40的側限位槽中,薄型電路板50的底側則穿設於下位具30的下限位槽36中,藉此以可有效避免電路板50飄動;此外,由於薄型電路板50的厚度遠小於側限位槽及下限位槽36的寬度,並且電路板50的底側與下限位槽的槽底尚有一段距離,而電路板50的兩側分別與兩側限位槽36的槽底有一段距離,因此縱使電路板50因熱膨脹,電路板50亦得以向下及橫向自由延伸,藉此以避免變形及產生皺折。Referring to FIG. 1 , FIG. 4 and FIG. 6 , when the present invention is used, the top side of the thin circuit board 50 is clamped and fixed to the inner clamping plate 23 of the two clamps 20 and Between the outer clamping plates 24, the two sides of the thin circuit board 50 are respectively disposed in the side limiting slots of the two side limiting devices 40, and the bottom side of the thin circuit board 50 is disposed in the lower limiting slot 36 of the lower positioning device 30. Therefore, the circuit board 50 can be effectively prevented from fluttering; in addition, since the thickness of the thin circuit board 50 is much smaller than the width of the side limiting slot and the lower limiting slot 36, and the bottom side of the circuit board 50 and the bottom of the lower limit slot are still There is a distance, and the two sides of the circuit board 50 are separated from the groove bottoms of the two side limiting slots 36, so that even if the circuit board 50 is thermally expanded, the circuit board 50 can be freely extended downward and laterally, thereby avoiding Deformation and wrinkles.
本創作藉此使薄型電路板50在烘烤過程中保持平直的板體表面,而不會變形或產生皺摺狀,亦不會與相鄰電路板相接觸,進而獲得良好的產品品質。The present invention thereby allows the thin circuit board 50 to maintain a flat surface of the board during the baking process without being deformed or wrinkled, and not in contact with an adjacent circuit board, thereby obtaining good product quality.
而欲卸下薄型電路板50時,僅需按壓夾具20的按壓板22即可使內夾板23及外夾板24分離而不再夾設電路板50;同樣地,按壓各限位具30、40的按壓板32、42即可使各外限位條34、44向前轉動,此時便可將電路板50向前移出。When the thin circuit board 50 is to be removed, only the pressing plate 22 of the clamp 20 is required to separate the inner clamping plate 23 and the outer clamping plate 24 without the circuit board 50 being inserted; likewise, pressing the limiting members 30, 40 The pressing plates 32, 42 can rotate the outer limiting strips 34, 44 forward, and the circuit board 50 can be moved forward.
請參閱圖7及圖8所示,以下為本創作之第二實施例,其與第一實施例大致相同,但僅具有單一側限位具40A,該單一側限位具40A可位於架體10A的左側側桿13A或右側側桿13A;本第二實施例仍透過夾具20A、下限位具30A及該單一側限位具40A而限制住薄型電路板50A的三個側邊,因此仍可達到與第一實施例相同之功效。Referring to FIG. 7 and FIG. 8 , the following is a second embodiment of the present invention, which is substantially the same as the first embodiment, but has only a single side limiting device 40A, and the single side limiting device 40A can be located in the frame. The left side side rail 13A or the right side side rod 13A of the 10A; the second embodiment still limits the three sides of the thin circuit board 50A through the clamp 20A, the lower limit position 30A and the single side limiter 40A, so that The same effects as the first embodiment are achieved.
請參閱圖9所示,以下為本創作之第三實施 例,其與第一實施例大致相同,但不具有側限位具;本第三實施例仍透過夾具20B及下限位具30B限制住薄型電路板50B的相對兩側邊,因此仍可達到與第一實施例相同之功效。Please refer to Figure 9, the following is the third implementation of the creation. For example, it is substantially the same as the first embodiment, but does not have a side limit device; the third embodiment still limits the opposite sides of the thin circuit board 50B through the clamp 20B and the lower limit position 30B, so that The same effect as the first embodiment.
請參閱圖10所示,以下為本創作之第四實施例,其與第一實施例大致相同,但是各限位具30C的各限位條33C、34C的包覆層331C、341C並未緊密貼合於限位條33C、34C的外壁面,其中包覆層331C、341C與相對應的限位槽36C的內壁面間具有一間隙,並且兩限位條33C、34C的包覆層331C、341C於相對應的限位槽36C上成V字形地排列;本第四實施例同樣可達到與第一實施例相同之功效。Referring to FIG. 10, the following is a fourth embodiment of the present invention, which is substantially the same as the first embodiment, but the covering layers 331C and 341C of the respective limiting strips 33C and 34C of the limiting members 30C are not tight. The outer wall surface of the limiting strips 33C, 34C is bonded to the outer wall surface of the limiting strips 33C, 34C, and the inner wall surface of the corresponding limiting groove 36C has a gap therebetween, and the coating layer 331C of the two limiting strips 33C, 34C, The 341C is arranged in a V shape on the corresponding limiting groove 36C; the fourth embodiment can also achieve the same effect as the first embodiment.
請參閱圖11至圖13所示,以下為本創作之第五實施例,其與第一實施例大致相同,但有以下差異:Referring to FIG. 11 to FIG. 13, the following is a fifth embodiment of the present creation, which is substantially the same as the first embodiment, but with the following differences:
架體10D的頂桿11D貫穿有一橫向長孔111D,且頂桿11D的背面突出有兩抵靠壁112D,該兩抵靠壁112D分別位於長孔111D的橫向兩側。The ejector 11D of the frame body 10D has a lateral long hole 111D, and the back surface of the ejector pin 11D protrudes from the abutting wall 112D, and the two abutting walls 112D are respectively located at lateral sides of the long hole 111D.
進一步包含有一位移裝置60D,位移裝置60D包含有一本體61D及兩彈性元件62D;本體61D可移動地設於頂桿11D上;兩個彈性元件62D的內端分別抵靠本體61D的兩端,且兩個彈性元件62D的外端分別抵靠頂桿11D的兩抵靠壁112D;兩螺栓63D貫穿本體61D及頂桿11D的長孔111D後,鎖合於其中一夾具20D上,藉此使該夾具20D可隨著本體61D一同相對頂桿11D橫向移動。Further comprising a displacement device 60D, the displacement device 60D includes a body 61D and two elastic members 62D; the body 61D is movably disposed on the plunger 11D; the inner ends of the two elastic members 62D abut against the two ends of the body 61D, respectively, and The outer ends of the two elastic members 62D respectively abut against the abutting walls 112D of the ejector 11D; the two bolts 63D extend through the long holes 111D of the body 61D and the ejector 11D, and are locked to one of the clamps 20D, thereby The jig 20D can move laterally with respect to the jack 11D along with the body 61D.
請參閱圖13及圖14所示,藉此當薄型電路板 50D受熱而橫向膨脹時,電路板50D的一側可連帶該側之夾具20D及位移裝置60D的本體61D相對架體10D橫向移動,藉此可有效避免電路板50D因無法橫向自由膨脹伸張而導致皺摺及變形。Please refer to FIG. 13 and FIG. 14 as a thin circuit board. When the 50D is heated and laterally expanded, the side of the circuit board 50D can be laterally moved relative to the frame 10D of the clamp 20D and the displacement device 60D of the side, thereby effectively preventing the circuit board 50D from being unable to expand laterally due to lateral expansion. Wrinkles and deformation.
此外,這時位於本體61D兩側的兩個彈性元件62D分別壓縮及拉伸,藉此當溫度降低後,兩彈性元件62會隨著恢復原狀的電路板50D而將本體61D及其夾具20D推回原位。Further, at this time, the two elastic members 62D located on both sides of the body 61D are respectively compressed and stretched, whereby when the temperature is lowered, the two elastic members 62 push the body 61D and its jig 20D back with the original circuit board 50D. In situ.
以上所述僅是本創作的較佳實施例而已,並非對本創作做任何形式上的限制,雖然本創作已以較佳實施例揭露如上,然而並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本創作技術方案的內容,依據本創作的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本創作技術方案的範圍內。The above description is only a preferred embodiment of the present invention, and does not impose any form limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present creation, and has any technical field. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical essence of the creation Any simple modification, equivalent change and modification of the above embodiments are still within the scope of the technical solution of the present invention.
10‧‧‧架體10‧‧‧ ‧ body
11‧‧‧頂桿11‧‧‧Pole
12‧‧‧底桿12‧‧‧ bottom pole
13‧‧‧側桿13‧‧‧ Sidebar
20‧‧‧夾具20‧‧‧ fixture
21‧‧‧裝設座21‧‧‧Installation seat
22‧‧‧按壓板22‧‧‧ Press plate
23‧‧‧內夾板23‧‧‧Internal splint
24‧‧‧外夾板24‧‧‧ outer splint
25‧‧‧彈性元件25‧‧‧Flexible components
30‧‧‧下限位具30‧‧‧lower limit
31‧‧‧裝設座31‧‧‧Installation seat
32‧‧‧按壓板32‧‧‧ Press plate
33‧‧‧內限位條33‧‧‧Limited bars
34‧‧‧外限位條34‧‧‧External bars
40‧‧‧側限位具40‧‧‧ side limit
41‧‧‧裝設座41‧‧‧Installation seat
42‧‧‧按壓板42‧‧‧ Press plate
43‧‧‧內限位條43‧‧‧Limited bars
44‧‧‧外限位條44‧‧‧ outer limit strip
45‧‧‧彈性元件45‧‧‧Flexible components
50‧‧‧電路板50‧‧‧ boards
Claims (26)
Priority Applications (1)
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TW102204661U TWM462847U (en) | 2013-03-14 | 2013-03-14 | Frame type thin circuit board bracket |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW102204661U TWM462847U (en) | 2013-03-14 | 2013-03-14 | Frame type thin circuit board bracket |
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Publication Number | Publication Date |
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TWM462847U true TWM462847U (en) | 2013-10-01 |
Family
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Application Number | Title | Priority Date | Filing Date |
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TW102204661U TWM462847U (en) | 2013-03-14 | 2013-03-14 | Frame type thin circuit board bracket |
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TW (1) | TWM462847U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112875248A (en) * | 2019-11-29 | 2021-06-01 | 群翊工业股份有限公司 | Plate frame conveying method |
TWI827463B (en) * | 2022-09-02 | 2023-12-21 | 群翊工業股份有限公司 | Vertical glass carrier clamping structure |
-
2013
- 2013-03-14 TW TW102204661U patent/TWM462847U/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112875248A (en) * | 2019-11-29 | 2021-06-01 | 群翊工业股份有限公司 | Plate frame conveying method |
CN112875248B (en) * | 2019-11-29 | 2022-07-26 | 群翊工业股份有限公司 | Plate frame conveying method |
TWI827463B (en) * | 2022-09-02 | 2023-12-21 | 群翊工業股份有限公司 | Vertical glass carrier clamping structure |
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