TWM450787U - Capacitive touch panel - Google Patents

Description

Capacitive touch panel

This creation is about the field of touch panel technology, especially regarding a capacitive touch panel.

Currently, there are many types of capacitive touch panels, such as the most conventional double glazing (Glass-Glass, GG) structure, PET glass (PG) structure, double film glass (Glass-Film- Film, GFF) structure, single glass solution (OGS) structure, etc.

In the process of actually manufacturing and using the capacitive touch panel, the creators found that the conventional GG structure capacitor panel requires double-layer glass, and the two-layer hard glass bonding yield and efficiency are low and the cost is high, and The thickness of the PG structure is PET film, the surface hardness is low, it is easy to be scratched, and the structure is relatively large; the GFF structure requires two layers of Indium Tin Oxide (ITO) film, and it needs to be bonded twice. The steps, material cost and process cost are both high, and the yield and efficiency are low, and the flexible circuit board binding also has functional hidden troubles; while the OGS structure requires the yellow light process in the manufacturing process, adopts the bridge technology, and the efficiency is high cost.

The technical problem to be solved by the present invention is to provide a capacitive touch panel with simple structure, low production cost and high efficiency.

In order to solve the above technical problems, the present invention provides the following technical solutions: a capacitive touch panel comprising an indium tin oxide tempered glass and an indium tin oxide film integrally formed by optical bonding.

Further, the indium tin oxide tempered glass comprises a glass substrate having a window region and a non-window region, and the first side surface of the glass substrate is provided with a black ink layer printed on a region corresponding to the non-window region, covering the black ink The layer of indium tin oxide is coated on the layer and the window region, and the outer surface of the indium tin oxide circuit layer is further provided with a metal circuit layer formed by a yellow light process technology.

Further, the indium tin oxide film includes a base material layer, an indium tin oxide layer formed on one surface of the base material layer, and a conductive silver paste layer covering the outer side of the indium tin oxide layer, and a metal wiring layer of the indium tin oxide tempered glass. The conductive silver paste layer on the outer surface and the indium tin oxide film is bonded by optical glue.

Further, the indium tin oxide tempered glass comprises a glass substrate having a window region and a non-window region, and the first black ink layer printed on the first side surface of the glass substrate is printed on a region corresponding to the non-window region, and plating An indium tin oxide wiring layer in a region corresponding to the window region, a conductive silver paste layer covering the outside of the first black ink layer and connected by a conductive block and an indium tin oxide circuit layer, and a second layer covering the outer side of the conductive silver paste layer Black ink layer.

Further, the indium tin oxide film includes a substrate layer, an indium tin oxide layer formed on one surface of the substrate layer, and a conductive silver paste layer covering the outside of the indium tin oxide layer, and a second black ink of the indium tin oxide tempered glass. The outer surface of the layer and the conductive silver paste layer of the indium tin oxide film are bonded by optical glue.

After adopting the above technical means, the present invention has at least the following beneficial effects: the present invention directly bonds ITO tempered glass and ITO film by optical glue, and the layer structure is simplified, which not only effectively reduces the overall thickness, but also has simple process and low cost. Production yield is high. The capacitive touch panel of the present invention has a smaller thickness than the existing GG structure and the GFF structure, and although it is slightly thicker than the OGS structure, the performance is superior.

It should be noted that, in the case of no conflict, the embodiments in the present invention and the features in the embodiments may be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

Referring to the embodiment shown in FIG. 1 , the present invention provides a capacitive touch panel comprising ITO tempered glass 1 and ITO film 2 which are bonded together by optical glue 3 .

The ITO tempered glass 1 includes a glass substrate 10 having a window region and a non-window region, and the first side surface of the glass substrate 10 is provided with a black ink layer 12 printed on a region corresponding to the non-window region, covering the black ink The layer 12 and the ITO line plating layer 14 of the window area, the outer surface of the ITO line plating layer 14 is further provided with a metal circuit layer 16 formed by a yellow light process technology, and the metal circuit layer 16 is distributed in a line shape instead of completely covering the ITO line plating layer. 14.

The ITO film 2 includes a base material layer 20, an ITO layer 22 formed on one surface of the base material layer 20, and a conductive silver paste layer 24 covering the outside of the ITO layer 22.

In the present embodiment, when the bonding is performed, the outer surfaces of the ITO wiring layer 14 and the metal wiring layer 16 of the ITO tempered glass 1 and the conductive silver paste layer 24 of the ITO film 2 are bonded by the optical adhesive 3.

The manufacturing process of the capacitive touch panel of the embodiment shown in FIG. 1 is as follows:
Step 1: printing a black ink layer 12 on a first side surface of the glass substrate 10 corresponding to a non-window area;
Step 2: ITO line plating layer 14 is plated on the entire surface of the glass substrate 10 on the outer side of the black ink layer 12, and the ITO line plating layer 14 completely covers the black ink layer 12 and the window area;
Step 3: using a yellow light process technology on the ITO line plating layer 14 is plated with a metal circuit layer 16, to obtain ITO tempered glass 1;
Step 4: printing a back protective glue on the substrate layer 20 of the ITO film 2, and performing pre-shrinkage treatment;
Step 5: printing an acid-resistant ink on the substrate layer 20, etching to obtain an ITO layer 22 of a predetermined ITO pattern;
Step 6: reprinting the conductive silver paste layer 24 on the ITO layer 22 to obtain the ITO film 2;
Step 7: attaching an optical adhesive 3 to the ITO film 2, and bonding the ITO film 2 and the ITO tempered glass 1 together;
Step 8: Press a flexible printed circuit (FPC) onto the line of the ITO tempered glass 1 and the ITO film 2. After the test is passed, the package can be shipped.

In another embodiment as shown in Fig. 2, the ITO tempered glass 4 of another embodiment is replaced by the ITO tempered glass 1 of the embodiment shown in Fig. 1, and the ITO in this embodiment The structure of the film 2 is the same as that of the ITO film in the embodiment shown in Fig. 1. In this embodiment, the ITO tempered glass 4 includes a glass substrate 40 having a window area and a non-window area, and the first side surface of the glass substrate 40 is provided with a first black printed on a region corresponding to the non-window area. An ink layer 42, an ITO wiring layer 44 plated on a region corresponding to the window region, a conductive silver paste layer 46 covering the outside of the first black ink layer 42 and connected to the ITO wiring layer 44 by the conductive block 45, and covering the conductive silver A second black ink layer 48 outside the slurry layer 46. In the present embodiment, when the bonding is performed, the outer surface of the second black ink layer 48 of the ITO tempered glass 4 and the conductive silver paste layer 24 of the ITO film 2 are bonded by the optical adhesive 3.

The manufacturing process of the capacitive touch panel of the embodiment shown in FIG. 2 is as follows:
Step 1: plating the ITO line plating layer 44 on the first side surface of the glass substrate 40 corresponding to the window area;
Step 2: printing a first black ink layer 42 on a first side surface of the glass substrate 40 corresponding to a non-window area;
Step 3: printing a conductive block 45 at a position where the ITO line plating layer 44 is adjacent to the first black ink layer 42;
Step 4: printing a conductive silver paste layer 46 outside the first black ink layer 42;
Step 5: printing a second black ink layer 48 on the outside of the conductive silver paste layer 46;
Step 6: printing a back protective glue on the substrate layer 20 of the ITO film 2, and performing pre-shrinkage treatment;
Step 7: printing an acid-resistant ink on the substrate layer 20, etching to obtain an ITO layer 22 of a predetermined ITO pattern;
Step 8: reprinting the conductive silver paste layer 24 on the ITO layer 22;
Step 9: attaching an optical adhesive 3 to the ITO film 2, and bonding the ITO film 2 and the ITO tempered glass 1 together;
Step 10: Press a flexible printed circuit (FPC) onto the line of the ITO tempered glass 4 and the ITO film 2. After the test is passed, the package can be shipped.

While the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications and substitutions can be made to these embodiments without departing from the spirit and scope of the present invention. The scope of the present invention is defined by the scope of the appended claims and their equivalents.

1‧‧‧ITO tempered glass
10‧‧‧ glass substrate
12‧‧‧Black ink layer
14‧‧‧ITO coating
16‧‧‧metal circuit layer
2‧‧‧ITO film
20‧‧‧Substrate layer
22‧‧‧ITO layer
24‧‧‧ Conductive silver paste layer
3‧‧‧Optical adhesive
4‧‧‧ITO tempered glass
40‧‧‧ glass substrate
42‧‧‧First black ink layer
44‧‧‧ITO coating
45‧‧‧Electrical block
46‧‧‧ Conductive silver paste layer
48‧‧‧Second black ink layer

FIG. 1 is a schematic cross-sectional view showing an embodiment of a capacitive touch panel of the present invention.
FIG. 2 is a schematic cross-sectional view showing another embodiment of the capacitive touch panel of the present invention.

1‧‧‧ITO tempered glass

10‧‧‧ glass substrate

12‧‧‧Black ink layer

14‧‧‧ITO coating

16‧‧‧metal circuit layer

2‧‧‧ITO film

20‧‧‧Substrate layer

22‧‧‧ITO layer

24‧‧‧ Conductive silver paste layer

3‧‧‧Optical adhesive

Claims (5)

A capacitive touch panel includes an indium tin oxide tempered glass and an indium tin oxide film integrally formed by optical bonding. The capacitive touch panel of claim 1, wherein the indium tin oxide tempered glass comprises a glass substrate having a window region and a non-window region, and the first side surface of the glass substrate is printed on The black ink layer in the area corresponding to the non-window area, the indium tin oxide line coating covering the black ink layer and the window area, and the outer surface of the indium tin oxide line plating layer are further provided with a metal circuit layer formed by a yellow light process technology. The capacitive touch panel of claim 2, wherein the indium tin oxide film comprises a substrate layer, an indium tin oxide layer formed on one surface of the substrate layer, and a conductive layer covering the outside of the indium tin oxide layer. In the silver paste layer, the outer surface of the metal wiring layer of the indium tin oxide tempered glass and the indium tin oxide wiring layer and the conductive silver paste layer of the indium tin oxide film are bonded by optical glue. The capacitive touch panel of claim 1, wherein the indium tin oxide tempered glass comprises a glass substrate having a window region and a non-window region, and printing is provided on the first side surface of the glass substrate. a first black ink layer in a region corresponding to the non-window region, an indium tin oxide plating layer plated on a region corresponding to the window region, covering the outside of the first black ink layer and connected by a conductive block and an indium tin oxide wiring layer a layer of conductive silver paste and a second black ink layer overlying the outer side of the layer of conductive silver paste. The capacitive touch panel of claim 4, wherein the indium tin oxide film comprises a substrate layer, an indium tin oxide layer formed on one surface of the substrate layer, and a conductive layer covering the outside of the indium tin oxide layer. In the silver paste layer, the outer surface of the second black ink layer of the indium tin oxide tempered glass and the conductive silver paste layer of the indium tin oxide film are bonded by optical glue.