TWM455192U - Power supply system and combination type power supply device thereof - Google Patents

Description

Power system and its combined power supply unit

The present invention relates to a power supply device and a power supply system, and more particularly to a combined power supply device and a power supply system having a combined power supply device.

The power supply unit is an essential component of industrial equipment, and is mainly used to convert AC power to DC power or provide boost or buck. A conventional power supply device includes a flat circuit board, at least one transformer, and a plurality of electronic components. The transformer and the electronic components are independently disposed on the circuit board and electrically formed by circuit wiring formed on the circuit board. Sexual connection.

As the demand for industrial equipment increases, the number of equipment installed in industrial equipment also increases. In order to be able to smoothly drive the installation of industrial equipment, the output power of the power supply device must naturally increase simultaneously. When the output power of the power supply device increases, the withstand capability of the transformer and the electronic components inside the power supply device, such as the withstand voltage value, must also be correspondingly increased. The volume of some electronic components, such as capacitors, is proportional to its withstand voltage value, which means that the larger the withstand voltage value of the electronic component, the larger the corresponding volume. When these large-volume electronic components are disposed on a circuit board, a large amount of space of the circuit board is occupied, which becomes a main cause of the inability of miniaturization of the overall volume of the high-power power supply system.

In view of the prior art, one of the aims of the present invention is to provide a small-sized combined power supply unit.

Another object of the present invention is to provide a power supply system having the above-described combined power supply unit.

In order to achieve the above object, the present invention provides a combined power supply device for mounting on a main carrier, the combined power supply device comprising a first substrate, a driving module and a conversion module; The first substrate has a first axial direction and a second axial direction substantially perpendicular to the first axial direction, the first substrate is interposed on the main carrier, and the second axial direction is substantially perpendicular to the main The driving module is located on one side of the first substrate and electrically connected to the first substrate; the conversion module is located on the other side of the first substrate, and is electrically connected to the driving module, wherein the conversion The length of the module is substantially equal to the length of the first axial direction of the first substrate, and the width of the conversion module is smaller than the length of the first axial direction of the first substrate.

For another purpose of the present invention, the present invention provides a power supply device comprising a main carrier board and a plurality of combined power supply units, the combined power supply units being disposed on the main carrier board, and the combined power supply The devices are connected in parallel.

The first substrate of the combined power supply device of the present invention is directly inserted on the main carrier board and is substantially perpendicular to the main carrier board. The driving module and the conversion module are respectively located on the first substrate. a side, and the driving module is directly disposed on the first substrate; thereby, the overall volume of the power supply device can be greatly reduced, and Reduce output power interference from input power and shorten current transfer path.

1, 1a, 1b, 6‧‧‧ combined power supply unit

10, 60‧‧‧ first substrate

102, 302, 322, 323b, 490, 602‧‧ ‧ stud

20, 70‧‧‧ drive module

200, 332, 332a, 700, 832‧‧ ‧ transformers

202, 702‧‧‧ Switching components

204, 352, 704‧‧‧ Electronic components

30, 80‧‧‧ conversion module

300, 300b, 800‧‧‧ second substrate

304, 304b, 324, 494‧‧ ‧ ribs

306b‧‧‧ card slot

307b‧‧‧Clock Department

308b‧‧‧ Conductive layer

310‧‧‧ third substrate

320, 320a, 320b‧‧‧ fourth substrate

322b‧‧‧Flat Department

324b‧‧‧Bend

325b‧‧‧Opening

330, 330a, 830‧‧‧ conversion unit

3322a‧‧‧Protruding

340, 840‧‧‧ control unit

342‧‧‧Control electronic components

350‧‧‧Signal transfer unit

360, 360b, 860‧‧‧ output unit

362, 362b, 862‧‧‧ inductors

363b‧‧‧ pin

364, 864‧‧ ‧ capacitor

370‧‧‧First connector

380‧‧‧Second connector

390‧‧‧ third connector

40, 40b‧‧‧Intermediate carrier

400‧‧‧fourth connector

400b‧‧‧Multilayer circuit board

401b‧‧‧through hole

402b‧‧‧First metal layer

403b‧‧‧first opening

404b‧‧‧Second metal layer

405b‧‧‧Second opening

41‧‧‧ accommodating slots

42‧‧‧ bearing seat

420‧‧‧ first board

422‧‧‧Second plate

424‧‧‧Connecting Department

425‧‧‧ accommodating space

426‧‧‧ shoulder

427‧‧‧Support

44, 94‧‧‧First isolation heat sink

46, 96‧‧‧Second isolation heat sink

48, 98‧‧‧ fixing parts

49‧‧‧ fifth substrate

492‧‧‧ Conductive layer

50‧‧‧Main carrier board

52‧‧‧ slots

54‧‧‧ board

801‧‧‧Perforation

802‧‧‧ slotting

810‧‧‧ conductor layer

870‧‧‧first connecting column

880‧‧‧Second connection post

890‧‧‧ Conductive layer

891‧‧‧ buckle

892‧‧‧Links

A1‧‧‧first axial direction

A2‧‧‧second axial

The first figure is an exploded perspective view of the combined power supply unit of the first embodiment of the present invention.

The second figure is an exploded perspective view of the combined power supply unit and the main carrier of the first embodiment of the present invention.

The third figure is a combination diagram of the combined power supply device and the main carrier of the first embodiment of the present invention.

The fourth figure is a perspective view of the power supply system of the first embodiment of the present invention.

The fifth figure is an exploded perspective view of the combined power supply unit of the second embodiment of the present invention.

The sixth figure is an exploded perspective view of the combined power supply unit and the main carrier of the second embodiment of the present invention.

Figure 7 is a perspective assembled view of the combined power supply unit and the main carrier board of the second embodiment of the present invention.

Figure 8 is an exploded perspective view of the combined power supply unit of the third embodiment of the present invention.

The ninth drawing is an exploded perspective view of the combined power supply unit and the main carrier of the third embodiment of the present invention.

The tenth drawing is an exploded perspective view of the combined power supply unit of the fourth embodiment of the present invention.

Figure 11 is an exploded perspective view of the combined power supply unit and the main carrier of the fourth embodiment of the present invention.

Figure 12 is a perspective view of the power supply system of the second embodiment of the present invention.

Referring to the first, second and third figures, respectively, an exploded perspective view of the combined power supply device of the first embodiment, an exploded perspective view and a combined view of the combined power supply device and the main carrier. The combined power supply unit 1 is configured to convert an input high voltage into a low voltage output. The combined power supply unit 1 is mounted on a main carrier 50 having a plurality of slots 52 for inserting the combined power supply unit 1 therein and electrically forming the main carrier 50. The main carrier 50 may be a printed circuit board (PCB) or a substrate on which a plurality of circuit wirings are formed in advance, wherein the substrate may be a copper substrate, an aluminum substrate, a ceramic substrate or the like. The sheet of thermally conductive material, or the main carrier 50 may be a board in which a printed circuit board is bonded to a copper sheet or other material having good electrical conductivity.

The combined power supply device 1 includes a first substrate 10, a driving module 20, and a conversion module 30. The driving module 20 is disposed on one side of the first substrate 10 and electrically connected to the first substrate 10. The conversion module 30 is located on the other side of the first substrate 10 and is electrically connected to the driving module 20 .

The first substrate 10 may be a printed circuit board or a plurality of circuits formed in advance thereon a wiring board, wherein the board may be a copper substrate, an aluminum substrate, a ceramic substrate or other board having good thermal conductivity properties, or the first substrate 10 may be a printed circuit board and a copper sheet or other material having good electrical conductivity properties. Combined with the plate.

The first substrate has a first axial direction A1 and a second axial direction A2 substantially perpendicular to the first axial direction A1 (as shown in the first figure); in the embodiment, the first axial direction A1 is In the longitudinal direction of the first substrate 10, the second axial direction A2 is the width direction of the first substrate 10. The first substrate 10 is inserted into the main carrier 50 , and the second axial direction A2 of the first substrate 10 is substantially perpendicular to one of the main carrier plates 50 . One end of the first substrate 10 has at least one stud 102. The number of the studs 102 may be one or more. In the embodiment, the first substrate 10 is exemplified by two studs 102. The protrusions 102 are respectively inserted into the slots 52 such that the first substrate 10 is substantially perpendicular to the main carrier 50 and electrically connected to the main carrier 50.

The driving module 20 is directly disposed on the first substrate 10 and electrically connected to the first substrate 10 . The driving module 20 is configured to receive power input to the combined power supply device 1 and drive the combined power supply device 1 . The driving module 20 includes at least one transformer 200, at least one switching element 202, and a plurality of active and passive electronic components 204. The number of the transformers 200 and the switching elements 202 may be one or more. In this embodiment, the combination The power supply device 1 is exemplified by two transformers 200 and four switching elements 202, and the switching elements 202 are preferably metal oxide semiconductor field effect transistors (Metal-Oxide-Semiconductor Field-Effect). Transistor, MOSFET). The transformers 200, the switching elements 202, and the electronic components 204 cooperate to form a driving circuit.

The conversion module 30 receives the voltage source through the driving module 20 and provides a voltage conversion function to reduce the voltage value of the voltage source. The length of the conversion module 30 is substantially equal to the length of the first axis A1 of the first substrate 10, and the width of the conversion module 30 is smaller than the length of the first axis A1 of the first substrate 10.

The conversion module 30 includes a second substrate 300, a third substrate 310, a fourth substrate 320, a conversion unit 330, a control unit 340, a signal transmission unit 350, an output unit 360, and a first connector. 370, a second connector 380, a third connector 390 and a fourth connector 400.

The conversion unit 330 is disposed on the first substrate 10 opposite to a surface of the driving module 20 and electrically connected to the first substrate 10 for receiving power output by the driving module 20 . The conversion unit 330 includes at least one transformer 332 and a plurality of active and passive electronic components (not shown). The transformer 332 and the electronic components cooperate to form a voltage adjustment circuit.

The first connector 370 is disposed on the first substrate 10 and electrically connected to the first substrate 10 , and the first connector 370 and the conversion unit 330 are located on the same side of the first substrate 10 .

The second substrate 300 may be a printed circuit board or a board on which a plurality of circuit wirings are formed in advance, wherein the board may be a copper substrate, an aluminum substrate, a ceramic substrate or other board having good thermal conductivity, or the second The substrate 300 may be a printed circuit board and a copper sheet or other material having good electrical conductivity properties. The board is combined; and preferably, the second substrate 300 may be a multi-layer (two or more layers) circuit board. The second substrate 300 is inserted into the main carrier 50 and electrically connected to the main carrier 50 , and the second substrate 300 is substantially parallel to the first substrate 10 . In addition, one end of the second substrate 300 has at least one protrusion 302, and the number of the protrusions 302 may be one or more. In the embodiment, the second substrate 300 is exemplified by three protrusions 302. The protrusions 302 are respectively inserted into the slots 52 such that the second substrate 300 is substantially perpendicular to the main carrier 50 and electrically connected to the main carrier 50.

The control unit 340 is disposed on the second substrate 300 and electrically connected to the second substrate 300. The control unit 340 includes a plurality of control electronic components 342, which may be active electronic components or passive electronic components, and cooperate to form a circuit having a control function; of course, the control electronic components 342 may also have control The integrated circuit of the function.

The second connector 380 is disposed on the second substrate 300 and electrically connected to the control unit 340. In the embodiment, the second connector 380 is located on the second substrate 300 facing the first substrate 10. One side.

The third substrate 310 may be a printed circuit board or a board on which a plurality of circuit wirings are formed in advance, wherein the board may be a copper substrate, an aluminum substrate, a ceramic substrate or other plate having good thermal conductivity, or the third substrate 310 may be a board in which a printed circuit board is bonded to a copper sheet or other material having good electrical conductivity. The third substrate 310 is located between the first substrate 10 and the second substrate 300 and is substantially parallel to the first substrate 10 . The signal transmission unit 350 is disposed on the third substrate 310 and electrically connected to the third substrate 310. The signal Transfer unit 350 includes a plurality of electronic components 352 that are used to form a signal transmission circuit.

The third connector 390 is disposed on the third substrate 310 and electrically connected to the third substrate 310. The third connector 390 is coupled to the first connector 370 to transmit the conversion unit 330 and the signal. Unit 350 forms an electrical connection.

The fourth connector 400 is disposed on the third substrate 310 and electrically connected to the third substrate 310. The fourth connector 400 is coupled to the second connector 380 to enable the signal transmission unit 350 and the control. Unit 340 forms an electrical connection.

The fourth substrate 320 may be a printed circuit board or a substrate on which a plurality of circuit wirings are pre-formed, wherein the substrate may be a copper substrate, an aluminum substrate, a ceramic substrate or other plate having good thermal conductivity or a printed circuit board and copper. A material in which sheets or other materials having good electrical conductivity are combined with each other. The fourth substrate 320 is disposed on the opposite side of the second substrate 310 and is substantially parallel to the second substrate 300. The fourth substrate 320 is inserted on the main carrier 50 and The main carrier 50 forms an electrical connection. One end of the fourth substrate 320 has at least one protrusion 322. The number of the protrusions 322 may be one or more. In the embodiment, the fourth substrate 320 is exemplified by three protrusions 322. The protrusions 322 are respectively inserted into the slots 52 such that the fourth substrate 320 is substantially perpendicular to the main carrier 50 and electrically connected to the main carrier 50.

The output unit 360 is disposed on the fourth substrate 320 and electrically connected to the fourth substrate 320. The output unit 360 includes at least one inductor 362 and at least one The number of the container 364, the inductor 362 and the capacitor 364 may be one or more. In the embodiment, the output unit 360 includes two inductors 362 and two capacitors 364, but the number is not For the limitations of this creation. The inductors 362 and the capacitors 364 cooperate to form a π-type filter for stabilizing the output current and reducing the output noise.

In actual use, the user can flexibly adjust the specifications of the driving module 20, the converting unit 330, the control unit 340, the signal transmitting unit 35, and the output unit 360 according to the required output power (for example, the withstand voltage value). And the first substrate 10, the second substrate 300, and the third substrate 310 of the drive module 20, the conversion unit 330, the control unit 340, the signal transmission unit 350, and the output unit 360. The fourth substrate 320 is respectively inserted into the main carrier 50 to electrically connect with the main carrier 50, and simultaneously engages the first connector 370 and the third connector 390, the second The connector 380 and the fourth connector 400 enable the conversion unit 330 and the control unit 340 to form an electrical connection through the signal transmission unit 350. In this way, the power entering the combined power supply device 1 by the driving module 20 can be converted into required power and output by the output unit 360; therefore, the combined power supply device 1 of the present invention has the convenience of assembly and Adjust the advantages of the specifications.

In summary, the combined power supply device 1 has the advantage of small volume, and the configuration is the isolation conversion unit 330 and the output unit 360, which can reduce the interference of the output power by the input power, thereby reducing the instability of the output power. In addition, the space between adjacent two units allows air to circulate therein, improving the overall heat dissipation effect.

Refer to the fourth figure for a perspective view of the power system of the creation. The power supply system includes a main carrier board 50 and a plurality of the combined power supply units 1 . The combined power supply unit 1 is mounted on the main carrier 50 and electrically connected to the main carrier 50 . In the embodiment, the power supply system includes two combined power supply devices 1 as an example. The combined power supply devices 1 are installed side by side on the main carrier 50, and the combined power supply devices 1 are connected in parallel. connection.

Thereby, when the power system is operated under light load, only a single combined power supply device 1 can be activated to reduce the output power of the power supply system. When the power system is in heavy-duty operation, the combined power supply device 1 is simultaneously turned on to increase the output power of the power system; secondly, when the plurality of combined power supply devices 1 are simultaneously turned on, each of the combined power supplies The control unit 340 of the device 1 cooperates to achieve a phase-shift function to increase the operating efficiency of the power system and reduce the output chopping current. In this way, the power system can achieve optimum efficiency under light load operation and heavy load operation, and avoid the problem of poor efficiency of the conventional high-watt power system at light load.

Referring to FIG. 5, FIG. 6 and FIG. 7 respectively, an exploded perspective view of the combined power supply device of the second embodiment, an exploded perspective view and a combined view of the combined power supply device and the main carrier plate are respectively shown. The combined power supply device 1a of the present embodiment is similar to the combined power supply device 1 of the first embodiment, and the same components are denoted by the same reference numerals.

The combined power supply device 1a further includes a carrier carrier 40. The intermediate carrier 40 is a printed circuit board or a board on which a plurality of circuit wirings are formed in advance, wherein the board may be a copper substrate, an aluminum substrate, a ceramic substrate or the like having good heat conduction. The sheet of the nature, or the intermediate carrier 40 may be a board in which the printed circuit board is bonded to a copper sheet or other material having good electrical conductivity. A plurality of accommodating grooves 41 are formed in the intermediate carrier 40.

The second substrate 300a has an end portion having at least one rib 304, and the number of the ribs 304 may be one or more. In this embodiment, the second carrier 300a has four The rib 304 is taken as an example. The ribs 304 are correspondingly inserted into the accommodating grooves 41 of the interposer 40 such that the second substrate 300a is substantially perpendicular to the interposer 40 and electrically connected to the interposer 40.

The fourth substrate 320a has an end portion of the protrusion 322 having at least one rib 324. The number of the ribs 324 may be one or more. In this embodiment, the fourth substrate 320a has four ribs. Take 324 as an example. The ribs 324 are correspondingly inserted into the accommodating grooves 41 of the interposer 40 such that the fourth substrate 320a is substantially perpendicular to the interposer 40 and electrically connected to the interposer 40.

The transformer 332a of the conversion unit 330a has at least one protrusion 3322a. The number of the protrusions 3322a may be one or more. In this embodiment, each of the transformers 332a includes two protrusions 3322a. example. The protrusions 3322a are correspondingly inserted into the receiving slots 41 of the interposer 40 to electrically connect the interposer 40 and the conversion unit 330a.

The control unit 340 on the second substrate 300a and the output unit 360 on the fourth substrate 320a can be electrically connected to the conversion unit 330a through the main carrier 50 and the interposer 40. The drive module 20; Preferably, the main carrier 50 and the interposer 40 can respectively transmit power of different levels.

The functions and related descriptions of the other components of the combined power supply device 1a are substantially the same as those of the combined power supply device 1 of the first embodiment, and will not be described herein. The combined power supply unit 1a can at least achieve the same function as the combined power supply unit 1.

In addition, the main carrier 50 may be combined with a plurality of combined power supply devices 1a to form a power supply device. The combined power supply device 1a is disposed in substantially the same manner as the combined power supply device 1 of the first embodiment. I will not repeat them here.

With reference to the eighth and ninth drawings, respectively, an exploded perspective view and a three-dimensional combination diagram of the combined power supply device of the third embodiment are created. The combined power supply device 1b of the present embodiment is similar to the combined power supply device 1a of the first embodiment, and the same components are denoted by the same reference numerals.

The second substrate 300b is a multi-layer circuit board, and a plurality of card slots 306b are formed thereon, and the card slots 306b are used for the plurality of conductive layers 308b disposed therein; and preferably, the wall surfaces of the card slots 306b are formed. There is a plurality of engaging portions 307b for fixing the conductive layers 308b. Each of the conductive layers 308b is made of copper or other material having good electrical conductivity for use as a current transfer path.

The interposer carrier 40b includes a multilayer circuit board 400b, a first metal layer 402b, and a second metal layer 404b. A plurality of through holes 401b are formed in the multilayer circuit board 400b. The first metal layer 402b and the second metal layer 404b are made of copper or other materials having good electrical conductivity for current transmission. path.

The first metal layer 402b is attached to a lower surface of the multilayer circuit board 400b, and a plurality of first openings 403b substantially corresponding to the through holes 401b are formed thereon. The second metal layer 404b is attached to an upper surface of the multilayer circuit board 400b, and a plurality of second openings 405b substantially corresponding to the through holes 401b are formed thereon.

The protruding portions 3322a of the transformers 332a and the ribs 304b of the second substrate 300b are inserted into the through holes 401b, the first openings 403b and the second openings 405b, and Electrical connection is made to the interposer carrier 40b.

The fourth substrate 320b includes a flat portion 322b and a bent portion 324b. The flat portion 322b is substantially parallel to the first substrate 10, and the flat portion 322b has a plurality of studs 323b for plugging. The main carrier 50 is electrically connected to the main carrier 50. The bent portion 324b is substantially perpendicular to the flat portion 322b, and a plurality of openings 325b are formed thereon. The plurality of pins 363b of the inductors 362b of the output unit 360b are inserted into the openings 325b of the fourth substrate 320b, the through holes 401b of the interposer 40b, the first openings 403b, and The second openings 405b are electrically connected to the fourth substrate 320b and the interposer 40b.

The combined power supply device 1b further includes a carrier 42 , a first isolation heat dissipation plate 44 , a second isolation heat dissipation plate 46 , a plurality of fixing members 48 , and a fifth substrate 49 . The carrier 42 includes a first plate body 420 , a second plate body 422 , a connecting portion 424 , and a shoulder portion 426 . The first board 420 is disposed adjacent to the first substrate 10 The second plate 422 is disposed adjacent to the second substrate 300b. In the embodiment, the first plate 420 and the second plate 422 are substantially rectangular, and the length of the second plate 422 is substantially equal to the length. The length of the first plate body 420 is smaller than the width of the first plate body 420. The connecting portion 424 is located at one end of the first plate body 420 and the second plate body 422 and is connected to the first plate body 420 and the second plate body 422. The first board body 420, the second board body 422 and the connecting portion 424 cooperate to form at least one accommodating space 425 for accommodating the transformers 332a of the converting unit 330a, so as to avoid the voltage 332a and the The voltages 200 of the drive module 20 generate electromagnetic interference. The connecting portion 424 further includes a plurality of supports 427 for inserting on the main carrier 50. The shoulder portion 426 is disposed on the first plate body 420 opposite to the end portion of the connecting portion 424 and extends toward the first substrate 10 for the carrier base 42 to be disposed on the first substrate 10 . .

The first isolation heat dissipation plate 44 is located on one side of the first substrate 10, and the second isolation heat dissipation plate 46 is located on the other side of the first substrate 10. The fixing member 48 extends through the first isolation heat dissipation plate 44. The first substrate 10 is locked on the second isolation heat dissipation plate 46 to achieve electromagnetic isolation and heat conduction.

The fifth substrate 49 is located on one side of the second substrate 300b opposite to the first substrate 10. The fifth substrate 49 may be a printed circuit board or a board on which a plurality of circuit wirings are formed in advance, wherein the board may be a copper substrate, an aluminum substrate, a ceramic substrate or other plate having good thermal conductivity, or the fifth substrate 49 may be a printed circuit board and a copper sheet or other material having good electrical conductivity combined with each other; and preferably, the fifth substrate 49 is a plurality of layers (two or more layers) Circuit board. One end of the fifth substrate 49 is formed with at least one stud 490. The number of the studs 490 may be one or more. In the embodiment, the fifth substrate 49 includes two studs 490 as an illustrative example. The studs 490 are inserted into the intermediate carrier 40b and electrically connected to the interposer 40b. The other end portion of the fifth substrate 49 is formed with at least one rib 494. The rib 494 is inserted into the main carrier 50 and electrically connected to the main carrier 50.

The fifth substrate 49 is further provided with at least one conductive layer 492 for use as a path for current transmission. The control unit 340 is disposed on the second substrate 300b and the fifth substrate 49 at the same time, and is electrically connected to the second substrate 300b and the fifth substrate 49. Thereby, the control electronic components can be dispersed. The setting interval is such that the heat dissipation effect is improved.

The functions and related descriptions of the other components of the combined power supply device 1b are substantially the same as those of the combined power supply device 1 of the first embodiment, and will not be described herein. The combined power supply unit 1b can at least achieve the same function as the combined power supply unit 1.

In addition, the main carrier 50 may be combined with a plurality of combined power supply devices 1b to form a power supply device. The combined power supply device 1b is arranged in substantially the same manner as the combined power supply device 1 of the first embodiment. I will not repeat them here.

With reference to the tenth and eleventh drawings, respectively, an exploded perspective view and a three-dimensional combination diagram of the combined power supply device and the main carrier of the fourth embodiment of the present invention. The combined power supply unit 6 is configured to convert the input high voltage into a low voltage output. The combined power supply unit 6 is mounted on a main carrier board 50, and the main carrier board 50 has a complex a plurality of slots 52 for inserting the combined power supply unit 6 therein and electrically connected to the main carrier 50; the main carrier 50 may be a printed circuit board or a plurality of circuits are pre-formed thereon a wiring board, wherein the board may be a copper substrate, an aluminum substrate, a ceramic substrate or other board having good thermal conductivity, or the main carrier 50 may be a printed circuit board and a copper sheet or other material having good electrical conductivity. Plates that are combined with each other.

The combined power supply device 6 includes a first substrate 60, a driving module 70, and a conversion module 80. The driving module 70 is disposed on one side of the first substrate 60 and electrically connected to the first substrate 60. The conversion module 80 is located on the other side of the first substrate 60 and electrically connected to the driving module 70.

The first substrate 60 may be a printed circuit board or a board on which a plurality of circuit wirings are formed in advance, wherein the board may be a copper substrate, an aluminum substrate, a ceramic substrate or other plate having good thermal conductivity, or the first substrate 60 may be a board in which a printed circuit board is bonded to a copper sheet or other material having good electrical conductivity. The first substrate 60 has a first axial direction A1 and a second axial direction A2 substantially perpendicular to the first axial direction A1 and substantially perpendicular to the first axial direction A1 (as shown in the tenth figure); In the embodiment, the first axial direction A1 is the longitudinal direction of the first substrate 60, and the second axial direction A2 is the width direction of the first substrate 60. The first substrate 60 is inserted into the main carrier 50 , and the second axial direction A2 of the first substrate 60 is substantially perpendicular to the main carrier 50 . One end of the first substrate 60 has at least one protrusion 602. The number of the protrusions 602 may be one or more. In the embodiment, the first substrate 60 is exemplified by two protrusions 602. The protrusions 602 are respectively inserted into the slots 52 such that the first substrate 60 is substantially perpendicular to The main carrier 50 is electrically connected to the main carrier 50.

The driving module 70 is directly disposed on the first substrate 60 and electrically connected to the first substrate 60. The driving module 70 is configured to receive power input to the combined power supply device 6 and drive the combined power supply device 6. The driving module 70 includes at least one transformer 700, at least one switching element 702, and a plurality of active and passive electronic components 704. The number of transformers 700 and the switching components 702 may be one or more. In this embodiment, the combination The power supply device 6 is exemplified by two transformers 700 and four switching elements 702, and the switching elements 702 are preferably metal oxide semiconductor field effect transistors. The transformers 700, the switching elements 702 and the electronic components 704 cooperate to form a driving circuit.

The conversion module 80 receives the voltage source passing through the driving module 70 and provides a voltage conversion function to reduce the voltage value of the voltage source. The length of the conversion module 80 is substantially equal to the length of the first axis A1 of the first substrate 60. The width of the conversion module 80 is smaller than the length of the first axis A1 of the first substrate 60.

The conversion module 80 includes a second substrate 800, at least one conductor layer 810, a conversion unit 830, a control unit 840, an output unit 860, a first connection post 870, two second connection posts 880, and a conductive layer. 890.

The second substrate 800 is disposed opposite to the main carrier 50. The second substrate 800 may be a printed circuit board or a board on which a plurality of circuit wirings are pre-formed, wherein the board may be a copper substrate, an aluminum substrate, a ceramic substrate or Other plates having good thermal conductivity properties, or the second substrate 800 may be a plate in which a printed circuit board and a copper sheet or other material having good electrical conductivity are combined with each other; The second substrate 800 can be a multi-layer (two or more layers) circuit board.

The conductor layer 810 is made of copper or other material having good electrical conductivity. The conductor layer 810 is attached to the second substrate 800 for use as a path for current transmission; and preferably, the second substrate 800 The upper portion is formed with a receiving groove (not shown) for receiving the conductor layer 810, so that the conductor layer 810 is fixed.

The conversion unit 830, the control unit 840, and the output unit 860 are disposed on the second substrate 800 and electrically connected to the second substrate 800. The conversion unit 830 is configured to receive the power output by the driving module 70, and The power output by the drive module 70 is converted into a demand voltage value. The conversion unit 330 preferably includes at least one transformer 832 and a plurality of active and passive electronic components (not shown). The transformer 832 and the electronic components cooperate to form a voltage adjustment circuit.

The control unit 840 is configured to control an operation state of the combined power supply device 6, and the control unit 840 may include a plurality of control elements for composing a control circuit, or the control unit 840 may also be an integrated body having a control function. Circuit. The output unit 860 includes at least one inductor 862 and at least one capacitor 864. The number of the inductor 862 and the capacitor 864 may be one or more. In this embodiment, the output unit 860 includes two inductors. 862 and four capacitors 864 are illustrative examples. The inductors 862 and the capacitors 864 cooperate to form a π-type filter for stabilizing the output current and reducing the output noise.

The first connecting post 870 is disposed between the main carrier 50 and the second substrate 800, and the two ends of the first connecting post 870 are respectively inserted into the main carrier 50. The groove 52 and the through hole 801 on the second substrate 800 electrically connect the main carrier 50 and the second substrate 800.

The conductive layer 890 is made of copper or other material having good electrical conductivity. The conductive layer 890 is attached to the second substrate 800 for connecting the output unit 860 and the second substrate 800 and transmitting current thereon. A plurality of latches 891 are formed on the conductive layer 890. The latches 891 are coupled to the plurality of slots 802 formed on the second substrate 800 to achieve a positioning effect, and the conductive layer 890 and the second substrate are strengthened. The strength of the connection between the 800 rooms. In this embodiment, the conductive layer 890 is substantially T-shaped. In actual implementation, the user can adjust the shape of the conductive layer 890 according to actual needs and limitations.

The conductive layer 890 is coupled to one end of the second connecting post 880 by a plurality of connecting members 892. The connecting member 892 may preferably be a copper rivet for joining the conductive layer 890 and the second connecting posts 880. A current can be transferred between the conductive layer 890 and the second connecting posts 880. The other end of the second connecting post 880 is inserted into the slots 52 of the main carrier 50 and electrically connected to the main carrier 50; thus, power can pass through the second connections. A post 880 is transferred between the main carrier 50 and the second substrate 800. The second connecting post 880 and the first connecting post 870 can respectively transmit power of different levels.

The combined power supply device 6 further includes a first isolation heat dissipation plate 94, a second isolation heat dissipation plate 96, and a plurality of fixing members 98. The first isolation heat dissipation plate 94 is located on one side of the first substrate 60, and the second isolation. The heat dissipation plate 96 is located on the other side of the first substrate 60. The fixing members 98 extend through the first isolation heat dissipation plate 94 and the first base. The plate 60 is locked to the second isolation heat sink 96 to provide electromagnetic isolation and heat dissipation.

In summary, the combined power supply unit 6 has the advantage of a small volume, and allows air to circulate therein to improve the overall heat dissipation effect. The driving module 70 is located between the first isolation heat dissipation plate 94 and the second isolation heat dissipation plate 96 to avoid electromagnetic interference with the conversion module 30.

In actual use, the user can flexibly adjust the specifications of the driving module 70, the converting unit 830, the control unit 840, and the output unit 860 according to the required output power, so that the driving module 70 enters the The power of the combined power supply unit 6 can be converted into demand power and output by the output unit 860. Therefore, the combined power supply unit 6 has the advantage that it can be easily assembled and adjusted.

With reference to the twelfth figure, a perspective view of the power supply system of the second embodiment of the present invention is shown. The power supply system includes a main carrier board 50 and a plurality of the combined power supply units 6 . The combined power supply unit 6 is mounted on the main carrier 50 and electrically connected to the main carrier 50 . In the present embodiment, the power supply system includes a two-combination power supply device 6 as an illustrative example. The combined power supply devices 6 are mounted side by side on the main carrier 50, and the combined power supply devices 6 are connected in parallel. .

Thereby, when the power system is operated under light load, only a single combined power supply device 6 can be activated to reduce the output power of the power supply system. When the power system is operated under heavy load, the combined power supply device 6 is simultaneously turned on, so that The output power of the power system is increased. Secondly, when a plurality of combined power supply units 6 are simultaneously turned on, the control unit 840 of each combined power supply unit 6 cooperates to achieve a phase shift function, so as to improve the working efficiency of the power supply system. And reduce the output chopping current. In this way, the power system can achieve optimum efficiency under light load operation and heavy load operation, and avoid the problem that the traditional high-watt power supply device is inefficient at light load.

However, the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited, that is, the equal changes and modifications made by the scope of the patent application of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect.

1‧‧‧Combined power supply unit

10‧‧‧First substrate

102‧‧‧Bump

20‧‧‧Drive Module

200‧‧‧Transformer

202‧‧‧Switching elements

204‧‧‧Electronic components

330‧‧‧Conversion unit

340‧‧‧Control unit

342‧‧‧Control electronic components

350‧‧‧Signal transfer unit

360‧‧‧Output unit

362‧‧‧Inductors

364‧‧‧ capacitor

370‧‧‧First connector

380‧‧‧Second connector

390‧‧‧ third connector

400‧‧‧fourth connector

50‧‧‧Main carrier board

52‧‧‧ slots

54‧‧‧ board

Claims (15)

A combined power supply device for mounting on a main carrier, the combined power supply device comprising: a first substrate having a first axial direction and a second axial direction substantially perpendicular to the first axial direction, a first substrate is inserted on the main carrier, and the second axis is substantially perpendicular to the main carrier; a driving module is located on one side of the first substrate and electrically connected to the first substrate; and a conversion The module is located on the other side of the first substrate and electrically connected to the driving module, wherein the length of the conversion module is substantially equal to the length of the first axial direction of the first substrate, and the width of the conversion module Less than the length of the first axial direction of the first substrate. The combined power supply device of claim 1, wherein the conversion module comprises: a second substrate inserted in the main carrier and substantially perpendicular to the main carrier; a third substrate located at the Between the first substrate and the second substrate, the third substrate is inserted into the main carrier and is substantially perpendicular to the main carrier; a conversion unit is located at the first substrate; and a control unit is disposed at the second The substrate is electrically connected to the second substrate; a signal transmission unit is disposed on the third substrate and electrically connected to the third substrate, the signal transmission unit is electrically connected to the control unit and the conversion unit; And an output unit electrically connected to the main carrier. The combined power supply device of claim 2, further comprising: a fourth substrate disposed on a side of the second substrate opposite to the third substrate, the fourth substrate being inserted into the main carrier And being substantially perpendicular to the main carrier, the output unit is disposed on the fourth substrate and electrically connected to the fourth substrate. The combined power supply device of claim 2, wherein the output unit comprises at least one capacitor and at least one inductor. The combined power supply device of claim 2, wherein the conversion module further comprises: a first connector disposed on the first substrate; a second connector disposed on the second substrate; a third connector disposed on the third substrate and coupled to the first connector to electrically connect the conversion unit and the signal transmission unit; and a fourth connector disposed on the third substrate and the second The connector is coupled to electrically connect the signal transfer unit and the control unit. The combined power supply device of claim 2, further comprising a carrier, the carrier includes a first plate body, a second plate body and a connecting portion, the connecting portion connecting the first plate body And the second board body, the first board body, the second board body and the connecting portion cooperate to form an accommodating space, the converting unit is located in the accommodating space, and the connecting part comprises a plurality of supporting members for inserting On the main carrier board. The combined power supply device of claim 3, wherein one end of the first substrate, the second substrate, and the fourth substrate has at least one stud. The protrusions are respectively inserted into a plurality of slots formed on the main carrier and electrically connected to the main carrier. The combined power supply device of claim 3, further comprising an intermediate carrier board, wherein the second substrate and the fourth substrate are oppositely inserted at the other end of the main carrier board and respectively inserted in the intermediary Carrier board. The combined power supply device of claim 8, wherein the intermediate carrier comprises: a multilayer circuit board; a first metal layer attached to one side of the multilayer circuit board; and a second metal A layer attached to the other side of the multilayer circuit board. The combined power supply device of claim 1, further comprising: a second substrate substantially parallel to the main carrier and located on a side of the first substrate opposite to the main carrier, the first The substrate is disposed on the second substrate; a conversion unit is disposed on the second substrate and electrically connected to the second substrate; a control unit is disposed on the second substrate and electrically connected to the second substrate; An output unit is disposed on the second substrate and electrically connected to the second substrate. The combined power supply device of claim 10, further comprising a first connecting post, the second substrate and the main carrier are electrically connected to the second substrate and the main carrier. The combined power supply device of claim 11, further comprising: a conductive layer attached to the second substrate, the conductive layer electrically connecting the output unit; at least a second connecting post located at the first Between the two substrates and the main carrier; A connecting member is coupled to the conductive layer and the second connecting posts. The combined power supply device of claim 1, further comprising: a first isolation heat dissipation plate on one side of the first substrate; and a second isolation heat dissipation plate on the other side of the first substrate And a plurality of fixing members extending through the first isolation heat dissipation plate and locked to the second isolation heat dissipation plate. A power supply system comprising: a main carrier board; and a combined power supply unit according to any one of clauses 1 to 13, wherein the combined power supply unit is mounted on the main carrier board, and the The combined power supply units are connected in parallel. The power supply system of claim 14, wherein the combined power supply units are juxtaposed on the main carrier.