TWM462449U - Improved package structure of LED assembly with driving chip - Google Patents

Description

Improved package structure of LED package with driver chip

The present invention relates to a light-emitting component package structure that is controlled by a central signal and can be easily realized for long-distance transmission, and in particular, an improved light-emitting component package structure with a drive chip.

According to the application of Light Emitting Diode (LED), it can be roughly divided into display function and illumination function; in addition to monochromatic light-emitting diode (LED), it has been widely used for lighting purposes, multi-color, full-color illumination. The diode (LED) can meet the human visual needs in display applications; among them, the full-color LEDs, in order to achieve various colors, each full-color LED package structure contains at least red light ( R) LED chip, green (G) LED chip and blue (B) LED chip, using three-color light to mix the ever-changing light color, but the ratio of RGB three primary colors required by various light colors is different, so full-color light The diode needs to be equipped with a driving unit to effectively and accurately control the mixing ratio of the three primary colors of RGB.

The traditional method is to set a full-color LED, a current limiting resistor and a driving unit on the printed circuit board, and after the plurality of circuit boards are electrically connected to each other, the working power and control signals transmitted by the central control are used to drive the whole. Color LEDs, and use the array of most full-color LED light and shadow transformation or change to form an LED display. Although the LED display screen technology of the traditional method has been completely completed, the current limiting resistor and the driving unit need to be added on the circuit board, which causes the spacing of the full-color LEDs adjacent to each other to be too large to display a finer image, and the driving unit is exposed easily. Frequency interference (RFI) and electromagnetic interference (EM) I).

A light-emitting diode assembly incorporating a driving unit, such as the Republic of China new patent No. M356232 "Light-emitting diode structure with integrated driving mechanism", mainly red (R) LED chip, green light (G) LED chip and In the blue (B) LED chip package, the driver chip and the current limiting resistor are packaged in the carrier to form a light emitting diode assembly with a driving chip and a current limiting resistor; although the circuit board is disposed, the frequency interference can be improved ( RFI) and electromagnetic interference (EMI) problems, and make the displayed pattern more detailed, but when the central control transmits the working power and control signals to the LED assembly, it is difficult to transmit long distances; that is, most of the illumination The array of diode components is sorted on the circuit board, and the distance between each of the light-emitting diodes and the central control terminal is not the same. Even when the central control terminal is far away from the circuit board, the working power supply is boosted or licensed. Long-distance transmission, but the driver chip (IC) needs to work at a certain voltage (usually 5V). If the external power supply voltage of the LED assembly is higher than the operating voltage of the driver chip (IC), it will easily affect The normal operation of the active chip (IC), and the possibility of damage; the addition of a voltage-stabilized IC chip on the external power supply, although the driver chip (IC) can get the normal working voltage to work, but this makes the board Planning for the use of circuit processing or electronic components, losing the original desire to simplify.

The main purpose of the present invention is to provide an LED package assembly structure with a driver chip, which is a light-emitting diode assembly, a package slot is formed on a carrier, and a transparent gel is injected from the package slot. , will have more than one LED (LED) wafer And a driver chip package is formed in the package slot; each of the light emitting diode (LED) chips and the driver chip are packaged in the package slot, and are integrated by a conductive integrated piece, the integration a side of the chip is provided with a power input end extending from the package slot to the outside of the carrier, a power output terminal, at least one data signal input end and at least one data signal output end; each of the light emitting diodes One end of the body (LED) chip is electrically connected to a control terminal of the driving chip, and the other end is electrically connected to the power input end, and the power input end is further connected with a sigma a Zener Diode, and the power supply of the driving chip is connected to the working power source from the second terminal of the driving chip; the power output end is electrically connected to the integrated chip, and the integrated piece is further Electrically connecting the power supply port of the driving chip, and at least one signal port and at least one signal port of the driving chip are respectively electrically connected to the data signal input end and the data signal output end; LED assembly The full-color or single-color light source controlled by the central control unit is used to depressurize (regulate) the external power supply by using the Jenus diode connected to the power input end of the carrier package slot, so that the driving chip is received from the data signal input terminal. In the case of the data signal, the matching operating voltage can be obtained by the semiconductor terminal to drive the light emitting diode (LED) wafer to emit light; thereby, the long-distance transmission of the central control can achieve the simple realization benefit.

The second objective of the present invention is to provide an improved package structure of a light-emitting diode package having a driving chip, wherein the power input end is connected with a bidirectional arrester diode connected in series with the power supply port of the driving chip. By using the bidirectional arrest diode to step down the voltage of the external power supply, the driving chip can work from the bidirectional inductive diode terminal to obtain a matching operating voltage, and the external power source has a reverse connection situation. The driving chip can also generate a protection function when the power is reversed through the bidirectional encoder diode; and a second bidirectional generator diode is further connected in series between the power input end and the integrated chip. The driving chip and the light emitting diode (LED) chip integrated on the integrated chip can generate forward and reverse static electricity and surge protection through the second two-way generator diode.

A further object of the present invention is to provide an improved package structure of a light-emitting diode package having a driving chip, wherein the power input end is connected with a one-way code two connected in series with the power supply port of the driving chip. a pole body; the voltage of the external power source is stepped down by the one-way encoder diode, so that the driving chip can work from the one-way encoder terminal to obtain a matching operating voltage; and the power input is A diode is connected in series between the terminal and the one-way encoder, so that when the external power source is reversely connected, the diode is used to protect the driving chip when the power is reversed; a second bidirectional generator diode is further connected in series between the power input end and the integrated chip, so that the driving chip and the light emitting diode (LED) chip integrated on the integrated chip can pass through the second The two-way encoder diode generates forward and reverse static and surge protection.

Another object of the present invention is to provide an improved light-emitting diode package structure with a driving chip, wherein the power input end is connected in series with a one-way encoder diode connected in parallel with the driving chip. The voltage stabilizing circuit is formed, and the voltage of the external power source is stepped down and stabilized by the voltage stabilizing circuit, so that the driving chip can obtain a matching working voltage from the serially connected one-way generator and the resistor. Work, and at the same time, the drive chip and the light-emitting diode (LED) wafer are protected by surge and static electricity.

A package structure of a light-emitting diode assembly with a driving chip is improved. As shown in FIG. 1 and FIG. 2, a light-emitting diode assembly 10 is provided. A package slot 110 is disposed on a carrier 11 and is transparently injected by the package slot 110. A gel (not shown) in which one or more light emitting diode (LED) wafers 12 (which may be three wafers of red R, green G, and blue B) and a driving wafer 13 (IC) are packaged in the package tank 110 The light-emitting diode (LED) wafer 12 (red R, green G, blue B optical wafer) and the driving wafer 13 are encapsulated in the packaging groove 110 by a conductive integration The chip 14 is integrated, and a side of the integrated chip 14 is provided with a power input terminal 15 extending from the package slot 110 to the outside of the carrier 11, a power output terminal 16, at least one data signal input terminal 17 and At least one data signal output terminal 18; an extreme end of each of the light emitting diode (LED) wafers 12 (red R, green G, and blue B optical wafers) is respectively connected to a control port 130 of the driving chip 13 Wire bonding is electrically connected, and at the other extreme, it is electrically connected to the power input terminal 15 (Wire bonding), and the power input terminal 15 is also connected. There is a Zener Diode, and the power supply port 131 of the driving chip 13 is connected to the working power source V _CC from the ZI terminal (Wire bonding); the power output 16 The connection piece 14 is electrically connected to the integrated piece 14 (wire bonding), and the integrated piece 14 is also electrically connected to the power receiving port 132 of the driving chip 13 (the driving chip 13 is completed on the integrated sheet 14). The ground signal is connected to the data signal input terminal 17 and the data signal output terminal 18; The 俾 light-emitting diode assembly 10 is applied to a full-color or single-color light source of a central control (not shown), and the external power supply V is connected to the power supply input terminal 15 of the carrier 110 in the carrier 11. _{When CC} is stepping down (regulating voltage) [ie, V _CC ≧V _DD , the ZI condition is V _ZI (F)=V _CC (Max)-V _DD (Max)], so that the driving chip 13 is at the slave data signal input terminal 17 When receiving the data signal, the matching operating voltage can be obtained by the ZI terminal of the Zener diode to drive the LED (photovoltaic diode) chip 12 (red R) G, and the wafer B) emission; whereby a central control (not shown) of the long-distance transmission is possible (Needless complex external wiring circuit board, circuits or elements) to achieve the benefits of easy implementation.

According to the above embodiment, as shown in FIG. 1 and FIG. 2, when the central control (not shown) controls the driving chip 13 by the two-wire signal (serial data signal SD, clock data signal CLK), the package slot 110 is A serial data signal input terminal 17 (SDI), a serial data signal output terminal 18 (SDO), a clock data signal input terminal 17A (CLKI) and a clock data signal output terminal 18A (CLKO) are provided. The two-wire controlled driving chip 13 receives the serial and clock data signals (SD, CLK) transmitted from the central control (not shown) from the serial data signal input terminal 17 and the clock data signal input terminal 17A. And serial and clock data signal output terminals 18, 18A, send serial and clock data signals (SD, CLK); again, as shown in Figure 3, 4, when the central control (not shown) is a single line signal ( When the data data signal Gate is controlled to drive the chip 13A, a data signal input terminal 17B (Data in) and a data data signal output terminal 18B (Data out) are disposed in the package slot 110, so that the single line control is performed. The driving chip 13A receives the data data signal (Data) transmitted from the data control signal input terminal 17B to the central control (not shown); regardless of the central control terminal, as shown in FIGS. 1, 2, 3, and 4, the double line is adopted. SD, CLK signal line) or single line (Data signal line) control driver chip (13 or 13A). For the purpose of this creation, it is the requirement of system selection, which does not affect the central control and facilitates the long-distance transmission. Or performance is achieved, equivalent implementation.

According to the above embodiment, in FIG. 1 and FIG. 2, the power input terminal 15 is connected (electrically connected) to a two-way array connected to the power supply port 131 of the driving chip 13 (wire bonding). The nanodiode ZI; the voltage of the external power source V _CC is stepped down by the bidirectional arrester diode ZI, so that the driving chip 13 can be matched from the ZI end (one extreme) of the bidirectional generator diode When the working voltage is operated and the external power source V _CC is reversely connected, the driving chip 13 can also generate the protection function when the power source V _{CC is} reversely connected through the action of the bidirectional generator diode ZI; Between the power input terminal 15 and the integrated sheet 14, a second bidirectional generator diode ZL (which is electrically attached to the integrated sheet 14) is connected in series (wire bonding), so that the integrated sheet is integrated. The driving chip 13 and the LED chip 12 (red R, green G, blue B optical wafer) on the 14 can pass through the second bidirectional generator diode ZL [ie, the condition of the _ZL is V _ZL (F)=V _ZL (R)>V _CC (Max), and V _ZL (R)<V _ZI (R)] protects against forward and reverse static and surge.

According to the above embodiment, as shown in FIGS. 5 and 6, the power input terminal 15 is provided with a one-way encoder diode ZI ₁ connected in series with the power supply port 131 of the driving chip 13 (wire bonding). The voltage of the external power source V _CC is _stepped down by the one-way generator diode ZI ₁ [ie, when V _CC ≧V _DD (Max), ZI ₁ is V _ZI1 (F)=V _CC (Max) -V _DD (Max)], so that the driving chip 13 can work from the unidirectional Scheduling diode ZI ₁ terminal to obtain a matching operating voltage; and the power input terminal 15 is electrically separated a power input terminal 15A, and the second power input terminal 15A electrically attaches the one-way encoder diode ZI ₁ , and the power input terminal 15 and the one-way encoder diode ZI ₁ A diode D ₁ (Diode) is also connected in series, for example, the diode D _{1 is} electrically attached to the second power input terminal 15A, and the diode D ₁ and the power input terminal 15 are connected. (Wire bonding) is electrically connected, and when the external power source V _CC is reversely connected, the protection performance when the power source V _{CC is} reversely connected to the driving chip 13 by using the diode D ₁ (Open); The power supply Between the end 15 and the integrating piece 14, a second bidirectional generator diode ZL (on the electrical surface of the whole chip 14) is connected in series (wire bonding) to enable integration on the integrated sheet 14. The driving chip 13 and the light emitting diode (LED) wafer 12 (red R, green G, blue B optical wafer) can pass through the second bidirectional generator diode ZL [ie, the ZL condition is V _ZL1 (F) =V _ZL1 (R)>V _CC (Max)] _Provides protection against forward and reverse static and surge.

According to the above embodiment, the present invention can also achieve the same performance by the following further embodiment; wherein, as shown in FIGS. 7 and 8, the power input terminal 15 is divided into a second power input terminal 15A, and the second power input terminal 15A. The power-on surface is provided with a resistor R ₁ electrically connected to the power input terminal 15 (wire bonding). The resistor R _{1 is} connected in series to a one-way generator diode ZI ₂ connected in parallel with the driving chip 13 . To form a voltage stabilizing circuit, for example, a one-way semiconductor diode ZI ₂ electrical meter is attached to the integrated sheet 14, from the second power input terminal 15A and the one-way encoder diode ZI ₂ and the driving The power supply port 131 of the chip 13 is electrically connected to form a voltage stabilizing circuit, and the voltage of the external power source V _CC is stepped down and stabilized by the voltage stabilizing circuit, so that the driving chip 13 can be driven from the string. The unidirectional shunt diode ZI ₂ and the resistor R ₁ are connected to obtain a matching operating voltage to operate, and at the same time drive the wafer 13 and the light emitting diode (LED) wafer 12 (red R, green G, blue B) Optical wafers are protected by surges and static electricity.

The above description is intended to be illustrative, and not restrictive, and many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention. , but all will fall within the scope of this creation.

10‧‧‧Lighting diode components

11‧‧‧Seat

110‧‧‧Packing slot

12‧‧‧Light Emitting Diode (LED) Wafer

13, 13A‧‧‧ drive chip

130‧‧‧Control

131‧‧‧Power access埠

132‧‧‧Power supply 埠

133‧‧‧Signal access

134‧‧‧ Signals received

14‧‧‧Integrated film

15‧‧‧Power input

15A‧‧‧second power input

16‧‧‧Power output

17, 17A, 17B‧‧‧ data signal input

18, 18A, 18B‧‧‧ data signal output

ZI, ZI ₁ , ZI ₂ ‧‧‧Jenner diode

ZL‧‧‧Second-Secondary

V _CC ‧‧‧Power supply

D ₁ ‧‧‧ diode

R ₁ ‧‧‧resistance

Figure 1 is a schematic diagram of the package structure of the present creation

2 is an equivalent circuit diagram of the package structure of FIG.

Figure 3 is a schematic diagram of the package structure when the central control of the creation is a single line signal.

4 is an equivalent circuit diagram of the package structure of FIG.

FIG. 5 is a schematic diagram of a package structure according to another embodiment of the present creation.

6 is an equivalent circuit diagram of the package structure of FIG.

FIG. 7 is a schematic diagram of a package structure according to still another embodiment of the present invention.

FIG. 8 is an equivalent circuit diagram of the package structure of FIG.

10‧‧‧Lighting diode components

11‧‧‧Seat

110‧‧‧Packing slot

12‧‧‧Light Emitting Diode (LED) Wafer

13‧‧‧Drive chip

130‧‧‧Control

131‧‧‧Power access埠

132‧‧‧Power supply 埠

133‧‧‧Signal access

134‧‧‧ Signals received

14‧‧‧Integrated film

15‧‧‧Power input

16‧‧‧Power output

17, 17A‧‧‧ data signal input

18, 18A‧‧‧ data signal output

ZI‧‧‧Jenner diode

ZL‧‧‧Second-Secondary

V _CC ‧‧‧Power supply

Claims (8)

A light-emitting diode assembly with a driving chip has an improved package structure, and is a light-emitting diode assembly. A package slot is formed on a carrier, and a light-transmissive gel is injected from the package slot to have more than one light-emitting diode. a body (LED) chip and a driver chip package are formed in the package slot; each of the light emitting diode (LED) wafer and the driver chip are packaged in the package groove, and are formed by a conductive integrated piece Integrating, the side of the integrated piece is provided with a power input end extending from the package slot to the outside of the carrier, a power output end, at least one data signal input end and at least one data signal output end; An extreme end of each of the LED chips is electrically connected to a control terminal of the driving chip, and the other terminal is electrically connected to the power input terminal, and the power input terminal is further connected. a Zener Diode is provided, and the power supply of the driving chip is connected to the working power source from the second terminal of the driver; the output end of the power is electrically connected to the integrated chip, and The integrated sheet is also electrically connected to the driving crystal The power supply of the chip is connected, and the at least one signal port of the driving chip and the at least one signal receiving port are electrically connected to the data signal input end and the data signal output end respectively; the light emitting diode assembly It is applied to the centrally controlled full-color or single-color light source, and the external power supply is stepped down (regulated) by the Jenus diode connected to the power input terminal of the carrier package slot, so that the driving chip is at the data signal input end. When the data signal is received, the matching operating voltage can be obtained by the semiconductor terminal to drive the light emitting diode (LED) wafer to emit light; thereby, the long-distance transmission of the central control can achieve the simple realization benefit. Light-emitting diode group with a driving chip according to item 1 of the patent application scope The package structure is improved, wherein the power input end is connected with a bidirectional arrester diode connected in series with the power supply port of the driving chip; and the voltage of the external power source is lowered by the bidirectional arrester diode The driving chip can be operated by a matching working voltage from the bidirectional output diode terminal, and the driving chip can also generate a power reverse connection through the bidirectional inductive diode when the external power source is reversely connected. The protection of the time. The package structure of the LED package with the driving chip according to the second aspect of the patent application is improved, wherein a second bidirectional arrester diode is connected in series between the power input end and the integrated piece. The driving chip and the light emitting diode (LED) chip integrated on the integrated chip can generate forward and reverse static electricity and surge protection through the second bidirectional generator diode. The light emitting diode assembly structure of the driving chip according to the first aspect of the patent application is improved, wherein the power input end is connected with a one-way sinus in series with the power supply port of the driving chip. The pole body; the voltage of the external power source is stepped down by the one-way encoder diode, so that the driving chip can work from the one-way generator terminal to obtain a matching working voltage. According to the fourth aspect of the patent application, the LED package structure of the driving chip is improved, wherein the power input terminal and the one-way encoder are further connected in series with a diode. When the external power source is reversely connected, the diode is used to protect the driving chip from the power supply when the power is reversed. According to the fourth aspect of the patent application, the LED package structure of the driving chip is improved, wherein the power input terminal and the integrated chip are connected in series There is a second bidirectional generator diode, so that the driving chip and the light emitting diode (LED) chip integrated on the integrated chip can generate forward and reverse static electricity and surge protection through the second bidirectional generator diode . The LED package assembly structure with the driving chip according to the fifth aspect of the patent application is improved, wherein a second bidirectional generator diode is connected in series between the power input end and the integrated chip. The driving chip and the light emitting diode (LED) chip integrated on the integrated chip can generate forward and reverse static electricity and surge protection through the second bidirectional generator diode. The light emitting diode package structure with the driving chip according to the first aspect of the patent application is improved, wherein the power input end is connected in series with a one-way generator diode connected in parallel with the driving chip through a resistor. The voltage stabilizing circuit is formed, and the voltage of the external power source is stepped down and stabilized by the voltage stabilizing circuit, so that the driving chip can obtain a matching working voltage from the serially connected one-way generator and the resistor. Work, and at the same time, the drive chip and the light-emitting diode (LED) wafer are protected by surge and static electricity.