TWM459985U - Silicon seed - Google Patents

Silicon seed Download PDF

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Publication number
TWM459985U
TWM459985U TW102205700U TW102205700U TWM459985U TW M459985 U TWM459985 U TW M459985U TW 102205700 U TW102205700 U TW 102205700U TW 102205700 U TW102205700 U TW 102205700U TW M459985 U TWM459985 U TW M459985U
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Taiwan
Prior art keywords
crystal
seed
germanium
protective layer
ingot
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TW102205700U
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Chinese (zh)
Inventor
Hung-Sheng Chou
Yu-Tsung Chiang
Yu-Min Yang
Ming-Kung Hsiao
wen-huai Yu
Sung-Lin Hsu
I-Ching Li
Chung-Wen Lan
Wen-Ching Hsu
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Sino American Silicon Prod Inc
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Priority to TW102205700U priority Critical patent/TWM459985U/en
Publication of TWM459985U publication Critical patent/TWM459985U/en

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Abstract

The invention discloses a silicon seed including a silicon crystal body and a protection layer. The protection layer is formed to overlay an external surface of the silicon crystal body. The met point of the silicon crystal body is higher than that of the silicon crystal body.

Description

矽晶種矽 seed

本創作係關於一種用於製造矽晶鑄錠(crystalline silicon ingot)之矽晶種(silicon seed),並且特別地,係關於可以減少製成矽晶鑄錠內之雜質汙染區域的矽晶種。The present invention relates to a silicon seed for producing a crystalline silicon ingot, and in particular, to a seed crystal which can reduce an impurity-contaminated area in a twinned ingot.

大多的太陽能電池是吸收太陽光,進而產生光伏效應(photovoltaic effect)。目前太陽能電池的材料大部份都是以矽材為主,主要是因矽材為目前地球上最容易取到的第二多元素,並且其具有材料成本低廉、沒有毒性、穩定性高等優點,並且其在半導體的應用上已有深厚的基礎。Most solar cells absorb sunlight and produce a photovoltaic effect. At present, most of the materials of solar cells are mainly coffins, mainly because coffins are the second most easily available elements on the earth, and they have the advantages of low material cost, no toxicity, and high stability. And it has a solid foundation in the application of semiconductors.

以矽材為主的太陽能電池有單晶矽、多晶矽以及非晶矽三大類。以多晶矽做為太陽能電池的原材,主要是基於成本的考量,因為其價格相較於以傳統的拉晶法(Czochralski method,CZ method)以及浮動區域法(floating zone method,FZ method)所製造的單晶矽,價格相對地便宜許多。The solar cells based on coffins include three types: single crystal germanium, polycrystalline germanium and amorphous germanium. The use of polycrystalline germanium as a raw material for solar cells is mainly based on cost considerations because its price is comparable to that of the conventional Czochralski method (CZ method) and the floating zone method (FZ method). The single crystal crucible is relatively cheaper.

使用在製造太陽能電池上的多晶矽,傳統上是利用一般鑄造製程來生產。利用鑄造製程來製備多晶矽,進而應用在太陽能電池上是本技術領域的現有的技術。簡言之,將高純度的矽熔融在模內(例如,石英坩堝),在控制凝固下被冷卻以形成多晶矽鑄錠。接著,該多晶矽鑄錠被切割成接近太陽能電池尺寸大小的晶圓,進而應用在製造太陽能電池 上。以這種方法製造的多晶矽鑄錠為矽結晶晶粒的聚集體,其中在由其製成的晶圓中,晶粒相互之間的晶向實際上是隨機的。The use of polycrystalline germanium in the manufacture of solar cells has traditionally been produced using conventional casting processes. The use of a casting process to prepare polycrystalline germanium, which is then applied to solar cells, is a prior art in the art. Briefly, high purity germanium is melted in a mold (e.g., quartz crucible) and cooled under controlled solidification to form a polycrystalline germanium ingot. Then, the polycrystalline germanium ingot is cut into a wafer close to the size of the solar cell, and then applied to manufacture a solar cell. on. The polycrystalline tantalum ingot produced in this way is an aggregate of ruthenium crystal grains in which crystal orientations of crystal grains with each other are actually random.

在現有的多晶矽中,因為晶粒的隨機晶向而難以對所製成的晶片表面進行粗紋化(texturing process)。表面粗紋化後可降低光反射並提高通過電池表面的光能吸收,來提高光伏電池的效率。另外,在現有的多晶矽晶粒之間的晶界中形成的"扭折/差排/缺陷",傾向形成成核差排的簇集,或形成多條線差排形式的結構缺陷。這些差排以及它們趨向吸引的雜質,造成了由現有的多晶矽製成的光伏電池中電荷載子的快速復合。這會導致電池的效率降低。由這類多晶矽製成的光伏電池通常比由單晶矽製成的等效光伏電池的效率低,即使考慮了在由現有技術製造的單晶矽中所存在之缺陷的徑向分佈。然而,因為製造現有的多晶矽相對簡單且成本更低,以及在電池加工中有效的缺陷鈍化,多晶矽成了廣泛用於製造光伏電池之矽材料的形式。In the existing polysilicon, it is difficult to perform a texturing process on the surface of the wafer to be formed because of the random crystal orientation of the crystal grains. The roughening of the surface can reduce the light reflection and increase the absorption of light energy through the surface of the battery to improve the efficiency of the photovoltaic cell. Further, "kneading/difference/defect" formed in the grain boundaries between the existing polycrystalline germanium grains tends to form clusters of nucleation-difference rows or structural defects in the form of a plurality of line-difference rows. These rows and the impurities they tend to attract cause a rapid recombination of charge carriers in photovoltaic cells made from existing polycrystalline germanium. This can result in a decrease in the efficiency of the battery. Photovoltaic cells made from such polycrystalline germanium are generally less efficient than equivalent photovoltaic cells made from single crystal germanium, even considering the radial distribution of defects present in single crystal germanium fabricated by the prior art. However, since the fabrication of existing polysilicon is relatively simple and less costly, as well as defect passivation that is effective in battery processing, polysilicon has become a widely used form of tantalum material for the fabrication of photovoltaic cells.

現有技術已揭露在坩堝的底部鋪設單晶粒晶種層並基於方向性凝固製成矽晶鑄錠。以這種方法,能夠鑄造具有高性能的單晶矽及/或雙晶(bi-crystal)或類單晶(mono-like crystal)矽塊狀體的鑄錠,後續製成晶圓的少數載子之壽命能被最大化,晶圓用於製造高效太陽能電池。在此,術語"單晶矽"是指單晶矽的主體,其在整個範圍內具有一個一致的晶體晶向。術語"雙晶矽"是指如下的矽的主體,其在大於或等於該主體體積50%的範圍內具有一個一致的晶體晶向,且在主體的剩餘體積內具有另一個一致的晶體晶向。例如,這種雙晶矽可以包含具有一個晶體晶向的單晶矽主體,其緊鄰構成結晶矽剩餘體積的另一種具有不同晶體晶向的單晶矽主體。術語"類單晶矽"是指如下的結晶矽的主體,其在超過主體體積的75%的範圍內具有一個一致的晶體晶向。此外,現 有的多晶矽是指具有厘米規模的細微性分佈的結晶矽,且在矽的主體內具有多種隨機晶向的晶體。It has been disclosed in the prior art to lay a single-grain seed layer on the bottom of the crucible and to make a twinned ingot based on directional solidification. In this way, it is possible to cast an ingot having a high-performance single crystal germanium and/or a bi-crystal or a mono-like crystal block, and a subsequent load of a wafer. Life can be maximized and wafers are used to make efficient solar cells. Here, the term "single crystal germanium" means a main body of a single crystal germanium having a uniform crystal crystal orientation over the entire range. The term "bimorph" refers to a body of ruthenium having a uniform crystal orientation in a range of greater than or equal to 50% of the volume of the body, and having another uniform crystal orientation within the remaining volume of the body. . For example, such a twin germanium may comprise a single crystal germanium body having a crystal crystal orientation, which is adjacent to another single crystal germanium body having a different crystal crystal orientation in the immediate vicinity of the remaining volume of the crystalline germanium. The term "monocrystalline single crystal" refers to a host of crystalline germanium having a uniform crystal orientation in a range exceeding 75% of the volume of the body. In addition, now Some polycrystalline yttrium refers to a crystalline yttrium having a fine distribution of a centimeter scale, and having a plurality of crystals having a random crystal orientation in the main body of the ruthenium.

現有技術也有在坩堝的底部鋪設多晶矽或單晶矽碎料(granular)構成的成核促進層協助矽晶粒成核並基於方向性凝固,最終成長成底部為小尺寸矽晶粒、整體缺陷密度低之矽晶鑄錠,矽晶鑄錠後續製成的太陽能電池之光電轉換效率也相當高。The prior art also has a nucleation promoting layer composed of polycrystalline germanium or single crystal granules at the bottom of the crucible to assist the nucleation of the ruthenium and to form a nucleation based on directional solidification, and finally grow into a small size 矽 grain at the bottom, and the overall defect density. The low-temperature twinning ingots, the photoelectric conversion efficiency of the solar cells produced by the twin-crystal ingots are also quite high.

然而,現有技術在坩堝底部鋪設單晶粒晶種層、多晶矽或單晶矽碎料構成的成核促進層製成矽晶鑄錠,在矽晶鑄錠製造過程中,坩堝內的雜質(以金屬(例如,鐵、鋁,等)雜質為主)溶入矽熔湯,擴散進入單晶粒晶種、多晶粒或單晶粒碎料,隨著矽熔湯在單晶粒晶種、多晶粒或單晶粒碎料成核、長晶,單晶粒晶種、多晶粒或單晶粒碎料內的雜質會回擴進入鑄造過程固化的矽晶體內,造成製成矽晶鑄錠內之雜質汙染區域範圍大。However, in the prior art, a nucleation promoting layer composed of a single crystal seed layer, a polycrystalline germanium or a single crystal crumb is laid at the bottom of the crucible to form a twin ingot, and in the manufacturing process of the twin ingot, the impurities in the crucible Metals (eg, iron, aluminum, etc.) are mainly dissolved in bismuth melt, diffused into single-grain seed crystals, multi-grain or single-grain granules, along with smelting soup in single-grain seed crystals, Multi-grain or single-grain nucleation, long-crystal, single-crystal seed, multi-grain or single-grain granules will re-expand into the ruthenium crystal solidified in the casting process, resulting in twinning The impurity contamination area in the ingot is large.

因此,本創作所欲解決之一技術問題在於提供一種用於製造矽晶鑄錠且減少製成矽晶鑄錠內之雜質汙染區域的矽晶種。Therefore, one of the technical problems to be solved by the present invention is to provide a seed crystal for producing a twinned ingot and reducing the impurity-contaminated area in the twin-shaped ingot.

本創作之一較佳具體實施例之矽晶種,係用於製造矽晶鑄錠。本創作之矽晶種包含矽晶體本體以及保護層。保護層係被覆在矽晶體本體之外表面上。並且,保護層的熔點高於矽晶體本體的熔點。One of the preferred embodiments of the present invention is a seed crystal for the production of twinned ingots. The seed crystal of this creation consists of a germanium crystal body and a protective layer. The protective layer is coated on the outer surface of the germanium crystal body. Also, the protective layer has a melting point higher than the melting point of the ruthenium crystal body.

於一具體實施例中,保護層可以由SiO2 、Si3 N4 、BaO、AlN、BN、Al2 O3 或其它熔點高於矽的熔點且能有效阻礙矽熔湯中雜質擴散進入矽晶體本體的材料所形成。In a specific embodiment, the protective layer may be made of SiO 2 , Si 3 N 4 , BaO, AlN, BN, Al 2 O 3 or other melting point higher than the melting point of cerium and can effectively hinder the diffusion of impurities into the cerium crystal. The material of the body is formed.

於一具體實施例中,矽晶體本體可以成立方體、 長方體、球型顆粒或不規則形狀的顆粒。In a specific embodiment, the germanium crystal body can be formed into a cube, Cuboid, spherical particles or irregularly shaped particles.

於一具體實施例中,保護層之厚度範圍為100nm-2500nm。In one embodiment, the thickness of the protective layer ranges from 100 nm to 2500 nm.

與先前技術不同,本創作之矽晶種在矽晶鑄錠製造過程中能有效阻礙矽熔湯中之雜質擴散進入矽晶種之矽晶體本體再回擴進入固化的矽晶體內,藉此,能減少製成矽晶鑄錠內之雜質汙染區域。Different from the prior art, the seed crystal of the present invention can effectively hinder the diffusion of impurities in the smelting soup into the ruthenium crystal body and then re-expand into the solidified ruthenium crystal in the process of manufacturing the twin crystal ingot, thereby It can reduce the impurity contamination area in the twin crystal ingot.

關於本創作之優點與精神可以藉由以下的實施方式及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention can be further understood by the following embodiments and the drawings.

1‧‧‧矽晶種1‧‧‧矽 seed

10‧‧‧矽晶體本體10‧‧‧矽crystal body

102‧‧‧外表面102‧‧‧ outer surface

12‧‧‧保護層12‧‧‧Protective layer

圖1係本創作之一較佳具體實施例之晶種的截面視圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of a seed crystal of one preferred embodiment of the present invention.

圖2係本創作之另一具體實施例之晶種的截面視圖。Figure 2 is a cross-sectional view of a seed crystal of another embodiment of the present invention.

圖3係本創作之另一具體實施例之晶種的截面視圖。Figure 3 is a cross-sectional view of a seed crystal of another embodiment of the present invention.

圖4係本創作之另一具體實施例之晶種的截面視圖。Figure 4 is a cross-sectional view of a seed crystal of another embodiment of the present invention.

請參閱圖1,係以截面視圖示意地繪示本創作之一較佳具體實施例之矽晶種1。本創作之矽晶種1係用於製造矽晶鑄錠。Referring to FIG. 1, a seed crystal 1 of a preferred embodiment of the present invention is schematically illustrated in a cross-sectional view. The seed crystal 1 of this creation is used to manufacture twin crystal ingots.

如圖1所示,本創作之矽晶種1包含矽晶體本體10以及保護層12。矽晶體本體10係由至少一晶粒所構成。保護層12係被覆在矽晶體本體10之外表面102上。並且,保護層12的熔點高於矽晶體本體10的熔點。As shown in FIG. 1, the seed crystal 1 of the present invention comprises a germanium crystal body 10 and a protective layer 12. The germanium crystal body 10 is composed of at least one crystal grain. The protective layer 12 is coated on the outer surface 102 of the germanium crystal body 10. Also, the protective layer 12 has a melting point higher than the melting point of the ruthenium crystal body 10.

於一具體實施例中,保護層12可以由SiO2 、Si3 N4 、BaO、AlN、BN、Al2 O3 或其它熔點高於矽的熔點且能 有效阻礙矽熔湯中雜質擴散進入矽晶體本體10的材料所形成。In a specific embodiment, the protective layer 12 may be made of SiO 2 , Si 3 N 4 , BaO, AlN, BN, Al 2 O 3 or other melting point higher than the melting point of the crucible and can effectively hinder the diffusion of impurities into the crucible soup into the crucible. The material of the crystal body 10 is formed.

於實際應用中,本創作之矽晶體本體10的外觀可以是大尺寸(釐米等級)的立方體,如圖1所示。請參閱圖2、圖3及圖4,皆係以截面視圖示意地繪示本創作之其他具體實施例的矽晶種1。如圖2所示,本創作之矽晶體本體10的外觀也可以是大尺寸(釐米等級)的長方體。如圖2所示,本創作之矽晶體本體10的外觀也可以是小尺寸(毫米等級)的球型顆粒。如圖2所示,本創作之矽晶體本體10的外觀也可以是小尺寸(毫米等級)的不規則形狀的顆粒(即所謂的碎料)。In practical applications, the appearance of the crystal body 10 of the present invention may be a large-sized (centimeter-scale) cube, as shown in FIG. Please refer to FIG. 2, FIG. 3 and FIG. 4, which are schematic cross-sectional views showing the seed crystal 1 of other specific embodiments of the present invention. As shown in FIG. 2, the appearance of the crystal body 10 of the present invention may also be a rectangular parallelepiped having a large size (cm scale). As shown in Fig. 2, the appearance of the crystal body 10 of the present invention may also be a spherical particle of a small size (millimeter grade). As shown in Fig. 2, the appearance of the crystal body 10 of the present invention may also be a small-sized (millimeter-scale) irregularly shaped particle (so-called scrap).

於一具體實施例中,保護層12之厚度範圍為100nm-2500nm,其中保護層10之厚度範圍為100nm-500nm為佳。於實際應用中,在矽晶鑄錠製造過程中,本創作之矽晶種1與矽熔湯接觸的時間約為1~5小時,厚度範圍為100nm-500nm的保護層12與矽熔湯接觸1~5小時並未完全溶解,足以保護矽晶種本體10,能有效阻礙矽熔湯中之雜質擴散進入矽晶種1之矽晶體本體10再回擴進入固化的矽晶體內,藉此,能減少製成矽晶鑄錠內之雜質汙染區域。In a specific embodiment, the thickness of the protective layer 12 ranges from 100 nm to 2500 nm, and the thickness of the protective layer 10 ranges from 100 nm to 500 nm. In practical application, in the process of manufacturing the twin crystal ingot, the time of contact between the seed crystal 1 and the smelting soup of the present invention is about 1 to 5 hours, and the protective layer 12 having a thickness ranging from 100 nm to 500 nm is in contact with the smelting soup. 1~5 hours is not completely dissolved, which is enough to protect the seed body 10, which can effectively prevent the impurities in the smelting soup from diffusing into the 矽 crystal seed body 10 and then re-expanding into the solidified yttrium crystal, thereby It can reduce the impurity contamination area in the twin crystal ingot.

此外,先前技術運用矽晶種來製造矽晶鑄錠,為避免矽熔湯尚未開始固化時矽晶種即完全融化,一般皆會加厚矽晶種層。但加厚矽晶種層或增加製造成本。如上文所述,本創作之矽晶種1與矽熔湯接觸並保護層12不會完全融化,可以讓由本創作之矽晶種1所構成的矽晶種層厚度縮減。In addition, the prior art uses a seed crystal to produce a twine ingot, and in order to prevent the seed crystal from completely melting when the tantalum melt has not begun to solidify, the seed layer is generally thickened. However, thickening the seed layer or increasing the manufacturing cost. As described above, the seed crystal 1 of the present invention is in contact with the enamel soup and the protective layer 12 is not completely melted, so that the thickness of the enamel seed layer composed of the enamel seed crystal 1 of the present invention can be reduced.

上述各種雜質擴散阻障層12在矽晶鑄錠製造過程中,具有避免晶體10提早熔化的功效,可以縮短矽晶鑄錠製造時間、減薄晶種層的厚度。The above-mentioned various impurity diffusion barrier layers 12 have the effect of avoiding premature melting of the crystal 10 during the manufacturing process of the twinned ingot, and can shorten the manufacturing time of the twinned ingot and reduce the thickness of the seed layer.

藉由以上較佳具體實施例之詳述,係希望能更加清楚描述本創作之特徵與精神,而並非以上述所揭露的較佳 具體實施例來對本創作之面向加以限制。相反地,其目的是希望能涵蓋各種改變及具相等性的安排於本創作所欲申請之專利範圍的面向內。因此,本創作所申請之專利範圍的面向應該根據上述的說明作最寬廣的解釋,以致使其涵蓋所有可能的改變以及具相等性的安排。With the above detailed description of the preferred embodiments, it is intended to more clearly describe the features and spirit of the present invention, and is not preferred as disclosed above. Specific embodiments are intended to limit the scope of this creation. On the contrary, the purpose is to cover all kinds of changes and equivalence arrangements within the scope of the patent application to which the present invention is intended. Therefore, the scope of the patent application filed by this creator should be interpreted broadly based on the above description so that it covers all possible changes and equivalent arrangements.

1‧‧‧矽晶種1‧‧‧矽 seed

10‧‧‧矽晶體本體10‧‧‧矽crystal body

102‧‧‧外表面102‧‧‧ outer surface

12‧‧‧保護層12‧‧‧Protective layer

Claims (4)

一種矽晶種,包含:一矽晶體本體;以及一保護層,係被覆在該矽晶體本體之一外表面上。A seed crystal comprising: a germanium crystal body; and a protective layer coated on an outer surface of the germanium crystal body. 如請求項1所述之矽晶種,其中該矽晶體本體係成一立方體、一長方體、一球型顆粒或一不規則形狀的顆粒。The seed crystal of claim 1, wherein the system of the germanium crystal forms a cube, a cuboid, a spherical particle or an irregularly shaped particle. 如請求項2所述之矽晶種,其中該保護層之厚度範圍為100nm-2500nm。The seed crystal of claim 2, wherein the protective layer has a thickness ranging from 100 nm to 2500 nm. 如請求項3所述之矽晶種,其中該保護層之厚度範圍為100nm-500nm。The seed crystal of claim 3, wherein the protective layer has a thickness ranging from 100 nm to 500 nm.
TW102205700U 2013-03-28 2013-03-28 Silicon seed TWM459985U (en)

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