TWM450500U - Transfer film having micro-pattern structure - Google Patents
Transfer film having micro-pattern structure Download PDFInfo
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- TWM450500U TWM450500U TW101217149U TW101217149U TWM450500U TW M450500 U TWM450500 U TW M450500U TW 101217149 U TW101217149 U TW 101217149U TW 101217149 U TW101217149 U TW 101217149U TW M450500 U TWM450500 U TW M450500U
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Description
一種具微圖形結構之轉印膜，尤指適用於將微圖形結構轉印於外殼基板表面之轉印膜。A transfer film having a micro-pattern structure, especially a transfer film suitable for transferring a micro-pattern structure to a surface of a casing substrate.
按，一般用於將微紋路圖案披覆於衣物、塑膠、木材或金屬(例如：筆記型電腦、各式3C產品等)等加工件表面時，係會利用轉印技術將所欲形成之微紋路圖案轉印於該加工件表面，用以改變加工件外表的色彩或質感，而諸類轉印技術中，大多以網版印刷的方式作為微圖形轉印技術，其中，該網版印刷係為利用油墨以批次方式逐一將所需之微圖形轉印於加工件表面，而此種方式因轉印的程序繁瑣導致生產工時較長，且處理方式成本較高，再者，網版技術無法提供更為細緻化之紋路，是以，上述習知之問題係為相關業者所亟欲解決之課題所在。Press, generally used to cover the surface of the workpiece, such as clothing, plastic, wood or metal (for example, notebook computer, various 3C products, etc.), will use the transfer technology to form the desired The texture pattern is transferred on the surface of the workpiece to change the color or texture of the surface of the workpiece, and in the various transfer technologies, most of the screen printing is used as a micro pattern transfer technology, wherein the screen printing system In order to use the ink to transfer the required micro-patterns to the surface of the workpiece one by one in batch mode, this method has a long production time and a high processing cost due to the cumbersome transfer procedure, and further, the screen version Technology cannot provide more detailed lines, so the above-mentioned problems are the subject of the relevant industry.
本創作之主要目的乃在於，利用未硬化之第二感光樹脂層轉印已硬化之第一感光樹脂層的微圖形紋路，讓第二感光樹脂層所形成之微圖形圖案可直接轉印至外殼基板表面，達到縮短生產工時之功效，並可提供更為細緻化之微圖形圖案。The main purpose of the present invention is to transfer the micropattern pattern of the hardened first photosensitive resin layer by using the uncured second photosensitive resin layer, so that the micropattern pattern formed by the second photosensitive resin layer can be directly transferred to the outer casing. The surface of the substrate is used to shorten the production time and provide a more detailed micro-pattern.
為達上述目的，本創作之轉印膜係設置有移載材以及轉印材，該移載材表面設置有轉印材，該移載材表面係設置有微圖形紋路，該轉印材係具有熱轉膠層，熱轉膠層一側表面設有未硬化之第二感光樹脂層，且未硬化之第二感光樹脂層硬度係小於移載材之硬度，而第二感光樹脂層表面係填充於微圖形紋路內；藉上， 將轉印膜利用熱轉膠層貼附於外殼基板表面，續剝離移載材並以紫外光照射第二感光樹脂層，第二感光樹脂層表面即形成微圖形圖案，由上可看出，本創作之轉印膜係具有縮短生產工時之優點。In order to achieve the above object, the transfer film of the present invention is provided with a transfer material and a transfer material. The surface of the transfer material is provided with a transfer material, and the surface of the transfer material is provided with a micro-pattern line, and the transfer material has a heat transfer. The adhesive layer, the surface of one side of the heat transfer adhesive layer is provided with an unhardened second photosensitive resin layer, and the hardness of the unhardened second photosensitive resin layer is smaller than the hardness of the transfer material, and the surface of the second photosensitive resin layer is filled with micro Graphic texture; borrowed, The transfer film is attached to the surface of the outer casing substrate by using a thermal transfer adhesive layer, the transfer carrier is continuously peeled off, and the second photosensitive resin layer is irradiated with ultraviolet light, and the surface of the second photosensitive resin layer forms a micro-pattern pattern, as can be seen from the above, The transfer film of the present invention has the advantage of shortening the production man-hour.
進一步而言，本創作之轉印膜係設置有移載材以及轉印材，該移載材係具有基材，基材表面塗佈有經硬化之第一感光樹脂層，第一感光樹脂層遠離基材表面設置有微圖形紋路，而該轉印材係設置於移載材表面，及具有熱轉膠層，熱轉膠層一側表面設有未硬化之第二感光樹脂層，第二感光樹脂層表面係填充於第一感光樹脂層之微圖形紋路內。Further, the transfer film of the present invention is provided with a transfer material and a transfer material, the transfer material has a substrate, and the surface of the substrate is coated with a hardened first photosensitive resin layer, and the first photosensitive resin layer is away from The surface of the substrate is provided with a micro-patterned texture, and the transfer material is disposed on the surface of the transfer material, and has a thermal transfer adhesive layer. The surface of the thermal transfer adhesive layer is provided with an uncured second photosensitive resin layer, and the second photosensitive resin The layer surface is filled in the micropattern trace of the first photosensitive resin layer.
請參閱第一圖至第三圖所示，由圖中可清楚看出本創作之較佳實施例，該轉印膜10係具有移載材1及轉印材2，該轉印材2係設置於移載材1表面，移載材1具有基材11，當該轉印膜10於製造時，係先於基材11表面塗佈有第一感光樹脂層12，第一感光樹脂層12遠離基材11表面設置有微圖形紋路13，該微圖形紋路13係以壓製方式所製成，續以紫外線光照射第一感光樹脂層12，使第一感光樹脂層12產生硬化。Referring to the first to third figures, a preferred embodiment of the present invention is clearly illustrated. The transfer film 10 has a transfer material 1 and a transfer material 2, and the transfer material 2 is disposed on On the surface of the transfer material 1, the transfer material 1 has a substrate 11. When the transfer film 10 is manufactured, the first photosensitive resin layer 12 is coated on the surface of the substrate 11, and the first photosensitive resin layer 12 is away from the base. The surface of the material 11 is provided with a micro-pattern line 13 which is formed by pressing, and the first photosensitive resin layer 12 is irradiated with ultraviolet light to harden the first photosensitive resin layer 12.
該轉印材2係具有熱轉膠層21，熱轉膠層21一側表面設有第二感光樹脂層22，且第二感光樹脂層22係未經紫外線光照射，以讓第二感光樹脂層22為未硬化狀態，因此，當第二感光樹脂層22塗佈於第一感光樹脂層12表面時，第二感光樹脂層22係會填充於第一感光樹脂層12之微圖形紋路13內。The transfer material 2 has a thermal transfer adhesive layer 21, a surface of one side of the thermal transfer adhesive layer 21 is provided with a second photosensitive resin layer 22, and the second photosensitive resin layer 22 is not irradiated with ultraviolet light to allow the second photosensitive resin layer 22 is an uncured state. Therefore, when the second photosensitive resin layer 22 is applied to the surface of the first photosensitive resin layer 12, the second photosensitive resin layer 22 is filled in the micropatterned lines 13 of the first photosensitive resin layer 12.
當本創作轉印膜10於轉印微圖形紋路13至外殼基板4表面時，係先將轉印材2之熱轉膠層21緊迫黏貼於外殼基板4，用以 讓轉印材2與外殼基板4形成黏接狀態，因第二感光樹脂層22為未硬化之狀態，因此第一感光樹脂層12係可於由第二感光樹脂層22表面移除時，未硬化之第二感光樹脂層22不會與硬化之第一感光樹脂層12相互黏接，再者，當第一感光樹脂層12由第二感光樹脂層22脫模移除後，再照射紫外光，讓第二感光樹脂層22經由紫外光照射後即產生硬化，因此第一感光樹脂層12之微圖形紋路13係會轉印至第二感光樹脂層22表面，即可讓外殼基材4表面產生具有裝飾效果之微紋路圖案23。When the transfer film 10 is transferred to the surface of the outer casing substrate 4, the thermal transfer layer 21 of the transfer material 2 is first adhered to the outer casing substrate 4 for The transfer material 2 is bonded to the outer casing substrate 4, and since the second photosensitive resin layer 22 is in an uncured state, the first photosensitive resin layer 12 can be hardened when removed from the surface of the second photosensitive resin layer 22. The second photosensitive resin layer 22 does not adhere to the hardened first photosensitive resin layer 12, and further, when the first photosensitive resin layer 12 is demolded and removed by the second photosensitive resin layer 22, ultraviolet light is irradiated. After the second photosensitive resin layer 22 is cured by ultraviolet light, the micro-pattern lines 13 of the first photosensitive resin layer 12 are transferred to the surface of the second photosensitive resin layer 22, so that the surface of the outer casing substrate 4 can be produced. A micro-grain pattern 23 with a decorative effect.
請參閱第四圖所示，由圖中可清楚看出本創作另一較佳實施例，其中該轉印膜10係設置有轉印材2以及移載材3，轉印材2係設置於移載材3表面，其中該轉印材2表面係具有熱轉膠層21，熱轉膠層21靠近移載材3一側表面設有未硬化之第二感光樹脂層22，而該移載材3表面係設置有微圖形紋路31，其中該未硬化之第二感光樹脂層22硬度係小於移載材3之硬度，使熱轉膠層21之第二感光樹脂層22表面係填充於微圖形紋路31內時，微圖形紋路31的結構不會因第二感光樹脂層22的擠壓而受到損壞，因此當轉印作業進行脫模時，係直接將移載材3由轉印材2表面移除，再讓紫外光照射第二感光樹脂層22表面，使第二感光樹脂層22表面硬化而完成轉印作業。Referring to the fourth figure, another preferred embodiment of the present invention is clearly seen in the drawings, wherein the transfer film 10 is provided with a transfer material 2 and a transfer material 3, and the transfer material 2 is disposed on the transfer. a surface of the material 3, wherein the surface of the transfer material 2 has a thermal transfer adhesive layer 21, and a surface of the thermal transfer adhesive layer 21 adjacent to the side of the transfer material 3 is provided with an uncured second photosensitive resin layer 22, and the surface of the transfer material 3 The micro-patterned film 31 is provided, wherein the hardness of the uncured second photosensitive resin layer 22 is smaller than the hardness of the transfer material 3, and the surface of the second photosensitive resin layer 22 of the thermal transfer adhesive layer 21 is filled in the micro-patterned line 31. In the meantime, the structure of the micro-patterned line 31 is not damaged by the pressing of the second photosensitive resin layer 22, so when the transfer operation is performed, the transfer material 3 is directly removed from the surface of the transfer material 2, Further, ultraviolet light is irradiated onto the surface of the second photosensitive resin layer 22, and the surface of the second photosensitive resin layer 22 is hardened to complete the transfer operation.
10‧‧‧轉印膜10‧‧‧Transfer film
1‧‧‧移載材1‧‧‧Transfer materials
11‧‧‧基材11‧‧‧Substrate
12‧‧‧第一感光樹脂層12‧‧‧First photosensitive resin layer
13‧‧‧微圖形紋路13‧‧‧Micrographic lines
2‧‧‧轉印材2‧‧‧Transfer materials
21‧‧‧熱轉膠層21‧‧‧Hot transfer layer
22‧‧‧第二感光樹脂層22‧‧‧Second photosensitive resin layer
23‧‧‧微紋路圖案23‧‧‧ micro-grain road pattern
3‧‧‧移載材3‧‧‧Transfer materials
31‧‧‧微圖形紋路31‧‧‧Micrographic lines
4‧‧‧外殼基板4‧‧‧ Shell substrate
第一圖係為本創作較佳實施例之壓製狀態剖面示意圖。The first figure is a schematic cross-sectional view of the pressed state of the preferred embodiment of the present invention.
第二圖係為本創作較佳實施例之分解圖。The second drawing is an exploded view of the preferred embodiment of the present invention.
第三圖係為本創作較佳實施例之剝離狀態剖面示意圖。The third figure is a schematic cross-sectional view of the peeling state of the preferred embodiment of the present invention.
第四圖係為本創作另一較佳實施例之壓製狀態剖面示意圖。The fourth figure is a schematic cross-sectional view of a pressed state of another preferred embodiment of the present invention.
10‧‧‧轉印膜10‧‧‧Transfer film
1‧‧‧移載材1‧‧‧Transfer materials
11‧‧‧基材11‧‧‧Substrate
12‧‧‧第一感光樹脂層12‧‧‧First photosensitive resin layer
13‧‧‧微圖形紋路13‧‧‧Micrographic lines
2‧‧‧轉印材2‧‧‧Transfer materials
21‧‧‧熱轉膠層21‧‧‧Hot transfer layer
22‧‧‧第二感光樹脂層22‧‧‧Second photosensitive resin layer
4‧‧‧外殼基板4‧‧‧ Shell substrate
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101217149U TWM450500U (en) | 2012-09-06 | 2012-09-06 | Transfer film having micro-pattern structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101217149U TWM450500U (en) | 2012-09-06 | 2012-09-06 | Transfer film having micro-pattern structure |
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| Publication Number | Publication Date |
|---|---|
| TWM450500U true TWM450500U (en) | 2013-04-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101217149U TWM450500U (en) | 2012-09-06 | 2012-09-06 | Transfer film having micro-pattern structure |
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| TW (1) | TWM450500U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328979A (en) * | 2019-08-07 | 2019-10-15 | 武汉华工图像技术开发有限公司 | A kind of blocking film with deep texture structure, thermoprint structure and preparation method |
-
2012
- 2012-09-06 TW TW101217149U patent/TWM450500U/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110328979A (en) * | 2019-08-07 | 2019-10-15 | 武汉华工图像技术开发有限公司 | A kind of blocking film with deep texture structure, thermoprint structure and preparation method |
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