TWM457218U - Baffle and server using the same - Google Patents

Abstract

A baffle used in a server is provided. The server includes a housing, and a motherboard and a plurality of memory modules disposed in the housing. The memory modules are plugged onto the motherboard in parallel. The baffle includes a sidewall portion, a covering portion, and a plurality of reinforcing portions. The sidewall portion is fixed to the housing and surrounds the periphery of the memory modules. The sidewall portion has an opening located at a side of the sidewall portion away from the motherboard. The memory modules protrude out from the opening. The covering portion is connected to the sidewall portion and partially covers the opening. The memory modules are located between the covering portion and the motherboard. The reinforcing portions are connected to the sidewall potion and the covering portion and partially cover the opening. Each of the reinforcing portions is located between two corresponding adjacent memory modules.

Description

Windshield and server using the same

This creation is about a windshield and a server for which it is applied, in particular, a windshield for use with a memory module.

In recent years, in order to maximize economic benefits, the market has been pursuing highly efficient servers. In order to maximize the processing power of the server in a limited space within the server, the density of electronic components inside the server is continuously increased, and the heat dissipation burden is continuously increased.

For the conventional server, many electronic components are inserted on the motherboard, for example, a central processing unit (CPU), a north-south bridge chip, a display chip, a memory module, and the like. If the heat generated by these electronic components is not immediately removed, it is easy to cause the server to crash, and in severe cases, the motherboard may be burnt. Therefore, designers usually set up fan devices in the server. The main principle of the fan device is to work on the air by creating a forced convection, causing disturbance of the gas molecules, thereby cooling and cooling the electronic components concentrated by the heat source.

In order to prevent the airflow from flowing to the main heat source that needs the most heat dissipation (In other words, the operation elements such as the central processing unit and the display chip) are generated, and a windshield is usually provided in the memory module having a relatively small amount of heat generation, so that the airflow can be concentrated to the main heat source. Further, in the conventional server, in order to effectively utilize the space, the battery line of the battery module is placed above the windshield. The upper part of the windshield is provided with a hook for the battery wire to be wound, and a retaining wall for limiting the battery wire.

However, the process of winding the battery wire around and placing it above the windshield is not easy, and the assembler often spends too much time on winding. Moreover, for the new memory module, the height is higher than that of the conventional memory module, and the space between the upper casing and the memory module of the server is further compressed. Therefore, the above conventional windshield can no longer be used.

This creation provides a windshield that is used in a server. The server includes a casing, a motherboard disposed in the casing, and a plurality of memory modules. The memory modules are inserted in parallel to the motherboard. The windshield includes a side wall portion, a cover portion, and a plurality of reinforcing portions. The side wall portion is fixed to the casing and surrounds the outer edge of the memory module. The side wall portion has an opening on a side of the side wall portion away from the main board. The memory module protrudes from the opening. The cover portion is connected to the side wall portion and covers a part of the opening. The memory module is located between the cover and the motherboard. The reinforcing portion connects the side wall portion and the covering portion and covers a part of the opening. Each reinforcing portion is located between the corresponding two adjacent memory modules.

In an embodiment of the present invention, the covering portion has the first Groove. One of the reinforcing portions has a second groove. The first trench and the second trench are recessed toward the motherboard and communicate with each other and are located between two adjacent ones of the memory module.

In an embodiment of the present invention, the cover portion further has at least one limiting block located at the entrance of the first trench.

The present invention further provides a server comprising a casing, a motherboard, a plurality of memory modules, and a windshield. The motherboard is placed inside the casing. The memory modules are inserted in parallel to the motherboard. The windshield includes a side wall portion, a cover portion, and a plurality of reinforcing portions. The side wall portion is fixed to the casing and surrounds the outer edge of the memory module. The side wall portion has an opening on a side of the side wall portion away from the main board. The memory module protrudes from the opening. The cover portion is connected to the side wall portion and covers a part of the opening. The memory module is located between the cover and the motherboard. The reinforcing portion connects the side wall portion and the covering portion and covers a part of the opening. Each reinforcing portion is located between the corresponding two adjacent memory modules.

In an embodiment of the present invention, the server further includes a battery module. The battery module contains a battery cable. The cover has a first groove. The first trench is recessed toward the motherboard and is located between two adjacent ones of the memory module for accommodating a portion of the battery line.

In an embodiment of the present invention, one of the reinforcing portions has a second groove. The second trench is recessed toward the motherboard and is located between two adjacent memory modules for accommodating a portion of the battery line.

In an embodiment of the present invention, the memory modules are arranged in two memory groups. The cover also has a third groove. The third groove is formed concavely toward the motherboard, and is located between the two memory groups for accommodating the portion Divided battery line. The second trench and the third trench respectively communicate with both ends of the first trench.

In an embodiment of the present invention, the casing has a card slot. The windshield includes a snap portion. The engaging portion is connected to the side wall portion for engaging with the card slot.

A main technical feature of the windshield provided by the present invention is that the memory module protrudes from the opening above the side wall portion of the windshield, and the windshield covers the memory module only in a sheet-like covering portion. Therefore, even if the space between the memory module and the upper casing is reduced, the windshield of the present invention can be applied. Another main technical feature of the windshield of the present invention is that the windshield further includes a reinforcing portion that spans the opening and connects the side wall portion and the covering portion, thereby increasing the structural strength of the entire windshield. A further main technical feature of the windshield of the present invention is that the covering portion and the reinforcing portion of the windshield are formed downward to form a groove for accommodating the battery line, and each groove is located between two adjacent memory modules. It does not interfere with the upper case. Therefore, the assembler can simply complete the cable management process by simply plugging the battery cable into the groove, thereby reducing assembly time and labor costs.

1‧‧‧Server

10‧‧‧Chassis

100‧‧‧ card slot

12‧‧‧ motherboard

120‧‧‧ memory slot

14‧‧‧ memory module

16‧‧‧wind shield

160‧‧‧ Side wall

160a‧‧‧ openings

162‧‧‧ Coverage

162a‧‧‧first trench

162a1‧‧‧Limited blocks

162b‧‧‧ third trench

164‧‧‧Reinforcement Department

164a‧‧‧Second trench

166‧‧‧Clock Department

168‧‧‧ battery slot

18‧‧‧ battery module

180‧‧‧ battery line

A1‧‧‧ first direction

A2‧‧‧ second direction

G‧‧‧Memory Group

FIG. 1 is a perspective view showing a windshield according to an embodiment of the present invention.

Fig. 2 is a partially enlarged view showing Fig. 1;

Fig. 3 is a perspective view showing the windshield of Fig. 1.

In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the creation. That is to say, in the implementation part of this creation, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

Please refer to Figure 1 and Figure 2. FIG. 1 is a perspective view showing a windshield 16 according to an embodiment of the present invention. Fig. 2 is a partially enlarged view showing Fig. 1;

As shown in FIGS. 1 and 2, in the present embodiment, the server 1 includes a casing 10, a motherboard 12, a plurality of memory modules 14, and a windshield 16. The motherboard 12 of the server 1 is disposed in the casing 10. The motherboard 12 of the server 1 includes a plurality of memory slots 120. The memory module 14 of the server 1 is inserted in parallel to the memory slot 120 of the motherboard 12. The windshield 16 of the server 1 is disposed outside the memory module 14, so that the airflow generated by the fan module (not shown) in the server 1 can be concentrated to the main heat source (for example, the center) The arithmetic elements such as the processor and the display chip are dissipated for heat dissipation, and are not wasted from passing between the memory modules 14 having relatively little heat generation.

Please refer to FIG. 3, which is a perspective view of the windshield 16 in FIG.

As shown in FIG. 3, with reference to FIG. 1, in the present embodiment, the windshield 16 of the servo 1 includes a side wall portion 160 and a cover portion 162. And a plurality of reinforcing portions 164. The side wall portion 160 of the windshield 16 is configured to surround the outer edge of the memory module 14. Also, the side wall portion 160 of the windshield 16 can stand smoothly on the main board 12 and be fixed to the cabinet 10. In the present embodiment, the casing 10 of the server 1 has a card slot 100. The windshield 16 of the server 1 includes an engaging portion 166. The engaging portion 166 of the windshield 16 is connected to the side wall portion 160 for engaging into the card slot 100 of the casing 10.

It can be seen that the windshield 16 of the present invention surrounds the side wall portion 160 of the outer edge of the memory module 14 to effectively block the airflow generated by the fan module from flowing into the memory module 14.

Also shown in Fig. 3, the side wall portion 160 of the windshield 16 has an opening 160a. The opening 160a of the side wall portion 160 is located on a side of the side wall portion 160 away from the main board 12. The memory module 14 of the server 1 protrudes upward from the opening 160a of the side wall portion 160. The cover portion 162 of the windshield 16 is connected to the side wall portion 160, and the cover portion 162 is divided into openings 160a. In other words, the memory module 14 is located between the cover portion 162 of the windshield 16 and the motherboard 12.

Therefore, the windshield 16 of the present invention is covered only by the sheet-like covering portion 162 above the memory module 14, so that even if the height of the memory module 14 is increased, the windshield 16 of the present invention is still created. It can be placed in the memory module 14 and properly mounted in the casing 10 of the server 1, so that there is no problem of interference with the casing 10.

Also shown in Fig. 3, the reinforcing portion 164 of the windshield 16 is connected to the side wall portion 160 and the covering portion 162, and the covering portion 162 is divided into openings 160a. In other words, the reinforcing portion 164 of the windshield 16 spans the opening 160a of the side wall portion 160 and is connected to the side wall portion 160 and the covering portion 162. In particular, In this embodiment, each reinforcing portion 164 of the windshield 16 is located between the corresponding two adjacent memory modules 14 and is not located above the memory module 14 .

Therefore, it can be seen that the windshield 16 of the present invention can increase the structural strength of the entire windshield 16 by the reinforcing portion 164, and can also function as a limit for the memory module 14.

Returning to Fig. 1, and referring to Fig. 3, in the present embodiment, the windshield 16 further includes a battery slot 168. The battery slot 168 of the windshield 16 is coupled to the side wall portion 160. The server 1 also includes a battery module 18. The battery module 18 of the server 1 is disposed in the casing 10 and housed in the battery slot 168 of the windshield 16 . The battery module 18 includes a battery line 180. The cover portion 162 of the windshield 16 has a first groove 162a. The first trench 162a of the cover portion 162 is recessed downward toward the direction of the motherboard 12 and is located between two adjacent ones of the memory module 14. Since the first trench 162a of the cover portion 162 is formed between the two adjacent memory modules 14, there is no interference problem with the two adjacent memory modules 14. Thereby, the first trench 162a of the cover portion 162 can be used to accommodate a portion of the battery line 180.

In addition, one of the reinforcing portions 164 of the windshield 16 has a second groove 164a. The second trench 164a of the reinforcing portion 164 is recessed downward toward the direction of the motherboard 12 and is located between the two adjacent memory modules 14. Since the second trench 164a of the reinforcing portion 164 is also formed between the two adjacent memory modules 14, there is no interference problem with the two adjacent memory modules 14. Thereby, the second groove 164a of the reinforcing portion 164 can also be used to accommodate a portion of the battery line 180.

Further, in the present embodiment, the first groove 162a of the covering portion 162 and the second groove 164a of the reinforcing portion 164 communicate with each other. Therefore, when the assembler wants to wire the battery line 180 of the battery module 18, the battery line 180 can be pulled up along the side wall portion 160 of the windshield 16 and then inserted into the first portion of the cover portion 162. In the second groove 164a of the groove 162a and the reinforcing portion 164, the purpose of fixing the battery line 180 can be achieved simply and quickly.

Further, in the present embodiment, the memory modules 14 of the server 1 are arranged in two memory groups G (as indicated by a broken line in FIG. 1). The memory modules 14 in each memory group G are arranged in parallel along the first direction A1, the two memory groups G are arranged along the second direction A2, and the first direction A1 and the second direction A2 vertical.

The cover portion 162 of the windshield 16 also has a third groove 162b. The third trench 162b of the cover portion 162 is recessed downward toward the direction of the motherboard 12 and is located between the two memory groups G. Since the third trench 162b of the cover portion 162 is located at the interval between the two memory groups G, there is no interference problem with the two memory modules 14. Thereby, the third groove 162b of the cover portion 162 can also be used to accommodate a portion of the battery line 180.

Further, in the present embodiment, the second groove 164a of the reinforcing portion 164 and the third groove 162b of the covering portion 162 communicate with both ends of the first groove 162a of the covering portion 162, respectively. Therefore, when the assembler wants to wire the battery line 180 of the battery module 18, the battery line 180 can be pulled up along the side wall portion 160 of the windshield 16 and then sequentially inserted into the reinforcing portion 164. In the second trench 164a, the first trench 162a and the third trench 162b of the cover portion 162, the purpose of fixing the battery line 180 can be achieved simply and quickly. Benchuang A third groove 162b is formed on the cover portion 162 of the windshield 16 to increase the degree of freedom of the path of the battery wire 180 to the windshield 16 (that is, to increase the design freedom of the windshield 16). And the effect of increasing the total length of the battery wire 180 fixed to the windshield 16 (i.e., increasing the total fixed length of the battery wire 180).

Also shown in Fig. 3, in the present embodiment, the cover portion 162 of the windshield 16 further has a stopper 162a1. The limiting block 162a1 of the cover portion 162 is located at the entrance of the first trench 162a for confining a portion of the battery line 180 in the first trench 162a. Thereby, the covering portion 162 of the windshield 16 can be fixed in the first groove 162a as much as possible by the limiting block 162a1, and the battery wire 180 is prevented from being unintentionally separated from the first groove 162a.

From the above detailed description of the specific embodiments of the present invention, it can be clearly seen that a main technical feature of the windshield provided by the present invention is that the memory module protrudes from the opening above the side wall portion of the windshield. The windshield covers the memory module only in a sheet-like covering portion, so that even if the space between the memory module and the upper casing is reduced, the windshield of the present invention can be applied. Another main technical feature of the windshield of the present invention is that the windshield further includes a reinforcing portion that spans the opening and connects the side wall portion and the covering portion, thereby increasing the structural strength of the entire windshield. A further main technical feature of the windshield of the present invention is that the covering portion and the reinforcing portion of the windshield are formed downward to form a groove for accommodating the battery line, and each groove is located between two adjacent memory modules. It does not interfere with the upper case. Therefore, the assembler can simply complete the cable management process by simply plugging the battery cable into the groove, thereby reducing assembly time and labor costs.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

16‧‧‧wind shield

160‧‧‧ Side wall

160a‧‧‧ openings

162‧‧‧ Coverage

162a‧‧‧first trench

162a1‧‧‧Limited blocks

162b‧‧‧ third trench

164‧‧‧Reinforcement Department

164a‧‧‧Second trench

166‧‧‧Clock Department

168‧‧‧ battery slot

Claims (10)

A windshield is applied to a server, the server includes a casing, and a motherboard disposed in the casing and a plurality of memory modules, wherein the memory modules are inserted in parallel to the The windshield includes: a side wall portion fixed to the casing and surrounding the outer edge of the memory module, the side wall portion having an opening at the side wall portion away from the host a memory module is protruded from the opening; a cover portion is connected to the side wall portion and covers the opening, wherein the memory modules are located between the cover portion and the motherboard; And a plurality of reinforcing portions connecting the side wall portion and the covering portion and covering a portion of the opening, wherein each of the reinforcing portions is located between the corresponding two adjacent memory modules. The windshield of claim 1, wherein the covering portion has a first groove, and one of the reinforcing portions has a second groove, the first groove and the second groove are oriented The motherboard is recessed and connected to each other and located between two adjacent ones of the memory modules. A windshield according to claim 2, wherein the covering portion further has at least one limiting block located at an entrance of the first groove. A server includes: a casing; a motherboard disposed in the casing; a plurality of memory modules are inserted into the motherboard in parallel; and a windshield includes: a side wall portion fixed to the casing and surrounding an outer edge of the memory modules, The side wall portion has an opening, the side of the side wall portion away from the main board, the memory modules protrude from the opening; a cover portion connecting the side wall portion and covering part of the opening, wherein the The memory module is located between the cover portion and the motherboard; and a plurality of reinforcing portions connecting the sidewall portion and the covering portion and covering a portion of the opening, wherein each of the reinforcing portions is located in a corresponding two phases Adjacent to the memory modules. The server of claim 4, further comprising a battery module, the battery module comprising a battery line, the cover portion has a first groove, the first groove is recessed toward the motherboard, and Located between two adjacent ones of the memory modules to accommodate a portion of the battery line. The server of claim 5, wherein the cover further has at least one limiting block located at an entrance of the first trench for confining a portion of the battery line in the first trench. The server of claim 5, wherein one of the reinforcing portions has a second groove, the second groove is recessed toward the motherboard, and is located in the two adjacent memory modules. To accommodate parts The battery line. The server of claim 7, wherein the first trench and the second trench are in communication with each other. According to the server of claim 7, wherein the memory modules are arranged in two memory groups, the cover portion further has a third groove, the third groove is recessed toward the motherboard, and Located between the two memory groups to accommodate a portion of the battery line, and the second trench and the third trench respectively communicate with both ends of the first trench. The server of claim 4, wherein the casing has a card slot, and the windshield includes a latching portion that is coupled to the side wall portion for engaging the card slot.