TWM459663U - Printed circuit board pressing pad with identification structure - Google Patents

Description

Printed circuit board press pad with identification structure

The present invention relates to a construction of a press pad, and more particularly to a printed circuit board press pad having an identification configuration.

Existing printed circuit boards, including single-layer boards, double-layer boards or multi-layer boards, need to be pressed onto the glass fiber resin film during the manufacturing process, and formed into an electronic circuit after being cured by high temperature and high pressure. Printed circuit board for electronic parts.

In the above process of pressing the conductive line with the glass fiber resin film, the device combines the conductive line with the glass fiber resin film by applying a high temperature and heavy pressure, but the metal surface for avoiding the heating of the device is in direct contact with the printed circuit board. In order to cause uneven pressure or uneven temperature distribution during application of the printed circuit board during pressing, the press pad having vertical compressibility is usually used to contact the printed circuit board through the pressed steel plate to buffer and uniform the metal surface of the device. The applied pressure and temperature distribute the pressure and temperature evenly across the printed circuit board.

Although the above-mentioned conventional pressure pad can achieve the effect of buffer pressure and uniform temperature, since the use environment of the pressure pad is not only high temperature and high pressure, it is also in contact with the curing chemical during use and the manufacturing process is unavoidable. Free hard dust, so after using the pressure pad for a certain number of times, it will be aging, damaged, or used more often. Increase the chance that the hard dust will fall between the metal surface pressed by the equipment and the pressure pad, so that the cushioning function of the pressure pad is lost.

If the printed circuit board is defective in aging and damage, the printed circuit board will be defective in the manufacturing process without the replacement of the new pressure pad before the pressing process. However, due to the individual pressure The appearance of the mat is the same and cannot be recognized. Except that it is difficult for the naked eye to identify which mat is aging and damaged, since it is impossible to manage the number of times of using the individual press pads, it is impossible to judge the press pad by the number of uses. The degree of aging and damage cannot be replaced before the pressure pad is aged or damaged to avoid damage when the printed circuit board is pressed.

In order to solve the deficiencies and limitations of the existing press pad, the main purpose of the present invention is to provide a printed circuit board press pad having an identification structure, and an identification tag for allowing the user to recognize on the surface of the press pad to make individual presses The number of times the pad is used can be managed cumulatively.

In order to achieve the above object, the printed circuit board press pad having the identification structure comprises: a press pad, a buffer layer having upper and lower surfaces, and a surface layer respectively coupled to the upper and lower surfaces of the buffer layer; And an identification tag, which is a tag provided with a mark that can be recognized by the user, the identification tag is coupled to the press pad, and the position of the identification tag is not limited to the buffer layer or the surface layer of the press pad.

Further, the area of each surface layer of the present invention is the same as the area of the upper and lower surfaces of the buffer layer, and an identification label gap is formed on the upper surface layer, and the identification label is combined with the upper surface of the buffer layer to expose the knowledge. The position of the notch is not specified, and the shape of the identification tag conforms to the shape of the notch of the identification tag and is embedded in the notch of the identification tag.

Furthermore, the buffer layer of the present invention and the surface layers are rectangular in shape, and the identification label notch is a long rectangular shape and is formed at one corner of the four corners of the upper surface layer.

Further, the area of each surface layer of the present invention is the same as the area of the upper and lower surfaces of the buffer layer, and the identification tag is bonded to the surface of the upper surface layer.

Furthermore, the buffer layer of the present invention and the surface layers are rectangular in shape, and the identification tag has a long rectangular shape and is bonded to one of the four corners of the upper surface layer.

Preferably, the user-recognizable mark of the present invention is a code mark and a digital mark.

The identification labels on the individual pressure pad of the present invention are different, so that the user can see the different pressure pad by the identification tag or by the instrument.

When the present invention is used in the process of pressing a printed circuit board, the pressing pad is placed between the metal surface pressed by the device and the printed circuit board to provide pressure buffering and temperature uniformity during pressing to enhance printing. The production yield of the circuit board, since the individual pressure-bonding pads can be distinguished by the identification label, the number of times the individual pressure-bonding pads can be used for accumulating the plurality of pressure-bonding pads can be used to judge the aging and damage of the pressure-bonding pad. Degree.

When the number of times of using the same pressure pad is accumulated to the set number of times of use, the pressure pad can be eliminated, thereby ensuring that the pressing of the printed circuit board is always clean and flat without contamination, and because of the pressure pad The number of times of use, that is, the time required for the press pad to be used in the process, is limited, thereby reducing the chance that the hard dust in the process falls between the metal surface of the device and the pressure pad, and the pressure pad can be prevented from being subjected to hard dust. Squeeze deformation results in a loss of cushioning function, ensuring that the press-fit of the printed circuit board does not cause defects.

10‧‧‧Press pad

11‧‧‧buffer layer

12‧‧‧ surface layer

121‧‧‧ Identification label gap

20‧‧‧ identification label

10A‧‧‧pressure pad

11A‧‧‧buffer layer

12A‧‧‧ surface layer

20A‧‧‧ Identification Label

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a first preferred embodiment of the present invention.

Figure 2 is an exploded view of the components of the first preferred embodiment of the present invention.

Figure 3 is a combined cross-sectional view of the first preferred embodiment of the present invention.

Figure 4 is a perspective view of a second preferred embodiment of the present invention.

Figure 5 is an exploded view of the components of the second preferred embodiment of the present invention.

Figure 6 is a combined cross-sectional view of a second preferred embodiment of the present invention.

The present invention provides a printed circuit board press pad having an identification structure, such as the first preferred embodiment shown in FIGS. 1 to 3, comprising: a press pad 10 provided with a rectangular plate-shaped buffer layer 11 The buffer layer 11 is an elastic body and has upper and lower surfaces. A rectangular sheet-like surface layer 12 is bonded to the upper and lower surfaces of the buffer layer 11, and each surface layer 12 may be a sheet of Teflon or non-woven fabric, and each The area of the surface layer 12 is the same as the area of the upper and lower surfaces of the buffer layer 11, and a long rectangular identification mark notch 121 is formed at one of the four corners of the upper surface layer 12.

An identification tag 20, which is provided with a bar code, a number, a text or other label for the user to identify the label. For example, in the preferred embodiment, the label is provided with a bar code mark and a digital mark on the surface, and the identification tag 20 is combined with The upper surface of the buffer layer 11 exposes a position of the identification label notch 121, and the identification The shape of the label 20 conforms to the shape of the identification label notch 121 and is embedded in the identification label recess 121.

In addition to the foregoing first preferred embodiment, the identification tag 20 is combined with one of the corners of the upper surface of the buffer layer 11, and the position of the identification tag notch 121 can be changed to other positions of the surface layer 12. The identification tag 20 is attached to another position on the upper surface of the buffer layer 11 to expose the identification tag notch 121. Further, the shape of the identification tag notch 121 and the identification tag 20 may be other shapes in addition to the long rectangle, and the buffer layer 11 may be provided. The shape of the surface layer 12 is also not limited to a rectangle.

The identification tag 20 on the individual individual pressure pad 10 of the present invention is provided with different bar code marks and digital marks, wherein the bar code mark provides bar code scanner interpretation, and the digital mark matches the content contained in the bar code mark to provide user interpretation.

When the present invention is used, it is used in the pressing process of the printed circuit board, and the pressing pad 10 is placed between the metal surface pressed by the device and the printed circuit board to provide pressure buffering and temperature uniformity during pressing. To improve the manufacturing yield of the printed circuit board, since the identification tag 20 on the individual pressure pad 10 is provided with different bar code marks and digital marks, different press pads 10 can be distinguished by this, and the same press pad 10 is The number of times of use is accumulated to determine the degree of aging and damage of the pressure pad 10, and when the number of times of use of the same pressure pad 10 is accumulated to a set number of unusable times, for example, 300 times or 400 times, the old The press pad 10 is eliminated and replaced with a new press pad 10, so that the press-fit of the printed circuit board is always clean and flat without contamination, and the new press pad 10 can be replaced while the process is hardened. The dust falls on the machine between the metal surface and the pressure pad Yes, to avoid the loss of function of the pressure pad cushion.

In addition to the first preferred embodiment described above, the identification tag 20 is bonded to the upper surface of the buffer layer 11 and embedded in the identification tag notch 121 of the upper surface layer 12, and the identification tag 20 may be bonded to the upper surface layer. The surface of the 12 is fixed, and the identification label 20 can also provide the user with the effect of recognizing the different press pads 10. As shown in FIG. 4 to FIG. 6, the second preferred embodiment of the present invention comprises: a press pad 10A, There is a rectangular plate-shaped buffer layer 11A which is an elastic body and has upper and lower surfaces. A rectangular sheet-like surface layer 12A is bonded to the upper and lower surfaces of the buffer layer 11A, and each surface layer 12A can be A sheet of Teflon or non-woven fabric, and the area of each surface layer 12A is the same as the area of the upper and lower surfaces of the buffer layer 11A.

An identification tag 20A is a tag having a bar code, a number, a text or other mark for the user to be recognized on the surface. For example, in the preferred embodiment, a long rectangular tag having a bar code mark and a digital mark on the surface, the identification tag 20A It is bonded to the surface of the upper surface layer 12A and located at one of the corners of the four corners of the surface layer 12A.

In addition to the foregoing second preferred embodiment, the present invention integrates the identification tag 20A with one of the corners of the upper surface layer 12A, and can also combine the position of the identification tag 20A with other positions of the upper surface layer 12A to identify The shape of the label 20A is not limited to a long rectangle, and the shapes of the buffer layer 11A and the surface layer 12A are not limited to a rectangle. Since the manner of use and the effect of the second preferred embodiment of the present invention are the same as those of the first preferred embodiment, the present invention is not described herein.

10‧‧‧Press pad

11‧‧‧buffer layer

12‧‧‧ surface layer

121‧‧‧ Identification label gap

20‧‧‧ identification label

Claims (6)

A printed circuit board press pad having an identification structure, comprising: a press pad, a buffer layer having upper and lower surfaces, a surface layer respectively coupled to the upper and lower surfaces of the buffer layer; and an identification tag, In order to provide a label for the user to identify the label, the identification label is bonded to the pressure pad. The printed circuit board press pad of the identification structure of claim 1, wherein an area of each of the surface layers is the same as an area of the upper and lower surfaces of the buffer layer, and an identification label gap is formed on the upper surface layer. The identification tag is coupled to a position on the upper surface of the buffer layer to expose the identification label notch. The shape of the identification label conforms to the shape of the identification label notch and is embedded in the identification label recess. A printed circuit board press pad having an identification configuration as claimed in claim 2, wherein the identification label notch is a long rectangular shape and is formed at one of four corners of the upper side surface layer. A printed circuit board pad having an identification structure according to claim 1, wherein an area of each of the surface layers is the same as an area of the upper and lower surfaces of the buffer layer, and the identification tag is bonded to the upper surface. The surface of the layer. A printed circuit board press pad having an identification configuration according to claim 4, wherein the buffer layer and the surface layers are rectangular shapes, and the identification tag has a long rectangular shape and is bonded to the upper surface layer. One of the corners of the four corners. A printed circuit board pad having an identification configuration according to any one of claims 1 to 5, wherein the user-recognizable mark is a code mark and a numeral mark.