TWM457376U - Welding structure of component - Google Patents

Description

Welding structure of components

The present invention relates to a welded structure, and more particularly to a welded structure of components that are easy to rework.

Conventionally, the fixed heat sink has a fastening method such as a solder pin, a wire clip, and a screw on the motherboard. Since the use of a solder pin for fixing is the smallest in the clearance out area, it is currently widely used.

Please refer to "1st drawing", which is a three-dimensional cross-sectional structural view of a welded structure of a conventional heat sink and a motherboard. The motherboard 102 has an opposite first surface 104 (ie, a bottom surface of the motherboard) and a second surface 106 (ie, a top surface of the motherboard), a wafer 108 and two holes 110, and the wafer 108 is disposed on the second surface 106. . The heat sink 112 has a bottom plate 114, a plurality of fins 116 and two pins 118, and the bottom plate 114 has an opposite third surface 120 (ie, a bottom surface of the bottom plate) and a fourth surface 122 (ie, a top surface of the bottom plate). The foot 118 is disposed on the third surface 120 , and the plurality of fins 116 are disposed on the fourth surface 122 .

The two pins 118 are respectively inserted into the two holes 110, and the two pins 118 are exposed to the first surface 104. The solder paste dots are respectively attached to the second pins 118 and disposed on the first surface 104, and after the soldering process, two solder dots 124 are formed to fix the heat sink 112 and the motherboard 102. The heat sink 112 and the motherboard 102 are respectively disposed on opposite sides of the wafer 108, and the second surface 106 and the third surface 120 is in contact with wafer 108, respectively.

When the operator needs to perform temperature testing on the wafer, the thermocouple must be separated from the motherboard due to the need to bond the thermocouple to the wafer. However, the solder joints of the soldering structure of the conventional heat sink and the motherboard are disposed on the bottom surface of the motherboard (ie, the first surface 104), so that when the wafer is subjected to temperature testing, the operator needs to flip the motherboard to make the bottom of the motherboard. The surface (i.e., the first surface 104) faces the operator to facilitate de-soldering the pins from the bottom surface of the motherboard.

When the number of pins of the heat sink is increased, the operator wastes too much time due to the number of times the motherboard is turned over. Furthermore, when all the thermocouples are installed and the motherboard is mounted to the electronic device, if one of the thermocouples is found to be damaged or has poor contact, the motherboard must be removed from the electronic device in order to replace the damaged thermocouple. Remove it and pay attention to other normal thermocouples to avoid damage to other thermocouples, which in turn requires more testing time. Therefore, when the soldering structure of the conventional heat sink and the motherboard is subjected to temperature testing on the wafer, there is a problem that excessive soldering time is required to rework the heat sink.

In view of the above problems, a soldering structure of a component is provided to solve the problem that the soldering structure of the heat sink and the motherboard in the prior art is subjected to temperature testing of the wafer, and excessive desolding time is required to rework the heat sink.

The welded structure of the components of an embodiment of the present invention includes a substrate, a component, a pin, and a first solder joint. The substrate has a first surface and a second surface opposite to each other, and further has a coupling hole penetrating the first surface and the second surface. The component has a third surface and a fourth surface opposite to each other, and further has a through hole penetrating the third surface and the fourth surface. The component is disposed on the substrate with the third surface facing the second surface of the substrate, and the components are spaced apart from the substrate by a distance. Pin The first end and the second end are oppositely disposed, and the first end is inserted into the bonding hole and exposed on the first surface of the substrate, and the first end is fixed to the first surface. The second end is inserted into the through hole and exposed on the fourth surface of the component. The first solder joint is disposed on the fourth surface, and the first solder joint is attached to the second end to bond the second end to the fourth surface.

According to an embodiment of the present invention, the component further includes a soldering interface formed on the fourth surface, and corresponding to the through hole, the first solder joint is disposed on the soldering interface and is fixed to the soldering interface. The second end is bonded to the fourth surface.

In accordance with an embodiment of the present invention, the pin may further have a stop body that contacts the second surface of the substrate to limit the extent to which the first end of the pin exposes the first surface of the substrate.

According to the soldering structure of the component disclosed in the present invention, when the soldering structure of the heat sink and the motherboard is subjected to temperature testing on the wafer, the first solder joint located on the outer surface of the heat sink can be desoldered to dissipate heat. The device is separated from the motherboard to facilitate bonding of the thermocouple to the surface of the wafer to reduce the time required to flip the motherboard in prior art test procedures.

When it is found that the thermocouple or the wafer adhered to the wafer is damaged, the heat sink and the motherboard can be separated from each other directly by desoldering the first solder joint, so that the thermocouple or the wafer can be quickly replaced without disassembling. A motherboard that is configured in an electronic device.

Furthermore, the welded structure of the components disclosed in the present invention can be easily fixed to the heat sink and the motherboard without any additional welding fixtures.

The description of the present invention and the following description of the embodiments are intended to illustrate and explain the spirit and principles of the present invention, and to provide a further explanation of the scope of the present patent application.

102, 202, 402, 502‧‧‧ motherboard

104, 212, 412, 512‧‧‧ first surface

106, 214, 414, 514‧‧‧ second surface

108, 216, 416, 516‧‧‧ wafers

110‧‧‧ hole

112, 204, 404, 504‧‧‧ radiator

114, 220, 420, 520‧‧‧ bottom plate

116, 222, 422, 522‧‧‧ fins

118, 206, 406, 506‧‧‧ feet

120, 224, 424, 524‧‧‧ third surface

122, 226, 426, 526‧‧‧ fourth surface

124‧‧‧ solder point

208, 408, 508‧‧‧ first solder joints

210, 410, 510‧‧‧second solder joints

218, 418, 518‧‧‧ bonding holes

228, 428, 528‧‧‧ perforation

230, 430, 530‧‧‧ first end

232, 432, 532‧‧‧ second end

434, 534‧‧‧ stop body

505‧‧‧ soldering interface

1 is a perspective sectional structural view of a welded structure of a conventional heat sink and a motherboard; FIG. 2 is a perspective sectional structural view of a welded structure of a component of the first embodiment of the present invention; A flow chart of the steps of the first embodiment; FIG. 4 is a perspective sectional structural view of the welded structure of the components of the second embodiment of the present invention; FIG. 5 is a third embodiment of the present invention and the zero of the fourth embodiment. 3 is a cross-sectional structural view of a welded structure of the assembly; FIG. 6 is a flow chart of the steps of the third embodiment of the present invention; and FIG. 7 is a flow chart of the steps of the fourth embodiment of the present invention.

Please refer to "Fig. 2" and "Fig. 3", which are respectively a perspective sectional structural view of the welded structure of the component of the first embodiment of the present invention and a flow chart of the steps of the first embodiment of the present invention. The first embodiment of the present invention includes: first, providing a substrate (step-302). In this embodiment, the substrate may be the motherboard 202. The motherboard 202 has a first surface 212 and a second surface 214 opposite to each other, and a coupling hole 218 is provided through the first surface 212 and the second surface 214. The wafer 216 is disposed on the motherboard 202 and the wafer 216 is in contact with the second surface 214 (step-303).

Next, the first end 230 of the pin 206 is inserted into the coupling hole 218 of the motherboard 202, and the first end 230 is exposed on the first surface 212 of the motherboard 202 (step-304). A second solder is disposed on the first surface 212 of the motherboard 202 and the first end 230 of the pin 206 is attached (step-306). A second soldering agent is applied to the second solder to form a second solder joint 210 to bond the first end 230 of the pin 206 to the first surface 212 of the motherboard 202 (step-308).

Next, a component is provided (step-310). In this embodiment, the component can be Heat sink 204. The heat sink 204 includes a bottom plate 220 and a plurality of fins 222 having a third surface 224 opposite to each other (ie, a bottom surface of the heat sink 204) and a fourth surface 226 (ie, a top surface of the heat sink 204), and through the first Two perforations 228 of the three surfaces 224 and the fourth surface 226. And the heat sink 204 is disposed on the second surface 214 of the motherboard 202 (step-312), and the heat sink 204 is disposed on the motherboard 202 at a spacing relationship of the third surface 224 toward the second surface 214, and the bottom plate 220 is The motherboards 202 are spaced apart by a distance therebetween. The heat sink 204 passes through the second ends 232 of the pins 206 with the through holes 228. The wafer 216 is in contact with the third surface 224.

Next, the first solder is disposed on the fourth surface 226 and the second end 232 of the pin 206 is attached (step-314). Finally, a soldering process is applied to the first solder to cause the first solder to form a first solder joint 208 to bond the second end 232 of the pin 206 to the fourth surface 226 of the heat sink 204 (step-316). The first soldering agent is disposed on the fourth surface 226 by means of dispensing and attached to the second end 232. The heat sink 204 can be an anode treated heat sink, and the material of the first solder joint 208 can be aluminum paste. The material of the second solder joint 210 may be a solder paste.

Referring to FIG. 2, in the present embodiment, in order to securely connect the heat sink 204 to the motherboard 202, the number of the above-mentioned pins 206 is two, but this embodiment is not intended to limit the present. New type. In more detail, the number of pins may vary depending on the size of the heat sink and the actual situation, and the number of pins is the same as the number of holes and the number of bonding holes. The following embodiments all take the two pins as an example.

Please refer to FIG. 4, which is a perspective sectional structural view of the welded structure of the component of the second embodiment of the present invention. In this embodiment, the soldering structure of the component includes a substrate, a component, two pins 406, two first solder joints 408, and two second solder joints 410. The substrate can be, but is not limited to, a motherboard 402, which can be, but is not limited to, a heat sink 404. Motherboard 402 has opposite each other The first surface 412 and the second surface 414, the wafer 416, and the two bonding holes 418 penetrating the first surface 412 and the second surface 414. The heat sink 404 includes a bottom plate 420 and a plurality of fins 422 having a third surface 424 and a fourth surface 426 opposite each other and two through holes 428 extending through the third surface 424 and the fourth surface 426. The bottom plate 420 is disposed on the motherboard 402 with the third surface 424 facing the second surface 414 of the motherboard 402, and the bottom plate 420 is spaced apart from the motherboard 402 by a distance. The wafer 416 is disposed between the bottom plate 420 and the motherboard 402, and the wafer 416 is in contact with the second surface 414 and the third surface 424, respectively.

The two legs 406 respectively have opposite first and second ends 430 and 432 and a stop 434. The first ends 430 are respectively inserted into the two coupling holes 418 and exposed on the first surface 412 of the motherboard 402. The first end 430 is fixed to the first surface 412. The second stop body 434 is in contact with the second surface 414 of the motherboard 402 to limit the length of the first end 430 of each of the pins 406 from exposing the first surface 412 of the motherboard 402 such that the first end 430 is exposed to the first surface The surface 412 is outside without exposing the length to the outside.

The wafer 416 is disposed between the two pins 406. The second ends 432 are respectively inserted into the two through holes 428 and exposed on the fourth surface 426 of the bottom plate 420. The two first solder joints 408 are respectively disposed on the fourth surface 426 , and the two first solder joints 408 are respectively attached to the second second ends 432 , so that the second second ends 432 are coupled to the fourth surface 426 . The heat sink 404 described above may be an anodized aluminum extruded heat sink, and the first solder joint 408 may be a solder joint formed by the aluminum paste after the soldering process.

Please refer to "figure 5" and "figure 6", which are respectively a perspective sectional structural view of the welded structure of the components of the third embodiment of the present invention and a flow chart of the steps of the third embodiment of the present invention. The third embodiment of the present invention includes: first, providing a substrate (step-602). In this embodiment, the substrate may be the motherboard 502. The motherboard 502 has a first surface 512 and a second surface opposite to each other 514, and a bonding hole 518 is disposed through the first surface 512 and the second surface 514. Wafer 516 is disposed on motherboard 502 and wafer 516 is in contact with second surface 514 (step-603). Next, the first end 530 of the pin 506 is inserted into the coupling hole 518 of the motherboard 502, and the first end 530 is exposed on the first surface 512 of the motherboard 502. The two pins 506 respectively have a stop body 534 ( Step-604). The first end 530 is secured to the first surface 512 (step-606).

Again, a component is provided (step -608). In this embodiment, the component can be a heat sink 504. The heat sink 504 includes a bottom plate 520 and a plurality of fins 522 having a third surface 524 (ie, a bottom surface of the heat sink 504) and a fourth surface 526 (ie, a top surface of the heat sink 504) opposite to each other, and through the first Three surfaces 524 and two perforations 528 of the fourth surface 526. Next, the second soldering interface 505 is plated on the fourth surface 526 of the heat spreader 504 and corresponds to the two vias 528 (step-610), respectively, wherein the solder interface 505 can be a metal sheet.

And the heat sink 504 is disposed on the second surface 514 of the motherboard 502 (step-612), and the heat sink 504 is disposed on the motherboard 502 at a spacing relationship of the third surface 524 toward the second surface 514, and the bottom plate 520 is The main board 502 is spaced apart from each other by a distance. The heat sink 504 is passed through the second end 532 of the pin 506 through the through hole 528, and each soldering interface 505 is sleeved on the second end 532 of the pin 506, and the wafer 516 and the third end. Surface 524 is in contact. Next, the first solder is disposed on the fourth surface 526 and the second end 532 of the pin 506 is attached (step-614). A soldering process is applied to the first solder to cause the first solder to form a first solder joint 508 to bond the second end 532 of the pin 506 to the fourth surface 526 of the heat sink 504 (step-616).

Finally, a second solder is disposed on the first surface 512 of the motherboard 502 and the first end 530 of the pin 506 is attached (step-618). And applying a soldering process to the second solder to form the second solder joint 510 to bond the first end 530 of the pin 506 to the motherboard 502 The first surface 512 (step -620). The second soldering interface 505 can be, but not limited to, nickel metal. Any suitable metal material can be used as the material of the second soldering interface 505. The first soldering agent can be a solder paste.

The two soldering interfaces 505 described above may be formed on the fourth surface 526 of the heat sink 504 by electroplating and correspond to the two through holes 528. However, this embodiment is not intended to limit the present invention. For example, the two soldering interfaces 505 can be placed directly on the fourth surface 526 by configuration and correspond to the two vias 528, respectively, which are described in detail below.

Please refer to "figure 5" and "figure 7", which are respectively a perspective sectional structural view of the welding structure of the component of the fourth embodiment of the present invention and a flow chart of the steps of the fourth embodiment of the present invention. The fourth embodiment of the present invention includes: first, providing a substrate (step-702). In this embodiment, the substrate may be the motherboard 502. The motherboard 502 has a first surface 512 and a second surface 514 opposite to each other, and a coupling hole 518 is disposed through the first surface 512 and the second surface 514. Wafer 516 is disposed on motherboard 502 and wafer 516 is in contact with second surface 514 (step-703).

Next, the first end 530 of the pin 506 is inserted into the bonding hole 518 of the motherboard 502, and the first end 530 is exposed on the first surface 512 of the motherboard 502 (step-704), and the first end 530 is fixed. First surface 512 (step-706).

Again, components are provided (step -708). In this embodiment, the component can be a heat sink 504. The heat sink 504 includes a bottom plate 520 and a plurality of fins 522 having a third surface 524 (ie, a bottom surface of the heat sink 504) and a fourth surface 526 (ie, a top surface of the heat sink 504) opposite to each other, and through the first Three surfaces 524 and two perforations 528 of the fourth surface 526. Next, a second solder interface 505 is disposed on the fourth surface 526 of the heat spreader 504 and corresponds to the second via 528 (step-710), wherein the solder interface 505 can be a metal sheet.

The heat sink 504 is disposed on the second surface 514 of the motherboard 502 (step-712), and the heat sink 504 is disposed on the motherboard 502 at a spacing relationship of the third surface 524 toward the second surface 514, and the bottom plate 520 is The main board 502 is spaced apart from each other by a distance. The heat sink 504 is passed through the second end 532 of the pin 506 through the through hole 528, and the soldering interface 505 is sleeved on the second end 532 of the pin 506. The wafer 516 and the third surface 524. contact. Next, the first solder is disposed on the fourth surface 526 and the second end 532 of the pin 506 is attached (step-714). Finally, a soldering process is applied to the first solder to cause the first solder to form a first solder joint 508 to bond the second end 532 of the pin 506 to the fourth surface 526 of the heat spreader 504 (step-716). The second soldering interface 505 of the fourth embodiment of the present invention may be, but not limited to, a copper foil. Any suitable metal material may be used as the material of the second soldering interface 505. The first soldering agent may be Solder paste.

The soldering structure of the component disclosed in the present invention, when the soldering structure of the heat sink and the motherboard is subjected to temperature testing on the wafer, the first solder joint can be directly soldered, and the heat sink and the motherboard are separated from each other to make the thermoelectric It is easy and quick to adhere to the surface of the wafer, reducing the time required to flip the motherboard.

When it is found that the thermocouple or the wafer adhered to the wafer is damaged, the heat sink can be directly separated from the main board by desoldering the first solder joint to replace the thermocouple or the wafer without disassembling the configuration. A motherboard in an electronic device.

Furthermore, the welded structure of the components disclosed in the present invention can be easily fixed to the heat sink and the motherboard without additional welding fixtures.

Therefore, the soldering structure of the component disclosed in the present invention can solve the problem that the soldering structure of the heat sink and the motherboard in the prior art is subjected to temperature testing on the wafer, and there is a problem of wasting operator time due to complicated operation steps.

Although the present invention has been described above with reference to the preferred embodiments thereof, it is not intended to limit the present invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of the new patent protection shall be subject to the definition of the scope of the patent application attached to this specification.

202‧‧‧Substrate

204‧‧‧Components

206‧‧‧ pins

208‧‧‧First solder joint

210‧‧‧second solder joint

212‧‧‧ first surface

214‧‧‧ second surface

216‧‧‧ wafer

218‧‧‧Contact hole

220‧‧‧floor

222‧‧‧Fins

224‧‧‧ third surface

226‧‧‧ fourth surface

228‧‧‧Perforation

230‧‧‧ first end

232‧‧‧ second end

Claims (6)

A soldering structure of a component, comprising: a substrate having a first surface and a second surface opposite to each other, the substrate further having a coupling hole penetrating the first surface and the second surface; a component The component has a third surface and a fourth surface opposite to each other, the component further having a through hole extending through the third surface and the fourth surface, the component facing the substrate with the third surface The second surface is disposed on the substrate, and the component is spaced apart from the substrate by a distance; the at least one pin has an opposite first end and a second end, and the first end is Inserted in the bonding hole and exposed on the first surface of the substrate, the first end is fixed to the first surface, the second end is inserted into the through hole, and is disposed on the component The fourth surface is exposed; and the at least one first solder joint is disposed on the fourth surface, and the first solder joint is attached to the second end to enable the second end to be coupled to the second surface The fourth surface. The welding structure of the component of claim 1, further comprising a soldering interface formed on the fourth surface, and corresponding to the through hole, the first soldering point is disposed on the soldering interface, And fixing to the soldering interface, the second end is coupled to the fourth surface. The soldering structure of the component of claim 2, wherein the soldering interface is a metal layer, and the material of the first solder joint is a solder paste. The welded structure of the component of claim 3, wherein the material of the metal layer is nickel metal. The soldering structure of the component of claim 2, wherein the soldering interface is a copper foil, the copper foil is sleeved on the second end, and the material of the first solder joint is a solder paste. The soldering structure of the component of claim 1, wherein the pin has a stop body that is in contact with the second surface of the substrate to limit the first end of the pin from being exposed The length of the first surface of the substrate.