CN108764436A - A kind of list interface stripe cell, single interface band, module and smart card - Google Patents
A kind of list interface stripe cell, single interface band, module and smart card Download PDFInfo
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- CN108764436A CN108764436A CN201810942969.9A CN201810942969A CN108764436A CN 108764436 A CN108764436 A CN 108764436A CN 201810942969 A CN201810942969 A CN 201810942969A CN 108764436 A CN108764436 A CN 108764436A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 74
- 239000011889 copper foil Substances 0.000 claims abstract description 73
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims description 122
- 238000005476 soldering Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000003801 milling Methods 0.000 description 11
- 238000013461 design Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application provides a kind of single interface stripe cell, including base material, the base material are covered with copper foil on one side, as copper-clad surface, totally 8 contacts C1-C8 are provided on the copper-clad surface, are electrically isolated from each other by insulating tape between contact；Using any two contacts in C4, C6 and C8 as the first contact and the second contact；It is both provided with hole in substrate regions corresponding with the first contact, the second contact, the contact C1, C2, C3, C5 and C7；Region where first contact and the second contact is extended to adjacent contact respectively, forms the first extension area and the second extension area；It is respectively arranged with the first datum hole and the second datum hole in first extension area and the corresponding substrate regions of the second extension area, present invention also provides the bands and module of the unit for using the list interface band, and the smart card of the application module.The application compatibility preferably, it is higher to promote flexibility.
Description
Technical Field
The application relates to the technical field of smart cards, in particular to a single-interface strip unit, a single-interface strip, a module and a smart card.
Background
The existing double-interface intelligent chip card (IC card) has contact and non-contact read-write operation functions, a double-interface IC module in the market is mainly packaged by using a special double-interface strip, the double-interface strip comprises two layers of copper foils, namely a contact surface (hereinafter, the front surface can be used for replacing a finger) copper foil is used for a contact interface, and a welding surface (or a pressure welding surface and an encapsulation surface, hereinafter, the welding surface can be used for replacing the finger) copper foil is used for a non-contact interface, so that the front and back layers of copper foils need to be manufactured on the strip, and processes such as etching, nickel plating, gold plating and the like need to. This results in a higher price for the double-interface tapes than for the single-interface tapes.
The contact and the circuit of the welding surface are formed in the strip production process, and after the module packaging process, the non-contact interface circuit of the chip and the antenna coil loop embedded in the card are conducted, so that the non-contact function of the IC card is realized. The industry refers to large modules with 8 contacts as 8PIN modules according to ISO standards. And a small module with 6 contacts is called a 6PIN module. The 8 contact interface pads of the 8pin module are identified by C1, C2, … and C8, respectively, according to ISO-7816. Of these, C4 and C8 are designed as reserved areas and have no practical use, while C6 was originally designed to power the EEPROM, but since the program Voltage (Programming Voltage) required by the EEPROM is then directly controlled on-chip, C6 is usually not used.
Based on the above, it has been proposed in the prior art to package a dual interface module using a single interface tape, as in the invention application of patent No. 201710245152.1, which utilizes the principle of using the gold wire and the card-based antenna of the non-contact interface of the module soldering surface to bridge the non-contact interface of the module soldering surface by base material punching with the C4, C8, and C6 regions left and unused on the 8pin module, thereby omitting the copper foil manufacturing of the soldering surface. However, the design is limited to the existing C4, C8 or C6 region on the 8pin module, so that the positions of the non-antenna pads are inconsistent with the existing design, and therefore, the compatibility on the sealing, testing and card manufacturing processes is poor, and the further popularization of the dual-interface module in the market is not flexible enough.
Disclosure of Invention
In order to solve the problems, the single interface tape unit comprises a base material, wherein one surface of the base material is covered with a copper foil as a copper foil surface, 8 contacts of C1-C8 are arranged on the copper foil surface, and the contacts are mutually and electrically isolated through an insulating tape;
any two contacts of C4, C6 and C8 are taken as a first contact and a second contact; holes are arranged on the substrate areas corresponding to the first contact, the second contact, the C1, the C2, the C3, the C5 and the C7;
the areas where the first contact and the second contact are located respectively extend towards the adjacent contacts to form a first extension area and a second extension area; and the substrate areas corresponding to the first extension area and the second extension area are respectively provided with a first base hole and a second base hole.
Preferably, the edge where the C5-C8 contact is located is set as the width of the single interface strip unit, the edge where the C1 and C5 are located is set as the height of the single interface strip unit, a coordinate axis is established by taking the center of the single interface strip unit as an origin, an axis parallel to the width is taken as an x axis, an axis parallel to the height is taken as a y axis, the actual height of the single interface strip unit is set as l, the minimum remaining height of the single interface strip unit is h, the widths of C2, C3, C6 and C7 are all a, the widths of C1, C4, C5 and C8 are all b, and the height of an insulating strip for isolating the two contacts is taken as s;
then one can get:
the extension range of C8 on C6 and C7 is as follows:the extension at C5 is:
the extension of C6 on C5 was:the extension at C7 is:the extension at C8 is:
the extension range of C4 on C3 and C2 is as follows:the extension of C4 on C1 was:
the present application also provides a single interface tape using the above single interface tape unit, wherein the single interface tape is composed of at least two single interface tape units.
The application also provides a module using the single interface strip unit, wherein the module comprises the single interface strip unit and a chip;
the surface of the single-interface strip unit, which is opposite to the copper foil surface, is a welding surface, and the chip is arranged on the welding surface;
a contact surface bonding pad is arranged at the position of a hole corresponding to the contact on the welding surface, and the hole enables the contact to be electrically communicated with the corresponding contact surface bonding pad;
the chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which is electrically connected with the contact surface bonding pads of the contacts C1, C2, C3, C5 and C7 correspondingly;
setting the contact surface bonding pads of the first contact and the second contact as an LA contact surface bonding pad and an LB contact surface bonding pad respectively;
the LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the LA bonding pad and the LB bonding pad of the chip;
an antenna LA welding pad and an antenna LB welding pad are respectively arranged at the positions of the first base hole and the second base hole on the welding surface of the single interface strip unit; the first and second base holes electrically communicate the first and second contacts with the antenna LA and LB bonding pads.
The application also provides an intelligent card using the module, which comprises a card base, the module and an antenna coil, wherein the antenna coil is arranged inside the card base, the surface of the card base is provided with a milling groove, and the module is embedded in the milling groove;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with two ends of the antenna coil loop.
Preferably, an antenna LA pad and an antenna LB pad are arranged on the card substrate, and the antenna LA pad and the antenna LB pad are respectively connected to two ends of the antenna coil loop;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with the antenna LA welding pad and the antenna LB welding pad.
Preferably, the antenna LA pad and the antenna LB pad are respectively disposed at two opposite ends of the milled slot on the card base, and the antenna LA pad and the antenna LB pad are respectively disposed at positions corresponding to the antenna LA pad and the antenna LB pad.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are connected to two ends of the antenna coil loop by means of direct wire bonding of an antenna enameled wire.
Preferably, the antenna LA pad and the LB pad are connected to the antenna LA bonding pad and the antenna LB bonding pad by soldering or conductive adhesive.
The application also provides a single interface tape unit, which comprises a base material, wherein one side of the base material is covered with a copper foil, the copper foil is used as a copper foil surface, the copper foil surface is provided with a central area, 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area, and the copper foil area of the C5 contact surrounds the central area; the contacts are mutually electrically isolated through an insulating tape;
a third contact is arranged between the C1 contact and the C5 contact, and a fourth contact is arranged between the C3 contact and the C7 contact; the third contact, the fourth contact and other contacts are respectively isolated by insulation electrification;
holes are formed in the substrate areas corresponding to the third contact, the fourth contact, the C1, the C2, the C3, the C5, the C6 and the C7;
and the third contact and the fourth contact are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate area.
Preferably, the side where C5-C7 is located is set as the width of the single boundary strip unit, the side where C3 and C7 are located is set as the height of the single boundary strip unit, a coordinate axis is established with the center of the single boundary strip unit as an origin, an axis parallel to the width is set as an x-axis, an axis parallel to the height is set as a y-axis, the actual height of the single boundary strip unit is set as l, the minimum remaining height of the contacts is p, the widths of C2 and C6 are C, the widths of C1, C3, C5 and C7 are d and m, the height of the insulating strip isolating the two contacts is set as s,
the range with the third contact is:
wherein,
the range of the fourth contact is:wherein,
preferably, wherein either of the third or fourth contacts is replaced by an extension of C6 and/or C6 to the adjacent contact.
Preferably, the side where C5, C6 and C7 are located is set as the width of the single boundary strip unit, the side where C3 and C7 are located is set as the height of the single boundary strip unit, a coordinate axis is established by taking the center of the single boundary strip unit as an origin, an axis parallel to the width is taken as an x axis, an axis parallel to the height is taken as a y axis, the actual height of the single boundary strip unit is set as l, the minimum remaining height of the module is h, the widths of C1, C3, C5 and C7 are all d, the widths of C2 and C6 are all C, and the height of the insulating tape isolating the two contacts is s;
the C6 has an extension in the C5 region of:
the C6 has an extension in the C7 region of:
the present application also provides a single interface tape using the above single interface tape unit, wherein the single interface tape is composed of at least two single interface tape units.
The application also provides a module using the single interface strip unit, wherein the module comprises the single interface strip unit and a chip;
the surface of the single interface tape unit, which is opposite to the copper foil surface, is a welding surface, and the chip is arranged on the welding surface;
a contact surface pad is arranged on the welding surface at the position of the hole corresponding to the contact; the holes enable the contacts to be electrically communicated with the corresponding contact surface bonding pads;
the chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which is electrically connected with the contact surface bonding pads of the contacts C1, C2, C3, C5 and C7 correspondingly;
the third contact and the fourth contact are respectively provided with an LA contact surface pad and an LB contact surface pad at the corresponding holes on the welding surface; the third contact and the fourth contact are electrically communicated with the LA contact surface bonding pad and the LB contact surface bonding pad through corresponding holes;
the LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the LA bonding pad and the LB bonding pad of the chip;
and on the welding surface of the single interface strip unit, an antenna LA welding pad and an antenna LB welding pad are respectively arranged at the positions of the third base hole and the fourth base hole, and the third base hole and the fourth base hole enable the third contact and the fourth contact to be electrically communicated with the antenna LA welding pad and the antenna LB welding pad.
The application also provides an intelligent card using the module, which comprises a card base, the module and an antenna coil, wherein the antenna coil is arranged inside the card base, the surface of the card base is provided with a milling groove, and the module is embedded in the milling groove;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with two ends of the antenna coil loop.
Preferably, an antenna LA pad and an antenna LB pad are arranged on the card substrate, and the antenna LA pad and the antenna LB pad are respectively connected to two ends of the antenna coil loop;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with the antenna LA welding pad and the antenna LB welding pad.
Preferably, the antenna LA pad and the antenna LB pad are respectively disposed at two opposite ends of the milled slot on the card base, and the antenna LA pad and the antenna LB pad are respectively disposed at positions corresponding to the antenna LA pad and the antenna LB pad.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are connected to two ends of the antenna coil loop by means of direct wire bonding of an antenna enameled wire.
Preferably, the antenna LA pad and the LB pad are connected to the antenna LA bonding pad and the antenna LB bonding pad by soldering or conductive adhesive.
The application also provides a single interface tape unit, which comprises a base material, wherein one side of the base material is covered with a copper foil, the copper foil is used as a copper foil surface, the copper foil surface is provided with a central area, and 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area; the contacts are mutually electrically isolated through an insulating tape;
a fifth contact is arranged between the C1 contact and the C5 contact, and a sixth contact is arranged between the C3 contact and the C7 contact; wherein the central region is surrounded by an extended copper foil region; the extending copper foil area is an extending copper foil area of the fifth contact, an extending copper foil area of the sixth contact or the combination of the extending copper foil areas of the fifth contact and the sixth contact;
the fifth contact and the sixth contact are isolated by an insulating tape; the fifth contact, the sixth contact and other contacts are respectively isolated by insulation electrification;
holes are formed in the substrate areas corresponding to the fifth contact, the sixth contact, the C1, the C2, the C3, the C5, the C6 and the C7;
and the fifth contact and the sixth contact are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate area.
Preferably, all or part of the holes are provided on the extended copper foil area of the respective contacts.
Preferably, the side where C5-C7 is located is set as the width of the single boundary strip unit, the side where C3 and C7 are located is set as the height of the single boundary strip unit, a coordinate axis is established with the center of the single boundary strip unit as an origin, an axis parallel to the width is set as an x-axis, an axis parallel to the height is set as a y-axis, the actual height of the single boundary strip unit is set as l, the minimum remaining height of the contacts is p, the widths of C2 and C6 are C, the widths of C1, C3, C5 and C7 are d and m, the height of the insulating strip isolating the two contacts is set as s,
the extent of the copper foil zone having the fifth contact disposed between C1 and C5 is:
wherein,
the range of the copper foil zone where the sixth contact is disposed between C3 and C7 is:
wherein,
preferably, wherein either of the fifth or sixth contacts is replaced by an extension of C6 and/or C6 to the adjacent contact.
Preferably, the side where C5, C6 and C7 are located is set as the width of the single boundary strip unit, the side where C3 and C7 are located is set as the height of the single boundary strip unit, a coordinate axis is established by taking the center of the single boundary strip unit as an origin, an axis parallel to the width is taken as an x axis, an axis parallel to the height is taken as a y axis, the actual height of the single boundary strip unit is set as l, the minimum remaining height of the module is h, the widths of C1, C3, C5 and C7 are all d, the widths of C2 and C6 are all C, and the height of the insulating tape isolating the two contacts is s;
the C6 has an extension in the C5 region of:
the C6 has an extension in the C7 region of:
the present application also provides a single interface tape using the above single interface tape unit, wherein the single interface tape is composed of at least two single interface tape units.
The application also provides a module using the single interface strip unit, wherein the module comprises the single interface strip unit and a chip;
the surface of the single interface tape unit, which is opposite to the copper foil surface, is a welding surface, and the chip is arranged on the welding surface;
a contact surface pad is arranged on the welding surface at the position of the hole corresponding to the contact; the holes enable the contacts to be electrically communicated with the corresponding contact surface bonding pads;
the chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which is electrically connected with the contact surface bonding pads of the contacts C1, C2, C3, C5 and C7 correspondingly;
the third contact and the fourth contact are respectively provided with an LA contact surface pad and an LB contact surface pad at the corresponding holes on the welding surface; the third contact and the fourth contact are electrically communicated with the LA contact surface bonding pad and the LB contact surface bonding pad through corresponding holes;
the LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the LA bonding pad and the LB bonding pad of the chip;
and on the welding surface of the single interface strip unit, an antenna LA welding pad and an antenna LB welding pad are respectively arranged at the positions of the third base hole and the fourth base hole, and the third base hole and the fourth base hole enable the third contact and the fourth contact to be electrically communicated with the antenna LA welding pad and the antenna LB welding pad.
The application also provides an intelligent card using the module, which comprises a card base, the module and an antenna coil, wherein the antenna coil is arranged inside the card base, the surface of the card base is provided with a milling groove, and the module is embedded in the milling groove;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with two ends of the antenna coil loop.
Preferably, an antenna LA pad and an antenna LB pad are arranged on the card substrate, and the antenna LA pad and the antenna LB pad are respectively connected to two ends of the antenna coil loop;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with the antenna LA welding pad and the antenna LB welding pad.
Preferably, the antenna LA pad and the antenna LB pad are respectively disposed at two opposite ends of the milled slot on the card base, and the antenna LA pad and the antenna LB pad are respectively disposed at positions corresponding to the antenna LA pad and the antenna LB pad.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are connected to two ends of the antenna coil loop by means of direct wire bonding of an antenna enameled wire.
Preferably, the antenna LA pad and the LB pad are connected to the antenna LA bonding pad and the antenna LB bonding pad by soldering or conductive adhesive.
The gold wire and the card-based antenna of the non-contact interface of the module welding surface are bridged on the expansion areas of the C4, C8 and C6 areas of the module through base material punching, so that the copper foil manufacturing of the welding surface is omitted, the design is not limited in the existing C4, C8 or C6 area of the module, the position of the non-antenna pad of the module is consistent with the existing design, the compatibility is good in the sealing and testing and card manufacturing processes, and the market popularization degree is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art according to the drawings.
Fig. 1 is a schematic diagram of an overall structure of a dual-interface smart card using a single-interface strip in the prior art.
Fig. 2 is a diagram of the positions of the antenna LA land and the antenna LB land on the milled grooves in the present embodiment 1.
Fig. 3 is a structural diagram of an 8pin module in embodiment 1.
Fig. 4 is a structural diagram of the 6pin module in embodiment 2.
Fig. 5 is a structural diagram of the 6pin module in embodiment 3.
Reference numerals:
1 card base 2 module 3 antenna coil 4 chip
5 contact pad 6 antenna LA pad 7 antenna LB pad
8 chip LA pad, 9 chip LB pad, 10 chip contact surface pad
11 third contact 12 fourth contact
21 milled slot 22 antenna LA pad 23 antenna LB pad 24 insulation tape
An extended copper foil section 26 encapsulates a glue field 27, a fifth contact 28 and a sixth contact.
Detailed Description
The technical solutions in the embodiments of the present application are clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The single-interface strip in the application refers to a strip with a copper foil covered on one surface of a base material, a chip is arranged on the other surface of the base material, and the single-interface strip enables the copper foil and the chip to be electrically conducted by arranging an antenna pad hole on the base material.
The modules for the smart card are divided into 8pin module and 6pin module, and their internal structures are shown in fig. 3 and 4, respectively.
Example one
In the present embodiment, an 8-contact smart card is provided, as shown in fig. 1, the smart card includes a card base 1, a module 2, and an antenna coil 3, where the antenna coil 3 is disposed inside the card base 1, a milling groove 21 is disposed on a surface of the card base 1, and the module 2 is embedded in the milling groove 21;
the module 2 comprises a single interface ribbon unit and a chip; the single boundary strip unit is formed by cutting a single boundary strip, namely the single boundary strip is composed of a plurality of single boundary strip units.
The single interface tape unit comprises a base material, wherein one surface of the base material is covered with a copper foil, 8 contacts C1-C8 are arranged on the surface of the copper foil, and the contacts are mutually and electrically isolated through an insulating tape; in this embodiment, the substrate is an epoxy glass substrate.
The module of the intelligent card comprises a single-interface strip unit and a chip 4, wherein the chip 4 is arranged on the other surface of the copper-coated surface of the base material of the single-interface strip; the whole structure of the dual-interface smart card is shown in fig. 1 and fig. 2, and comprises a card base 1, an antenna coil 3 inside the card base 1 and a module 2 embedded on a milling groove 21 of the card base 1;
as shown in fig. 3, the positions and sizes of 8 contacts C1-C8 conform to ISO7816 standard, and holes penetrating through the substrate are arranged on the substrate areas corresponding to the first contact, the second contact, the C1, the C2, the C3, the C5 and the C7 contacts; a contact surface bonding pad of each contact is arranged at the position of the corresponding hole, and the contact surface bonding pad is arranged on the reverse side of the copper foil of the module; the contact is electrically communicated with the contact surface bonding pad through the holes;
in the prior art, C6 was earlier defined as a programming voltage contact point (Vpp), which is now not commonly used, and is only used in the SIM card for SWP interface in practice; while C4 and C8 are reserved and are used in practice for USB high speed interfaces, or other shaped antenna interfaces, and are not used at present.
Thus, we extended C4 to the outer regions of C3, C2 and C1; extending C8 to the outside regions of C7, C6 and C5 to form two extension regions;
in order to enable the module to be read, the height of the module must be larger than a certain reserved height, namely the extension range of the C8 to the C5, the C6 and the C7 is set to be an area from the edge of the module where the C5-C8 are located to the edge which is less than a certain height away from the edge.
Establishing a coordinate axis by taking the center of the module as an origin, setting an axis parallel to the width of the smart card module as an x axis and an axis parallel to the height of the smart card module as a y axis, setting the actual height of the module as l (including insulating tapes on two sides), setting the minimum reserved height of the module as h, the width of the insulating tapes between contacts as s, setting the widths of C2, C3, C6 and C7 as a (excluding the insulating tapes on two sides), and setting the widths of C1, C4, C5 and C8 as b (excluding the insulating tapes on two sides);
then one can get:
the extension range of C8 on C6 and C7 is as follows:the extension at C5 is:
the extension of C6 on C5 was:the extension at C7 is:the extension at C8 is:
the extension range of C4 on C3 and C2 is as follows:the extension of C4 on C1 was:
in this embodiment, the height of the module is 12.6mm, and according to the content defined in ISO/IEC 7816-2, it can be obtained that the minimum reserved height is 9.62mm in order to enable the module to be read by a card reader, wherein the width of the insulating tape 24 electrically isolating the two contacts is 0.15 mm;
the maximum height of the extension region that C8 can provide to C5, C6, C7 is found to be (12.6-9.62)/2-0.15-1.34 mm;
similarly, the maximum height of the extension region that the C4 can set on the C1, C2 and C3 contacts is: (12.6-9.62)/2-0.15 ═ 1.34 mm;
an antenna pad hole is respectively arranged on the epoxy glass substrate of the module which can be provided with the extension areas of the C4 and the C8, in the embodiment, the shape of the antenna pad hole is a circular track shape or an oval shape, and the size of the antenna pad hole is 2.2 x 1 mm; setting one surface of a copper-clad foil on the module as a copper foil surface of the module, and setting one surface of the copper-clad foil on the module as a welding surface, and setting an antenna LA welding pad 6 and an antenna LB welding pad 7 at an antenna pad hole on the welding surface of the module;
the chip 4 is provided with a chip LA pad 8, a chip LB pad 9 and 5 chip contact surface pads 10 which are connected with the contact surface pads 5 of the contacts C1, C2, C3, C5 and C7;
the antenna coil 3 is provided with an antenna LA land 22 and an antenna LB land 23 on both sides of the milled groove 21, and the antenna LA land 22 and the antenna LB land 23 are respectively connected to both ends of a loop of the antenna coil 3.
The antenna LA bonding pad 6 and the antenna LB bonding pad 7 on the module 2 are electrically connected to the antenna LA bonding pad 8 and the antenna LB bonding pad 9 on the antenna coil 3, respectively.
Contact surface pads of contacts where the antenna LA welding pad 6 and the antenna LB welding pad 7 are located are electrically connected with the chip LA welding pad 8 and the chip LB welding pad 9 respectively;
the antenna LA welding pad 8 and the antenna LB welding pad 9 are respectively arranged at two ends of the milling groove 21, and the antenna LA welding pad and the antenna LB welding pad correspond to the antenna LA welding pad and the antenna LB welding pad in position.
The pads formed on the module 2 and the chip 4 conform to the ISO7816 standard.
And C8 is subjected to the same design change as C4, and when the height of the module is greater than the minimum reserved height, the module extends to the contact areas of C7, C6 and C5 to form an extension area, a hole is punched in the extension area, an antenna LB welding pad is arranged at the position of the punched hole on the welding surface of the module, and another bridge is formed.
With the above arrangement, the antenna LA pad 6, the antenna LB pad 7, and the contact pad 5 are naturally electrically connected to the circuit by the copper foil, and bridge the chip 4 and the antenna coil 3.
In addition to bonding the contact pads of C1, C2, C3, C5, C7 to the corresponding chip contact pads by gold wire bonding during module packaging, chip LA pad 8 is also electrically connected to the contact pad of C8 by gold wire (or other means). The LB pads 9 of the chip are also electrically connected to the C4 contact pad.
In the encapsulating process, the chip is covered on the welding surface of the module 2 by using encapsulating glue, and the gold wires, the contact surface pads of C1, C2, C3, C5, C6, C7, C4 and C8 are encapsulated and cured, so that the rest parts including the antenna LA welding pad 6 are exposed, and the antenna LB welding pad 7 is exposed. And (5) after the module is packaged, carrying out a testing procedure.
And finally, the antenna LA welding pad 6 and the antenna LB welding pad 7 of the module 2 are respectively and electrically connected with the antenna LA welding pad 22 and the antenna LB welding pad 23 of the antenna coil 3 by welding or other methods, the module 2 is flatly embedded in the milling groove 21 and is adhered and fixed on the surface of the card substrate, and the antenna connecting part is hidden.
As an alternative, any of the two bridges of C4 and C8 of the above embodiments may be replaced by a C6 contact, in which case one of the LA pads or LB pads of the chip is electrically connected to the contact pad of C6 by gold wire bonding or the like.
When using C6 contacts instead, in the case of a module having a height greater than the minimum retention height, a bridge may be formed by punching out the C6 contact or C6 onto an extension of the adjacent contact.
The connection between the antenna LA and the antenna LB pad on the module and the antenna LA and the antenna LB pad on the module may be performed by other methods than welding, such as conductive adhesive connection, or by direct welding of enameled wires of the antenna (omitting the antenna LA and the antenna LB pad).
If the design size also takes into account other industry standards that the card must comply with, then the size is calculated to be otherwise compatible.
Example two:
the double-interface smart card in the embodiment adopts a 6pin module, and the 6pin module comprises a single-interface strip unit and a chip; the single boundary strip unit is formed by cutting a single boundary strip, namely the single boundary strip is composed of a plurality of single boundary strip units.
A central area is arranged at the center of the single-interface strip unit used by the 6pin module, 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area, wherein a copper foil area of the C5 contact surrounds the central area; the contacts are mutually electrically isolated through an insulating tape;
a separate metal contact 11 (i.e., a third contact) is provided between C1 and C5;
a separate metal contact 12 (i.e., a fourth contact) is provided between C3 and C7, the third and fourth contacts being indicated by the shaded portions in fig. 4; the third contact 11 and the fourth contact 12 are electrically isolated from the other contacts by insulation.
Contact surface pads 5 are also arranged on the third contact 11, the fourth contact 12 and other 6 contacts respectively;
base holes are respectively arranged on the base materials of the third contact 11 and the fourth contact 12, and an antenna LA welding pad 6 and an antenna LB welding pad 7 are respectively arranged on the two base holes;
for example, the contact pad 5 of C1, C2, C3, C5, C7 is electrically connected to the corresponding chip contact pad 10 on the chip 4; the contact surface bonding pads 5 of the contacts where the antenna LA bonding pad 6 and the antenna LB bonding pad 7 are located are electrically connected with the chip LA bonding pad 8 and the chip LB bonding pad 9 respectively;
the antenna LA pad 6 and the antenna LB pad 7 are electrically connected to the antenna LA pad 22 and the antenna LB pad 23, respectively.
Wherein, the edge where C5-C7 is located is set as the width of a single boundary strip unit, the edge where C3 and C7 are located is set as the height of the single boundary strip unit, a coordinate axis is established by taking the center of the single boundary strip unit as an origin, an axis parallel to the width is taken as an x axis, an axis parallel to the height is taken as a y axis, the actual height of the single boundary strip unit is set as l (including insulating strips on two sides), the minimum remaining height of the contact is p, the widths of C2 and C6 are C (excluding insulating strips on two sides), the widths of C1, C3, C5 and C7 are d (excluding insulating strips on two sides) and m (excluding insulating strips on two sides), and the height of the insulating strip for isolating two contacts is s,
the range with the third contact is:
wherein,
the range of the fourth contact is:
wherein,
the minimum allowable height of each contact point defined according to ISO/IEC 7816-2 is 2.0mm, the minimum reserved height is 9.62mm, the maximum height of the third contact point 11 and the fourth contact point 12 can be calculated to be 9.62-2 x 2-2 x 0.15-5.32 mm, and the third contact point 11 arranged between C1 and C5 evenly divides C1 and C5; the fourth contact 12 disposed between C3 and C7 evenly divides C3 and C7 equally, the width of the third contact 11 is the width of C1, and the width of the fourth contact 12 is the width of C3.
The size of the antenna LA, LB solder pads is set to an oval or racetrack loop with a length and width of 1.5 × 0.8mm, respectively.
Other methods of gold wire bonding of contacts, encapsulation of the module, placement of the antenna LA, LB pads on the card substrate, connection of the module and card antenna, etc. are the same as the 8-contact dual-interface smart card embodiment.
In the above method, as another alternative, it is also possible if any one of the two bridge regions is replaced by a bridge of C6. With its corresponding antenna LA or LB bond pad disposed on the opposite side of the C6 copper foil section.
In this case, if necessary, the area of C5 and C7 may be extended as appropriate from C6 and its bonding pads, and similarly to the embodiment, the edge where C5, C6 and C7 are located on the dual-interface smart card is set as the width of the module, the edge where C3 and C7 are located is set as the height of the module, a coordinate axis is established with the center of the module as the origin, an axis parallel to the width is set as the x-axis, an axis parallel to the height is set as the y-axis, the actual height of the module is set as l, the minimum retention height of the module is h (the minimum retention height is referred to fig. 3), the widths of C1, C3, C5 and C7 are d (excluding the insulating tapes on both sides), and the widths of C2 and C6 are C (excluding the insulating tapes on both sides);
the C6 has an extension in the C5 region of:
the C6 has an extension in the C7 region of:
if the design size of the bridge area also needs to be compatible with other industry standards, the size is calculated additionally.
Example three:
the dual-interface smart card in this embodiment adopts a 6pin module, as shown in fig. 5, there are 6 total contacts of C1, C2, C3, C5, C6, and C7, the copper foil surface of the 6pin module is provided with a central area, and 6 total contacts of C1, C2, C3, C5, C6, and C7 are provided around the central area; the contacts are mutually electrically isolated through an insulating tape;
a fifth contact 27 is provided between the C1 contact and the C5 contact, and a sixth contact 28 is provided between the C3 and the C7; wherein the central region is surrounded by an extended copper foil region 25; the extended copper foil area 25 can be an extended copper foil area of the fifth contact, an extended copper foil area of the sixth contact, or a combination of the extended copper foil areas of the fifth contact and the sixth contact;
the fifth contact and the sixth contact are isolated by insulation electrification; the fifth contact, the sixth contact and other contacts are respectively isolated by insulation electrification.
In fig. 5 is shown the case where the extended copper foil area 25 surrounding the central area is the copper foil area of the fifth contact 27 in its entirety, in which case the fifth contact 27, the sixth contact 28 and the 6 other contact areas are provided with contact surface pads, respectively; base holes are respectively arranged on the base materials corresponding to the fifth contact 27 and the sixth contact 28, and antenna LA and LB welding pads are respectively arranged on the two base holes;
as can be seen from fig. 5, the hole where the contact pad of the fifth contact is located is disposed on the extended copper foil area, and all or a part of the hole may also be disposed on the extended copper foil area of the corresponding contact, in this embodiment, for packaging convenience, the contact pad is disposed in the encapsulating glue range 26, and the antenna LA, LB solder pad is disposed outside the encapsulating glue range 26.
Similarly, in the second embodiment, the contact surface pads 5 of C1, C2, C3, C5 and C7 are electrically connected to the corresponding chip contact surface pads on the chip 4 respectively; contact surface bonding pads of contacts where the antenna LA and the antenna LB welding bonding pads are located are electrically connected with the chip LA and the chip LB bonding pads respectively;
the antenna LA and the antenna LB welding pads are respectively and electrically connected with the antenna LA and the antenna LB welding pads.
Wherein, the edge where C5-C7 is located is set as the width of a single boundary strip unit, the edge where C3 and C7 are located is set as the height of the single boundary strip unit, a coordinate axis is established by taking the center of the single boundary strip unit as an origin, an axis parallel to the width is set as an x-axis, an axis parallel to the height is set as a y-axis, the actual height of the single boundary strip unit is set as l (including insulating strips on two sides), the minimum remaining height of a contact is p (excluding insulating strips on two sides), the widths of C2 and C6 are C (excluding insulating strips on two sides), the widths of C1, C3, C5 and C7 are d (excluding insulating strips on two sides) and m (excluding insulating strips on two sides), and the height of the insulating strip separating two contacts is set as s,
then there is a fifth contact in the range between C1 and C5:
wherein,
the range of the sixth contact between C3 and C7 is:wherein,
other methods of gold wire bonding of contacts, encapsulation of the module, placement of the antenna LA, LB pads on the card substrate, connection of the module and card antenna, etc., are the same as in the embodiments.
In the above method, as another alternative, it is also possible if any one of the two bridge regions is replaced by a bridge of C6. With its corresponding antenna LA or LB bond pad disposed on the opposite side of the C6 copper foil section.
In this case, if necessary, the C6 and its bonding pad may also be extended to the copper foil area of C5 and C7, and the specific extension range is the same as that of the embodiment.
If the design size of the bridge area also needs to be compatible with other industry standards, the size is calculated additionally.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts.
Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application. It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (32)
1. A single interface tape unit comprises a base material, wherein one surface of the base material is covered with a copper foil as a copper foil surface, 8 contacts of C1-C8 are arranged on the copper foil surface, and the contacts are mutually and electrically isolated through an insulating tape;
any two contacts of C4, C6 and C8 are taken as a first contact and a second contact; holes are arranged on the substrate areas corresponding to the first contact, the second contact, the C1, the C2, the C3, the C5 and the C7;
the areas where the first contact and the second contact are located respectively extend towards the adjacent contacts to form a first extension area and a second extension area; and the substrate areas corresponding to the first extension area and the second extension area are respectively provided with a first base hole and a second base hole.
2. The single interface tape unit of claim 1, wherein the edge where the C5-C8 contact is located is set as the width of the single interface tape unit, the edge where the C1 and C5 are located is set as the height of the single interface tape unit, a coordinate axis is established with the center of the single interface tape unit as an origin, an axis parallel to the width is set as an x-axis, an axis parallel to the height is set as a y-axis, the actual height of the single interface tape unit is set as l, the minimum remaining height of the single interface tape unit is set as h, the widths of C2, C3, C6 and C7 are all a, the widths of C1, C4, C5 and C8 are all b, and the height of the insulating tape separating the two contacts is set as s;
then one can get:
the extension range of C8 on C6 and C7 is as follows:the extension at C5 is:
the extension of C6 on C5 was:the extension at C7 is:the extension at C8 is:
the extension range of C4 on C3 and C2 is as follows:extension of C4 on C1The extension range is as follows:
3. a single interface tape using the single interface tape unit according to claim 1 or 2, wherein the single interface tape is composed of at least two single interface tape units.
4. A module using the single interface tape unit according to claim 1 or 2, wherein the module comprises the single interface tape unit and a chip;
the surface of the single-interface strip unit, which is opposite to the copper foil surface, is a welding surface, and the chip is arranged on the welding surface;
a contact surface bonding pad is arranged at the position of a hole corresponding to the contact on the welding surface, and the hole enables the contact to be electrically communicated with the corresponding contact surface bonding pad;
the chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which is electrically connected with the contact surface bonding pads of the contacts C1, C2, C3, C5 and C7 correspondingly;
setting the contact surface bonding pads of the first contact and the second contact as an LA contact surface bonding pad and an LB contact surface bonding pad respectively;
the LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the LA bonding pad and the LB bonding pad of the chip;
an antenna LA welding pad and an antenna LB welding pad are respectively arranged at the positions of the first base hole and the second base hole on the welding surface of the single interface strip unit; the first and second base holes electrically communicate the first and second contacts with the antenna LA and LB bonding pads.
5. A smart card using the module of claim 4, comprising a card base, a module and an antenna coil, wherein the antenna coil is arranged in the card base, the surface of the card base is provided with a milled groove, and the module is embedded in the milled groove;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with two ends of the antenna coil loop.
6. The smart card of claim 5, wherein an antenna LA pad and an antenna LB pad are provided on the card base, the antenna LA pad and the antenna LB pad being respectively connected to both ends of the antenna coil loop;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with the antenna LA welding pad and the antenna LB welding pad.
7. The smart card of claim 6, wherein the antenna LA pad and the antenna LB pad are disposed at opposite ends of a milled slot on the card base, respectively, the antenna LA pad and the antenna LB pad being disposed at positions corresponding to the antenna LA pad and the antenna LB pad, respectively.
8. The smart card of claim 5, wherein the antenna LA solder pad and the antenna LB solder pad are connected with two ends of the antenna coil loop by means of direct wire bonding of antenna enameled wires.
9. The smart card of claim 6, wherein the antenna LA solder pads and the LB solder pads are connected with the antenna LA solder pads and the antenna LB solder pads by soldering or conductive adhesive connection.
10. A single boundary strip unit comprises a base material, wherein one side of the base material is covered with a copper foil, the base material is used as a copper foil side, the copper foil side is provided with a central area, 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area, and the copper foil area of the C5 contact surrounds the central area; the contacts are mutually electrically isolated through an insulating tape;
a third contact is arranged between the C1 contact and the C5 contact, and a fourth contact is arranged between the C3 contact and the C7 contact; the third contact, the fourth contact and other contacts are respectively isolated by insulation electrification;
holes are formed in the substrate areas corresponding to the third contact, the fourth contact, the C1, the C2, the C3, the C5 and the C7;
and the third contact and the fourth contact are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate area.
11. The single boundary tape unit as claimed in claim 10, wherein the side where C5-C7 is located is set as the width of the single boundary tape unit, the side where C3, C7 are located is set as the height of the single boundary tape unit, a coordinate axis is established with the center of the single boundary tape unit as the origin, an axis parallel to the width is set as the x-axis, an axis parallel to the height is set as the y-axis, the actual height of the single boundary tape unit is set as l, the minimum remaining height of the contacts is p, the widths of C2 and C6 are C, the widths of C1, C3, C5, C7 are d, the height of the insulating tape separating the two contacts is set as m, and the height of the insulating tape separating the two contacts is set as s,
the range with the third contact is:
wherein,
the range of the fourth contact is:wherein,
12. the single interface tape unit of claim 10, wherein either of the third contact or the fourth contact is replaced with an extension of C6 and/or C6 to an adjacent contact.
13. The single boundary strip unit of claim 12, wherein the sides of C5, C6 and C7 are set as the width of the single boundary strip unit, the sides of C3 and C7 are set as the height of the single boundary strip unit, a coordinate axis is established with the center of the single boundary strip unit as the origin, an axis parallel to the width is taken as an x-axis, an axis parallel to the height is taken as a y-axis, the actual height of the single boundary strip unit is set as l, the minimum remaining height of the module is h, the widths of C1, C3, C5 and C7 are d, the widths of C2 and C6 are C, and the height of the insulating strip separating the two contacts is s;
the C6 has an extension in the C5 region of:
the C6 has an extension in the C7 region of:
14. a single interface tape using the single interface tape unit according to any one of claims 10 to 13, wherein the single interface tape is composed of at least two single interface tape units.
15. A module using the single interface tape unit as claimed in any one of claims 10 to 13, wherein the module comprises the single interface tape unit and a chip;
the surface of the single interface tape unit, which is opposite to the copper foil surface, is a welding surface, and the chip is arranged on the welding surface;
a contact surface pad is arranged on the welding surface at the position of the hole corresponding to the contact; the holes enable the contacts to be electrically communicated with the corresponding contact surface bonding pads;
the chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which is electrically connected with the contact surface bonding pads of the contacts C1, C2, C3, C5 and C7 correspondingly;
the third contact and the fourth contact are respectively provided with an LA contact surface pad and an LB contact surface pad at the corresponding holes on the welding surface; the third contact and the fourth contact are electrically communicated with the LA contact surface bonding pad and the LB contact surface bonding pad through corresponding holes;
the LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the LA bonding pad and the LB bonding pad of the chip;
and on the welding surface of the single interface strip unit, an antenna LA welding pad and an antenna LB welding pad are respectively arranged at the positions of the third base hole and the fourth base hole, and the third base hole and the fourth base hole enable the third contact and the fourth contact to be electrically communicated with the antenna LA welding pad and the antenna LB welding pad.
16. A smart card using the module of claim 15, comprising a card base, a module and an antenna coil, wherein the antenna coil is arranged in the card base, the surface of the card base is provided with a milled groove, and the module is embedded in the milled groove;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with two ends of the antenna coil loop.
17. The smart card of claim 16, wherein an antenna LA pad and an antenna LB pad are provided on the card base, the antenna LA pad and the antenna LB pad being connected to both ends of the antenna coil loop, respectively;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with the antenna LA welding pad and the antenna LB welding pad.
18. The smart card of claim 17, wherein the antenna LA pad and the antenna LB pad are disposed at opposite ends of a milled slot on the card base, respectively, and the antenna LA pad and the antenna LB pad are disposed at positions corresponding to the antenna LA pad and the antenna LB pad, respectively.
19. The smart card of claim 16, wherein the antenna LA bonding pad and the antenna LB bonding pad are connected to both ends of the antenna coil loop by means of direct wire bonding of antenna enameled wires.
20. The smart card of claim 17, wherein the antenna LA pad and the LB pad are connected to the antenna LA pad and the antenna LB pad by soldering or conductive adhesive connection.
21. A single boundary strip unit comprises a base material, wherein one side of the base material is covered with a copper foil to serve as a copper foil side, the copper foil side is provided with a central area, and 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area; the contacts are mutually electrically isolated through an insulating tape;
a fifth contact is arranged between the C1 contact and the C5 contact, and a sixth contact is arranged between the C3 contact and the C7 contact; wherein the central region is surrounded by an extended copper foil region; the extending copper foil area is an extending copper foil area of the fifth contact, an extending copper foil area of the sixth contact or the combination of the extending copper foil areas of the fifth contact and the sixth contact;
the fifth contact and the sixth contact are isolated by an insulating tape; the fifth contact, the sixth contact and other contacts are respectively isolated by insulation electrification;
holes are formed in the substrate areas corresponding to the fifth contact, the sixth contact, the C1, the C2, the C3, the C5, the C6 and the C7;
and the fifth contact and the sixth contact are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate area.
22. The single interface tape unit of claim 21, wherein all or part of the holes are provided on the extended copper foil section of the respective contacts.
23. The single boundary strip unit as claimed in claim 21, wherein the side where C5-C7 is located is set as the width of the single boundary strip unit, the side where C3 and C7 are located is set as the height of the single boundary strip unit, a coordinate axis is established with the center of the single boundary strip unit as an origin, an axis parallel to the width is set as an x-axis, an axis parallel to the height is set as a y-axis, the actual height of the single boundary strip unit is set as l, the minimum remaining height of the contacts is p, the widths of C2 and C6 are C, the widths of C1, C3, C5 and C7 are d and the height of the insulating strip separating the two contacts is set as m,
the extent of the copper foil zone having the fifth contact disposed between C1 and C5 is:
wherein,
the range of the copper foil zone where the sixth contact is disposed between C3 and C7 is:
wherein,
24. the single interface tape unit of claim 21, wherein either of the fifth contact or the sixth contact is replaced with an extension of C6 and/or C6 to an adjacent contact.
25. The single boundary strip unit of claim 24, wherein the edge on which C5, C6, C7 are located is set as the width of the single boundary strip unit, the edge on which C3, C7 are located is set as the height of the single boundary strip unit, a coordinate axis is established with the center of the single boundary strip unit as the origin, an axis parallel to the width is set as an x-axis, an axis parallel to the height is set as a y-axis, the actual height of the single boundary strip unit is set as l, the minimum remaining height of the module is h, the widths of C1, C3, C5, C7 are d, the widths of C2, C6 are C, and the height of the insulating strip isolating the two contacts is s;
the C6 has an extension in the C5 region of:
the C6 has an extension in the C7 region of:
26. a single interface tape using the single interface tape unit of any one of claims 22-25, wherein the single interface tape is composed of at least two single interface tape units.
27. A module using the single interface tape unit of any one of claims 22-25, wherein the module comprises the single interface tape unit and a chip;
the surface of the single interface tape unit, which is opposite to the copper foil surface, is a welding surface, and the chip is arranged on the welding surface;
a contact surface pad is arranged on the welding surface at the position of the hole corresponding to the contact; the holes enable the contacts to be electrically communicated with the corresponding contact surface bonding pads;
the chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which is electrically connected with the contact surface bonding pads of the contacts C1, C2, C3, C5 and C7 correspondingly;
the third contact and the fourth contact are respectively provided with an LA contact surface pad and an LB contact surface pad at the corresponding holes on the welding surface; the third contact and the fourth contact are electrically communicated with the LA contact surface bonding pad and the LB contact surface bonding pad through corresponding holes;
the LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the LA bonding pad and the LB bonding pad of the chip;
and on the welding surface of the single interface strip unit, an antenna LA welding pad and an antenna LB welding pad are respectively arranged at the positions of the third base hole and the fourth base hole, and the third base hole and the fourth base hole enable the third contact and the fourth contact to be electrically communicated with the antenna LA welding pad and the antenna LB welding pad.
28. A smart card using the module of claim 27, comprising a card base, a module and an antenna coil, wherein the antenna coil is arranged in the card base, the surface of the card base is provided with a milled groove, and the module is embedded in the milled groove;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with two ends of the antenna coil loop.
29. The smart card of claim 28, wherein an antenna LA pad and an antenna LB pad are provided on the card base, the antenna LA pad and the antenna LB pad being connected to both ends of the antenna coil loop, respectively;
the antenna LA welding pad and the antenna LB welding pad are respectively and electrically connected with the antenna LA welding pad and the antenna LB welding pad.
30. The smart card of claim 29, wherein the antenna LA pad and the antenna LB pad are disposed at opposite ends of a milled slot on the card base, respectively, and the antenna LA pad and the antenna LB pad are disposed at positions corresponding to the antenna LA pad and the antenna LB pad, respectively.
31. The smart card of claim 28, wherein the antenna LA bond pad and the antenna LB bond pad are connected to both ends of the antenna coil loop by means of direct wire bonding of antenna coated wires.
32. The smart card of claim 29, wherein the antenna LA pad and the LB pad are connected to the antenna LA pad and the antenna LB pad by soldering or conductive adhesive connection.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810942969.9A CN108764436B (en) | 2018-08-17 | 2018-08-17 | Single-interface strip unit, single-interface strip, module and smart card |
| PCT/CN2019/099598 WO2020034885A1 (en) | 2018-08-17 | 2019-08-07 | Single interface stripe unit, single interface stripe, module and smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810942969.9A CN108764436B (en) | 2018-08-17 | 2018-08-17 | Single-interface strip unit, single-interface strip, module and smart card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108764436A true CN108764436A (en) | 2018-11-06 |
| CN108764436B CN108764436B (en) | 2024-07-02 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020034885A1 (en) * | 2018-08-17 | 2020-02-20 | 恒宝股份有限公司 | Single interface stripe unit, single interface stripe, module and smart card |
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| CN208781268U (en) * | 2018-08-17 | 2019-04-23 | 恒宝股份有限公司 | A kind of list interface stripe cell, single interface band, module and smart card |
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| FR2947392B1 (en) * | 2009-06-29 | 2019-05-10 | Idemia France | METHOD FOR ELECTRICALLY CONNECTING TWO ORGANS BETWEEN THEM |
| CN103199024B (en) * | 2012-12-31 | 2016-06-01 | 深圳市华鑫精工机械技术有限公司 | The manufacture method of a kind of double-interface card and production equipment |
| CN108764436B (en) * | 2018-08-17 | 2024-07-02 | 恒宝股份有限公司 | Single-interface strip unit, single-interface strip, module and smart card |
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| US20150269476A1 (en) * | 2012-10-15 | 2015-09-24 | Smart Packaging Solutions | Simplified electronic module for a smart card with a dual communication interface |
| CN205845082U (en) * | 2016-06-17 | 2016-12-28 | 北京同方微电子有限公司 | A kind of Novel double-interface smart card band |
| CN206639242U (en) * | 2017-04-14 | 2017-11-14 | 恒宝股份有限公司 | A kind of double-interface smart card using single interface band |
| CN208781268U (en) * | 2018-08-17 | 2019-04-23 | 恒宝股份有限公司 | A kind of list interface stripe cell, single interface band, module and smart card |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020034885A1 (en) * | 2018-08-17 | 2020-02-20 | 恒宝股份有限公司 | Single interface stripe unit, single interface stripe, module and smart card |
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| Publication number | Publication date |
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| CN108764436B (en) | 2024-07-02 |
| WO2020034885A1 (en) | 2020-02-20 |
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