TWM452394U - Smart card and smart card contact pad carrier board - Google Patents
Smart card and smart card contact pad carrier board Download PDFInfo
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- TWM452394U TWM452394U TW101221770U TW101221770U TWM452394U TW M452394 U TWM452394 U TW M452394U TW 101221770 U TW101221770 U TW 101221770U TW 101221770 U TW101221770 U TW 101221770U TW M452394 U TWM452394 U TW M452394U
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Abstract
Description
本創作涉及一種智能卡及智能卡接觸墊載板。The present invention relates to a smart card and a smart card contact pad carrier.
智能卡由於具有高安全性已在各行各業得到廣泛應用。通常，一張智能卡含內置微處理器和天線或接觸墊，天線或接觸墊中含若干金屬觸點。智能卡可直接用作卡本身，如手機用的SIM卡，或者安裝到較大的基板如用於銀行信用卡/儲蓄卡和身份識別卡等。Smart cards have been widely used in various industries due to their high security. Typically, a smart card contains a built-in microprocessor and an antenna or contact pad with a number of metal contacts in the antenna or contact pad. The smart card can be used directly as the card itself, such as a SIM card for a mobile phone, or mounted to a larger substrate such as a bank credit/deposit card and an identification card.
本創作涉及智能卡接觸墊。This creation involves a smart card contact pad.
智能卡接觸墊的尺寸必須符合國際標準如ISO7816或4FF Nano-SIM標準，以便在智能卡插入讀取設備如付款終端機、讀卡機等時能進行有效的數據傳輸。The size of the smart card contact pads must conform to international standards such as ISO7816 or 4FF Nano-SIM standards to enable efficient data transfer when smart cards are inserted into reading devices such as payment terminals, card readers, and the like.
智能卡接觸墊使用的材料通常為貴重金屬如金等。隨著近年來原材料價格的一路攀升，智能卡接觸墊的製造成本越來越高。但如果使用其他替換材料，由於需要重新對卡的堅韌性、壽命、安全性等進行認證，成本將更高。The materials used for smart card contact pads are usually precious metals such as gold. With the rising prices of raw materials in recent years, the manufacturing cost of smart card contact pads is increasing. However, if other replacement materials are used, the cost will be higher due to the need to re-certify the card's toughness, longevity, safety, and the like.
本創作旨在提供一種可提高原材料利用率的智能卡接觸墊載板。This creation aims to provide a smart card contact pad carrier that increases the utilization of raw materials.
本創作提供一種智能卡接觸墊載板，包括基板和形成於基板上的若干導電層，所述基板的寬度基本等於35N毫米，N 為正整數，所述載板沿所述基板寬度方向形成有2個以上智能卡接觸墊，所述智能卡接觸墊的寬度方向與基板寬度方向平行。The present invention provides a smart card contact pad carrier comprising a substrate and a plurality of conductive layers formed on the substrate, the substrate having a width substantially equal to 35 N mm, N The positive carrier is formed by the carrier board having two or more smart card contact pads along the width direction of the substrate, and the width direction of the smart card contact pads is parallel to the substrate width direction.
較佳地，所述智能卡接觸墊的寬度基本等於一智能卡國際標準規定的最小寬度。Preferably, the width of the smart card contact pad is substantially equal to a minimum width specified by an international standard for smart cards.
較佳地，每一智能卡接觸墊包括若干由導電層形成的觸點，所述若干觸點中的大部分的寬度方向與基板寬度方向平行。Preferably, each of the smart card contact pads includes a plurality of contacts formed by a conductive layer, a majority of the plurality of contacts having a width direction that is parallel to the substrate width direction.
較佳地，每一智能卡接觸墊包括兩組沿基板長度方向排列設置的觸點，每組觸點包括四個沿基板寬度方向排列設置的觸點。Preferably, each smart card contact pad comprises two sets of contacts arranged along the length of the substrate, each set of contacts comprising four contacts arranged in the width direction of the substrate.
較佳地，所述基板為柔性板，所述導電層分別設置於基板兩相對表面。Preferably, the substrate is a flexible board, and the conductive layers are respectively disposed on opposite surfaces of the substrate.
較佳地，所述基板的寬度基本等於35毫米，沿所述基板寬度方向設置有3個智能卡接觸墊。Preferably, the width of the substrate is substantially equal to 35 mm, and three smart card contact pads are disposed along the width direction of the substrate.
可選地，所述基板的寬度基本等於70毫米，沿所述基板寬度方向設置有6個或7個智能卡接觸墊。Optionally, the substrate has a width substantially equal to 70 mm, and six or seven smart card contact pads are disposed along the width direction of the substrate.
可選地，沿所述基板寬度方向設置有3N個智能卡接觸墊，所述智能卡接觸墊的長度方向與載板長度方向平行。Optionally, 3N smart card contact pads are disposed along the width direction of the substrate, and the length direction of the smart card contact pads is parallel to the longitudinal direction of the carrier.
較佳地，所述智能卡接觸墊排列成若干排，每一排沿平行所述基板長度方向延伸，所述智能卡接觸墊排列成若干列，每一列沿平行基板寬度方向延伸。Preferably, the smart card contact pads are arranged in a plurality of rows, each row extending in a direction parallel to the length of the substrate, and the smart card contact pads are arranged in a plurality of columns, each column extending in a width direction of the parallel substrate.
本創作還提供一種智能卡，包括一智能卡接觸墊及一智能卡接觸墊載板，所述智能卡接觸墊具有前述智能卡接觸墊載板 的結構。The present invention also provides a smart card, comprising a smart card contact pad and a smart card contact pad carrier, the smart card contact pad having the aforementioned smart card contact pad carrier Structure.
本創作中，由於智能卡接觸墊的寬度方向與載板的寬度方向一致，沿載板寬度方向可以設置儘量多的智能卡接觸墊以使得智能卡接觸墊排佈更加緊凑，從而可提高載板的原材料利用率，即與現有技術(智能卡接觸墊的寬度方向與載板的長度方向一致)中相同面積的載板可生產更多的智能卡接觸墊。而且，通過增加載板的寬度，可提高智能卡接觸墊的生產效率。In this creation, since the width direction of the smart card contact pad is consistent with the width direction of the carrier board, as many smart card contact pads as possible can be disposed along the width direction of the carrier board to make the smart card contact pad arrangement more compact, thereby improving the raw material of the carrier board. The utilization rate, that is, the carrier board of the same area in the prior art (the width direction of the smart card contact pad coincides with the length direction of the carrier board) can produce more smart card contact pads. Moreover, by increasing the width of the carrier, the production efficiency of the smart card contact pads can be improved.
為了能更進一步瞭解本創作的特徵以及技術內容，請參閱以下有關本創作的詳細說明與圖式，然而所附圖式僅提供參考與說明用，並非用來對本創作加以限制。In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and explanation, and are not intended to limit the creation.
下面結合圖式，通過對本創作的具體實施方式詳細描述，將使本創作的技術方案及其他有益效果顯而易見。可以理解地，圖式僅提供參考與說明用，並非用來對本創作加以限制。圖式中顯示的尺寸僅僅是為便於清晰描述，並不限定比例關係。The technical solutions and other advantageous effects of the present invention will be apparent from the detailed description of the specific embodiments of the present invention in conjunction with the drawings. It is to be understood that the drawings are provided for purposes of illustration and description only and are not intended to be limiting. The dimensions shown in the drawings are for convenience of clarity and are not to be construed as limiting.
第1圖至第2圖所示為依本創作第一實施例的智能卡接觸墊載板10，所述智能卡接觸墊載板10上形成有若干智能卡接觸墊12，每一智能卡接觸墊12包括若干觸點，在本實施例中，每一智能卡接觸墊12包括8個觸點：分別為觸點C1，也叫電源電壓觸點(VCC)，用於連接外部電源以向智能卡的微處理晶片供電；觸點C2，也叫複位觸點(RST)，用於向智能卡提供複位信號；觸點C3，也叫時鐘觸點(CLK)，用於向智能卡提供 時鐘信號；觸點C4，也叫保留觸點(RFU)，保留待未來使用；觸點C5，也叫地觸點(GND)，地基準電壓；觸點C6，也叫編程電壓觸點(VPP)，用於編程電壓輸入；觸點C7，也叫輸入/輸出觸點(I/O)，用於串行數據的輸入/輸出；觸點C8，也叫保留觸點(RFU)，保留待未來使用。FIG. 1 to FIG. 2 show a smart card contact pad carrier 10 according to the first embodiment of the present invention. The smart card contact pad carrier 10 is formed with a plurality of smart card contact pads 12, each of which includes a plurality of smart card contact pads 12. In the present embodiment, each smart card contact pad 12 includes eight contacts: a contact C1, also called a power supply voltage contact (VCC), for connecting an external power supply to supply power to the smart card's microprocessor chip. Contact C2, also called reset contact (RST), is used to provide a reset signal to the smart card; contact C3, also called the clock contact (CLK), is provided to the smart card. Clock signal; contact C4, also known as reserved contact (RFU), reserved for future use; contact C5, also known as ground contact (GND), ground reference voltage; contact C6, also known as programming voltage contact (VPP) ) for programming voltage input; contact C7, also called input/output contact (I/O), for serial data input/output; contact C8, also called reserved contact (RFU), reserved Future use.
第2圖所示為智能卡接觸墊載板10的橫截面示意圖，包括由電絕緣材料製成的基板14和若干設置於基板14兩側的導電層16、18、20。這樣，從智能卡接觸墊載板10上截取下來的智能卡接觸墊12亦包括基板和導電層，觸點由導電層形成，且基板14的邊緣超出觸點C1~ C8的邊緣，所述超出的基板邊緣可用作後續安裝智能卡接觸墊12至智能卡時的安裝邊。本實施例中，每一智能卡接觸墊12基本為長方形或矩形，寬度方向的尺寸D1小於等於長度方向的尺寸D2。2 is a schematic cross-sectional view of the smart card contact pad carrier 10, including a substrate 14 made of an electrically insulating material and a plurality of conductive layers 16, 18, 20 disposed on opposite sides of the substrate 14. Thus, the smart card contact pad 12 taken from the smart card contact pad carrier 10 also includes a substrate and a conductive layer, the contacts are formed of a conductive layer, and the edge of the substrate 14 extends beyond the edges of the contacts C1 - C8, the excess substrate The edge can be used as a mounting edge for subsequent installation of the smart card contact pad 12 to the smart card. In this embodiment, each smart card contact pad 12 is substantially rectangular or rectangular, and the dimension D1 in the width direction is less than or equal to the dimension D2 in the longitudinal direction.
所述基板14較佳地由柔性塑料如聚對苯二甲酸乙二酯(PET)製成，基板14的厚度在55至95微米(micron)之間，較佳地為75微米。The substrate 14 is preferably made of a flexible plastic such as polyethylene terephthalate (PET) having a thickness between 55 and 95 micron, preferably 75 microns.
在本實施例中，第一導電層16的材料為銅，第一導電層16形成在基板14的兩相對外表面。較佳地，第一導電層16的厚度為5至25微米，較佳為10微米左右。In the present embodiment, the material of the first conductive layer 16 is copper, and the first conductive layer 16 is formed on two opposite outer surfaces of the substrate 14. Preferably, the first conductive layer 16 has a thickness of 5 to 25 μm, preferably about 10 μm.
在本實施例中，第二導電層18的材料為鎳(Nickel)，第二導電層18形成在第一導電層16的外側。較佳地，第二導電層18的厚度為1.0至4.0微米，較佳為2.5微米左右。In the embodiment, the material of the second conductive layer 18 is nickel (nickel), and the second conductive layer 18 is formed outside the first conductive layer 16 . Preferably, the second conductive layer 18 has a thickness of 1.0 to 4.0 μm, preferably about 2.5 μm.
在本實施例中，第三導電層(外導電層)20的材料為金，外導電層20形成在第二導電層18的外側。較佳地，外導電層 20的厚度為0.02至0.08微米，較佳為0.045微米左右。In the present embodiment, the material of the third conductive layer (outer conductive layer) 20 is gold, and the outer conductive layer 20 is formed outside the second conductive layer 18. Preferably, the outer conductive layer The thickness of 20 is 0.02 to 0.08 μm, preferably about 0.045 μm.
所述導電層形成所述智能卡接觸墊12的觸點C1~ C8，較佳地，所述智能卡接觸墊12的觸點C1~ C8通過蝕刻形成，在本實施例中，通過濕法刻蝕(Wet etching)形成，相鄰觸點之間相互絕緣。The conductive layer is formed in contact with the smart card contact pad 12 C1 ~ C8, preferably, the smart card contact pad 12 contacts a C1 ~ C8 are formed by etching, in the present embodiment, by wet etching ( Wet etching) is formed, and adjacent contacts are insulated from each other.
本實施例中，所述智能卡接觸墊12的寬度基本等於一智能卡國際標準規定的最小寬度，長度基本等於所述智能卡國際標準規定的最小長度。In this embodiment, the width of the smart card contact pad 12 is substantially equal to the minimum width specified by an international standard for smart cards, and the length is substantially equal to the minimum length specified by the international standard of the smart card.
較佳地，每個智能卡接觸墊12觸點C1~ C8的尺寸按照國際標準ISO7816規定的最小尺寸設置。在本實施例中，觸點C4與C8中心之間的距離較佳為7.62毫米，觸點C1與C4中心之間的較佳距離為7.62毫米。較佳地，至少觸點C1至C4及C6至C8中每一觸點的主要接觸區的面積為1.7毫米乘以2.0毫米。每一智能卡接觸墊12被設置為寬度方向與基板寬度方向(橫向)一致。具體地，至少觸點C1至C4及C6至C8中每一觸點的寬度方向與基板14橫向一致。每一智能卡接觸墊12的觸點C1至C4沿基板14橫向緊挨著順次排列，同樣地，觸點C5至C8沿基板橫向緊挨著順次排列。在本實施例中，觸點C1至C4於基板中的位置處於觸點C5至C8的上游(如圖中所示，觸點C1至C4位於C5至C8的右邊)。當然，根據需要，也可以反過來設置。Preferably, the size of each smart card contact pad 12 contact C1 ~ C8 is set according to the minimum size specified by the international standard ISO7816. In the present embodiment, the distance between the centers of the contacts C4 and C8 is preferably 7.62 mm, and the preferred distance between the centers of the contacts C1 and C4 is 7.62 mm. Preferably, at least the area of the main contact area of each of the contacts C1 to C4 and C6 to C8 is 1.7 mm by 2.0 mm. Each of the smart card contact pads 12 is disposed such that the width direction coincides with the substrate width direction (lateral direction). Specifically, at least the width direction of each of the contacts C1 to C4 and C6 to C8 is laterally coincident with the substrate 14. The contacts C1 to C4 of each smart card contact pad 12 are sequentially arranged in the lateral direction of the substrate 14, and likewise, the contacts C5 to C8 are sequentially arranged next to each other in the lateral direction of the substrate. In the present embodiment, the positions of the contacts C1 to C4 in the substrate are upstream of the contacts C5 to C8 (as shown in the figure, the contacts C1 to C4 are located to the right of C5 to C8). Of course, it can be set in reverse as needed.
每一智能卡接觸墊12的第一組觸點C1至C4沿基板14橫向對齊排列，第二組觸點C5至C8亦沿基板14橫向對齊排列。The first set of contacts C1 to C4 of each smart card contact pad 12 are laterally aligned along the substrate 14, and the second set of contacts C5 to C8 are also aligned laterally along the substrate 14.
在本實施例中，基板14橫向尺寸基本為35毫米，可適用現有的卷對卷制程(roll to roll manufacturing processes)。因此，在已有的技術上無需大的改變，接觸墊的用戶也無需作新的測試或調整。In the present embodiment, the substrate 14 has a lateral dimension of substantially 35 mm and is applicable to existing roll to roll manufacturing processes. Therefore, no major changes are required in the prior art, and the user of the contact pad does not need to make new tests or adjustments.
本創作通過調整智能卡接觸墊12的設置方向：智能卡接觸墊12的寬度方向基本平行基板14的寬度(橫向)方向，長度方向基本平行基板14的長度方向(縱向)和/或觸點C1~ C8中的大部分(半數以上)觸點的長度方向基本平行基板14的長度方向，從而使得沿一個35毫米寬的基板14的寬度方向可以設置2個以上(3個)成列排列的智能卡接觸墊12，沿基板14長度方向可設置若干個類似的成列排列的智能卡接觸墊12。The present invention adjusts the orientation of the smart card contact pads 12: the width direction of the smart card contact pads 12 is substantially parallel to the width (lateral) direction of the substrate 14, the length direction is substantially parallel to the length direction of the substrate 14 (longitudinal direction) and/or the contacts C1 ~ C8 The majority of the (half or more) contacts have a length direction substantially parallel to the length direction of the substrate 14, so that more than two (3) smart card contact pads arranged in a row along the width direction of a 35 mm wide substrate 14 can be disposed. 12, a plurality of similar smart card contact pads 12 arranged in a row may be disposed along the length of the substrate 14.
使用時，可通過衝壓等方式切割智能卡接觸墊載板10而製成單個智能卡接觸墊12，然後再將智能卡接觸墊12安裝到智能卡的相應位置即可。本發明的智能卡接觸墊12，可通過倒裝晶片(flip-chip)方式與智能卡的外部電路電連接，也可以用引線接合(wire bonding)方式與智能卡的外部電路電連接。In use, the smart card contact pad carrier 10 can be cut by punching or the like to form a single smart card contact pad 12, and then the smart card contact pad 12 can be mounted to the corresponding position of the smart card. The smart card contact pad 12 of the present invention can be electrically connected to an external circuit of the smart card by a flip-chip method, or can be electrically connected to an external circuit of the smart card by wire bonding.
第3圖所示為本創作第二實施例的智能卡接觸墊載板的平面示意圖。智能卡接觸墊載板10的寬度調整至70毫米，這樣，沿基板14寬度方向可以設置6個成列設置的智能卡接觸墊12，沿基板14長度方向排列有多數個類似的接觸墊列。這樣，智能卡接觸墊12沿基板14長度方向成排設置，每一排與基板14長度方向平行。沿基板14長度方向，某些成排設置的 接觸墊的朝向可以相反設置，即在部分成排的接觸墊中，觸點C1至C4在觸點C5至C8的上游，在其他部分排的接觸墊中，觸點C1至C4在觸點C5至C8的下游。Figure 3 is a plan view showing the smart card contact pad carrier of the second embodiment of the present invention. The width of the smart card contact pad carrier 10 is adjusted to 70 mm, so that six smart card contact pads 12 arranged in a row can be disposed along the width direction of the substrate 14, and a plurality of similar contact pad rows are arranged along the length of the substrate 14. Thus, the smart card contact pads 12 are arranged in a row along the length of the substrate 14, each row being parallel to the longitudinal direction of the substrate 14. Along the length of the substrate 14, some rows are arranged The orientation of the contact pads can be reversed, ie in a partial row of contact pads, contacts C1 to C4 are upstream of contacts C5 to C8, in other partial rows of contact pads, contacts C1 to C4 are at contact C5 Down to C8.
智能卡接觸墊載板10的兩邊分別各設一排定位孔22，以供衝壓和安裝智能卡接觸墊時定位用。在本實施例中，除了沖孔設備需要調整外，其他的都可以利用現有的技術和設備。Each of the two sides of the smart card contact pad carrier 10 is provided with a row of positioning holes 22 for positioning when punching and installing the smart card contact pads. In this embodiment, in addition to the need for adjustment of the punching device, other existing technologies and devices can be utilized.
可以理解地，智能卡接觸墊載板10的寬度可以是35N毫米；相應地，沿智能卡接觸墊載板10寬度方向可以設置3N個智能卡接觸墊12，N為正整數。It can be understood that the width of the smart card contact pad carrier 10 can be 35N mm; accordingly, 3N smart card contact pads 12 can be disposed along the width direction of the smart card contact pad carrier 10, N being a positive integer.
本創作上述實施中，由於智能卡接觸墊12的寬度方向與智能卡接觸墊載板10的寬度方向一致，從而使得沿智能卡接觸墊載板10寬度方向可以設置3N個智能卡接觸墊12，從而可提高智能卡接觸墊載板10的原材料利用率，即與現有技術(智能卡接觸墊的長度方向與載板的寬度方向一致)中相同面積的載板可生產更多的智能卡接觸墊12。而且，通過增加智能卡接觸墊載板10的寬度，可提高智能卡接觸墊12的生產效率。In the above implementation of the present invention, since the width direction of the smart card contact pad 12 coincides with the width direction of the smart card contact pad carrier 10, 3N smart card contact pads 12 can be disposed along the width direction of the smart card contact pad carrier 10, thereby improving the smart card. The raw material utilization rate of the contact pad carrier 10, that is, the carrier board of the same area as in the prior art (the length direction of the smart card contact pad coincides with the width direction of the carrier board) can produce more smart card contact pads 12. Moreover, by increasing the width of the smart card contact pad carrier 10, the production efficiency of the smart card contact pad 12 can be improved.
第4圖和第5圖所示分別為本創作第三及第四實施例的智能卡接觸墊載板30，所述智能卡接觸墊載板30的結構與前述實施例的智能卡接觸墊載板10的結構基本相同，不同之處在於：第三及第四實施例的智能卡接觸墊載板30上設置的智能卡接觸墊12的尺寸按照國際標準4FF Nano-SIM的規定設置，每一智能卡接觸墊12的長度D2基本等於12.3 mm±0.1 mm，寬度D1基本等於8.8 mm±0.1 mm。這樣，如第4圖所 示的一張35mm寬的智能卡接觸墊載板30可以很容易地設置3排智能卡接觸墊12，且載板30沿寬度方向的兩側皆可設置定位孔22。如第5圖所示的一張70mm寬的智能卡接觸墊載板30可以設置7排智能卡接觸墊12，載板30沿寬度方向的兩側皆可設置定位孔22。4 and 5 are the smart card contact pad carrier 30 of the third and fourth embodiments, respectively, the structure of the smart card contact pad carrier 30 and the smart card contact pad carrier 10 of the foregoing embodiment. The structure is basically the same, except that the smart card contact pads 12 disposed on the smart card contact pad carrier 30 of the third and fourth embodiments are sized according to the international standard 4FF Nano-SIM, and each smart card contacts the pad 12 The length D2 is substantially equal to 12.3 mm ± 0.1 mm and the width D1 is substantially equal to 8.8 mm ± 0.1 mm. In this way, as shown in Figure 4 A 35 mm wide smart card contact pad carrier 30 can be easily provided with three rows of smart card contact pads 12, and the positioning holes 22 can be disposed on both sides of the carrier plate 30 in the width direction. A 70 mm wide smart card contact pad carrier 30 as shown in FIG. 5 can be provided with 7 rows of smart card contact pads 12, and the positioning holes 22 can be disposed on both sides of the carrier plate 30 in the width direction.
以上所述僅為本創作的較佳實施例而已，並不用以限制本創作，凡在本創作的精神和原則之內所作的任何修改、等同替換和改進等，均應包含在本創作的保護範圍之內。The above description is only for the preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent replacement and improvement made within the spirit and principle of the present creation should be included in the protection of the present creation. Within the scope.
10‧‧‧智能卡接觸墊載板10‧‧‧Smart card contact pad carrier
12‧‧‧智能卡接觸墊12‧‧‧Smart card contact pads
14‧‧‧基板14‧‧‧Substrate
16‧‧‧導電層16‧‧‧ Conductive layer
18‧‧‧導電層18‧‧‧ Conductive layer
20‧‧‧導電層20‧‧‧ Conductive layer
22‧‧‧定位孔22‧‧‧Positioning holes
C1‧‧‧觸點C1‧‧‧ contacts
C2‧‧‧觸點C2‧‧‧ contacts
C3‧‧‧觸點C3‧‧‧Contacts
C4‧‧‧觸點C4‧‧‧ contacts
C5‧‧‧觸點C5‧‧‧ contacts
C6‧‧‧觸點C6‧‧‧ contacts
C7‧‧‧觸點C7‧‧‧ contacts
C8‧‧‧觸點C8‧‧‧Contacts
D1‧‧‧寬度方向的尺寸D1‧‧‧ dimension in the width direction
D2‧‧‧長度方向的尺寸D2‧‧‧ dimensions in the length direction
第1圖為本創作第一實施例的智能卡接觸墊承載板的部分平面示意圖。FIG. 1 is a partial plan view showing the smart card contact pad carrier board of the first embodiment of the present invention.
第2圖為本創作智能卡接觸墊載板的橫截面示意圖。Figure 2 is a schematic cross-sectional view of the creative smart card contact pad carrier.
第3圖為本創作第二實施例的智能卡接觸墊承載板的部分平面示意圖。FIG. 3 is a partial plan view showing the smart card contact pad carrier board of the second embodiment of the present invention.
第4圖為本創作第三實施例的智能卡接觸墊承載板的部分平面示意圖。Figure 4 is a partial plan view showing the smart card contact pad carrier plate of the third embodiment of the present invention.
第5圖為本創作第四實施例的智能卡接觸墊承載板的部分平面示意圖。FIG. 5 is a partial plan view showing the smart card contact pad carrier board of the fourth embodiment of the present invention.
10‧‧‧智能卡接觸墊載板10‧‧‧Smart card contact pad carrier
12‧‧‧智能卡接觸墊12‧‧‧Smart card contact pads
14‧‧‧基板14‧‧‧Substrate
22‧‧‧定位孔22‧‧‧Positioning holes
C1‧‧‧觸點C1‧‧‧ contacts
C2‧‧‧觸點C2‧‧‧ contacts
C3‧‧‧觸點C3‧‧‧Contacts
C4‧‧‧觸點C4‧‧‧ contacts
C5‧‧‧觸點C5‧‧‧ contacts
C6‧‧‧觸點C6‧‧‧ contacts
C7‧‧‧觸點C7‧‧‧ contacts
C8‧‧‧觸點C8‧‧‧Contacts
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210182012 | 2012-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM452394U true TWM452394U (en) | 2013-05-01 |
Family
ID=49078842
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101141868A TWI606401B (en) | 2012-06-05 | 2012-11-09 | Smart card, smart card contact pad carrier board and manufacturing method thereof |
| TW101221770U TWM452394U (en) | 2012-06-05 | 2012-11-09 | Smart card and smart card contact pad carrier board |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101141868A TWI606401B (en) | 2012-06-05 | 2012-11-09 | Smart card, smart card contact pad carrier board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (2) | TWI606401B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9282636B2 (en) | 2012-06-05 | 2016-03-08 | Johnson Electric S.A. | Contact pad carrier strip and method for making same |
-
2012
- 2012-11-09 TW TW101141868A patent/TWI606401B/en not_active IP Right Cessation
- 2012-11-09 TW TW101221770U patent/TWM452394U/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9282636B2 (en) | 2012-06-05 | 2016-03-08 | Johnson Electric S.A. | Contact pad carrier strip and method for making same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201351297A (en) | 2013-12-16 |
| TWI606401B (en) | 2017-11-21 |
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