TWM451488U - Assembly structure of LED lamp and heat dissipation plate - Google Patents
Assembly structure of LED lamp and heat dissipation plate Download PDFInfo
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- TWM451488U TWM451488U TW101220060U TW101220060U TWM451488U TW M451488 U TWM451488 U TW M451488U TW 101220060 U TW101220060 U TW 101220060U TW 101220060 U TW101220060 U TW 101220060U TW M451488 U TWM451488 U TW M451488U
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- heat dissipation
- dissipation plate
- led lamp
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Description
本創作係與LED有關,特別是一種LED燈與散熱板之組合結構。This creation is related to LEDs, especially a combination of LED lights and heat sinks.
為了節能省碳現在市面上有許多的LED燈,這些LED燈雖然達到了省電照明的功能可是LED燈的散熱卻始終是一個很大的問題。目前的做法是以金屬鑄造的方式直接做出散熱板或是以多個金屬板焊接連結的方式做出散熱板,然後再將散熱板的一側塗上散熱膏再黏合於電路板的一側來做為散熱之用。因為熱能無法有效的透過塑膠的電路板傳導到散熱板所以這些做法不僅效果不佳而且鑄造的散熱板成本太高,焊接的散熱板製成太過繁瑣,導熱效果也因為板材不連續所以又不好,因此也造成LED燈的製造成本提高失去市場的競爭力。In order to save energy and save carbon, there are many LED lights on the market. Although these LED lights have achieved the function of power-saving lighting, the heat dissipation of LED lights is always a big problem. The current practice is to directly make a heat sink by means of metal casting or to make a heat sink by soldering a plurality of metal plates, and then apply one side of the heat sink to the heat sink paste and then adhere to one side of the circuit board. To use as a heat sink. Because the thermal energy can not be effectively transmitted to the heat sink through the plastic circuit board, these practices are not only ineffective, but also the cost of the cast heat sink is too high. The welded heat sink is too cumbersome to make the heat conduction effect because the plate is not continuous. Well, it also causes the manufacturing cost of LED lights to increase and lose market competitiveness.
有鑑於上述缺失,本創作之主要目的在於提供一種製成簡便,導熱效果佳的LED燈與散熱板之組合結構。In view of the above-mentioned shortcomings, the main purpose of the present invention is to provide a combination structure of an LED lamp and a heat sink which are easy to manufacture and have good heat conduction effect.
為達成上述目的,本創作所提供之LED燈與散熱板之組合結構以金屬板直接彎折成具有複數凸起立面之立體散熱板,再將該散熱板透過一金屬連接件與電路板結合固定,使散熱板可以透過金屬連接件接收來自於LED所產 生的熱而達到散熱的目的。In order to achieve the above object, the combination structure of the LED lamp and the heat dissipation plate provided by the creation is directly bent into a three-dimensional heat dissipation plate having a plurality of convex elevations, and the heat dissipation plate is fixed to the circuit board through a metal connecting member. So that the heat sink can receive the light from the LED through the metal connector The heat is generated to achieve the purpose of heat dissipation.
為能詳細說明本創作之特徵及功效,以下茲舉二實施例並配合圖式說明如下。In order to explain the features and functions of the present invention in detail, the following embodiments are described below with reference to the drawings.
如第一圖至第四圖所示,為本創作LED燈與散熱板之組合結構之第一實施例,包含有:As shown in the first to fourth figures, the first embodiment of the combined structure of the LED lamp and the heat sink is:
一散熱板10,係由金屬板彎折成型,該金屬板可是鐵、銅、鋁、合金等等金屬材料所製成,彎折後使該散熱板具有複數凸起立面11的立體結構並且該散熱板上設有複數固定孔,該等固定孔是於該金屬板上直接沖孔成型。該散熱板可以由單一金屬板一體彎折成型也可以由多個金屬板彎折後再組合成型,其組合的方式可以是鉚接、螺接、焊接或黏合等等。在本創作的第一實施例中該散熱板是由一長型金屬板連續彎折而形成複數個朝外彎折呈放射狀的立面,並且於其中複數立面的一側彎折有一凸耳12,該凸耳處設有一固定孔13,該固定孔是由該凸耳直接沖孔或鑽孔成型。a heat dissipation plate 10 is formed by bending a metal plate, which may be made of a metal material such as iron, copper, aluminum, alloy, etc., and the heat dissipation plate has a three-dimensional structure of a plurality of convex elevation faces 11 after bending and The fixing plate is provided with a plurality of fixing holes, and the fixing holes are directly punched and formed on the metal plate. The heat dissipating plate may be integrally bent by a single metal plate or may be formed by bending a plurality of metal plates and then combined, and the combination may be riveting, screwing, welding or bonding. In the first embodiment of the present invention, the heat dissipation plate is continuously bent by a long metal plate to form a plurality of outwardly bent and radially curved façades, and a convex portion is bent on one side of the plurality of façades. The ear 12 is provided with a fixing hole 13 formed by directly punching or drilling the lug.
一電路板20,該電路板的正面設有電路以及至少一LED21,該電路板上對應於該散熱板固定孔13的位置設有貫孔22。A circuit board 20 is disposed on the front surface of the circuit board and at least one LED 21. The circuit board is provided with a through hole 22 corresponding to the position of the heat dissipation plate fixing hole 13.
複數金屬連接件30,設於該散熱板固定孔13與該電路板的貫孔22處,該散熱板10係透過該等金屬連接件的結合而固定設於該電路板20的背面。該金屬連接件可以是鉚釘或是螺栓。The plurality of metal connectors 30 are disposed on the heat dissipation plate fixing holes 13 and the through holes 22 of the circuit board. The heat dissipation plate 10 is fixedly disposed on the back surface of the circuit board 20 through the combination of the metal connectors. The metal connector can be a rivet or a bolt.
一燈罩40,具有一環形本體以及該環形本體中間的透空部,該電路板20係設於該燈罩內而該散熱板10則穿過該透空部而外露於該燈罩外。A lamp cover 40 has an annular body and a hollow portion in the middle of the annular body. The circuit board 20 is disposed in the lamp cover, and the heat dissipation plate 10 passes through the transparent portion to be exposed outside the lamp cover.
以本創作第一實施例的結構,透過鉚釘的鉚合或是螺栓的螺合可以將散熱板直接與電路板固定連結,並且由於於該等金屬連接件是由該電路板的背面穿透至該電路板的正面,所以當該電路板上的LED發光而產生熱時,金屬連接件可以接受這些熱並且將熱直接傳導到與該等金屬連接件連接的散熱板來散熱。又因為本創作中該散熱板是由一金屬板一體彎折成型所以在熱的傳導效果上會比多個金屬板連結而成的散熱板好。在製成上又會比鑄造成型的金屬板簡單、便宜。In the structure of the first embodiment of the present invention, the heat sink can be directly fixed to the circuit board through the riveting of the rivet or the screwing of the bolt, and since the metal connectors are penetrated from the back side of the circuit board to The front side of the board, so when the LEDs on the board illuminate to generate heat, the metal connectors can accept the heat and conduct heat directly to the heat sink connected to the metal connectors for heat dissipation. Moreover, since the heat sink is integrally bent by a metal plate in the present creation, the heat transfer effect is better than that of the heat sink which is connected by a plurality of metal plates. It is simpler and cheaper to produce than a cast metal plate.
如第五圖及第六圖所示,為本創作LED燈與散熱板之組合結構之第二實施例,包含有:As shown in the fifth and sixth figures, the second embodiment of the combined structure of the LED lamp and the heat sink is:
一散熱板10,係由金屬板彎折成型,使該散熱板具有複數凸起立面11的立體結構並且該散熱板上設有複數固定孔,該等固定孔是於該金屬板上直接沖孔成型,該散熱板可以由一金屬板一體彎折成型也可以由多個金屬板彎折後再結合成型,金屬板的結合方式可以為鉚接、螺接、焊接或黏合。在本實施例中該散熱板是由一金屬板沖壓彎折成複數凹凸間隔交錯的肋部,各肋部包含有二立面11以及位於二立面之間的一橫向面14,並且該散熱板於各橫向面處設有固定孔13,該等固定孔是由該金屬板直接沖孔或鑽孔成型。A heat dissipating plate 10 is formed by bending a metal plate so that the heat dissipating plate has a three-dimensional structure of a plurality of convex façades 11 and the plurality of fixing holes are disposed on the heat dissipating plate, and the fixing holes are directly punched in the metal plate Forming, the heat dissipating plate may be integrally bent by a metal plate or may be formed by bending a plurality of metal plates, and the metal plate may be riveted, screwed, welded or bonded. In the embodiment, the heat dissipation plate is stamped and bent into a plurality of concave and convex ribs by a metal plate, and each rib includes two vertical faces 11 and a lateral surface 14 between the two vertical faces, and the heat dissipation is performed. The plate is provided with fixing holes 13 at each lateral surface, and the fixing holes are directly punched or drilled by the metal plate.
一電路板20,該電路板的正面設有電路以及至少一LED21,該電路板上對應於該散熱板固定孔13的位置設有貫孔22。A circuit board 20 is disposed on the front surface of the circuit board and at least one LED 21. The circuit board is provided with a through hole 22 corresponding to the position of the heat dissipation plate fixing hole 13.
複數金屬連接件30,設於該散熱板固定孔13與該電路板的貫孔22處,該散熱板10係透過該等金屬連接件30的結合而固定設於該電路板20的背面。該金屬連接件可以是鉚釘或是螺栓。The plurality of metal connectors 30 are disposed on the heat dissipation plate fixing holes 13 and the through holes 22 of the circuit board. The heat dissipation plate 10 is fixedly disposed on the back surface of the circuit board 20 through the combination of the metal connectors 30. The metal connector can be a rivet or a bolt.
一燈罩40,具有一環形本體以及該環形本體中間的透空部,該電路板20係設於該燈罩內而該散熱板10則穿過該透空部而外露於該燈罩外。A lamp cover 40 has an annular body and a hollow portion in the middle of the annular body. The circuit board 20 is disposed in the lamp cover, and the heat dissipation plate 10 passes through the transparent portion to be exposed outside the lamp cover.
本創作第二實施中該散熱板與電路板的連接方式與前一實施例相同。所以當該電路板上的LED發光而產生熱時,金屬連接件可以接受這些熱並且將熱直接傳導到與該等金屬連接件連接的散熱板來散熱。又因為本創作中該散熱板是由一金屬板一體彎折成型所以在熱的傳導效果上會比多個金屬板連結而成的散熱板好。在製成上又會比鑄造成型的金屬板簡單、便宜。In the second implementation of the present invention, the heat sink is connected to the circuit board in the same manner as the previous embodiment. Therefore, when the LEDs on the board emit light to generate heat, the metal connectors can receive the heat and conduct the heat directly to the heat sink connected to the metal connectors for heat dissipation. Moreover, since the heat sink is integrally bent by a metal plate in the present creation, the heat transfer effect is better than that of the heat sink which is connected by a plurality of metal plates. It is simpler and cheaper to produce than a cast metal plate.
在本創作中該散熱板上固定孔的設置數量並無特定限制,如第一實例中該等凸耳與固定孔是每間隔一彎折就設置一凸耳與固定孔。而於第二實施例中則是每一橫向面上都設有一固定孔。In the present invention, the number of the fixing holes on the heat dissipating plate is not particularly limited. For example, in the first example, the lugs and the fixing holes are provided with a lug and a fixing hole every time a bend is formed. In the second embodiment, a fixing hole is provided on each lateral surface.
10‧‧‧散熱板10‧‧‧heating plate
11‧‧‧立面11‧‧‧Facade
12‧‧‧凸耳12‧‧‧ lugs
13‧‧‧固定孔13‧‧‧Fixed holes
20‧‧‧電路板20‧‧‧ boards
21‧‧‧LED21‧‧‧LED
22‧‧‧貫孔22‧‧‧through holes
30‧‧‧金屬連接件30‧‧‧Metal connectors
40‧‧‧燈罩40‧‧‧shade
第一圖為本創作第一實施例散熱板之立體示意圖; 第二圖為本創作第一實施例散熱板之頂面示意圖; 第三圖為本創作第一實施例之側面示意圖; 第四圖為本創作第一實施例之剖面示意圖; 第五圖為本創作第二實施例散熱板之立體示意圖; 第六圖為本創作第二實施例之側面示意圖。The first figure is a perspective view of the heat dissipation plate of the first embodiment of the present invention; The second figure is a schematic diagram of the top surface of the heat dissipation plate of the first embodiment of the present invention; The third figure is a schematic side view of the first embodiment of the creation; The fourth figure is a schematic cross-sectional view of the first embodiment of the creation; The fifth figure is a perspective view of the heat dissipation plate of the second embodiment of the present invention; The sixth drawing is a schematic side view of the second embodiment of the creation.
10‧‧‧散熱板10‧‧‧heating plate
11‧‧‧立面11‧‧‧Facade
12‧‧‧凸耳12‧‧‧ lugs
13‧‧‧固定孔13‧‧‧Fixed holes
20‧‧‧電路板20‧‧‧ boards
40‧‧‧燈罩40‧‧‧shade
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101220060U TWM451488U (en) | 2012-10-17 | 2012-10-17 | Assembly structure of LED lamp and heat dissipation plate |
RU2012156194/07U RU130123U1 (en) | 2012-10-17 | 2012-12-24 | COMBINATION OF LED LAMP AND RADIATOR STRUCTURE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101220060U TWM451488U (en) | 2012-10-17 | 2012-10-17 | Assembly structure of LED lamp and heat dissipation plate |
Publications (1)
Publication Number | Publication Date |
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TWM451488U true TWM451488U (en) | 2013-04-21 |
Family
ID=48787923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW101220060U TWM451488U (en) | 2012-10-17 | 2012-10-17 | Assembly structure of LED lamp and heat dissipation plate |
Country Status (2)
Country | Link |
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RU (1) | RU130123U1 (en) |
TW (1) | TWM451488U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU173701U1 (en) * | 2017-02-16 | 2017-09-06 | Андрей Владимирович Кащеев | LED LAMP |
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2012
- 2012-10-17 TW TW101220060U patent/TWM451488U/en unknown
- 2012-12-24 RU RU2012156194/07U patent/RU130123U1/en not_active IP Right Cessation
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RU130123U1 (en) | 2013-07-10 |
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